JPH09167900A - Chip mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a chip to be precisely corrected on positional deviation in the direction of rotation so as to mount it very accurately on a board. SOLUTION: A head nozzle which transfers and mounts a chip 15 on a board is composed of a nozzle holder 22 and a nozzle unit 23 mounted on the lower part of the nozzle holder 22 in a detachable manner. The nozzle unit 23 is equipped with a flange 25 and a nozzle 26. The tip 33 of an arm 32 extending from the nozzle holder 22 is fitted in a groove 34 provided in the upside of the flange 25 in a radial direction. When the nozzle is rotated around its axial line so as to correct the chip 15 on positional deviation in a direction of θ, an angular error is induced in the direction of rotation by looseness induced by a gap between the tip 33 and the groove 34, time angular error is very small because the arm 32 can be enhanced in arm length, therefore the positional error of the chip 15 in a direction of θ is very small, so that the chip 15 can be very accurately mounted on the board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus for vacuum-sucking a chip onto a nozzle of a head and transferring and mounting the chip on a substrate.

[0002]

2. Description of the Related Art A chip mounting apparatus is designed so that a chip of a head is vacuum-sucked and transferred onto a substrate. Further, in order to deal with damages to various types of chips and nozzles, the nozzles of the head are detachably attached to the nozzle holder on the head side and can be replaced.

FIG. 6A is a sectional view of a nozzle holder and a nozzle unit of a nozzle portion of a head of a conventional chip mounting apparatus, and FIG. 6B is a side view of the nozzle unit.
FIG. 7 is a plan sectional view of the nozzle holder and the nozzle unit in a coupled state. In FIG. 6A, a mounting hole 2 is formed in the center of the nozzle holder 1, and a pin 3 for preventing rotation of the nozzle unit 4 is inserted in the side surface. The nozzle unit 4 is composed of a collar portion 5, a nozzle 6 suspended from the center of the collar portion 5, and an upper thin taper head portion 7 protruding from the center of the collar portion 5. The head 7 is inserted into the mounting hole 2 of the nozzle holder 1. An elongated cut groove 8 is formed in the head portion 7. By inserting the pin 3 into the cut groove 8, the nozzle unit 4
Is a detent (see also FIG. 7). 6 (b)
FIG. 7 is a side view of the nozzle unit 4 of FIG. 6A as viewed from the right side.

[0004]

As shown in FIG. 7, a slight gap G between the pin 3 and the kerf 8 is unavoidable in terms of processing technology. On the other hand, in a state where the tip is vacuum-sucked to the lower end of the nozzle 6, the tip is observed by a recognition system such as a camera, and the positional deviation is detected. The positional deviation in the rotation direction (θ direction) is corrected by rotating the nozzle 6 by θ about the axis NA thereof, and then the chip is mounted on the substrate. However, since there is a gap G between the pin 3 and the kerf 8, an angular error θ ′ is generated during θ rotation, and thus the positional deviation in the rotational direction of the chip cannot be sufficiently corrected, and the mounting accuracy of the chip deteriorates. There was a problem.

Therefore, it is an object of the present invention to provide a chip mounting apparatus capable of accurately correcting a positional deviation of a chip in a rotation direction and mounting the chip on a substrate with high accuracy.

[0006]

To this end, according to the present invention, a chip supply unit, a substrate positioning unit, and a chip provided in the chip supply unit are vacuum-sucked by a nozzle of a nozzle unit to a substrate positioning unit. A chip mounting apparatus comprising a head for transfer and mounting on a positioned substrate, wherein the nozzle portion is a nozzle holder mounted on the head, and a nozzle detachably mounted on a lower end portion of the nozzle holder. The nozzle unit includes a brim portion, a nozzle vertically extending from the brim portion, and a head mounted in a mounting hole of the nozzle holder, and an engaged portion on an upper surface of the brim portion. In addition, the nozzle holder is provided with a rotation preventing member whose tip portion engages with the engaged portion.

