JPH09167747A - Substrate treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To treat a substrate by a treatment solution without giving damage to the surface of the substrate and without adhesion of particles to the substrate by a method wherein a treatment disc, which is rotated keeping a little space from the surface of the substrate, is provided in the substrate treatment device. SOLUTION: A substrate surface treatment device 4 is provided with a treatment disc 46 which is rotated in the state having a little space between the surface of the device 4 and the surface of a substrate B. A treatment solution is discharged from the treatment solution discharging nozzle 92 provided in the center of rotation of the treatment disc 46 toward the surface of the substrate B in the state wherein the treatment disc 46 is being rotated. As a result, the treatment solution fed between the bottom face of the rotating treatment disc 46 and the surface of the substrate B is rotatingly moved in the radial direction by the induction of rotation of the treatment disc 46. The surface of the substrate B is washed by the powerful turbulent flow of the treatment solution having the prescribed viscosity. The surface of the substrate B is not damaged by the direct contact with the brush.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus for rotating a substrate such as a semiconductor or a liquid crystal and performing a cleaning process or a developing process on the surface of the substrate by a processing liquid supplied to the surface thereof. is there.

[0002]

2. Description of the Related Art Conventionally, there is known a substrate manufacturing apparatus for manufacturing a substrate such as a semiconductor or a liquid crystal, which is constructed by combining processing operation devices such as a developing device, an etching device, or a peeling device. In such a substrate manufacturing apparatus, a predetermined processing liquid is supplied from each of the unit processing apparatuses, and the substrate is subjected to a predetermined processing by the processing liquid. Therefore, when the substrate is transferred from the upstream side device to the downstream side device or when the substrate is finally finished, the processing liquid used in the previous processing is prevented from remaining on the substrate and the substrate itself is cleaned. Therefore, a cleaning apparatus, which is a kind of substrate processing apparatus, is provided in an appropriate place of the substrate manufacturing apparatus.

As such a cleaning device, a cleaning liquid is supplied only to the surface of the substrate being transported, or a cleaning liquid is supplied to the surface of the substrate rotated at a high speed, and the cleaning liquid is scattered by centrifugal force. It is known that the cleaning liquid is supplied to the substrate and the surface of the substrate is wiped and cleaned (brushing) by using a cleaning jig such as a brush.

[0004]

By the way, in the conventional brushing method, the brush bristles directly contact the surface of the substrate, so that the surface is scratched or particles generated by the abrasion of the brush bristles adhere to the surface. There is a problem in that

Further, when the processing device is a developing device, brushing is not usually performed, and a process of merely dropping a processing liquid (developing liquid) on a substrate being transported or rotating at high speed is performed. In the processing, there is a problem that the processing liquid may not be able to be reliably supplied to the details of the surface of the substrate.

The present invention has been made in order to solve the above-mentioned problems, and does not damage the surface of the substrate at all, and the substrate is treated with the treatment liquid in a state where particles do not adhere. An object of the present invention is to provide a substrate processing apparatus that can be surely applied.

[0007]

According to the first aspect of the present invention,
A substrate processing apparatus for supplying a processing liquid to a surface of a substrate for processing while rotating the substrate, the substrate supporting means being configured to be rotatable, and supporting the substrate with the surface of the substrate exposed. Rotating means for rotating the substrate supporting means, processing liquid supplying means for supplying the processing liquid to the surface of the substrate supported by the substrate supporting means, and predetermined processing on the surface of the rotating substrate by the processing liquid supplied to the substrate. Substrate surface processing means for performing the above processing, wherein the substrate surface processing means is provided with a processing disk that rotates in a state in which the facing surface is separated from the surface of the substrate by a slight distance. It is a thing.

