JPH09165661A - Formation of striped solder plating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming striped solder plating capable of applying striped plating on the surfaces of a long-sized metallic band-shaped material. SOLUTION: Highly heat resistant masking tapes 6, 7 are stuck to both surfaces of a copper tape 1 in the process of transporting the copper tape 1 to mask these surfaces. While the copper tape 1 stuck with these masking tapes 6, 7 is transported, the masking tape 6 is subjected to cutting of stripe patterns by a cutter 8 and, thereafter, the copper tape is immersed into molten solder 12 in a solder tank 11, by which solder films 16 are formed on the cut surfaces of the masking tape 6. The masking tapes 6, 7 are successively peeled from the surfaces of the copper tape 1 with which the immersion ends.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating method for plating a strip of metal solder on the surface of a metal strip such as a copper tape.

[0002]

2. Description of the Related Art Conventionally, when metal plating is performed on the surface of a metal strip material such as a copper tape, an electroplating method utilizing electrodeposition by electrolysis is used. This method is carried out using the plating apparatus shown in FIG. As shown in FIG.
A copper tape 203, which is a material to be plated, is placed in a plating tank 201 filled with an electrolytic solution 202 (including ions of a metal to be plated), and further, an electrode 204 (or an insoluble material) is provided so as to face the copper tape 203. Metal). The DC power supply 20 is placed between the copper tape 203 and the electrode 204.
5 is connected, + voltage is applied to the electrode 204, and-is applied to the copper tape 203.
Apply voltage.

To perform plating, the surface of the copper tape 203 is cleaned in advance, and when it is desired to perform striped plating, a tape provided with slits or a tape having a narrow width at regular intervals is attached at regular intervals. This copper tape 2
03 is immersed in the plating bath 201, and the copper tape 203 and the electrode 2
An appropriate potential difference is applied between 04. As a result, the metal reduced from the cations is deposited, and a film (plating) is formed on the surface of the copper tape 203 that is the cathode.

[0004]

However, according to the conventional striped plating method, the electroplating method is mainly used, and the molten solder plating method is not used. The reason for this is that the dipping method is used for solder plating, and the material to be plated is dipped in a solder bath filled with molten solder. This is because the high heat solder is in contact with the entire surface, and it is difficult to perform the masking process for the stripe.

As a conventional hot dip plating method, for example,
JP-A-49-106926 and JP-A-49-11
Japanese Laid-Open Patent Publication No. 2571 discloses a technique in which a tape is attached to a strip material where plating is not required, the tape is supplied to a plating device, and the exposed portion is plated. However, it cannot be applied to long thin objects such as copper tape. Further, Japanese Patent Publication No. 62-31077 discloses a conventional technique in which a non-conductive pressure-sensitive adhesive tape is attached while leaving a predetermined plating pattern on the surface of a strip, and the tape is introduced into a plating solution for plating. However, in order to prevent the difficulty of sticking the tape in a predetermined position in this case, and to consume a large amount of the tape, apply a UV curable resist to a portion other than the plating pattern using a spin coater, This coating film is cured by ultraviolet rays to form a mask, and a plating solution is sprayed on this surface to plate the pattern portion. However, there is a possibility that the equipment cost increases and the plating thickness cannot be made uniform.

[0006] Therefore, an object of the present invention is to provide a method for forming stripe solder plating capable of performing stripe plating on the surface of a long metal strip.

[0007]

In order to achieve the above-mentioned object, the present invention is to apply a high heat-resistant tape to both sides of a metal strip material for masking, and immerse the masked metal strip material in molten solder. Form a solder film on the non-masking surface,
The high heat resistant tape is peeled off from the surface of the metal strip after the immersion.

According to this method, the stripe pattern can be formed by masking the surface of the metal strip with a high heat resistant tape and then cutting with a cutter or the like. By dipping the metal strip having this pattern in the molten solder, the molten solder adheres to the portion where the high heat resistant tape is not provided, and the solder plating can be continuously performed. Therefore, stripe plating can be applied to the surface of the long metal strip with a simple facility.

A polyimide film adhesive tape can be used as the high heat resistant tape. According to this method, the polyimide film withstands high temperatures, does not melt or burn even when immersed in molten solder, and enables solder plating by immersion. In the high heat resistant tape, a high temperature high viscosity material or a mixture of a high temperature high viscosity material and a thermosetting resin can be used as an adhesive.

According to this method, the highly heat-resistant tape adhered to the metal strip does not peel off from the metal strip or is not displaced even when immersed in the molten solder, and the forced stripping treatment is performed. The adhesive strength is maintained until the above step is performed, and the solder plating can be applied only to the non-masking portion.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a block diagram showing an outline of equipment for achieving a method for forming stripe solder plating according to the present invention. In FIG. 1, a copper tape 1 as a metal strip is pulled out from a drum (not shown) or the like, and is horizontally moved through pressure rolls 2 and 3 (each composed of an upper roll and a lower roll) arranged at a predetermined distance. Be transported. Immediately before the pressure rolls 2 and 3, the high heat resistance masking tapes 6 and 7 drawn from the reels 4 and 5 are superposed on the upper and lower surfaces of the copper tape 1 so as to be in close contact with each other. And is conveyed integrally with the copper tape 1. At this time, as shown in the cross-sectional view of FIG. 2, the masking tapes 6 and 7 are brought into close contact with the copper tape 1 by the pressure roll 2 while the copper tape 1 is completely wrapped.