[0007]

According to the configuration of the present invention, even if there is a gap between the engaged portion and the tip of the anti-rotation member engaging with the engaged portion, the length of the anti-rotation member is increased. Since the length can be made long, the angular error due to the clearance is extremely small, and therefore the positional deviation in the rotational direction of the chip can be accurately corrected and the chip can be mounted on the substrate with high accuracy.

Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention, FIG. 2 is a front view of a nozzle portion of the same head, FIGS. 3 and 4 are sectional views of the nozzle portion of the same head, and FIG. It is a simplified plan view of a nozzle portion of the head.

In FIG. 1, reference numeral 10 is a base on which a positioning portion 12 for the substrate 11 is provided. The positioning unit 12 clamps the substrate 11 for positioning. A chip supply unit 13 is provided on the side of the base 10. The chip supply unit 13 has a large number of parts feeders 14.
Are arranged side by side, and each parts feeder 14
Various types of chips 15 are stored in the. Base 1
An X table 16 and a Y table 17 which are orthogonal to each other are provided above 0, and a head 20 is held on the Y table 17. X table 16 and Y table 1
When the head 7 is driven, the head 20 horizontally moves in the X and Y directions, the chip 15 of the parts feeder 14 is vacuum-sucked and picked up by the lower end of the nozzle, and mounted on the substrate 11 at predetermined coordinate positions. Reference numeral 18 is a camera for chip observation.

A nozzle portion 21 is mounted on the head 20. Next, the structure of the nozzle portion 21 will be described with reference to FIGS. The nozzle portion 21 is composed of a nozzle holder 22 attached to the lower portion of the head 20, and a nozzle unit 23 detachably attached to the lower portion of the nozzle holder 22. A suction hole 24 is formed in the nozzle holder 22. The nozzle unit 23 has a disk-shaped brim portion 25.
And a nozzle 26 vertically provided at the center of the collar portion 25,
It is composed of a head portion 27 protruding from the center of the collar portion 25, and a suction hole 28 communicating with the suction hole 24 of the nozzle holder 22 is formed in the center thereof. The lower surface of the collar portion 25 serves as a light diffusion surface 29. The light diffusion surface 29 serves as a back plate when observing the chip 15 vacuum-adsorbed on the lower end portion of the nozzle 26 from below with the camera 18, and a black silhouette of the chip 15 is provided in the center of the white light diffusion surface. To be observed.

The outer surface of the head 27 has a wedge-shaped bulging shape, and the inner surface of the lower end of the nozzle holder 22 to which the head 27 is mounted is a tapered surface on which the outer surface of the head 27 fits. ing. Reference numeral 30 denotes an engaging claw, which is fitted to the outer surface of the nozzle holder 22 and the outer surface of the head portion 27, and a ring-shaped spring 31 is attached to the outer periphery thereof, whereby the nozzle unit 23 is attached to the nozzle holder 22. It As shown in FIG. 4, an arm 32 as a detent member extends outward from the lower end of the nozzle holder 22. The arm 32 is bent in a hook shape, and its tip 3
3 is engaged with a groove 34 as an engaged portion formed in the radial direction on the upper surface of the collar portion 25 (see also FIG. 5). 4 is a cross-sectional view taken along the line AA of FIG. 2, and FIG. 3 is a cross-sectional view of a plane orthogonal to this. Inside the head 20, means for rotating the nozzle portion 21 about its axis and means for causing the nozzle portion 21 to move up and down are incorporated.

The mounting device of this chip is constructed as described above, and its operation will be described below. In FIG. 1, X
The head 20 moves above the parts feeder 14 when the table 16 and the Y table 17 are driven, and the nozzle portion 21 moves up and down there to move the tip 15 provided in the parts feeder 14 to the lower end portion of the nozzle 26. It is vacuum-adsorbed and picked up.