According to the present invention, on the surface of the substrate supported by the substrate supporting means rotating by the operation of the rotating means,
By supplying the treatment liquid from the treatment liquid supply means and rotating the treatment disc facing the surface of the substrate with a slight gap, the treatment liquid entering between the treatment disc and the surface of the substrate is treated. The bottom surface of the substrate and the surface of the substrate are in a kneaded state due to the viscosity of the liquid, and are moved in the radial direction of the processing disk by centrifugal force, and the strong liquid flow reliably processes the surface of the substrate.

Then, by setting the diameter of the processing disk to a considerable size, the entire surface is processed by the rotation of the substrate.

The invention according to claim 2 is characterized in that, in the invention according to claim 1, the processing disk is configured to swing in a direction orthogonal to the surface of the substrate. is there.

According to the present invention, the vertical movement of the processing disk changes the distance between the bottom surface of the processing disk and the surface of the substrate. Therefore, the state of the processing liquid flow existing in the gap between the two changes. However, the change in the liquid flow more reliably treats the surface of the substrate.

The invention according to claim 3 is the invention according to claim 1 or 2.
In the substrate processing apparatus described above, the processing disk is configured to be movable in a direction parallel to the surface of the substrate.

According to the present invention, even if the size of the processing disk is considerably smaller than the size of the substrate, the processing disk is moved in parallel so as to scan the surface of the rotating substrate. The entire surface is processed.

According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the processing disk has a discharge port for discharging a processing liquid in a central portion thereof, and the processing is performed. The liquid supply means is configured to discharge the processing liquid from the discharge port toward the surface of the substrate.

According to the present invention, a new processing liquid is constantly supplied between the processing disk and the surface of the substrate by discharging the processing liquid from the discharge port provided in the processing disk.
The speed of discharge of the processing liquid from the discharge port is added to the speed of the liquid flow due to the rotation of the processing disk, and the liquid flow between the processing disk and the surface of the substrate becomes faster, so that the substrate is processed by the processing liquid more efficiently. It will be surely done.

[0016]

1 is a partially cutaway perspective view showing an embodiment of a substrate processing apparatus 1 according to the present invention.
FIG. 2 is a cross-sectional view taken along the line AA of the substrate processing apparatus 1 shown in FIG. In addition, in FIG. 1, the outer hood 7 shown in FIG.
8 is omitted in the drawing. In these figures, the substrate processing apparatus 1 is for cleaning the surface of the substrate B for a liquid crystal display device with pure water (processing liquid). The substrate processing apparatus 1 includes a substrate supporting unit 2 that supports a rectangular substrate B, and a rotating unit 3 that rotates the substrate supporting unit 2 around the center of the substrate B supported by the substrate supporting unit 2.
A processing liquid supply means 5 for supplying a processing liquid to the surface of the substrate B supported by the substrate supporting means 2 and a substrate surface processing means 4 for performing processing with the processing liquid supplied to the surface of the substrate B are provided. Has been formed.

The substrate processing apparatus 1 has a base T (FIG. 2).
It is supported by a cylindrical column 6 which is erected upright. The cylindrical strut 6 is formed of a cylindrical strut body 61 having a circular fitting hole 60 extending in the up-down direction, and a flange portion 62 formed at the lower portion of the cylindrical strut body 61. On the other hand, the base T is provided with a mounting hole T1 having a diameter slightly larger than the outer diameter of the cylindrical support body 61.
The cylindrical support body 61 is fixed to the base T by fitting the portion of the cylindrical support main body 61 below the flange portion 62 and bolting the flange portion 62 and the base T together in this state.

The substrate supporting means 2 is a plate-shaped circular rotary base 21, a plate-shaped circular straightening plate 22 integrally provided on the rotary base 21, and a center portion of the rotary base 21 concentrically. It is formed from the vacuum chuck 23 provided. Cylindrical spacers 24 are arranged between the rotary base 21 and the current plate 22 at equal pitches along the peripheral edge of the rotary base 21 and the rotary base 21 by screwing through the cylindrical spacers 24. The current plate 22 is integrally fixed. Further, the straightening plate 22 includes
A board mounting port 22a into which the board B is fitted is provided in the central portion.

