JPH09162338A - Lsi heat sink and manufacture thereof - Google Patents
Lsi heat sink and manufacture thereofInfo
- Publication number
- JPH09162338A JPH09162338A JP31937195A JP31937195A JPH09162338A JP H09162338 A JPH09162338 A JP H09162338A JP 31937195 A JP31937195 A JP 31937195A JP 31937195 A JP31937195 A JP 31937195A JP H09162338 A JPH09162338 A JP H09162338A
- Authority
- JP
- Japan
- Prior art keywords
- gypsum body
- holes
- ferrous metal
- hole
- lsi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 229910052602 gypsum Inorganic materials 0.000 claims abstract description 65
- 239000010440 gypsum Substances 0.000 claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000007787 solid Substances 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 8
- 238000005266 casting Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000011505 plaster Substances 0.000 description 5
- 230000006837 decompression Effects 0.000 description 4
- 230000003014 reinforcing effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、ＬＳＩモジュール
とピンフィンとが同一材質で、極めて放熱性能の優れた
ＬＳＩ用ヒートシンク及びその製造法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for an LSI, which is made of the same material for an LSI module and a pin fin and has an extremely excellent heat dissipation performance, and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】ＣＰＵ，ＭＰＵ等のＬＳＩ（高密度集積
回路）においては、特に、熱的性能が部品の信頼度ある
いは寿命に影響し、温度上昇がその寿命，高速性等に大
きく影響される。そのＬＳＩが高密度集積化および高速
化されるのに伴い、それから発生する熱量の増大で従来
技術のものでは放熱性能に限界がありファン等を最近接
させて強制的に冷却を施さなければ対処できないのが現
状であり、それでも放熱が追いつかないＬＳＩも出てき
ている。したがって、ファンを近接に取り付けるための
スペース確保，及び組み上げ後の入り組んだ部分でのフ
ァン故障の放置によるコンピュータ本体への迅大な被
害，他ファン交換の多大な工作が必要，等の問題が多々
あった。2. Description of the Related Art In an LSI (high-density integrated circuit) such as a CPU or MPU, thermal performance particularly affects the reliability or life of parts, and temperature rise is greatly affected by its life, high speed, etc. . As the LSI is highly integrated and speeded up, the amount of heat generated from it increases and the conventional technology has a limited heat dissipation performance. The current situation is that it is not possible, and there are some LSIs that cannot keep up with heat dissipation. Therefore, there are many problems such as securing a space for mounting the fan in close proximity, tremendous damage to the computer main body due to leaving a fan failure in a complicated part after assembly, and a large amount of work for replacing other fans. there were.
【０００３】また、ピンフィン付きのＬＳＩ用ヒートシ
ンクとして、空冷構造のものがあり、該当のＣＰＵ，Ｍ
ＰＵ等のＬＳＩ箇所を個別的に放熱でき、さらに、液体
による冷却構造とは異なり、液漏れ等もなく故障もな
く、簡易な構造で、安全性、信頼性の著しく高いもので
ある。このようなピンフィン付きのＬＳＩ用ヒートシン
クでは、放熱性能において低いという問題がある。これ
を解決して放熱性能を高めるには、具体的には、多数設
けたピンフィンの直径を小さくすればする程良いと研究
されており、これは実験的にも認められている事実であ
る。As a heat sink for an LSI with pin fins, there is an air-cooling structure, and the corresponding CPU, M
It can individually radiate heat to LSI parts such as PU, and unlike a liquid cooling structure, has no liquid leakage or failure, has a simple structure, and is extremely high in safety and reliability. Such a heat sink for LSI with pin fins has a problem of low heat dissipation performance. In order to solve this problem and enhance the heat dissipation performance, it has been researched that it is better to reduce the diameter of the pin fins provided in large numbers, which is a fact that has been experimentally confirmed.
【０００４】ところで、近時の新聞，雑誌等の刊行物で
は、ピンフィンの直径約１mmのものが開発された旨が開
示されている。樹脂型を利用した特殊技術のガイカスト
鋳造法によるピンフィン付きのＬＳＩ用ヒートシンクで
ある。By the way, recent publications such as newspapers and magazines disclose that pin fins having a diameter of about 1 mm have been developed. This is a heat sink for LSI with pin fins made by the special technique of cast casting using resin mold.
【０００５】[0005]
【発明が解決しようとする課題】以上のように、現在の
技術では、ピンフィンの直径約１mmが最小径とされ、こ
れ以下の直径のピンフィンを整然と製造することは困難
とされている。即ち、ピンフィンの直径が小さくなる
と、型に設けた小径の穴内に、圧力を上げて充填して
も、アルミニウム等の溶湯が十分に回らず、整然とした
ピンフィンの形成はできない欠点があった。As described above, in the present technology, the minimum diameter of the pin fin is about 1 mm, and it is difficult to orderly manufacture the pin fin having a diameter smaller than this. That is, when the diameter of the pin fin becomes smaller, there is a drawback that the molten metal such as aluminum does not sufficiently rotate even when the pressure is increased to fill the small diameter hole provided in the mold, so that the orderly pin fin cannot be formed.
