JPH09161564A - Manufacture of self fusion aggregate wire - Google Patents

Manufacture of self fusion aggregate wire

Info

Publication number
JPH09161564A
JPH09161564A JP31566495A JP31566495A JPH09161564A JP H09161564 A JPH09161564 A JP H09161564A JP 31566495 A JP31566495 A JP 31566495A JP 31566495 A JP31566495 A JP 31566495A JP H09161564 A JPH09161564 A JP H09161564A
Authority
JP
Japan
Prior art keywords
self
bonding
wire
layer
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP31566495A
Other languages
Japanese (ja)
Inventor
Masao Arashida
昌男 嵐田
Noriaki Harada
紀明 原田
Hideo Doshita
日出夫 堂下
Masahiro Koyano
正宏 小谷野
Tetsuo Uchida
哲雄 内田
Hideo Kimura
英男 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OPT D D MELCO LAB KK
Optec Dai Ichi Denko Co Ltd
Original Assignee
OPT D D MELCO LAB KK
Optec Dai Ichi Denko Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OPT D D MELCO LAB KK, Optec Dai Ichi Denko Co Ltd filed Critical OPT D D MELCO LAB KK
Priority to JP31566495A priority Critical patent/JPH09161564A/en
Publication of JPH09161564A publication Critical patent/JPH09161564A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To eliminate a baking furnace and reduce facility cost and manufacturing space by bundling plural self fusion insulation element wires in parallel, passing them through dice while heating, and forcibly fusing them so as to make an integrated aggregate wire. SOLUTION: For self fusion insulation element wires 1, an insulation layer 3 is formed on a conductor 2, and a self fusion layer 4 is formed on the insulation layer 3. Plural element wires continuously supplied are bundled in parallel via a scale plate 6 and a guide die 7, and this aggregate wire 10 is guided in a heating device 8. The aggregate wire 10 is heated in the heating device and is forcibly passed to a dice 5 arranged in the heating device 8. And, a fusion layer 4 of each element wire 1 is mutually fused, and the bundled element wire 1 is wound by means of a winding machine 9 as a self fusion aggregate wire 11 integrated in its specified sectional shape. At this time, the electric wire surface temperature when the dice 5 is passed through ranges from the melting point of a resin component used for the fusion layer 4 to a temperature which is 60 deg.C higher than the temperature.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、高詳細CRT(C
athod Ray Tube)に用いる偏向ヨークの
巻線を始めとする高周波機器用のコイル等に好適な、所
謂ストレート束ね線からなる自己融着集合線の製造方法
に関する。
TECHNICAL FIELD The present invention relates to a high-detail CRT (CRT).
The present invention relates to a method for producing a self-bonding assembly line composed of a so-called straight bundled wire, which is suitable for a coil for a high-frequency device such as a winding of a deflection yoke used for an Atho Ray Tube.

【0002】[0002]

【従来の技術】自己融着集合線として、従来より複数本
の自己融着絶縁素線を撚り合わせた所謂リッツ線が汎用
されているが、近年において、複数本の絶縁素線を平行
に束ね合わせた集合線の外側に自己融着層を形成したも
のが種々提案されている。これらは、上記リッツ線を偏
向ヨーク用コイルのような複雑な形状に巻線する際、撚
り戻り等による絶縁素線の飛び出しや該素線の断線が頻
繁に起こり、コイルの歩留りが低下するという問題があ
ったため、その対策として外側に更に自己融着層を設
け、その融着力によって上記の飛び出しや断線を抑える
ようにしたものである。
2. Description of the Related Art Conventionally, a so-called litz wire formed by twisting a plurality of self-bonding insulating wires has been generally used as a self-bonding assembly wire, but in recent years, a plurality of insulating wires are bundled in parallel. Various proposals have been made in which a self-bonding layer is formed on the outer side of the combined assembly line. These are said that when the Litz wire is wound into a complicated shape such as a deflection yoke coil, protrusion of the insulating wire due to untwisting or the like and breakage of the wire frequently occur, which lowers the yield of the coil. Since there is a problem, a self-fusion layer is further provided on the outside as a countermeasure, and the above-mentioned protrusion and disconnection are suppressed by the fusion force.

