JPH09171174A - Transparent conductive substrate and display device formed by using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to obtain a transparent conductive base material having optical characteristics and heat resistance in combination by adhering a first transparent resin base material which has chemical resistance and heat resistance and is provided with a transparent electrode layer on its main surface and a second transparent resin base material which has shape maintainability. SOLUTION: The first transparent resin base material 21 has the chemical resistance and heat resistance and has further an excellent gas barrier property, etc., at need and consists of layer constitution consisting of a steam barrier layer 2/adhesive layer 4/oxygen barrier layer 1/adhesive layer 4/steam barrier layer 2. Further, the main surface of the first transparent resin base material 21 is provided with the transparent electrode layer and an oriented layer according to need. On the other hand, the second transparent resin base material has the excellent shape maintainability and the gas barrier property, etc., according to need and is preferably thicker than the former. The one surface is hard coated with a silicone resin, urethane resin, acrylic resin, etc. The first transparent resin base material 21 and the second transparent resin base material are laminated via an adhesive film, etc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transparent conductive substrate used in various display devices and a display device using the same.

[0002]

2. Description of the Related Art With recent advances in satellite communication and mobile communication technologies, lightweight display devices for small-sized portable information terminal devices have been developed. The substrate of this display is usually
A transparent conductive substrate is used.

A conventional transparent conductive substrate is a transparent electrode layer on a glass plate having a thickness of 0.7 to 1.1 mm, which has heat resistance, chemical resistance, and optical characteristics such as high light transmittance, low haze and low retardation. Is formed. Since this transparent conductive substrate uses a glass plate as a base material,
For example, it can sufficiently withstand a photoetching process, a sputtering process and the like performed in an alignment layer forming process and an electrode forming process in the manufacture of a liquid crystal display device.

On the other hand, compact and portable information terminal devices are required to have excellent impact resistance and be lightweight.
Therefore, when the thickness of the glass plate is made thinner than the current thickness to reduce the weight of the transparent conductive substrate, there is a problem that the impact resistance becomes worse than that of the current glass plate. Therefore, there is a demand for technological development of using a transparent resin material such as a plastic film or sheet, which has excellent impact resistance and is lightweight, for a transparent conductive substrate.

However, in a transparent resin material such as an existing plastic film or sheet, it is difficult to simultaneously satisfy the optical characteristics such as high light transmittance, low haze value and low retardation value and heat resistance. The light transmittance and the heat resistance cannot be satisfied at the same time.
For example, when an aromatic ring or a heterocycle is introduced into the main chain of a polymer compound that constitutes a transparent resin material to improve heat resistance to form a highly conjugated structure, the transparent resin material is inevitably colored, which causes the visible part. The light transmittance of is reduced. Further, the crystalline structure increases the haze value and retardation value.

Further, taking a transparent conductive substrate used for a liquid crystal display device as an example, in order to improve display quality, for example, oxygen barrier property, water vapor barrier property, scratch resistance and the like are required. Not all can be borne by a single transparent resin material. For this reason, a heat-resistant transparent resin material is used as a base material, and various types of transparent resin materials having various functions are prepared and laminated on such a base material in a multilayer form.

That is, it is difficult to impart oxygen barrier ability and water vapor barrier ability to the same resin with a transparent resin material, and in general, a resin having a water vapor barrier ability has a large surface energy and is not familiar with other resins. Since it is small, the surface treatment of the resin is required to bond it with other resin. As described above, the transparent conductive substrate has been developed as a layered structure having an enormous number of layers.

Moreover, unlike a general-purpose transparent resin material which is easily manufactured by a roll extrusion method of a molten resin, a transparent resin material for optics reduces productivity in order to reduce optical anisotropy. Being produced. Therefore, it is very expensive.

[0009]

As described above, the transparent conductive substrate made of a transparent resin material is intricate to manufacture because it is inevitable that the resin material having various functions is multilayered. Further, since various solvents are used for the treatment / film formation, there is a problem in that it is not environmentally friendly and it is difficult to sufficiently withstand the manufacturing process temperature of a conventional liquid crystal display device such as an electrode forming process.