【０００６】[0006]
【課題を解決するための手段】そこで発明者は、前記課
題を解決すべく、鋭意，研究を重ねた結果、その発明
を、小径で、所定深さ、所定間隔をおいて多数の穴部が
形成された固体状の石膏体と、その穴部付き石膏体を内
部に装填する減圧式鋳型装置とを備え、アルミニウム等
の非鉄金属の溶湯が前記石膏体の多数の穴部上に減圧下
にて所定厚さに充填され、前記溶湯の硬化後に前記石膏
体のみが破壊され、所定厚さの非鉄金属の取付モジュー
ルと、前記穴部内の非鉄金属は前記取付モジュールに一
体化されたピンフィンとからなるＬＳＩ用ヒートシンク
としたり、或いは、固体状の石膏体に対して小径で、所
定深さ、所定間隔をおいて穿設して多数の穴部を形成
し、その穴部付き石膏体を、減圧式鋳型装置の鋳枠内に
設置し、該鋳枠内に、アルミニウム等の非鉄金属の溶湯
を所定厚さとなるように充填し、且つ前記石膏体の周面
側を減圧させて前記溶湯を前記穴部内にも充填し、硬化
後に、前記石膏体のみを破壊して、前記所定厚さの非鉄
金属は取付モジュールとし、前記穴部内の非鉄金属は前
記取付モジュールに一体化したピンフィンを多数植設し
てなるＬＳＩ用ヒートシンクの製造法等としたことによ
り、極めて放熱性能の優れたものにでき、前記の課題を
解決したものである。Therefore, as a result of earnest studies to solve the above problems, the inventor has found that the invention has a large number of holes with a small diameter, a predetermined depth and a predetermined distance. A solid gypsum body formed, and equipped with a pressure reducing mold device for loading the gypsum body with a hole therein, the molten metal of non-ferrous metal such as aluminum under reduced pressure on a large number of holes of the gypsum body Is filled to a predetermined thickness, only the gypsum body is destroyed after the molten metal is hardened, and the non-ferrous metal mounting module of a predetermined thickness and the non-ferrous metal in the hole are formed from the pin fins integrated in the mounting module. Is used as a heat sink for LSI, or a small diameter is formed in a solid gypsum body at a predetermined depth and at predetermined intervals to form a large number of holes, and the gypsum body with holes is decompressed. Installed in the flask of the type mold equipment, in the flask, The molten metal of non-ferrous metal such as aluminum is filled to a predetermined thickness, and the peripheral surface side of the gypsum body is decompressed to fill the molten metal into the hole portion as well, and only the gypsum body is destroyed after hardening. The non-ferrous metal having the predetermined thickness is used as a mounting module, and the non-ferrous metal in the hole is used as a manufacturing method of a heat sink for an LSI in which a large number of pin fins integrated with the mounting module are implanted. It has excellent performance and solves the above problems.
【０００７】[0007]
【実施の形態】以下、本発明の実施の形態について図１
乃至図９に基づいて説明する。まず、その構成について
説明する。図１（Ａ），（Ｂ）に示すように、本件発明
のＬＳＩ用ヒートシンクＡは、取付モジュール１と、こ
の上面に多数植設したピンフィン２，２，…とからアル
ミニウム等の非鉄金属Ｃにて一体成形されている。FIG. 1 is a block diagram showing an embodiment of the present invention.
This will be described with reference to FIGS. First, the configuration will be described. As shown in FIGS. 1 (A) and 1 (B), a heat sink A for LSI according to the present invention includes a mounting module 1 and pin fins 2, 2, ... Are integrally molded.
【０００８】そのＬＳＩ用ヒートシンクＡは、方形状の
板片としての取付モジュール１に対して、Ｘ方向又はＹ
方向に所定間隔をおいてピンフィン２，２，…が多数植
設されている。そのピンフィン２，２，…の構成例とし
ては、図１（Ａ），（Ｂ）に示すように、第１の実施の
形態としては、比較的小径のピンフィン２，２，…のみ
で形成されたり、或いは、図９（Ａ），（Ｂ），（Ｃ）
に示すように、補強用ピンフィン３，３，…が周囲に突
設され、その内部は外周よりも小径に形成された極小径
のピンフィン２，２，…にて形成されることもある。The LSI heat sink A is attached to the mounting module 1 as a rectangular plate piece in the X direction or Y direction.
A large number of pin fins 2, 2, ... Are planted at predetermined intervals in the direction. As an example of the configuration of the pin fins 2, 2, ..., As shown in FIGS. 1A and 1B, in the first embodiment, only the pin fins 2, 2 ,. Or, as shown in FIG. 9 (A), (B), (C)
As shown in FIG. 3, reinforcing pin fins 3, 3, ... May be formed around the periphery, and the inside thereof may be formed by extremely small diameter pin fins 2, 2, ...
【０００９】そのピンフィン２，２間はあまり密に設け
てもフィン間流路の流動抵抗が増加し、フィンは有効に
働かない。このため、空気流速が小さい場合、過密なフ
ィンを用いるのは危険である。またフィンの設置間隔が
粗になり過ぎると伝熱面積が小さく、ＬＳＩ用ヒートシ
ンクとしての放熱性能が低下するため、流動抵抗の増大
と伝熱面積の増加率との調和から決定される適正なるフ
ィン相互の間隔を求めることが必要である。Even if the pin fins 2 and 2 are provided too close to each other, the flow resistance of the flow path between the fins increases and the fins do not work effectively. For this reason, it is dangerous to use dense fins when the air velocity is low. Further, if the fins are installed too coarsely, the heat transfer area is small, and the heat dissipation performance as a heat sink for LSI is deteriorated. Therefore, an appropriate fin determined from the harmony of the increase in flow resistance and the increase rate of the heat transfer area. It is necessary to find the mutual distance.