Next, the head 20 moves above the camera 18, and the tip 15 vacuum-adsorbed on the lower end of the nozzle 26 is observed by the camera 18 in the X direction, Y direction, and rotation direction (θ direction). Detect misalignment. Next head 20
Moves above the substrate 11, where the nozzle portion 21 again moves up and down, and the vacuum suction state of the chip 15 is released, so that the chip 15 is mounted at a predetermined coordinate position on the substrate 11. Prior to this mounting, the misalignment of the chip 15 in the X, Y, and θ directions is corrected. X direction and Y
The positional deviation in the direction is corrected by adjusting the movement strokes of the head 20 in the X and Y directions due to the driving of the X table 16 and the Y table 17, and the positional deviation in the θ direction causes the nozzle portion 21 to move. Correct by rotating around the line.

As shown in FIG. 5, the tip portion 3 of the arm 32 is shown.
It is unavoidable in terms of processing technology that a gap G is formed between the groove 3 and the groove 3. Therefore, when the nozzle portion 21 is rotated about its axial center line NA in order to correct the positional deviation in the θ direction, an angular error θ occurs due to the clearance of the gap G. However, since the arm length L from the axial center line NA to the tip portion 33 is long, this angle error θ is considerably smaller than the angle error θ ′ of the conventional example shown in FIG. Therefore, the error in the θ direction of the chip 15 is extremely small, and the chip 15 can be mounted on the substrate 11 with high accuracy.

In the above embodiment, the transfer head is X.
Although the chip mounting device of the type that moves in the Y direction and the Y direction has been described as an example, the present invention is also applied to other types of devices such as a mounting device of a rotary type chip in which the transfer head moves in the rotational trajectory. it can.

[0016]

According to the present invention, even if there is a gap between the engaged portion formed on the collar portion of the nozzle unit and the nozzle holder side detent member engaging with the engaged portion, the rotation is prevented. Since the length of the stopper member can be made long, the angular error due to the clearance is extremely small. Therefore, the positional deviation of the chip in the rotational direction can be precisely corrected and the chip can be mounted on the substrate with high accuracy.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of a nozzle portion of a head of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a nozzle portion of a head of a chip mounting device according to an embodiment of the present invention.

FIG. 4 is a sectional view of a nozzle portion of a head of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 5 is a simplified plan view of a nozzle portion of a head of a chip mounting apparatus according to an embodiment of the present invention.

6A is a sectional view of a nozzle holder and a nozzle unit of a nozzle portion of a head of a conventional chip mounting apparatus, and FIG. 6B is a side view of a nozzle unit of a nozzle portion of a head of a conventional chip mounting apparatus.

FIG. 7 is a plan cross-sectional view of a nozzle holder and a nozzle unit of a head of a conventional chip mounting apparatus in a coupled state.

[Explanation of symbols]

 11 substrate 12 substrate positioning part 13 chip supply part 15 chip 16 X table 17 Y table 20 head 21 nozzle part 22 nozzle holder 23 nozzle unit 25 flange part 26 nozzle 27 head part 32 arm (rotation stop member) 33 tip part 34 groove part (Part to be engaged) L Arm length (length of rotation prevention member)

Claims (1)

[Claims] 1. A chip supply unit, a substrate positioning unit, and a head for vacuum-sucking a chip provided in the chip supply unit with a nozzle of a nozzle unit and transferring and mounting the chip on the substrate positioned in the substrate positioning unit. In a mounting device for a chip, the nozzle portion has a nozzle holder mounted on the head, and a nozzle unit detachably mounted on a lower end portion of the nozzle holder, and the nozzle unit includes It is composed of a collar portion, a nozzle vertically installed on the collar portion, and a head mounted in a mounting hole of the nozzle holder, and an engaged portion is formed on the upper surface of the collar portion, and the tip of the nozzle holder is attached to the engaged portion. A device for mounting a chip, characterized in that a detent member is provided so as to engage with the engaged portion.