From the viewpoint of facilitating handling, when a transparent conductive substrate having a thickness of 0.2 to 0.5 mm is manufactured, a roll-to-roll method is adopted to attempt multi-layering on a base material. However, unless the torque of the device is made larger than that of a general-purpose device, insufficient tension of the base material occurs and a transparent conductive substrate having a layered structure with spots is produced.

The present invention has been made to deal with such a problem, and can be obtained by a simple manufacturing method by positively utilizing various functional divisions, and further, optical characteristics and heat resistance. An object of the present invention is to provide a transparent conductive substrate having both of the above and a display device using the same.

[0012]

A transparent conductive substrate according to claim 1 has chemical resistance and heat resistance, and a first transparent resin substrate having a transparent electrode layer provided on its main surface, It is characterized by being bonded to a second transparent resin base material having shape retention.

According to a second aspect of the present invention, there is provided a first display device having chemical resistance and heat resistance, the transparent electrode layer being provided on the main surface thereof.
Transparent conductive substrate and a second transparent resin substrate having a shape-retaining property, and a counter substrate disposed so as to face the transparent conductive substrate. And a display portion provided between the substrate and the counter substrate.

The transparent conductive substrate according to the first aspect positively utilizes the various functional divisions of the transparent resin material and the transparent resin base material.

That is, here, the first transparent resin substrate having excellent chemical resistance and heat resistance and, if necessary, gas barrier properties, and the like, excellent in shape retention and, if necessary, gas barrier properties, The second one, which is preferably thicker than the former
And the transparent resin base material of. In addition, as the first transparent resin substrate, it is preferable to bond a plurality of transparent resin materials having excellent properties such as chemical resistance, gas barrier property and heat resistance to form a composite transparent resin substrate. .

In the present invention, "having chemical resistance" means that the transparent resin material or the transparent resin base material has resistance to chemicals encountered in manufacturing processes such as photoetching processes. Depending on the process, room temperature to 120 ℃ cellosolve acetate, hydrogen peroxide solution,
It means that the initial characteristics are substantially maintained even after being immersed in sulfuric acid, hydrochloric acid, nitric acid, acetone, methanol, γ-butyrolactone, 5% caustic soda aqueous solution, 5% caustic potash aqueous solution for 10 minutes to 1 hour.

In the present invention, having heat resistance means that the transparent resin material or the transparent resin base material has resistance in a thermal process such as an alignment layer forming process and an electrode forming process. Specifically, 170 ° C. It is resistant to aging for 1 to 2 hours.

In the present invention, having a gas barrier property means that the transparent resin material or the transparent resin base material has a property of blocking or suppressing the permeation of various gases, especially water vapor and oxygen, and specifically, water vapor. Transmittance is 1 g / m ²
atm ・ 24H or less, oxygen permeability 0.5cc / m ²・ atm ・ 24H
It means that.

Specific examples of the first transparent resin substrate include a water vapor barrier layer / oxygen barrier layer / water vapor barrier layer,
Alternatively, there may be mentioned a composite transparent resin substrate composed of a heat resistant protective layer / water vapor barrier layer / oxygen barrier layer / water vapor barrier layer / heat resistant protective layer in this order. Further, the second transparent resin substrate having shape retention property may include a film or sheet selected from a polycarbonate film or sheet, or a polyarylate film or sheet. It is preferably used after being hard-coated.

A display device according to a second aspect uses the above-mentioned transparent conductive substrate and is particularly suitable for a liquid crystal display device.

Further, the present invention will be described in detail with reference to the drawings. FIG. 1 shows a cross-sectional view of a first transparent resin substrate 21 having a layer structure of water vapor barrier layer 2 / adhesive layer 4 / oxygen barrier layer 1 / adhesive layer 4 / water vapor barrier layer 2.

FIG. 2 is a heat-resistant protective layer 3 / adhesive layer 5 / water vapor barrier layer 2 / adhesive layer 4 / oxygen barrier layer 1 / adhesive layer 4 / water vapor barrier layer 2 / adhesive layer 5 / heat resistant protective layer 3
A cross-sectional view of a first transparent resin substrate 22 having the above layer structure is shown.

In FIG. 3, one surface layer of the water vapor barrier layer of the first transparent resin substrate 21 of FIG. 1 is surface-treated to form a surface-treated layer 6, on which a transparent electrode layer 7 is formed and further oriented. FIG. 3 shows a cross-sectional view of a layer structure that has undergone a high temperature process in which layer 8 is formed.