【００１０】次に、その第１の製造方法について図２乃
至図７に基づいて説明すると、まず、固体状の厚さ数cm
の石膏体７に対して小径のドリル５にて所定深さ穿設し
て、多数の穴部８，８，…を形成する。隣接する間隔を
数mmとして、Ｘ方向，Ｙ方向に対して多数の穴部８，
８，…を形成する〔図２（Ｂ）及び（Ｃ）参照〕。この
場合には、一般に穴開けロボット等に設けたドリル５に
よって、所定の間隔に一定の深さで多数の穴部８，８，
…を穿設する。Next, the first manufacturing method will be described with reference to FIGS. 2 to 7. First, the thickness of the solid state is several cm.
The plaster body 7 is drilled to a predetermined depth with a small-diameter drill 5 to form a large number of holes 8, 8. A large number of holes 8 in the X and Y directions, with a space of several mm between adjacent holes.
8 are formed [see FIGS. 2 (B) and 2 (C)]. In this case, generally, a drill 5 provided in a drilling robot or the like is used to provide a large number of holes 8, 8 at a predetermined depth at a predetermined interval.
Drill ...
【００１１】このようにして多数の穴部８，８，…を石
膏体７に成形した後、その穴部８，８，…付きの石膏体
７を、減圧式鋳型装置Ｂの鋳枠１０内で減圧台１１上
に、前記穴部８，８，…を上向きにして挿入する。この
場合、前記石膏体７の上側に、硬化後に取付モジュール
１の所定の板厚となるように、前記減圧式鋳型装置Ｂの
鋳枠１０内に非鉄金属Ｃの溶湯Ｃ0 を充填する〔図３
（Ａ）参照〕。そして、充填された溶湯Ｃ0 が前記石膏
体７の穴部８，８，…箇所にも充填且つ挿入される。溶
湯Ｃ0 が充填されている途中及び充填された直後に、そ
の石膏体７の下面の減圧台１１を介して、前記減圧式鋳
型装置Ｂの減圧筺体１２に設けた真空ポンプ１３により
減圧する。即ち、その穴部８，８，…箇所に空気等が混
入している場合のその空気を抜く。このときに、その石
膏体７全体が減圧する構成となっている。In this way, after forming a large number of holes 8, 8, ... In the gypsum body 7, the gypsum body 7 with the holes 8, 8 ,. Then, the holes 8, 8, ... Are inserted upward on the decompression table 11. In this case, on the upper side of the gypsum body 7, the molten metal C 0 of the non-ferrous metal C is filled in the casting frame 10 of the pressure reducing mold apparatus B so that the plate thickness of the mounting module 1 becomes a predetermined thickness after hardening [Fig. Three
(See (A)]. Then, the filled molten metal C 0 is also filled and inserted into the holes 8, 8, ... During the filling of the molten metal C 0 and immediately after the filling, the pressure is reduced by the vacuum pump 13 provided in the decompression housing 12 of the decompression-type mold apparatus B through the decompression table 11 on the lower surface of the gypsum body 7. That is, when air or the like is mixed in the holes 8, 8, ... At this time, the entire gypsum body 7 is depressurized.
【００１２】すると、その穴部８，８，…箇所に充填さ
れた溶湯Ｃ0 が穴部８，８，…の奥まで入っていない場
合には、石膏体７に対して減圧作用を施したことで、穴
部８，８，…箇所周縁の石膏体７に多数形成された毛細
管に食い込むようになり、穴部８，８，…箇所の奥の方
でも全体に溶湯Ｃ0 が充填される。Then, when the molten metal C 0 filled in the holes 8, 8, ... Does not reach the inside of the holes 8, 8, ..., The gypsum body 7 is decompressed. As a result, the large number of capillaries formed in the gypsum body 7 around the holes 8, 8, ... Places to be bitten, and the molten metal C 0 is filled in the back of the holes 8, 8 ,. .
【００１３】このような状態を所定時間保持し、溶湯Ｃ
0 を冷却させる〔図３（Ｂ）参照〕。その後に、減圧式
鋳型装置Ｂから非鉄金属Ｃ付き石膏体７を取り出す（図
４参照）。そして、冷却した穴部８，８，…箇所の棒片
なるピンフィン２，２，…を破損しない圧力による水圧
ノズル１４にて前記石膏体７を破壊する（図５参照）。
ピンフィン２，２，…のみが露出するようにし、且つ前
記所定厚さで冷却した非鉄金属Ｃを取付モジュール１と
して成形し、該取付モジュール１上に多数のピンフィン
２，２，…を一体的に設けたＬＳＩ用ヒートシンクＡを
製造する（図６参照）。By keeping such a state for a predetermined time, the melt C
0 is cooled [see FIG. 3 (B)]. After that, the non-ferrous metal C-attached gypsum body 7 is taken out from the depressurizing mold apparatus B (see FIG. 4). Then, the plaster body 7 is broken by the hydraulic nozzle 14 with a pressure that does not damage the pin fins 2, 2, ...