The vacuum chuck 23 has a hollow interior, and a horizontal surface is formed on the upper portion, and a large number of suction holes 23a are formed in the horizontal surface. Then, with the substrate B mounted in the substrate mounting port 22a placed on the horizontal surface of the vacuum chuck 23, the surface of the substrate B and the surface of the current plate 22 are flush with each other. Height is set.

Then, the substrate B is the vacuum chuck 23.
By depressurizing the space inside the vacuum chuck 23 in the state of being placed on the top, the back surface of the substrate B is adsorbed to the front surface of the vacuum chuck 23, whereby the substrate B
The mounting state of the substrate to the substrate mounting port 22a is stabilized.

The rotation means 3 is a rotation drive mechanism 31 formed by combining a drive motor, a driving force transmission means and the like.
And a vertical rotary shaft 32 connected to the rotary drive mechanism 31.
Are formed. The vertical rotation shaft 32 has an outer diameter slightly smaller than the inner diameter of the fitting hole 60 of the cylindrical column 6 and can be fitted into the fitting hole 60. Then, in the state where the vertical rotation shaft 32 is fitted in the fitting hole 60, a vertical bearing 33 is interposed between the vertical rotation shaft 32 and the vertical rotation shaft 32.
It is rotatable about its own axis while being supported by 1.

The vacuum chuck 23 is concentrically and integrally fixed to the top of the vertical rotary shaft 32.
Therefore, the vertical rotation shaft 3 is driven by the rotation drive mechanism 31.
When 2 is rotated, this rotation is caused by the vacuum chuck 23.
It is transmitted to the rotary base 21 and the current plate 22 through the board, and the board B mounted in the board mounting opening 22a also rotates.

The vertical rotary shaft 32 is provided with a suction passage 32a (FIG. 2) extending in the vertical direction at the axial center thereof.
The suction passage 32a is connected to the vacuum pump 34. Therefore, the vacuum chuck 23 of the substrate supporting means 2
By driving the vacuum pump 34 with the substrate B placed thereon, the inside of the cavity of the vacuum chuck 23 is decompressed, whereby the substrate B is sucked toward the suction holes 23a and sucked by the vacuum chuck 23. It will be in a state of being.

A liquid collecting and exhausting means 7 is provided around the substrate supporting means 2 so as to surround the substrate supporting means 2 as shown in FIG. The liquid collecting and exhausting means 7 is
It is for capturing and collecting the processing liquid supplied onto the substrate B from the substrate surface processing means 4, and has an annular bottom portion 71.
a and the substrate supporting means 2 from the peripheral portion of the bottom portion 71a.
A collecting hood 71 having an annular wall 71b that is erected so as to surround the connecting hood 71, a plurality of connecting pipes 72 whose upper end is connected to a bottom 71a of the collecting hood 71, and a lower end of each connecting pipe 72 is connected. The liquid collecting duct 73 has an annular shape and a liquid collecting device 74 connected to the liquid collecting duct 73.

The upper edge of the annular wall 71b is curved toward the center, so that the processing liquid which is scattered outward in the radial direction of the flow straightening plate 22 by the centrifugal force due to the rotation of the substrate supporting means 2 is sure. Therefore, the splashed portion of the processing liquid is prevented from jumping out of the liquid collection hood 71.

The bottom portion 71a of the liquid collecting hood 71 is provided with a through hole at the center thereof for allowing the vertical rotation shaft 32 to penetrate therethrough, and the vertical rotation shaft 32 is inserted into the through hole to form a through hole. The edge is fixed to the top of the vertical rotation shaft 32 by bolting, whereby the liquid collecting hood 71 is attached around the substrate supporting means 2.