As the masking tapes 6 and 7, for example, an adhesive tape made of a polyimide film can be used, and as the adhesive, a high temperature and high viscosity material is used, or a mixture of a high temperature and high viscosity material and a thermosetting resin is used. A thing can be used. In order to enable stripe solder plating in a later step, a cutter 8 is installed between the pressure roll 2 and the pressure roll 3 to remove unnecessary portions. Then, in order to wind up the masking tape 6a removed by the cutter 8, a roll 9
And a reel 10 are provided.

A solder bath 11 for performing solder plating is installed behind the pressure roll 3, and molten solder 12 is placed in the bath.
Is satisfied. Rolls 13 and 14 are provided on both sides above the solder bath 11 in order to immerse and insert the copper tape 1 to which the masking tapes 6 and 7 are adhered in the molten solder 12. Behind the roll 14, a tape removing device 15 is installed in order to remove the masking tapes 6 and 7 after the soldering process.

In the above equipment, in order to perform stripe plating on a copper material, the copper tape 1 is continuously inserted into the pressure roll 2. At this time, the copper tape 1 is nipped between the rolls, and at the same time, the masking tapes 6 and 7 are overlapped and attached on both upper and lower surfaces, and both ends 6a and 7a of the masking tapes 6 and 7 are pressure-bonded. After leaving the pressure roll 2, a part of the masking tape 6 is cut in the lengthwise direction by a cutter 8, a striped pattern is cut out on the masking tape 6, and the cut out part is wound by a reel 10. After this, the masked copper tape 1 is pressed onto the pressure roll 3
And it is sent to the solder bath 11 via the roll 13.
Since the solder bath 11 is filled with the molten solder 12, the molten solder adheres to the surface of the copper tape 1 where the masking tape 6 has been removed while being immersed in the molten solder 12. This state is shown in the cross-sectional view of FIG. 3, and the solder film 16 adheres to the cutout portion of the masking tape 6, and this becomes the stripe plating. In this state, the copper tape 1 is sent to the tape removing device 15 via the roll 14, and the masking tapes 6 and 7 which are no longer needed are peeled off from both sides of the copper tape 1 to form the stripe-plated copper. Only eject tape 1. If a blade having heat resistance and elasticity such as urethane rubber is placed immediately before the roll 13 and the solder forming surface is squeezed, excess solder can be removed and the plating thickness can be made uniform. it can.

In such stripe plating, the plating property is improved when a masking tape using a mixture containing a thermosetting resin as an adhesive is used. Further, in stripe plating, the exudation of solder on the masking tape surface affects the plating property. However, as shown in FIG. 4, when a masking tape using a mixture containing a thermosetting resin as an adhesive is used, even if the mixture is dipped in the solder bath 11 for a long time (for example, 20 minutes), It was confirmed that there was no bleeding and the stripe plating property was good.

In the above description, the copper tape is taken as an example, but the present invention is not limited to the copper tape, and all the copper or the like which is dipped in the molten solder and subjected to the stripe-shaped solder plating is used. It is applicable to all products made of copper alloy. Further, the example in which the solder plating is applied only to one surface of the copper tape 1 has been described, but the solder plating may be applied to both surfaces. In this case, two sets of cutters will be provided one above the other.

[0017]

As is apparent from the above, according to the present invention, a masking tape having high heat resistance is applied to both surfaces of the copper tape 1 during the process of transporting the metal strip for masking,
While carrying this masked metal strip material, the masking tape is cut with a stripe pattern, and then immersed in molten solder to form a solder film on the cutting surface of the masking tape. Since the masking tape is peeled off from the surface of the strip-shaped material, it is possible to perform stripe plating on the surface of the long metal strip-shaped material with a simple facility, and further to easily form a uniform plating thickness. be able to.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an outline of equipment for achieving a method for forming stripe solder plating according to the present invention.

FIG. 2 is a cross-sectional view showing a state in which masking tape is attached to both surfaces of the copper tape in FIG.

FIG. 3 is a cross-sectional view showing a state of the surface of the copper tape after being immersed in the molten solder in the present invention.

FIG. 4 is an explanatory diagram showing an effect of the present invention.

FIG. 5 is a configuration diagram showing an outline of equipment for performing metal plating on a copper material by electroplating.

[Explanation of symbols]

 1 Copper Tape 2 Pressure Roll 6,7 Masking Tape 6a Masking Tape Removed from Copper Tape 8 Cutter 11 Solder Tank 12 Molten Solder 15 Tape Removal Device 16 Solder Film

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiro Kiyoto 3550 Kidayo-cho, Tsuchiura-shi, Ibaraki Hitachi Cable Co., Ltd. Tsuchiura factory (72) Inventor Hidezumi Morii 3550 Kida-yocho, Tsuchiura-shi, Ibaraki Hitachi Cable Shares (72) Inventor Masaharu Kurita 3550, Kidayomachi, Tsuchiura City, Ibaraki Prefecture Hitachi Cable Co., Ltd., Tsuchiura Factory

Claims (3)

[Claims] 1. A high heat resistant tape is applied on both sides of a metal strip material for masking, and the masked metal strip material is dipped in molten solder to form a solder film on a non-masking surface. A method for forming stripe solder plating, characterized in that the high heat-resistant tape is peeled off from the surface of the strip-shaped material. 2. The method for forming striped solder plating according to claim 1, wherein the high heat resistant tape is a polyimide film adhesive tape. 3. The stripe according to claim 1 or 2, wherein the high heat resistant tape uses a high temperature high viscosity material or a mixture of the high temperature high viscosity material and a thermosetting resin as an adhesive. Method of forming solder plating.