Only the pin fins 2, 2, ... Are exposed, and the non-ferrous metal C cooled to the predetermined thickness is molded as a mounting module 1, and a large number of pin fins 2, 2 ,. The provided LSI heat sink A is manufactured (see FIG. 6).
【００１４】このような第１の製造方法では、ドリル５
にて穿設するために、その穴径を任意にでき、これによ
って、多数の穴部８，８，…の直径を適宜異なるように
できる大きな利点がある。In the first manufacturing method as described above, the drill 5 is used.
The hole diameter can be arbitrarily set in order to make holes, and this has a great advantage that the diameters of the many hole portions 8, 8, ... Can be appropriately changed.
【００１５】次に、第２の製造方法について図７にて説
明すると、予め多数の小径の棒状物１５ａ，１５ａ，…
が、隣接する間隔を数mmとして、Ｘ方向，Ｙ方向に設け
られた穴成形マスター１５を用意し〔図７（Ａ）参
照〕、該穴成形マスター１５の多数の棒状物１５ａ，１
５ａ，…を、常温にて、固体状の厚さ数cmの石膏体７に
対して上から押圧穿設する〔図７（Ｂ）参照〕。その直
後に棒状物１５ａ，１５ａ，…を引抜き、多数の穴部
８，８，…を一度に形成する〔図７（Ｃ）参照〕。Next, the second manufacturing method will be described with reference to FIG. 7, in which a large number of small-diameter rod-shaped members 15a, 15a, ...
However, a hole forming master 15 provided in the X direction and the Y direction with an adjacent interval of several mm is prepared [see FIG. 7 (A)], and a large number of rod-shaped objects 15a, 1 of the hole forming master 15 are prepared.
, Are pressed and punched from above onto a solid gypsum body 7 having a thickness of several cm at room temperature (see FIG. 7B). Immediately after that, the rod-shaped objects 15a, 15a, ... Are withdrawn to form a large number of holes 8, 8, ... At a time (see FIG. 7C).
【００１６】この後の成形は、第１の製造方法と同一で
あるため省略する。この第２の製造方法は、石膏体７と
いう比較的柔らかい材質であるために可能であり、極め
て迅速にできる利点がある。The subsequent molding is the same as in the first manufacturing method, and will be omitted. This second manufacturing method is possible because the gypsum body 7 is a relatively soft material, and has the advantage of being extremely quick.
【００１７】次に、第３の製造方法について図８にて説
明すると、前記第２の製造方法の穴成形マスター１５を
用意し〔図８（Ａ）参照〕、該穴成形マスター１５の多
数の棒状物１５ａ，１５ａ，…を、ケース１６内に充填
された，液状化した石膏体７に対して上から、所定深さ
となるように挿入する〔図８（Ｂ）参照〕。このような
状態で所定時間経過させて液状化した石膏体７を固体化
させた後に棒状物１５ａ，１５ａ，…を引抜き〔図８
（Ｃ）参照〕、これによって、固体化させた石膏体７に
多数の穴部８，８，…を形成する〔図８（Ｄ）参照〕。Next, the third manufacturing method will be described with reference to FIG. 8. The hole forming master 15 of the second manufacturing method is prepared [see FIG. 8 (A)], and a large number of the hole forming masters 15 are prepared. The rod-shaped objects 15a, 15a, ... Are inserted into the liquefied gypsum body 7 filled in the case 16 from above so as to have a predetermined depth (see FIG. 8B). In this state, the liquefied gypsum body 7 is solidified after a predetermined time elapses, and then the rods 15a, 15a, ...
(See (C)], thereby forming a large number of holes 8, 8, ... In the solidified gypsum body 7 (see FIG. 8D).
【００１８】この後の成形は、第１の製造方法と同一で
あるため省略する。この第３の製造方法では、第２の製
造方法に比し迅速ではないが、石膏体７に対して穴部
８，８，…の成形時に穴損傷等を防止して整然と成形で
きる効果があり、前記第１の製造方法に比し量産が可能
である。The subsequent molding is the same as that of the first manufacturing method, and is therefore omitted. This third manufacturing method is not so quick as the second manufacturing method, but has an effect of preventing hole damage and the like when forming the holes 8, 8, ... Mass production is possible as compared with the first manufacturing method.
【００１９】[0019]
【実施例】図９に示すように、６cm平方の大きさで、厚
さ３mmのアルミニウム合金製で取付モジュール１とし、
該取付モジュール１に、一体的に、複数の補強用ピンフ
ィン３，３，…と多数のピンフィン２，２，…が植設さ
れている。具体的には、前記取付モジュール１の周縁よ
り２mm残して、１０mm間隔をおいて、太さ２mmの補強用
ピンフィン３，３，…が平方状に２２本設けられ、且つ
該補強用ピンフィン３，３，…の内部側に、Ｘ方向の間
隔が２．４mmで Ｙ方向の間隔が１．５mmをなし、約７
３０本のピンフィン２，２，…が多数穿設されて構成さ
れている。このようなＬＳＩ用ヒートシンクＡは、前述
の減圧式鋳型装置Ｂにて製造されている。EXAMPLE As shown in FIG. 9, a mounting module 1 made of an aluminum alloy having a size of 6 cm square and a thickness of 3 mm was prepared.