The liquid collecting device 74 is formed by arranging an eliminator 74a, which is a gas-liquid separating device, and a suction blower 74b in series. Then, by driving the suction blower 74b, the processing liquid supplied from the substrate surface processing means 4 and spun in the radial direction of the straightening plate 22 by the centrifugal force by the rotation of the substrate B is the annular wall 71b of the liquid collecting hood 71.
Is introduced into the eliminator 74a through the connecting pipe 72 and the liquid collecting duct 73, and is removed by the gas-liquid separation process here. The airflow after the treatment liquid is removed is discharged to the outside of the system through the suction blower 74b.

The bottom portion 71 of the liquid collecting hood 71 is
An annular wall member 75 is provided on a so as to surround the upper portion of the vertical rotation shaft 32, and an outer peripheral surface 75a of the annular wall member 75 is provided.
An annular airflow passage is formed between the liquid collecting hood 71 and the inner surface of the liquid collecting hood 71. An annular umbrella member 76 is provided between the inner peripheral surface 75b of the annular wall member 75 and the vertical rotation shaft 32.
The umbrella member 76 prevents the processing liquid dropped from above from entering the fitting hole 60.

Further, the space formed between the inner peripheral surface 75b of the annular wall member 75 and the outer peripheral surface of the umbrella member 76 is defined by the connecting pipe 7
The processing liquid 7 is communicated with the inside of the communication pipe 72 by this, and thereby the processing liquid that has entered the space is led out into the communication pipe 72 through the connection pipe 77.

Further, an outer hood 78 is provided on the outer periphery of the liquid collecting hood 71 so as to surround the liquid collecting hood 71, and the outer hood 78 captures the processing liquid that has jumped out of the liquid collecting hood 71. , Through the connecting pipe 79 provided at the bottom of the connecting pipe 79.

The substrate surface treatment means 4 is provided inside the outer hood 78 and adjacent to the liquid collecting hood 71. FIG. 3 is a partially cutaway perspective view showing an embodiment of the substrate surface treatment means 4, and FIG.
FIG. 4 is a cross-sectional view taken along line B. First, as shown in FIG. 3, the substrate surface treatment means 4 includes a support frame body 40, a drive mechanism 41 provided in the support frame body 40, a drive arm 45 for performing a predetermined operation by driving the drive mechanism 41, and Drive arm 45
Processing disk 46 provided at the tip of the disk, and processing disk 46
Processing liquid source 5a for supplying the processing liquid to the surface of the substrate B via the
Are formed.

The support frame 40 is formed in a rectangular parallelepiped shape in which a bottom plate 40a and a ceiling plate 40b are supported via four columns 40c. The support frame 40 has a pair of guide holes 402 facing each other in the vertical direction on the bottom plate 40a and the ceiling plate 40b at the rear (right side in FIG. 3). On the other hand, a guide rod 401 is erected on the base T (FIG. 2), and the guide holes 401 are provided in the guide rod 401.
2 is externally fitted in a sliding contact state, whereby the support frame 40 can be moved up and down while being guided by the guide rod 401. In addition, a pair of upper and lower screw holes 403 are screwed in substantially the central portions of the bottom plate 40a and the ceiling plate 40b, and a circular mounting hole 404 is formed in front of the ceiling plate 40b.

The drive mechanism 41 comprises an elevating means 42, an arm turning means 43 and a disk rotating means 44. The elevating means 42 is for elevating and lowering the support frame 40, and is concentrically connected to the first drive motor 42a vertically installed on the base T and the drive shaft of the first drive motor 42a. And a screw shaft 42b. The screw shaft 42b is screwed into screw holes 403 screwed in the bottom plate 40a and the ceiling plate 40b of the support frame 40, and is rotated by the first drive motor 42a to rotate the screw shaft 42b forward and backward. The body 40 moves up and down.

The arm revolving means 43 is a support frame 40.
Second drive motor 43a vertically installed on the bottom plate 40a of the vehicle, a drive pulley 43b provided on the drive shaft of the second drive motor 43a, and a mounting hole 4 for the ceiling plate 40b.
04 includes an arm support cylinder 43c fitted in the 04, a driven pulley 43d provided at the lower end of the arm support cylinder 43c, and a connecting belt 43e stretched between the driven pulley 43d and the drive pulley 43b. There is.