【0003】しかるに、複数本の絶縁素線を単に束ね合
わせた集合線の外側に自己融着層を形成する場合、集合
線の表面に熱可塑性樹脂を複数回塗布、焼付けして所要
の厚さの自己融着層とするが、その焼付け時に絶縁素線
のばらけを生じてコイルとして実用に耐える自己融着集
合線が得られないため、予め絶縁素線を集合状態で拘束
(仮止め)しておく必要がある。従来、この拘束手段と
して、熱硬化性樹脂の焼付けによって絶縁素線同士を結
着する方法(特開平5−250923号公報)や、熱可
塑性樹脂からなる中心介在によって絶縁素線同士を結着
する方法(特開平3−184214号公報)等が提案さ
れている。
However, when a self-fusing layer is formed on the outer side of an assembly wire formed by simply bundling a plurality of insulating wires, a thermoplastic resin is applied and baked on the surface of the assembly wire a plurality of times to obtain a desired thickness. Although the self-bonding layer is used as a self-bonding layer, since the insulation wire will come apart during baking and a self-bonding assembly wire that can withstand practical use as a coil cannot be obtained. You need to do it. Conventionally, as the restraint means, a method of binding the insulating wires to each other by baking a thermosetting resin (Japanese Patent Laid-Open No. 5-250923) or a method of binding the insulating wires to each other by a central interposition of a thermoplastic resin is used. A method (Japanese Patent Laid-Open No. 3-184214) and the like have been proposed.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前記の
熱硬化性樹脂による拘束手段では、外側に自己融着層を
設けて得られる自己融着集合線は、中央に配置する素線
に自己融着層がないため、コイル成形時のプレスの際に
融着力が及ばない中央の素線の飛び出しによるばらけを
生じ易い上、絶縁素線間に熱硬化性樹脂が入り込んで硬
く固化し、全体として硬い電線になるという難点がある
と共に、その製造において絶縁素線群を拘束する熱硬化
性樹脂層と外側の自己融着層を各々形成するために少な
くとも2基の焼付け炉を必要とし、設備コスト及び維持
管理のコストが嵩む上に製造のスペース効率も悪化する
という問題があった。一方、前記の熱可塑性樹脂の中心
介在による拘束手段では、導体でない中心介在が集合線
中で大きな断面積を占めるため、得られる自己融着集合
線は径のわりに導体断面積が小さいものとなり、コイル
の占積率が悪くなって性能低下をきたすという問題があ
った。
However, in the restraint means using the thermosetting resin, the self-bonding assembly wire obtained by providing the self-bonding layer on the outside is self-bonding to the wire arranged in the center. Since there are no layers, the fusion force does not reach during pressing during coil forming, and the strands in the center tend to come apart, causing thermosetting resin to enter between the insulating strands and harden and solidify as a whole. In addition to the drawback that it becomes a hard wire, at least two baking furnaces are required to form the thermosetting resin layer for restraining the insulating wire group and the self-bonding layer on the outside in the manufacturing process. Also, there is a problem that the maintenance cost increases and the manufacturing space efficiency also deteriorates. On the other hand, in the restraint means by the center interposition of the thermoplastic resin, since the non-conductor center interposition occupies a large cross-sectional area in the assembly line, the resulting self-fusion assembly line has a small conductor cross-sectional area for diameter, There is a problem that the space factor of the coil is deteriorated and the performance is deteriorated.

【0005】なお、複数本の絶縁素線を撚り合わせ、こ
の撚り合わせ集合線の外側に熱可塑性樹脂を塗布、焼付
けして自己融着層を形成するようにすれば、自己融着層
の焼付け時のばらけを防止できるが、別途に撚り工程を
必要とするため、設備コストが非常に高く付く上、一つ
の連続走行ラインで製造できなくなり、製造コストが大
幅に上昇するという致命的な問題がある。
If a plurality of insulating wires are twisted together and a thermoplastic resin is applied to the outside of the twisted assembly wire and baked to form a self-bonding layer, the self-bonding layer is baked. Although it is possible to prevent time lag, a separate twisting process is required, resulting in a very high equipment cost, and it is not possible to manufacture on one continuous running line, which is a fatal problem that the manufacturing cost rises significantly. There is.

【0006】本発明は、上述の状況に鑑み、複数本の絶
縁素線が平行に束ね合わさった構造の自己融着集合線を
製造するに当たり、従来のように絶縁素線を束ね合わせ
た重合線の外側に自己融着層を設ける工程を必要とせ
ず、もって該自己融着層の形成に先立って絶縁素線群を
集合状態で拘束する必要もなく、従来に比較して製造能
率を飛躍的に向上できる上、外側の自己融着層を形成す
るための焼付け炉が不要であるため、設備コスト及び製
造スペースを著しく低減できる画期的な方法を提供する
ことを目的としている。
In view of the above situation, the present invention is to manufacture a self-bonding assembly wire having a structure in which a plurality of insulating wires are bundled in parallel. Does not require a step of providing a self-bonding layer on the outer side of the wire, and therefore does not need to restrain the insulating wire group in an aggregated state prior to the formation of the self-bonding layer. In addition, since the baking furnace for forming the outer self-fusing layer is unnecessary, it is an object of the invention to provide an epoch-making method capable of significantly reducing the equipment cost and the manufacturing space.