A plurality of reinforcing pin fins 3, 3, ... And a large number of pin fins 2, 2, ... Are integrally implanted in the mounting module 1. Specifically, 22 reinforcing rod fins 3, 2 having a thickness of 2 mm are provided in a square shape at intervals of 10 mm, leaving 2 mm from the peripheral edge of the mounting module 1, and the reinforcing pin fin 3, On the inner side of 3, ..., the X-direction distance is 2.4 mm and the Y-direction distance is 1.5 mm.
A large number of 30 pin fins 2, 2, ... Are provided. Such a heat sink A for LSI is manufactured by the above-mentioned depressurization type mold apparatus B.
【００２０】[0020]
【発明の効果】請求項１の発明においては、小径で、所
定深さ、所定間隔をおいて多数の穴部８，８，…が形成
された固体状の石膏体７と、その穴部８，８，…付き石
膏体７を内部に装填する減圧式鋳型装置Ｂとを備え、ア
ルミニウム等の非鉄金属Ｃの溶湯Ｃ0 が前記石膏体７の
多数の穴部８，８，…上に減圧下にて所定厚さに充填さ
れ、前記溶湯の硬化後に前記石膏体７のみが破壊され
て、所定厚さの非鉄金属Ｃの取付モジュール１と、前記
穴部８内の非鉄金属Ｃは前記取付モジュール１に一体化
されたピンフィン２とからなるＬＳＩ用ヒートシンクと
したことにより、同一なる非鉄金属Ｃの溶湯Ｃ0 で硬化
後にピンフィン２，２，…が取付モジュール１上に一体
化したＬＳＩ用ヒートシンクＡを簡単に製造できる利点
がある。特に、鋳型等で引き抜いて成形する構成とは全
く異なり、その引き抜かないことで小径のピンフィン２
でも整然として加工できる。According to the first aspect of the present invention, a solid gypsum body 7 having a small diameter, a predetermined depth, and a plurality of holes 8 formed at predetermined intervals, and the hole 8 thereof. , 8, ... A pressure-reducing mold apparatus B for loading the attached gypsum body 7 therein, and the molten metal C 0 of the non-ferrous metal C such as aluminum is decompressed onto the large number of holes 8, 8 ,. It is filled to a predetermined thickness below, and only the gypsum body 7 is destroyed after the molten metal is hardened, and the mounting module 1 of the non-ferrous metal C having a predetermined thickness and the non-ferrous metal C in the hole 8 are mounted by the mounting. Since the LSI heat sink is composed of the pin fins 2 integrated with the module 1, the LSI heat sink in which the pin fins 2, 2, ... Are integrated on the mounting module 1 after being hardened by the same molten metal C 0 of the non-ferrous metal C. There is an advantage that A can be easily manufactured. Especially, it is completely different from the structure in which the pin fins 2 are molded by pulling out with a mold or the like.
But it can be processed neatly.
【００２１】請求項２の発明では、固体状の石膏体７に
対して小径で、所定深さ、所定間隔をおいて穿設して多
数の穴部８，８，…を形成し、その穴部８付き石膏体７
を、減圧式鋳型装置Ｂの鋳枠１０内に設置し、該鋳枠１
０内に、アルミニウム等の非鉄金属Ｃの溶湯Ｃ0 を所定
厚さとなるように充填し、且つ前記石膏体７の周面側を
減圧させて前記溶湯Ｃ0 を前記穴部８，８，…内にも充
填し、硬化後に、前記石膏体７のみを破壊して、前記所
定厚さの非鉄金属Ｃは取付モジュール１とし、前記穴部
８，８，…内の非鉄金属Ｃは前記取付モジュール１に一
体化したピンフィン２，２，…を多数植設してなるＬＳ
Ｉ用ヒートシンクの製造法としたことにより、溶湯Ｃ0
が硬化後に石膏体７が破壊され、穴部８，８，…に充填
されて硬化した非鉄金属Ｃがピンフィン２，２，…とし
て形成されるため、引き抜き加工とは異なり、極めて小
径なるピンフィン２であっても整然と加工できる大きな
利点がある。According to the second aspect of the present invention, a large number of holes 8, 8, ... Are formed in the solid gypsum body 7 with a small diameter at a predetermined depth and at predetermined intervals to form the holes. Gypsum body 7 with part 8
Is installed in the flask 10 of the depressurization mold apparatus B, and the flask 1
0 is filled with a molten metal C 0 of a non-ferrous metal C such as aluminum so as to have a predetermined thickness, and the peripheral surface side of the gypsum body 7 is depressurized so that the molten metal C 0 is filled with the holes 8, 8, ... The non-ferrous metal C having a predetermined thickness is used as the mounting module 1, and the non-ferrous metal C in the holes 8, 8, ... Is filled with the mounting module. An LS formed by arranging a large number of pin fins 2, 2, ...
Due to the manufacturing method of the heat sink for I, the molten metal C 0
The gypsum body 7 is destroyed after being hardened, and the non-ferrous metal C filled in the holes 8, 8, ... And hardened is formed as the pin fins 2, 2 ,. However, there is a great advantage that it can be processed orderly.