The arm support cylinder 43c is rotatably fitted in the mounting hole 404 of the ceiling plate 40b in a state in which the vertical movement is restricted. Therefore, the second drive motor 4
By driving 3a, the driving rotation is transmitted to the arm support cylinder 43c via the drive pulley 43b, the connecting belt 43e and the driven pulley 43d, and the arm support cylinder 4c.
3c will rotate around a center line extending in the vertical direction.

The disc rotating means 44 is the arm supporting cylinder 4
3c, a third drive motor 44a installed vertically on a bottom plate 40a, a vertical shaft 44b coupled to the drive shaft of the third drive motor 44a, and a drive pulley provided on the upper end of the vertical shaft 44b. 44c, a driven pulley 44d mounted on a disk support shaft 9 described later, and a connecting wire 44e stretched between the driven pulley 44d and the drive pulley 44c.

The vertical shaft 44b is an arm support cylinder 43c.
The inside is concentrically extended upward, and the upper part thereof is the arm support cylinder 4
The drive pulley 44c is integrally attached to a portion of the vertical shaft 44b which is axially supported by the bearing portion 43g of the 3c and projects upward from the bearing portion 43g of the vertical shaft 44b. Then, the drive rotation is driven by the third drive motor 44a to drive the vertical shaft 44b, the drive pulley 44c, and the connecting wire 4.
It is adapted to be transmitted to the disk support shaft 9 via 4e and the driven pulley 44d.

The drive arm 45 includes an arm body 45a having a hollow interior, a connecting portion 45b provided at the base end of the arm body 45a and having an opening in a direction orthogonal to the longitudinal direction, and an arm body 45a. And a disk support portion 45c formed at the tip of the.

A female screw corresponding to the male screw portion 43f of the arm support cylinder 43c is screwed on the inner peripheral surface of the connecting portion 45b of the drive arm 45, and this female screw is screwed into the male screw portion 43f. The arm body 45a is coupled to the arm support cylinder 43c so as to extend in the horizontal direction. A bearing portion 45d that supports the disc support shaft 9 is provided on the inner bottom of the disc support portion 45c. A bearing 45e is provided between the inner peripheral surface of the bearing portion 45d and the outer peripheral surface of the disk support shaft 9.

The processing disk 46 has a screw hole 46a at the center thereof which penetrates in the vertical direction. On the other hand, a male screw corresponding to the screw hole 46a is screwed on the lower portion of the disc support shaft 9, and the processing disc 46 is attached to the disc support shaft 9 by screwing the disc support shaft 9 into the screw hole 46a. It can be attached. The disc support shaft 9 is provided with a processing liquid passage 91 penetrating in the vertical direction in the axial center portion thereof, and a processing liquid discharge nozzle 92 is formed at the lower end of the processing liquid passage 91. The processing liquid is discharged from the discharge port 92.

The treatment liquid source 5a is a treatment liquid tank 51 for storing the treatment liquid in a hermetically sealed state, and a treatment liquid conduit 5 connecting the treatment liquid tank 51 and the treatment liquid passage 91 of the disc support shaft 9 to each other.
Two. High-pressure nitrogen is supplied to the processing liquid tank 51 via a regulator 54.
The pressure of the high-pressure nitrogen causes the internal processing liquid to be drawn out through the processing liquid pipe 52. Further, an opening / closing valve 53 is provided at an appropriate position in the processing liquid pipe line 52, and the opening / closing operation of the opening / closing valve 53 causes the processing liquid in the processing liquid tank 51 to be discharged and stopped.