【0007】[0007]

【課題を解決するための手段】請求項1の発明に係る自
己融着集合線の製造方法は、導体2上に絶縁層3と自己
融着層4を順次形成してなる自己融着絶縁素線1の複数
本を、平行に束ね合わせた状態で加熱しつつダイス5に
通すことにより、これら素線1…の自己融着層4相互を
強制的に融着させて一体の集合線11とすることを特徴
としている。従って、この方法によって得られる自己融
着集合線11は、素線1自体の自己融着層4によって集
合線全体としての自己融着性が担われるため、従来のよ
うに絶縁素線を束ね合わせた集合線の外側に改めて自己
融着層を設ける必要がない上、全ての素線1の周囲に自
己融着層4が存在するから、コイル成形時のプレスの際
に全素線1…に融着力が作用して飛び出しを生じる恐れ
がなく、また熱可塑性樹脂の中心介在を用いた場合のよ
うな導体断面積の低下によるコイル占積率の悪化がな
く、高性能且つ高品質となる。
According to a first aspect of the present invention, there is provided a self-bonding assembly wire manufacturing method, wherein an insulating layer 3 and a self-bonding layer 4 are sequentially formed on a conductor 2. By passing a plurality of the wires 1 in a state of bundling them in parallel while passing them through a die 5, the self-bonding layers 4 of these wires 1 are forcibly fused to each other to form an integrated assembly wire 11. It is characterized by doing. Therefore, the self-bonding assembly wire 11 obtained by this method bears the self-bonding property of the entire assembly wire due to the self-bonding layer 4 of the wire 1 itself, and thus the insulation wires are bundled as in the conventional case. It is not necessary to newly provide a self-bonding layer on the outer side of the assembly wire, and since the self-bonding layer 4 is present around all the wire strands 1, the whole wire wire 1 is pressed at the time of pressing during coil forming. There is no possibility of the fusion force acting to cause popping out, and there is no deterioration of the coil space factor due to the reduction of the conductor cross-sectional area as in the case of using the central interposition of thermoplastic resin, resulting in high performance and high quality.

【0008】また、この方法によれば、平行に束ね合わ
せた素線1…をダイス5に通すだけでよく、集合線の外
側に改めて自己融着層を設ける必要がないから、従来に
比較して自己融着集合線の製造能率が飛躍的に向上する
上、外側の自己融着層を形成する焼付け炉を省略でき、
もって設備コスト及び製造スペースを著しく低減でき
る。
Further, according to this method, it is only necessary to pass the strands 1 bundled in parallel to each other through the die 5, and it is not necessary to newly provide a self-welding layer on the outside of the assembly line. In addition to dramatically improving the production efficiency of the self-bonding assembly line, the baking furnace for forming the outer self-bonding layer can be omitted,
Therefore, equipment cost and manufacturing space can be significantly reduced.

【0009】請求項2の発明では、請求項1の自己融着
集合線の製造方法において、自己融着絶縁素線1の導体
2径を0.1〜0.3mm、該素線1の自己融着層4の
片側皮膜厚さを5〜30μmに設定するため、得られる
自己融着集合線11は導体断面積を充分に確保して且つ
良好な自己融着性を有するものとなる。
According to a second aspect of the present invention, in the method for producing a self-bonding assembly wire according to the first aspect, the diameter of the conductor 2 of the self-bonding insulating strand 1 is 0.1 to 0.3 mm, and Since the coating thickness on one side of the fusing layer 4 is set to 5 to 30 μm, the obtained self-fusing assembly line 11 has a sufficient conductor cross-sectional area and good self-fusing property.

【0010】請求項3の発明では、請求項1又は2の自
己融着集合線の製造方法において、ダイス通過時の電線
表面温度を自己融着絶縁素線の自己融着層に用いた樹脂
成分の融点以上で且つ該融点よりも60℃高い温度まで
の範囲に設定するため、ダイス5を通過する際に素線1
…の自己融着層4相互が確実に融着し、得られる自己融
着集合線11は素線相互が強固に一体化して使用時の素
線1のばらけをより生じにくいものとなる。
According to a third aspect of the present invention, in the method for producing a self-bonding assembly wire according to the first or second aspect, the surface temperature of the electric wire when passing through the die is used as the resin component used for the self-bonding layer of the self-bonding insulating wire. Since the temperature is set to a temperature equal to or higher than the melting point and higher than the melting point by 60 ° C., the wire 1
The self-bonding layers 4 of ... Are reliably fused together, and the self-bonding assembly wire 11 obtained is such that the wires are firmly integrated with each other and the strands 1 are less likely to come apart during use.