Further, in FIG. 4, the heat-resistant protective layer, which is one surface layer of the first transparent resin substrate 22 of FIG. 2, is surface-treated to form a surface-treated layer 6, on which the transparent electrode layer 7 is formed. ,
Further, a cross-sectional view of the layer constitution after the high temperature process in which the alignment layer 8 is formed is shown.

FIG. 5 shows a second transparent resin substrate 10 having a hard coat layer 11 on one side with a water vapor barrier layer on the opposite side of the alignment layer 8 in the layer structure of FIG. The final transparent conductive substrate 3 of the present invention to which is adhered
1 shows a cross-sectional view of the layer structure of 1.

Further, FIG. 6 shows a second transparent resin group having a hard coat layer 11 on one side with a heat-resistant protective layer on the opposite side of the orientation layer 8 in the layer structure of FIG. The final transparent conductive substrate 3 of the present invention to which the material 10 is adhered
2 shows a cross-sectional view of a two layer construction. FIG. 7 is a schematic cross-sectional view of a display device 51 using the transparent conductive substrate of the present invention, in which an alignment layer 44 is formed on a transparent conductive substrate 41 having a patterned electrode, and a rubbing treatment is performed. The counter substrate 42 is provided with a color filter 46 on one surface of a transparent resin substrate 45, if necessary, and a solid transparent electrode layer 47 is provided on this surface.
Further, an alignment layer 44 is provided to produce the layer. After the spacers 49 are dispersed on the transparent conductive substrate 41, the transparent conductive substrate 41 is sealed with the sealing material 50 leaving an opening serving as a liquid crystal material injection port.
After forming a cell on the counter substrate 42 and injecting a liquid crystal material 43 to be a display portion, the opening is sealed. Then, the polarizing film 4 is formed on the transparent conductive substrate 41 and the counter substrate 42.
A liquid crystal display device, which is an example of the display device of the present invention, is completed by bonding 8 and 48 together. Here, when such a transparent conductive substrate is used in a liquid crystal display device in particular, in addition to satisfying both heat resistance and transparency, other required properties include water vapor barrier property, oxygen barrier property, scratch resistance and the like. Can be mentioned. Further, the adhesiveness between the layers of the multi-layered layer structure having these characteristics is also required. By the way, only a part of resins having a halogen atom is known as an organic material having both oxygen barrier property and water vapor barrier property. However, since the presence of free halogen ions adversely affects the liquid crystal substance in the resin having halogen atoms, it is not preferable to use it in the layer structure of the transparent conductive substrate used in the liquid crystal display device. Further, as a monofunctional gas barrier resin film, a nylon film is known as a resin film exhibiting an oxygen barrier property, and a polyethylene film is known as a resin film exhibiting a water vapor barrier property, but these have large crystallinity, Alternatively, it has a problem such as poor heat resistance.

Therefore, as the oxygen barrier layer used for the layer constitution of the transparent conductive substrate of the present invention, it is preferable to use an ethylene-vinyl alcohol copolymer film showing an excellent oxygen barrier property among organic systems. This ethylene-vinyl alcohol copolymer film is commercially available from Nigo Film Co., Ltd. as a Bobron SE film. The thickness can be determined in consideration of transparency and the overall oxygen barrier property of the composite transparent resin substrate described below.

When the ethylene-vinyl alcohol copolymer film absorbs moisture, the oxygen barrier property is significantly lowered. Therefore, in the present invention, in order to prevent moisture absorption of the ethylene-vinyl alcohol copolymer film, a film having a large water vapor barrier property is usually arranged on both sides of this film. At this time, it is preferable to use a polypropylene film showing excellent water vapor barrier property among organic materials, further excellent chemical resistance, and heat resistance for the water vapor barrier layer used for the layer constitution of the transparent conductive substrate of the present invention. . The thickness of this film can also be determined in consideration of transparency and the comprehensive water vapor barrier property of the composite transparent resin substrate described later.