The processing liquid pipe line 52 has its downstream side guided into the drive arm 45, and has its downstream end connected to the upper end of the processing liquid passage 91 of the disk support shaft 9. Specifically, the disc support shaft 9 is provided with a rotary joint 93 at its upper end, and the treatment liquid from the treatment liquid conduit 52 is passed through the rotary joint 93 to the treatment liquid passage 91 of the disc support shaft 9. It is being supplied. The rotary joint 93 is capable of supplying the processing liquid from the processing liquid pipe 52 to the processing liquid passage 91 while allowing the rotation of the disk support shaft 9.

FIG. 5 is a bottom view showing the processing disk 46. As shown in this figure, a plurality of line grooves 46b intersecting with each other are formed in the bottom surface of the processing disk 46. The processing liquid discharged from the processing liquid discharge nozzle 92 of the rotating processing disk 46 enters the line groove 46b between the bottom surface of the processing disk 46 and the surface of the substrate B (FIG. 1),
It is sheared horizontally by the high speed rotation of the processing disk 46,
As a result, a strong turbulent liquid flow is generated, and the surface of the substrate B can be treated more reliably.

Incidentally, in this embodiment, the processing disk 4 is used.
The rotation speed of No. 6 is set to about 200 to 500 rpm, and the discharge rate of the processing liquid is set to about 2000 cm ³ / min. Then, the discharge of the treatment liquid is continued for about 10 seconds. Further, the size of the gap between the bottom surface of the disk support shaft 9 and the surface of the substrate B is set to 2-3 mm.

The operation of this embodiment will be described below.
First, as shown by the chain double-dashed line in FIG. 1, the drive arm 45 is positioned at a storage position where it does not interfere with the board mounting opening 22a of the board supporting means 2, and the board B is mounted on the board mounting opening 22a.
It is loaded into a and then driven by the vacuum pump 34 (FIG. 2) so that it is attracted to the vacuum chuck 23.

In this state, the drive arm 4 is driven by the first drive motor 42a of the elevating means 42 through the support frame 40.
5 is once raised so that the processing disk 46 does not interfere with the upper edge of the annular wall 71b of the liquid collection hood 71. Then, the drive arm 45 is rotated together with the arm support cylinder 43c by driving the second drive motor 43a of the arm revolving means 43, and the disk support portion 45c is positioned substantially in the center of the substrate B, and then the first drive is performed again. By driving the motor 42a, the drive arm 45 is lowered, and when the gap between the bottom surface of the disc support shaft 9 and the surface of the substrate B reaches 2-3 mm, the drive arm 45 is stopped. With this initial operation, the preparatory stage for substrate processing is completed as shown by the solid line in FIG.

Then, the rotary drive mechanism 31 is driven to rotate the vertical rotary shaft 32 at approximately 200 to 2000 rpm, and at the same time, the third drive motor 44a is driven to drive the vertical shaft 44.
The processing disk 46 is rotated via b, the drive pulley 44c, the connecting wire 44e, and the driven pulley 44d (approximately 200 to
(500 rpm) and the opening / closing valve 53 of the processing liquid conduit 52 is opened. Second drive motor 43a
Are driven at regular intervals to reciprocate at a speed of about 150 mm / sec so that the disk support shaft 9 traverses over the current plate 22.

By doing so, the processing liquid from the processing liquid tank 51 passes through the processing liquid conduit 52, and from the processing liquid discharge nozzle 92 provided at the center of the disk supporting shaft 9, the rotating disk supporting shaft 9 is rotated. Is discharged into a small gap (2 to 3 mm) between the bottom surface of the substrate and the surface of the substrate B.

Then, the processing liquid discharged from the processing liquid discharge nozzle 92 is rotated by the high-speed rotation of the processing disk 46 as shown in FIG. 6 (in the example shown in FIG. 6, the processing disk 46 is indicated by a white arrow). Is rotating clockwise around the disk support shaft 9). The diameter of the processing disk gradually increases, and the processing disk performs a circular motion in a meandering state by the rotation of the substrate B and the action of the line groove 46b of the processing disk 46. It is extruded outward from the peripheral portion of 46. The strong turbulent liquid flow at this time ensures that the surface of the substrate B has been subjected to the cleaning treatment.