【0011】請求項4の発明では、請求項1〜3の自己
融着集合線の製造方法において、ダイス5通過前の束ね
合わされた自己融着絶縁素線1…の集合線10の最大直
径をA、この最大直径A内に占める自己融着層4…の合
計厚さをPn、ダイス径をDとしたとき、(A−2/3
・Pn)≦D≦(A−1/3・Pn)に設定することか
ら、ダイス5通過時に削られた自己融着層4の樹脂がダ
イス5に蓄積して電線表面に移着することによるブツの
発生や、ダイス5通過による集合線10の集合形状の崩
れを確実に回避でき、もって外観及び断面形状に優れる
自己融着集合線11が安定的に得られることになる。
According to a fourth aspect of the present invention, in the method for producing a self-bonding assembly wire according to any one of claims 1 to 3, the maximum diameter of the assembly wire 10 of the bundled self-bonding insulating wires 1 ... A, where Pn is the total thickness of the self-bonding layers 4 in this maximum diameter A, and D is the die diameter, (A-2 / 3)
・ Pn) ≦ D ≦ (A-1 / 3 · Pn) is set, so that the resin of the self-bonding layer 4 scraped when passing through the die 5 accumulates in the die 5 and is transferred to the surface of the wire. It is possible to surely avoid the occurrence of bumps and the collapse of the aggregate shape of the aggregate wire 10 due to the passage of the die 5, and thus it is possible to stably obtain the self-melting aggregate wire 11 having an excellent appearance and cross-sectional shape.

【0012】請求項5の発明では、請求項1〜4の自己
融着集合線の製造方法において、連続走行する導体2上
に塗料の塗布、焼付けにより絶縁層3と自己融着層4を
順次形成する工程に引き続いて得られた自己融着素線1
を連続走行させつつ、その複数本を平行に束ね合わせ、
加熱下でダイス5に通して一体の集合線10とすること
から、自己融着素線1の製造から自己融着集合線11の
製造まで1ラインの連続工程で行え、製造能率が更に著
しく向上すると共に、製造コストがより低減される。
According to a fifth aspect of the present invention, in the method for producing a self-bonding assembly wire according to any of the first to fourth aspects, the insulating layer 3 and the self-bonding layer 4 are sequentially formed on the continuously running conductor 2 by coating and baking. Self-bonding strand 1 obtained following the forming step
While running continuously, bundle a plurality of them in parallel,
Since the integrated wire 10 is passed through the die 5 under heating to form the integrated wire 10, the production of the self-bonding element wire 1 to the production of the self-bonding assembly wire 11 can be performed in one continuous process, and the manufacturing efficiency is further improved. In addition, the manufacturing cost is further reduced.

【0013】[0013]

【発明の実施の形態】図1は本発明の製造方法に用いる
自己融着絶縁素線1の断面を示す。この自己融着絶縁素
線1は、導体2上に絶縁層3が形成されると共に、該絶
縁層3上に更に自己融着層4が形成されている。そし
て、導体2には径0.1〜0.3mm程度の軟銅線、絶
縁層3にはポリウレタン、ポリエステル系樹脂、ポリエ
ステルイミド系樹脂等、自己融着層4にはポリアミド、
熱可塑性エポキシ系樹脂等、がそれぞれ使用される。
DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a cross section of a self-bonding insulating strand 1 used in the manufacturing method of the present invention. In this self-bonding insulating strand 1, an insulating layer 3 is formed on a conductor 2 and a self-bonding layer 4 is further formed on the insulating layer 3. Annealed copper wire having a diameter of about 0.1 to 0.3 mm is used for the conductor 2, polyurethane, polyester resin, polyesterimide resin, etc. are used for the insulating layer 3, and polyamide is used for the self-bonding layer 4.
A thermoplastic epoxy resin or the like is used, respectively.

【0014】各素線1の自己融着層4の片側皮膜厚さ
は、5〜30μmと比較的厚く設定される。しかして、
この片側皮膜厚さが5μm未満では、最終的に得られる
自己融着集合線の自己融着性と素線1…相互の結着力が
不充分となり、コイル形成に用いた場合にプレス時に素
線1のばらけや飛び出しを生じ易くなる。逆に前記片側
皮膜厚さが30μmを越えると、導体断面積の低下によ
って自己融着集合線を用いたコイルの占積率が悪化する
ことに加え、融着樹脂の絶対量が多くなるために電線が
硬くなる。なお、絶縁層3の厚さは、JIS C320
2におけるエナメル線の0〜2種相当に設定される。
The film thickness on one side of the self-bonding layer 4 of each strand 1 is set to be relatively thick, 5 to 30 μm. Then
If the thickness of this one-side coating is less than 5 μm, the self-bonding property of the finally obtained self-bonding assembly wire and the binding force between the wires 1 ... become insufficient, and when used for forming a coil, the wires are pressed during pressing. It becomes easy to cause the separation of 1 and the pop-out. On the other hand, if the thickness of the coating on one side exceeds 30 μm, the space factor of the coil using the self-bonding assembly line deteriorates due to the reduction of the conductor cross-sectional area, and the absolute amount of the fusion-bonding resin increases. The wire becomes stiff. The thickness of the insulating layer 3 is JIS C320.
It is set to correspond to 0 to 2 kinds of enamel wire in 2.