Further, when laminating these, the magnitude of the surface energy of polypropylene may be an obstacle. Generally, when a polypropylene film is laminated with another resin film, it is necessary to introduce a surface treatment of the polypropylene film, for example, strong acid, flame, plasma discharge, corona discharge treatment to introduce an active group such as a hydroxyl group or a carboxyl group on the surface. . Of course, it is also possible to carry out such an operation and then laminate it with various adhesives, for example, epoxy resin, acrylic resin, etc., but as an adhesive method without using a solvent, an active group such as a carboxyl group It is effective to use a polyolefin introduced into the side chain by a grafting reaction as an adhesive film. As a film that meets this purpose, for example, an Admer film manufactured by Mitsui Petrochemical Co., Ltd. is preferable.

The thickness of this adhesive film is selected from 5 to 10 μm. This is because if it is too thin, adhesiveness cannot be expected, and if it is too thick, the transparency of the entire composite transparent resin substrate tends to decrease.

Further, in the present invention, the reason why the heat-resistant protective layer is preferably provided as shown in FIG. 2 is that a thermal process such as an electrode forming process may require a temperature process which polypropylene cannot withstand in some cases. Therefore, a poly (4-methylpentene-1) film having good chemical resistance is effective for this heat-resistant protective layer. Since the water vapor barrier ability of this poly (4-methylpentene-1) film is about a fraction of that of the polypropylene film, even when such a heat-resistant protective layer is provided in the present invention, it still functions as a water vapor barrier layer. It is usually necessary to use (laminate) together with the polypropylene film. Here, in the lamination of the polypropylene film and the poly (4-methylpentene-1) film, since the surface energy of these films is large, both films are subjected to some surface treatment as described above, and then the above-mentioned It is common to laminate via such an adhesive film.

Further, polypropylene film and poly (4-
Methylpentene-1) It is also possible to adhere a film without treatment, and in this case, an acrylic ester resin film can be particularly preferably used. Specific examples include, for example, a special resin manufactured by Mitsui Petrochemical Co., Ltd. the film,
CMPS series can be mentioned. The thickness of this adhesive film is also selected from 5 to 10 μm. This is because if it is too thin, adhesiveness cannot be expected, and if it is too thick, the transparency of the entire composite transparent resin substrate tends to decrease.

Here, the first transparent resin substrate is basically a water vapor barrier layer / oxygen barrier layer / water vapor barrier layer, or a heat resistant protective layer / water vapor barrier layer / oxygen barrier layer / water vapor barrier layer / heat resistant protection. The reason why it is preferable to have a symmetric layer structure such as layers will be described.

That is, the transparent conductive substrate of the liquid crystal display device is required to have transparency, heat resistance, water vapor barrier property and oxygen barrier property. Therefore, as described above, a transparent resin material that is as thin as possible is multilayered to provide oxygen barrier properties and water vapor barrier properties, and if necessary, a transparent resin material having higher heat resistance is formed in the outermost layer. In the present invention, at this time, by making the layer structure symmetrical, it is possible to alleviate the thermal stress based on the difference in the thermal expansion coefficient between the transparent resin materials, and thus to prevent the composite transparent resin substrate from being deformed. It is also possible to give a barrier function to the converted resin base material. Furthermore, by disposing a polypropylene film or poly (4-methylpentene-1) film having high chemical resistance in the outermost layer of the first transparent resin substrate,
It can be made resistant to various chemicals encountered in the manufacturing process of liquid crystal display devices.

Therefore, the total thickness of the first transparent resin substrate in the present invention is 50 to 150 μm, preferably 70 to 120 μm.
Roll press capable of applying a pressure of 5 to 20 Kg / cm ^{2 at} a temperature above the softening point temperature of the adhesive and / or the transparent resin material present in the inner layer and below the softening point temperature of the resin material in the outermost layer. Can be molded at once by. In addition, the anisotropy greatly reduces the anisotropy of the inner layer resin material having some optical anisotropy in this heat step. Here, the preferable total thickness of the first transparent resin substrate is 50 to 150 μm.
If it is less than 50 μm, sufficient chemical resistance, heat resistance, and gas barrier property may not be given.
This is because transparency tends to decrease when the thickness exceeds μm.