Further, during the processing of the substrate B, the first drive motor 42a is driven forward and backward at predetermined time intervals, whereby the drive arm 45 is swung in the vertical direction. By doing so, the gap size between the bottom surface of the processing disk 46 and the surface of the substrate B is periodically changed, and the discharge pressure of the processing liquid from the processing liquid discharge nozzle 92 is periodically changed, so that the impact of the water flow is generated. Since the so-called hammer effect that is added to the surface of B is obtained, the cleaning process of the surface of the substrate B can be performed better.

According to the present invention, as described above in detail, the substrate surface processing means 4 is provided with the processing disk 46 which rotates with the facing surface separated from the surface of the substrate B by a slight distance. Moreover, the processing liquid discharge nozzle 92 is provided at the center of rotation of the processing disk 46, and the processing liquid is discharged from the processing liquid discharge nozzle 92 toward the surface of the substrate B while the processing disk 46 is rotated. Therefore, the processing liquid supplied between the bottom surface of the rotating processing disk 46 and the surface of the substrate B is guided by the rotation of the processing disk 46 and moves in the radial direction while rotating. The surface of the substrate B is cleaned by a strong turbulent flow of the processing liquid having a predetermined viscosity.

As described above, in the present invention, the processing disk 46 is set in a state of being separated from the surface of the substrate B at the time of processing the surface of the substrate B by discharging the processing liquid. Since the brushing process is not performed, the surface of the substrate B is not damaged by direct contact with the brush. Further, particles due to abrasion of the brush do not adhere to the surface of the substrate B, and it is possible to reliably prevent recontamination of the surface of the substrate B. Further, it is possible to reliably prevent recontamination of the surface of the base B by the particles attached to the brush.

The present invention is not limited to the above embodiment, but also includes the following contents. (1) In the above embodiment, the substrate processing apparatus 1 is applied to the cleaning processing of the substrate B with pure water, but the present invention is not limited to the substrate processing apparatus 1 being applied only to the cleaning processing. However, the present invention can also be applied to so-called substrate B development processing in which a developing solution as a processing solution is supplied to the surface of the substrate B in the developing step.

(2) In the above embodiment, the processing liquid is discharged from the processing liquid discharge nozzle 92 provided at the rotation axis of the processing disk 46.
It is not limited to discharging the processing liquid from the processing liquid discharging nozzle 92 of the processing disk 46, and a processing liquid discharging nozzle for discharging the processing liquid toward the surface of the substrate B may be separately provided. .

(3) In the above embodiment, the processing disk 46 is swung in the vertical direction by the forward and reverse driving of the first drive motor 42a. However, instead of this, the disk support portion of the drive arm 45 is used. An actuator made of an electromagnet or the like may be installed inside 45c, and the processing disk 46 may be vertically swung by the operation of this actuator.

(4) In the above embodiment, the vertical and horizontal grid-shaped line grooves 46b are provided on the bottom surface of the processing disk 46, but the line grooves 46b are not limited to the grid-like shape. Instead, it is possible to adopt various shapes capable of stirring the processing liquid. Further, even if the line groove 46b is not provided, a desired level of processing effect can be obtained.

[0057]

According to the first aspect of the present invention, there is provided the substrate surface treating means for subjecting the surface of the substrate rotating by the operation of the rotating means to the predetermined treatment by the treating liquid supplied thereto. Since the processing means comprises a processing disk that rotates with the facing surface spaced apart from the surface of the substrate by a slight distance, the surface of the substrate that is rotating while being supported by the substrate support means. In addition, while supplying the processing liquid from the processing liquid supply means, by rotating the processing disk facing the surface of the substrate, the processing liquid that has entered between the processing disk and the surface of the substrate is the bottom surface of the processing disk. Between the substrate and the surface of the substrate becomes a kneaded state due to the viscosity of the liquid, and it moves in the radial direction of the processing disk by centrifugal force, making it possible to reliably process the surface of the substrate with these strong liquid flows. Become.