【００２２】この点について詳述すると、その穴部８，
８，…を極めて小径にあけ、これを鋳型なる石膏体７と
し、これに溶湯Ｃ0 を入れて固体化し、固体化した後
に、その石膏体７のみを破損して、ピンフィン２，２，
…のみを露出させて加工することで、小径ゆえに、従来
では、脱型時の引張力にて途中で切断したり、曲がった
りして破損することがあったが、請求項２の発明では、
ピンフィン２が破損しない範囲内において石膏体７を破
損することで、ピンフィン２には何らの損傷もなく成形
できる。Explaining this point in detail, the holes 8,
8 ... is made into a very small diameter, and this is used as a gypsum body 7 that serves as a template. Molten metal C 0 is put into this to solidify, and after solidifying, only the gypsum body 7 is damaged, and the pin fins 2, 2,
By exposing and processing only ..., due to the small diameter, in the past, there was a case where it was cut or bent on the way due to the tensile force at the time of demolding, and damaged, but in the invention of claim 2,
By breaking the gypsum body 7 within the range where the pin fins 2 are not broken, the pin fins 2 can be molded without any damage.
【００２３】このため、極めて小径のピンフィン２であ
っても整然として仕上げることができ、空冷式のＬＳＩ
用ヒートシンクＡとして極めて放熱性能を高めることが
できる最大の効果がある。即ち、効率よく熱を放熱さ
せ、省スペースでメインテナンスが簡単なＬＳＩ用ヒー
トシンクＡが供給できる。Therefore, even an extremely small pin fin 2 can be finished in an orderly manner, and an air-cooled LSI
As the heat sink A for use, the greatest effect is that the heat dissipation performance can be extremely enhanced. That is, the heat sink A for LSI, which efficiently radiates heat and saves space and is easy to maintain, can be supplied.
【００２４】また、請求項３の発明では、請求項２にお
いて、前記穴部８，８，…は小径のドリル５にて穿設
し、最終仕上げの石膏体７は、ピンフィン２が破損しな
い範囲内の圧力による水圧ノズル１４にて破壊してなる
ＬＳＩ用ヒートシンクの製造法としたことにより、ドリ
ル５の使用にて、その穴径を任意にでき、これによっ
て、多数の穴部８，８，…の直径を適宜異なるようにで
きる大きな利点がある。さらには、石膏体７を最小圧力
にて破壊してピンフィン２，２，…を極めて整然として
成形できる。この場合には、特に、小径，例えば、太さ
０．３mm、０．５mm、０．７mm等に整然として成形でき
る。Further, in the invention of claim 3, in claim 2, the holes 8, 8, ... Are drilled by a small-diameter drill 5, and the final finished gypsum body 7 is within a range where the pin fins 2 are not damaged. By using the manufacturing method of the LSI heat sink that is destroyed by the water pressure nozzle 14 due to the internal pressure, the diameter of the hole can be made arbitrary by using the drill 5, whereby a large number of holes 8, 8, There is a great advantage that the diameters of the ... Can be appropriately changed. Further, the gypsum body 7 can be broken at the minimum pressure to form the pin fins 2, 2, ... In an extremely orderly manner. In this case, in particular, small diameters, for example, thicknesses of 0.3 mm, 0.5 mm, and 0.7 mm can be formed in an orderly manner.
【００２５】また、請求項４の発明では、請求項２にお
いて、前記穴部８，８，…は小径の棒状物１５ａにて押
圧穿設し、最終仕上げの石膏体７は、ピンフィン２が破
損しない範囲内の圧力による水圧ノズル１４にて破壊し
てなるＬＳＩ用ヒートシンクの製造法としたことによ
り、鋳型なる石膏体７を極めて迅速にできる利点があ
る。他の構成は請求項３の発明と同一であり、これと同
一なる効果を奏する。Further, in the invention of claim 4, in claim 2, the holes 8, 8, ... Are pressed and pierced by the rod-shaped object 15a having a small diameter, and the pin fin 2 of the gypsum body 7 of the final finish is damaged. By adopting the method of manufacturing the heat sink for LSI which is broken by the water pressure nozzle 14 by the pressure within the range not to be applied, there is an advantage that the gypsum body 7 as a mold can be made extremely quick. The other structure is the same as that of the third aspect of the invention, and has the same effect.
【００２６】次に、請求項５の発明では、液状化した石
膏体７に対して、穴成形マスター１５の多数の棒状物１
５ａ，１５ａ，…にて、小径で、所定深さ、所定間隔を
おいた穴部８を形成し、その後に固体化した穴部８，
８，…付き石膏体７を、減圧式鋳型装置Ｂの鋳枠１０内
に設置し、該鋳枠１０内に、アルミニウム等の非鉄金属
Ｃの溶湯Ｃ0 を所定厚さとなるように充填し、且つ前記
石膏体７の周面側を減圧させて前記溶湯Ｃ0 を前記穴部
８，８，…内にも充填し、硬化後に、前記石膏体７のみ
を破壊して、前記所定厚さの非鉄金属Ｃは取付モジュー
ル１とし、前記穴部８，８，…内の非鉄金属Ｃは前記取
付モジュール１に一体化したピンフィン２，２，…を多
数植設してなるＬＳＩ用ヒートシンクの製造法としたこ
とにより、石膏体７に対して穴部８，８，…の成形時に
穴損傷等を防止し、ピンフィン２を極めて整然と成形で
きる利点がある。Next, in the fifth aspect of the invention, a large number of rod-shaped objects 1 of the hole forming master 15 are added to the liquefied gypsum body 7.