Further, in providing the transparent electrode layer on the main surface of the first transparent resin substrate thus obtained in the transparent conductive substrate of the present invention, first, the main surface is subjected to the surface treatment as described above. After that, it is preferable to form various coupling agent layers such as silane coupling agents such as vinylsilane, acrylsilane, thionylsilane, epoxysilane and aminosilane, or titanium coupling agents and zirconium coupling agents. In forming the coupling agent layer, various coupling agents are diluted with a solvent such as isopropyl alcohol and dried by various coating methods such as roll coating.
It is applied to a thickness of about 10 nm and dried with hot air at a temperature of around 100 ° C for 30 minutes. A solid transparent electrode layer or a patterned transparent electrode layer and, if necessary, an alignment layer are formed on this treated surface by a conventional method.

On the other hand, a second transparent resin substrate prepared separately, preferably one surface of which is hard-coated with a silicone resin, a urethane resin, an acrylic resin, or the like, and thus a first electrode having a transparent electrode layer and an alignment layer if necessary. The transparent resin substrate is laminated, for example, via an adhesive film. In this case, after the above-mentioned various surface treatments are applied to the main surface of the first transparent resin substrate opposite to the transparent electrode, the main surface may be bonded with an adhesive, or simply the adhesive film may be applied without the surface treatment. It suffices to heat-bond it. Also in this case, the above-mentioned acrylic ester-based transparent resin film and CMPS series are effective. Then, this adhesion is performed using a laminator or the like.

Further, in order to prevent the adhesion surface from being contaminated at this time, the main surface of the first transparent resin substrate opposite to the transparent electrode layer and the alignment layer may be previously protected with a release film. It is valid. As a material of the release film, an aramid film coated with a silicone resin or the like is effective from the viewpoint of heat resistance and chemical resistance when forming a transparent electrode layer or the like. Here, such a release film also contributes to the improvement of handleability when forming the transparent electrode layer, and the adhesive force can be appropriately adjusted by changing the hardness of the silicone resin.

The thickness of the second transparent resin base material such as the polycarbonate resin base material or the polyarylate resin base material is 0.1 to 0.4 mm from the viewpoint of shape retention and transparency.
The thickness of the hard coat layer is 10 μm even if it is thick.
It is adjusted to.

The transparent conductive substrate of the present invention, including the transparent electrode layer or the array electrode layer and the alignment layer using the transparent electrode layer, is adjusted to have a thickness of 0.15 to 0.5 mm. This thickness makes the transparency compatible with the handling property of the transparent conductive substrate in the manufacturing process of the liquid crystal display device. Moreover, it becomes a transparent conductive substrate that is elastic even for a display of about 5 inches.

As explained above, the transparent conductive substrate of the present invention can be manufactured by a simple method, that is, a method which has almost no steps using a solvent. In addition, a transparent electrode layer and an orientation layer are formed on a thin first transparent resin substrate having excellent transparency, chemical resistance, gas barrier property and heat resistance, and thereafter, sufficient shape retention and transparency are provided. In order to bond this thin multilayered first transparent resin base material to the relatively thick second transparent resin base material, the roll
The tow-roll continuous method can be easily adopted.

Further, when a thermal process is adopted in forming the multi-layer, the orientation of the transparent resin material having a relatively large optical anisotropy is also annealed by thermal annealing. As a result, the optical anisotropy is significantly reduced.

The transparent conductive substrate of the present invention and the display device using the same as described above make a great contribution to weight reduction and improvement of impact resistance of a small portable information terminal device. Although the liquid crystal display device has been described as the display device of the present invention, other display devices, for example, ECD, PDP, EL, L.
It can also be effectively used as a substitute for a glass substrate of a display device using ED, electrophoresis or the like. Furthermore, it is also effective in reducing the weight and impact resistance of the light control glass (liquid crystal shutter).

[0044]

BEST MODE FOR CARRYING OUT THE INVENTION

Example 1 15 μm-thick polypropylene film manufactured by Tohcello / polyolefin film grafted with functional groups manufactured by Tohcello, Admer XE film (10 μm thick) / 20 μm
Thick Nichigo Film's ethylene-vinyl alcohol copolymer, Bobron SE film / 10 μm thick Admer X
A laminate consisting of E film / 15 μm thick polypropylene film is heat-bonded by roll press at 140 ° C. and 5 Kg / cm ² to produce a warped composite transparent resin substrate,
This was the first transparent resin substrate. The peel strength between the obtained first transparent resin substrates was 0.2 Kg / cm or more. The composite transparent resin substrate had a light transmittance of 87% and a haze value of
0.8%, retardation value is 15 nm, oxygen permeability is 0.1 cc / m ² · atm · 24H, water vapor permeability is 0.3
It was g / m ² · atm · 24H.