【0015】図2は本発明に係る自己融着集合線の製造
方法の一構成例を示す。この場合、に、連続的に供給さ
れる複数本の自己融着絶縁素線1…は目板6及びガイド
ダイス7を介して平行に束ね合わされ、この束ね合され
た集合線10が続いて小型電気炉の如き加熱装置8内に
誘導され、加熱されると共に該加熱装置8内に配置した
ダイス5に強制的に通されることにより、各素線1の自
己融着層4が相互に融着し、もって平行に束ね合された
素線1…が所定の断面形状に一体化された自己融着集合
線11として巻取り機9に巻き取られる。
FIG. 2 shows an example of the construction of a method for producing a self-bonding assembly wire according to the present invention. In this case, a plurality of self-bonding insulating strands 1, ..., Which are continuously supplied, are bundled in parallel via the eye plate 6 and the guide die 7, and the bundled assembly line 10 is continuously compacted. By being introduced into a heating device 8 such as an electric furnace, heated, and forcedly passed through a die 5 arranged in the heating device 8, the self-bonding layers 4 of the individual wires 1 are fused to each other. The strands of wire 1, which are attached and are thus bundled in parallel, are wound up by a winder 9 as a self-bonding assembly line 11 integrated into a predetermined cross-sectional shape.

【0016】ここで、加熱装置8による加熱は、自己融
着絶縁素線の自己融着層4が半溶融する程度とするのが
よく、より好ましくはダイス5を通過する際の電線表面
温度が上記自己融着層4に用いた樹脂成分の融点から該
融点よりも60℃高い温度までの範囲に設定するのがよ
い。この温度が上記融点より低温であると、自己融着層
4相互の接合が不充分になり、得られる自己融着集合線
11は素線1…相互の結着が弱いためにコイル形成時に
ばらけを生じ易くなる。また上記温度が上記融点より6
0℃高い温度を越える場合、自己融着層4が溶融過度に
なり、ダイス5を通過する際に集合形状の崩れを生じて
得られる自己融着集合線11の外観及び断面形状が悪化
することになり、著しい場合は溶融状態になった自己融
着層4の樹脂がダイス5で絞り取られる恐れもある。
Here, the heating by the heating device 8 is preferably carried out to such an extent that the self-bonding layer 4 of the self-bonding insulating wire is semi-melted, and more preferably the surface temperature of the wire when passing through the die 5. It is preferable to set the melting point of the resin component used for the self-bonding layer 4 to a temperature 60 ° C. higher than the melting point. If this temperature is lower than the above melting point, the self-bonding layers 4 are not sufficiently joined to each other, and the obtained self-bonding assembly wire 11 is loosely bonded to the strands 1 ... Injuries are likely to occur. Further, the temperature is 6 above the melting point.
When the temperature exceeds 0 ° C. higher, the self-bonding layer 4 becomes excessively melted, and the assembly shape collapses when passing through the die 5, resulting in deterioration of the appearance and cross-sectional shape of the self-bonding assembly line 11. In a remarkable case, the resin of the self-bonding layer 4 in a molten state may be squeezed out by the die 5.