5a, 15a, ... Forming holes 8 having a small diameter, a predetermined depth and a predetermined distance, and then solidifying the holes 8.
8 ... The gypsum body with 7 is installed in the flask 10 of the depressurization mold apparatus B, and the molten metal C 0 of the non-ferrous metal C such as aluminum is filled into the flask 10 so as to have a predetermined thickness. Further, the peripheral surface side of the gypsum body 7 is depressurized to fill the molten metal C 0 into the holes 8, 8, ... And after hardening, only the gypsum body 7 is destroyed to have the predetermined thickness. The non-ferrous metal C is used as the mounting module 1, and the non-ferrous metal C in the holes 8, 8, ... Is provided with a large number of pin fins 2, 2, ... By doing so, there is an advantage that the pin fins 2 can be extremely neatly formed by preventing hole damage and the like when forming the holes 8, 8, ... For the gypsum body 7.
【図１】（Ａ）は本発明の斜視図 （Ｂ）は（Ａ）の要部拡大断面図FIG. 1A is a perspective view of the present invention, and FIG. 1B is an enlarged cross-sectional view of a main part of FIG.
【図２】（Ａ）は石膏体の斜視図 （Ｂ）は石膏体に穴部加工している状態図 （Ｃ）は石膏体に多数の穴部加工を完了した断面図2A is a perspective view of a plaster body, FIG. 2B is a state diagram in which holes are formed in the gypsum body, and FIG. 2C is a cross-sectional view in which a large number of holes have been formed in the plaster body.
【図３】（Ａ）は減圧式鋳型装置に石膏体を挿入し、上
からアルミニウム等の非鉄金属の溶湯を充填している状
態の断面図 （Ｂ）は減圧式鋳型装置にアルミニウム等の非鉄金属の
溶湯の充填して硬化しつつある状態の断面図FIG. 3 (A) is a cross-sectional view showing a state in which a gypsum body is inserted into a depressurization type mold device and a molten metal of non-ferrous metal such as aluminum is filled from the top. Sectional view of a state in which the molten metal is being filled and is being hardened
【図４】減圧式鋳型装置から取り出した硬化した非鉄金
属付き石膏体の断面図FIG. 4 is a cross-sectional view of the hardened gypsum body with a non-ferrous metal taken out from the pressure reducing mold device.
【図５】石膏体を水圧ポンプにて圧力破壊している状態
図[Fig. 5] A state diagram in which the plaster body is pressure-ruptured by a hydraulic pump.
【図６】石膏体の中のピンフィンが露出し、本発明を製
造完了した断面図FIG. 6 is a cross-sectional view in which the pin fins in the gypsum body are exposed and the production of the present invention is completed.
【図７】（Ａ），（Ｂ），（Ｃ）は別の製造法による穴
成形マスターにて固形状の石膏体に穴部加工している工
程図7 (A), (B), and (C) are process diagrams in which holes are formed in a solid gypsum body by a hole forming master manufactured by another manufacturing method.
【図８】（Ａ），（Ｂ），（Ｃ），（Ｄ）はさらに別の
製造法による穴成形マスターにて液状の石膏体に穴部を
成形している工程図8 (A), (B), (C), and (D) are process diagrams in which holes are formed in a liquid gypsum body by a hole forming master according to another manufacturing method.
【図９】（Ａ）は本発明の別の実施の形態の斜視図 （Ｂ）は（Ａ）のＰ−Ｐ矢視の一部拡大断面図 （Ｃ）は（Ａ）のＱ−Ｑ矢視の一部拡大断面図9A is a perspective view of another embodiment of the present invention, FIG. 9B is a partially enlarged cross-sectional view taken along the line P-P of FIG. 9A, and FIG. 9C is a line QQ of FIG. Partially enlarged cross-sectional view
１…取付モジュール ２…ピンフィン ５…ドリル ７…石膏体 ８…穴部 Ｂ…減圧式鋳型装置 １０…鋳枠 １５ａ…棒状物 DESCRIPTION OF SYMBOLS 1 ... Mounting module 2 ... Pin fin 5 ... Drill 7 ... Gypsum body 8 ... Hole part B ... Decompression type mold device 10 ... Casting frame 15a ... Rod-shaped object
Claims (5)
数の穴部が形成された固体状の石膏体と、その穴部付き
石膏体を内部に装填する減圧式鋳型装置とを備え、アル
ミニウム等の非鉄金属の溶湯が前記石膏体の多数の穴部
上に減圧下にて所定厚さに充填され、前記溶湯の硬化後
に前記石膏体のみが破壊され、所定厚さの非鉄金属の取
付モジュールと、前記穴部内の非鉄金属は前記取付モジ
ュールに一体化されたピンフィンとからなることを特徴
とするＬＳＩ用ヒートシンク。1. A solid gypsum body having a small diameter, a predetermined depth, and a plurality of holes formed at predetermined intervals, and a pressure-reducing mold apparatus for loading the gypsum body with holes therein. , Molten metal of non-ferrous metal such as aluminum is filled to a predetermined thickness on a large number of holes of the gypsum body under reduced pressure, only the gypsum body is destroyed after hardening of the molten metal, of a non-ferrous metal of a predetermined thickness A heat sink for an LSI, comprising: a mounting module; and a non-ferrous metal in the hole, which is a pin fin integrated with the mounting module.