Next, one surface of the first transparent resin base material is subjected to surface treatment by high frequency corona discharge, and then an IPA solution of an aminosilane coupling agent manufactured by Nippon Unicar Co., Ltd. is applied and dried to form a coupling having a thickness of about 10 nm. An agent layer was provided. Furthermore, MIM is formed on this coupling agent layer by a conventional method.
A transparent electrode of a mold was provided, and a polyimide film was further formed on this transparent electrode layer and subjected to rubbing treatment to form an alignment layer. A 10 μm-thick CMPS-009 film as an adhesive film was formed on the polypropylene film side opposite to the alignment layer.
A film and a 0.25 mm thick polyarylate sheet as a second transparent resin substrate were laminated and laminated at 140 ° C. and 5 Kg / cm ² to prepare a warp-free transparent conductive substrate. A tape peeling test and a peel test were performed in each manufacturing process of this transparent conductive substrate, and it was confirmed that there was no problem in interlayer adhesion.

Example 2 A warp-free transparent conductive substrate was prepared in the same manner as in Example 1 except that a 0.25 mm thick polycarbonate sheet having one side hard-coated with a silicone resin was used in place of the polyarylate sheet. . A tape peeling test and a peel test were performed in each manufacturing process of this transparent conductive substrate, and it was confirmed that there was no problem in interlayer adhesion.

Example 3 Poly (4-methylpentene) having a thickness of 25 μm manufactured by Mitsui Petrochemical Co., Ltd.
-1) Film, TPX film / 10 μm thick special resin film made by East Cello, CMPS-009 film / 15 μm thick polypropylene film made by East Cello / 10 μm Admer XE film / 20 μm thick made by Nigo Film Co., Ltd. Laminate composed of Boblon SE film / 10 μm thick Admer XE film / 15 μm thick polypropylene film / 10 μm thick CMPS-009 film / 25 μm thick TPX film by roll press at 160 ° C., 5 Kg / cm ²
A transparent resin base material that was composited by heat fusion was prepared without warpage and was used as a first transparent resin base material.

The peel strength between the obtained first transparent resin substrates was 0.2 Kg / cm or more. The light transmittance of this first transparent resin substrate was 85%, the haze value was 1.0%, the retardation value was 18 nm, and the oxygen transmittance was 0.1 cc / m ²
・ Atm ・ 24H, water vapor transmission rate is 0.3g / m ²・ atm
・ It was 24H.

Then, a transparent electrode and an alignment layer were provided on one surface of the obtained first transparent resin material in the same manner as in Example 1, and a polyarylate sheet was placed at 160 ° C. and 5 Kg / cm with a CMPS-009 film interposed. ^A transparent conductive substrate having no warp was produced by adhering with ² . A tape peeling test and a peel test were also performed in each manufacturing process of this transparent conductive substrate, and it was confirmed that there was no problem in interlayer adhesion.

Example 4 The same as Example 3 except that a 0.25 mm thick polycarbonate sheet having one side hard coated with a silicone resin was used in place of the polyarylate sheet, and the molding conditions were 140 ° C. and 5 kg / cm ^2. A transparent conductive substrate having no warp was produced. A tape peeling test and a peel test were also performed in each manufacturing process of this transparent conductive substrate, and it was confirmed that there was no problem in interlayer adhesion. Also, the water vapor barrier property and the oxygen barrier property of the obtained transparent conductive substrate were measured, and the respective transmittances were 0.3 g / m ² · 24H and 0.1 cc / m.
^{It was 2}・ 24H ・ atm.

Further, the light transmittance, haze value, and retardation of the layer structure excluding the transparent electrode layer and the alignment layer were 80%, 0.6% and 25 nm, respectively. The haze value and the retardation were smaller than the total values of the single-layer polypropylene film and the poly (4-methylpentene-1) film constituting the transparent conductive substrate. This is because, when a transparent conductive substrate was produced, a thermal process was used, and thus these films, which were produced by a roll extrusion method and had an orientation, were thermally annealed and the orientation was relaxed. Conceivable.