【0017】ダイス5の径は、自己融着絶縁素線1…を
束ね合わせた集合線10が通過する際に、素線1…相互
を強制密着させ、加熱により半溶融した自己融着層4…
が当該ダイス4で削り取られることなく相互に融着一体
化するように設定される。具体的には、ダイス通過前の
集合線10の最大直径をA、この最大直径A内に占める
自己融着層4の合計厚さをPn、ダイス径をDとしたと
き、 (A−2/3・Pn)≦D≦(A−1/3・Pn) となるように設定するのがよい。すなわち、D<(A−
2/3・Pn)の場合は、自己融着層4の樹脂がダイス
5通過時に削られて該ダイス5に蓄積し易く、これが電
線表面に移着してブツを生じ、得られる自己融着集合線
11の外観が悪化することになる。またD>(A−1/
3・Pn)の場合は、ダイス5を通過する際に素線1…
の集合形状が崩れ易く、これによって得られる自己融着
集合線11の断面形状が悪化すると共に、素線1…相互
の結着力が弱くなってコイル形成時にばらけを生じ易く
なる。
The diameter of the die 5 is such that, when the assembly wire 10 in which the self-bonding insulating wires 1 are bundled together, the wires 1 are forcibly brought into close contact with each other, and the self-bonding layer 4 is semi-melted by heating. …
Are set so as to be fused and integrated with each other without being scraped off by the die 4. Specifically, when the maximum diameter of the assembly line 10 before passing through the die is A, the total thickness of the self-fusing layer 4 occupying within the maximum diameter A is Pn, and the die diameter is D, (A-2 / 3 · Pn) ≦ D ≦ (A-1 / 3 · Pn) is preferably set. That is, D <(A-
In the case of 2/3 · Pn), the resin of the self-bonding layer 4 is easily scraped off when passing through the die 5 and easily accumulates in the die 5, and this is transferred to the surface of the electric wire to cause lumps, resulting in the self-bonding. The appearance of the assembly line 11 is deteriorated. In addition, D> (A-1 /
In the case of 3.Pn), the wire 1 is passed when passing through the die 5.
Of the self-bonding assembly wire 11 is deteriorated, and the binding force between the wires 1 ...

【0018】例えば、目的とする自己融着集合線11が
7本集合線である場合、ダイス5通過前の集合線10は
7本の自己融着絶縁素線1…が図3のように配置する集
合状態となるから、この集合線10の最大直径Aは3本
の素線1の直径の和であり、この最大直径A内に自己融
着層4の計6層分(素線1本当たり径方向両側で2層)
の厚みが含まれることになる。ここで、素線1の仕上げ
外径をa、自己融着層4の片側皮膜厚さをPとすれば、
自己融着層4の合計厚さPn=6P、最大直径A=3a
であるから、ダイス径Dは(3a−4P)〜(3a−2
P)の範囲に設定すればよい。
For example, when the target self-bonding assembly wire 11 is seven assembly wires, the assembly wire 10 before passing through the die 5 has seven self-bonding insulating wires 1 ... Arranged as shown in FIG. Therefore, the maximum diameter A of the assembly wire 10 is the sum of the diameters of the three strands 1, and a total of 6 layers of the self-bonding layer 4 (one strand 1 (Two layers on both sides in the radial direction)
Will be included. Here, if the finishing outer diameter of the wire 1 is a and the one-side coating thickness of the self-bonding layer 4 is P,
Total thickness Pn of self-bonding layer 4 = 6P, maximum diameter A = 3a
Therefore, the die diameter D is (3a-4P) to (3a-2
It may be set in the range of P).

【0019】なお、図2では省略しているが、目板7へ
供給される各素線1は、導体2上に絶縁層3及び自己融
着層4を成形して得られたものを一旦ボビン等に巻取
り、この巻き取った状態から連続的に繰り出すように構
成してもよいが、該素線1の製造から自己融着集合線1
1の製造まで1ラインの連続工程で行うことが可能であ
る。すなわち、連続走行する導体2上に塗料の塗布、焼
付けにより絶縁層3と自己融着層4を順次形成する工程
に引き続いて、得られた自己融着素線1を連続走行させ
つつ目板7を介して束ね合わせ、加熱下でダイス5に通
して一体の自己融着集合線11を得るようにすれば、製
造能率を更に著しく向上できると共に、製造コストをよ
り低減できることになる。
Although not shown in FIG. 2, each strand 1 to be supplied to the eye plate 7 is obtained by molding the insulating layer 3 and the self-bonding layer 4 on the conductor 2 once. It may be constructed such that it is wound on a bobbin or the like and continuously fed out from this wound state.
It is possible to perform the production of 1 in a continuous process of 1 line. That is, following the step of sequentially forming the insulating layer 3 and the self-bonding layer 4 by coating and baking the coating material on the conductor 2 that runs continuously, the obtained self-bonding element wire 1 is continuously run and the eye plate 7 is formed. If the self-bonding assembly wire 11 is integrated by bundling it through the die and passing it through the die 5 under heating, the production efficiency can be further remarkably improved and the production cost can be further reduced.

【0020】かくして得られた自己融着集合線11は、
例えば図4に示すように、各素線1…の自己融着層4が
互いに融着し合い、該集合線11の外周を覆うと共に素
線1…間を埋めており、もって素線1…が強固に一体化
した状態にある。従って、この自己融着集合線11をコ
イル形成に使用した場合、自己融着層4の融着力が全て
の素線…に及ぶことから、プレス時に素線1が飛び出し
てばらけを生じる恐れはなく、特に偏向ヨーク用コイル
等の複雑な形状の巻線用として高い適性が発揮される。
なお、自己融着絶縁素線1の本数は、図では7本として
いるが、用途に応じて3〜61本の範囲で選択される。
The self-welding assembly line 11 thus obtained is
For example, as shown in FIG. 4, the self-bonding layers 4 of the individual wires 1 ... Fuse each other to cover the outer circumference of the assembly wire 11 and fill the spaces between the wires 1 ,. Are in a tightly integrated state. Therefore, when the self-welding assembly wire 11 is used for forming a coil, the self-bonding layer 4 exerts a welding force on all the wires ... In particular, high suitability is exhibited especially for winding of complicated shape such as a deflection yoke coil.
Although the number of the self-bonding insulating strands 1 is 7 in the figure, it is selected in the range of 3 to 61 depending on the application.