さ、所定間隔をおいて穿設して多数の穴部を形成し、そ
の穴部付き石膏体を、減圧式鋳型装置の鋳枠内に設置
し、該鋳枠内に、アルミニウム等の非鉄金属の溶湯を所
定厚さとなるように充填し、且つ前記石膏体の周面側を
減圧させて前記溶湯を前記穴部内にも充填し、硬化後
に、前記石膏体のみを破壊して、前記所定厚さの非鉄金
属は取付モジュールとし、前記穴部内の非鉄金属は前記
取付モジュールに一体化したピンフィンを多数植設して
なることを特徴とするＬＳＩ用ヒートシンクの製造法。2. A solid gypsum body is formed with a small diameter, a predetermined depth and a predetermined distance so as to form a large number of holes, and the gypsum body with the holes is formed into a depressurized mold device. It is installed in a casting frame, and the molten metal of non-ferrous metal such as aluminum is filled to a predetermined thickness in the casting frame, and the peripheral surface side of the gypsum body is depressurized so that the molten metal is also in the hole portion. After filling and hardening, only the gypsum body is destroyed, the non-ferrous metal having the predetermined thickness is used as a mounting module, and the non-ferrous metal in the hole is formed by implanting a large number of pin fins integrated with the mounting module. A method for manufacturing a heat sink for an LSI, characterized by:
リルにて穿設し、最終仕上げの石膏体は、ピンフィンが
破損しない範囲内の圧力による水圧ノズルにて破壊して
なることを特徴とするＬＳＩ用ヒートシンクの製造法。3. The method according to claim 2, wherein the hole is formed by a small-diameter drill, and the gypsum body of the final finish is broken by a hydraulic nozzle with a pressure within a range that does not damage the pin fin. And manufacturing method of LSI heat sink.
状物にて押圧穿設し、最終仕上げの石膏体は、ピンフィ
ンが破損しない範囲内の圧力による水圧ノズルにて破壊
してなることを特徴とするＬＳＩ用ヒートシンクの製造
法。4. The gage according to claim 2, wherein the hole is formed by pressing a small diameter rod-shaped object, and the gypsum body of the final finish is broken by a hydraulic nozzle with a pressure within a range that does not damage the pin fin. A method for manufacturing a heat sink for an LSI, characterized by:
ターの多数の棒状物にて、小径で、所定深さ、所定間隔
をおいた穴部を形成し、その後に固体状となった穴部付
き石膏体を、減圧式鋳型装置の鋳枠内に設置し、該鋳枠
内に、アルミニウム等の非鉄金属の溶湯を所定厚さとな
るように充填し、且つ前記石膏体の周面側を減圧させて
前記溶湯を前記穴部内にも充填し、硬化後に、前記石膏
体のみを破壊して、前記所定厚さの非鉄金属は取付モジ
ュールとし、前記穴部内の非鉄金属は前記取付モジュー
ルに一体化したピンフィンを多数植設してなることを特
徴とするＬＳＩ用ヒートシンクの製造法。5. A liquefied gypsum body is formed with a large number of rod-shaped members of a hole forming master to form holes having a small diameter, a predetermined depth and a predetermined distance, and thereafter become solid. The gypsum body with a hole is installed in the casting frame of the depressurization type mold device, and the casting frame is filled with a molten metal of non-ferrous metal such as aluminum so as to have a predetermined thickness, and the peripheral surface side of the gypsum body. The pressure is reduced to fill the molten metal also in the hole, after curing, only the gypsum body is destroyed, the non-ferrous metal of the predetermined thickness is the mounting module, the non-ferrous metal in the hole is the mounting module. A method for manufacturing a heat sink for LSI, which is characterized in that a large number of integrated pin fins are planted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31937195A JPH09162338A (en) | 1995-12-07 | 1995-12-07 | Lsi heat sink and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31937195A JPH09162338A (en) | 1995-12-07 | 1995-12-07 | Lsi heat sink and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09162338A true JPH09162338A (en) | 1997-06-20 |
Family
ID=18109410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31937195A Pending JPH09162338A (en) | 1995-12-07 | 1995-12-07 | Lsi heat sink and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09162338A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010088566A (en) * | 2001-08-07 | 2001-09-28 | 유은종 | the Method for Fabricating a Heat-Sink Plate |
| WO2011016083A1 (en) * | 2009-08-04 | 2011-02-10 | Yoshida Naohiro | Heat sink and method for manufracturing the heat sink |
| KR101022954B1 (en) * | 2008-05-30 | 2011-03-16 | 삼성전기주식회사 | Cooling fin and package substrate comprising the cooling fin and fabricating method of the same |
-
1995
- 1995-12-07 JP JP31937195A patent/JPH09162338A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010088566A (en) * | 2001-08-07 | 2001-09-28 | 유은종 | the Method for Fabricating a Heat-Sink Plate |
| KR101022954B1 (en) * | 2008-05-30 | 2011-03-16 | 삼성전기주식회사 | Cooling fin and package substrate comprising the cooling fin and fabricating method of the same |
| WO2011016083A1 (en) * | 2009-08-04 | 2011-02-10 | Yoshida Naohiro | Heat sink and method for manufracturing the heat sink |
| JP5453608B2 (en) * | 2009-08-04 | 2014-03-26 | 直博 吉田 | Heat sink and manufacturing method thereof |
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