Comparative Example 1 A transparent electrode and an alignment layer were provided on one surface of a 25 μm thick TPX film in the same manner as in Example 1. As a result, a film in which the alignment layer side was significantly concavely curled was obtained.

Comparative Example 2 A polycarbonate sheet having a thickness of 0.25 mm was coated with an ethylene-vinyl alcohol copolymer resin solution as an oxygen barrier layer and dried, and a phenoxy resin solution was further coated as a chemical resistant layer to dry the polycarbonate sheet on a reverse coater. As a result, the running of the sheet became unstable, and a coating film with spots was formed.

Example 5 A liquid crystal display device is manufactured using the transparent conductive substrate of Example 4. The counter substrate is prepared by providing a color filter on one surface of a transparent resin substrate, if necessary, a solid transparent electrode layer on this surface, and further providing an alignment layer. After spraying the spacers on the transparent conductive substrate, leaving a opening for the liquid crystal substance injection port, a cell is formed between the transparent conductive substrate and the counter substrate by the sealing material, and after injecting the liquid crystal material for the display part, this opening Seal. Then, a polarizing film is laminated on each of the transparent conductive substrate and the counter substrate to complete the liquid crystal display device which is an example of the display device of the present invention. When this was set in a compact and portable information terminal device, the weight was reduced by about 20%. Moreover, even if this small portable information terminal device was dropped from a height of 1 m, no damage was caused to the transparent conductive substrate.

[0055]

As described in detail above, the transparent conductive substrate according to claim 1 has excellent optical characteristics, gas barrier properties, and heat resistance. Further, it can be obtained by a simple production method in which the number of steps of using a solvent is small and the roll-to-roll method is easy to apply.

When the display device according to the second aspect is used for various small and portable information terminal devices, the weight and safety of these devices can be improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a first transparent resin base material forming a transparent conductive substrate.

FIG. 2 is a cross-sectional view showing another aspect of the first transparent resin base material forming the transparent conductive substrate.

FIG. 3 is a cross-sectional view of a layer structure in which a transparent electrode layer and an alignment layer are provided on one surface of a first transparent resin base material which constitutes a transparent conductive substrate.

FIG. 4 is a cross-sectional view showing another aspect of the layer structure in which a transparent electrode layer and an alignment layer are provided on one surface of a first transparent resin substrate which constitutes a transparent conductive substrate.

FIG. 5 is a cross-sectional view of a transparent conductive substrate.

FIG. 6 is a cross-sectional view showing another aspect of the transparent conductive substrate.

FIG. 7 is a cross-sectional view of a display device using a transparent conductive substrate.

[Explanation of Codes] 1 ... Oxygen barrier layer, 2 ... Water vapor barrier layer, 3 ... Heat-resistant protective layer, 4, 5, 9 ... Adhesive layer, 6 ... Surface treatment layer, 7 ...
Transparent electrode layer, 8 ... alignment layer, 10 ... second transparent resin substrate,
11 ... Hard coat layer, 21, 22 ... 1st transparent resin base material, 31, 32 ... Transparent conductive substrate, 41 ... Transparent conductive substrate, 42 ... Opposing transparent conductive substrate, 43 ... Display part, 4
4 ... Alignment layer, 45 ... Transparent resin base material, 46 ... Color filter, 47 ... Transparent electrode layer, 48 ... Polarizing film, 49 ...
Spacer, 50 ... Sealing material, 51 ... Display device.

Claims (2)

[Claims] 1. A first transparent resin base material having chemical resistance and heat resistance and having a transparent electrode layer provided on the main surface thereof, and a second transparent resin base material having shape maintaining property. A transparent conductive substrate characterized by being bonded. 2. A first transparent resin base material having chemical resistance and heat resistance and having a transparent electrode layer provided on its main surface and a second transparent resin base material having a shape-retaining property are adhered to each other. A transparent conductive substrate, a counter substrate arranged to face the transparent conductive substrate, and a display unit provided between the transparent conductive substrate and the counter substrate. Characteristic display device.