【0021】[0021]

【実施例】図1の如く径0.13mmの軟銅線よりなる
導体2上に片側皮膜厚さ20μmのポリエステルイミド
樹脂よりなる絶縁層3と後記表1記載の厚みのポリアミ
ド樹脂よりなる自己融着層4を各々樹脂の塗布、焼付け
により形成し、得られた自己融着絶縁素線1…の7本を
それらの製造工程から引き続いて30m/分の割合で連
続的走行させながら、図2に示すように、目板6及びガ
イドダイス7を介して平行に束ね合わせて集合線10と
し、この集合線10を、長さ約1.5mのパイプ型電気
炉よりなる加熱装置8内に導入して加熱しつつダイス5
に通して素線1…相互を強制的に圧接させ、素線1…が
一体化した集合線11として巻取り機15にて巻き取る
方法において、後記表1に示すように各素線1の自己融
着層4の片側皮膜厚さ、ダイス5通過時の電線表面温
度、ダイス5の径Dを種々の値に設定して自己融着集合
線の製造を行った。
EXAMPLE As shown in FIG. 1, an insulating layer 3 made of a polyester imide resin having a coating thickness of 20 μm on one side and a polyamide resin having a thickness shown in Table 1 below are self-fused on a conductor 2 made of an annealed copper wire having a diameter of 0.13 mm. The layer 4 is formed by coating and baking a resin, respectively, and the seven self-bonding insulating wires 1 ... Obtained are continuously run at a rate of 30 m / min from the manufacturing process thereof, as shown in FIG. As shown, they are bundled in parallel through the eye plate 6 and the guide die 7 to form an assembly line 10, and the assembly line 10 is introduced into a heating device 8 composed of a pipe-type electric furnace having a length of about 1.5 m. Die 5 while heating
In the method in which the wires 1 are forcibly pressed into contact with each other by passing through the wire, and are wound by the winding machine 15 as the integrated wire 11 in which the wires 1 are integrated, as shown in Table 1 below, The self-bonding assembly wire was manufactured by setting the film thickness on one side of the self-bonding layer 4, the surface temperature of the wire when passing through the die 5, and the diameter D of the die 5 to various values.

【0022】上記方法によって得られた各自己融着集合
線につき、表面状態、断面形状、素線の結着性、偏向ヨ
ーク用コイルへの適用性(ばらけの程度)をそれぞれ調
べた。その結果を次の表1に示す。
With respect to each self-fusion-bonded assembly wire obtained by the above method, the surface condition, the cross-sectional shape, the binding property of the wire, and the applicability (degree of loosening) to the deflection yoke coil were examined. The results are shown in Table 1 below.

【0023】[0023]

【表1】 [Table 1]

【0024】上表から、素線1の自己融着層4の片側皮
膜厚さが5μm未満の集合線(製造No.1)では素線
相互の結着性に劣るために断面の崩れを生じ、またダイ
ス5通過時の電線表面温度が低過ぎる場合(製造No.
8)は素線相互の結着不良で断面の崩れが著しいために
コイル巻線性が悪く、同温度が高過ぎたる場合(製造N
o.9)は自己融着層の過度な溶融によって表面の外観
が悪化し、更にダイス径Dが既述範囲より大き過ぎる場
合(製造No.7)は素線相互の結着性が劣るために断
面形状の悪化を招き、更にダイス径Dが既述範囲より小
さ過ぎる場合(製造No.3)は電線表面にブツを生じ
て外観不良となることが判る。
From the above table, in the assembled wire (manufacturing No. 1) in which the film thickness on one side of the self-bonding layer 4 of the wire 1 is less than 5 μm (manufacturing No. 1), the bonding property between the wires is inferior and the cross-section collapses. , If the wire surface temperature is too low when passing through the die 5, (manufacturing No.
In the case of 8), the coil winding property is poor because the cross-section is significantly broken due to the poor binding between the wires, and the temperature is too high (manufacturing N
o. In the case of 9), the surface appearance deteriorates due to excessive melting of the self-bonding layer, and when the die diameter D is larger than the above-mentioned range (Production No. 7), the binding property between the wires is poor and the cross section It can be seen that the deterioration of the shape is caused, and when the die diameter D is too smaller than the above range (Production No. 3), the electric wire surface has a lump and the appearance becomes poor.