According to the second aspect of the present invention, since the processing disk is swung in the direction orthogonal to the surface of the substrate, the distance between the bottom surface of the processing disk and the surface of the substrate is increased. Changes, the state of the processing liquid flow existing in the gap between the two changes, and the change in the liquid flow allows the surface of the substrate to be processed more reliably.

According to the third aspect of the present invention, since the processing disk can move in the direction parallel to the surface of the substrate, the size of the processing disk is considerably smaller than the size of the substrate. However, by moving the processing disk in parallel so as to scan the surface of the rotating substrate, the entire surface of the substrate can be surely processed.

According to the invention described in claim 4, since the processing disk has the discharge port for discharging the processing liquid toward the surface of the substrate in the central portion thereof, the discharge port provided in the processing disk. A new processing liquid is constantly supplied between the processing disk and the surface of the substrate by discharging the processing liquid from the substrate, and the discharging speed of the processing liquid from the discharge port is added to the speed of the liquid flow due to the rotation of the processing disk. As the liquid flow between the processing disk and the surface of the substrate becomes faster, the processing of the substrate with the processing liquid can be performed more reliably.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view showing an embodiment of a substrate processing apparatus according to the present invention.

2 is a cross-sectional view taken along the line AA of the substrate processing apparatus shown in FIG.

FIG. 3 is a partially cutaway perspective view showing an embodiment of a substrate surface treatment means.

FIG. 4 is a sectional view taken along line BB of the substrate surface treatment means shown in FIG.

FIG. 5 is a bottom view showing the processing disk.

FIG. 6 is an explanatory diagram showing a liquid flow of a processing liquid discharged from a processing liquid discharge nozzle of a processing disk.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 2 Substrate supporting means 21 Rotating substrate 22 Straightening plate 22a Substrate mounting port 23 Vacuum chuck 3 Rotating means 31 Rotational drive mechanism 32 Vertical rotation shaft 32a Suction passage 33 Bearing 34 Vacuum pump 4 Substrate surface treating means 40 Support frame 40a Bottom plate 40b Ceiling plate 40c Strut 401 Guide rod 41 Drive mechanism 42 Elevating means 43 Arm rotating means 44 Disc rotating means 45 Drive arm 46 Treatment disc 46a Screw hole 46b Line groove 5 Treatment liquid supply means 5a Treatment liquid source 51 Treatment liquid tank 52 Processing liquid conduit 53 Opening / closing valve 6 Cylindrical support 7 Liquid collecting and exhausting means B Substrate

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical indication H01L 21/306 H01L 21/306 J

Claims (4)

[Claims] 1. A substrate processing apparatus for supplying a processing liquid to a surface of a substrate for processing while rotating the substrate, which is configured to be rotatable and supports the substrate with the surface of the substrate exposed. Substrate supporting means, rotating means for rotating the substrate supporting means, processing liquid supplying means for supplying a processing liquid to the surface of the substrate supported by the substrate supporting means, and rotating by the processing liquid supplied to the substrate. Substrate surface treatment means for performing a predetermined treatment on the surface of the substrate is provided, and the substrate surface treatment means is provided with a treatment disk that rotates in a state in which the facing surface is separated from the surface of the substrate by a slight distance. A substrate processing apparatus characterized by the above. 2. The substrate processing apparatus according to claim 1, wherein the processing disk is configured to swing in a direction orthogonal to the surface of the substrate. 3. The substrate processing apparatus according to claim 1, wherein the processing disk is configured to be movable in a direction parallel to the surface of the substrate. 4. The processing disk has a discharge port for discharging the processing liquid in its central portion, and the processing liquid supply means discharges the processing liquid from the discharge port toward the surface of the substrate. 4. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is configured as described above.