【0025】[0025]

【発明の効果】請求項1の発明によれば、複数本の絶縁
素線が平行に束ね合わさった構造の自己融着集合線を製
造するに当たり、集合状態の自己融着絶縁素線群を加熱
下で単にダイスに通すだけで自己融着集合線を得ること
ができ、従来のように絶縁素線を束ね合わせた重合線の
外側に自己融着層を設ける工程を必要とせず、従来に比
較し、自己融着集合線の製造能率が飛躍的に向上する
上、外側の自己融着層を形成する焼付け炉を省略でき、
もって設備コスト及び製造スペースを著しく低減でき
る。しかも得られる自己融着集合線は、全ての素線の周
囲に自己融着層が存在する状態となるから、コイル成形
時のプレスの際に素線の飛び出しによるばらけを生じる
恐れがなく、また熱可塑性樹脂の中心介在を用いた場合
のような導体断面積の低下によるコイル占積率の悪化が
なく、高性能且つ高品質であり、特に偏向ヨーク用コイ
ル等のような形状の巻線用として優れた適性を備えるも
のとなる。
According to the first aspect of the present invention, when manufacturing a self-welding assembly wire having a structure in which a plurality of insulating wires are bundled in parallel, a self-bonding insulation wire group in an assembled state is heated. A self-bonding assembly wire can be obtained by simply passing it through a die below, and it does not require the step of providing a self-bonding layer on the outside of the polymerized wire that bundles the insulation wires as in the conventional method However, the manufacturing efficiency of the self-bonding assembly line is dramatically improved, and the baking furnace for forming the outer self-bonding layer can be omitted,
Therefore, equipment cost and manufacturing space can be significantly reduced. Moreover, the resulting self-bonding assembly wire is in a state where the self-bonding layer exists around all the wires, so there is no risk of the wires coming off during pressing during coil forming, In addition, there is no deterioration of the coil space factor due to the reduction of the conductor cross-sectional area as in the case of using the center interposition of thermoplastic resin, high performance and high quality, especially the winding of the shape such as the deflection yoke coil. It has excellent suitability for use.

【0026】請求項2の発明によれば、上記製造方法に
おいて、自己融着絶縁素線の導体径と自己融着層の片側
皮膜厚さを特定範囲に設定するため、充分な導体断面積
で且つ良好な自己融着性を有する自己融着集合線が得ら
れるという利点がある。
According to the second aspect of the present invention, in the above manufacturing method, the conductor diameter of the self-bonding insulating element wire and the film thickness on one side of the self-bonding layer are set within specific ranges, so that a sufficient conductor cross-sectional area is provided. Further, there is an advantage that a self-bonding assembly line having a good self-bonding property can be obtained.

【0027】請求項3の発明によれば、上記製造方法に
おいて、ダイス通過時の電線表面温度を特定範囲に設定
するため、素線相互の結着が強く、使用時の素線のばら
けをより生じにくい自己融着集合線が得られるという利
点がある。
According to the third aspect of the invention, in the above manufacturing method, the wire surface temperature when passing through the die is set in a specific range, so that the mutual binding of the wires is strong and the wires do not come apart during use. There is an advantage that a self-bonding assembly line that is less likely to occur can be obtained.

【0028】請求項4の発明によれば、上記製造方法に
おいて、ダイス通過前の集合線の最大直径に対して、ダ
イス径を特定範囲に設定するとから、表面にブツがなく
良好な外観で且つ断面形状に優れる自己融着集合線が安
定的に得られるという利点がある。
According to the fourth aspect of the invention, in the above manufacturing method, the die diameter is set to a specific range with respect to the maximum diameter of the assembly line before passing through the die, so that the surface has no spots and has a good appearance. There is an advantage that a self-bonding assembly line having an excellent cross-sectional shape can be stably obtained.

【0029】請求項5の発明によれば、上記製造方法に
おいて、自己融着素線の製造から自己融着集合線の製造
まで1ラインの連続工程で行えるから、製造能率が更に
著しく向上すると共に、製造コストをより低減できると
いう利点がある。
According to the fifth aspect of the present invention, in the above manufacturing method, the production of the self-bonding element wire to the production of the self-bonding assembly wire can be performed in one continuous process, so that the production efficiency is further improved. There is an advantage that the manufacturing cost can be further reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】 本発明に用いる自己融着絶縁素線の断面図。FIG. 1 is a cross-sectional view of a self-bonding insulating strand used in the present invention.

【図2】 本発明に係る自己融着集合線の製造方法を示
す模式工程図。
FIG. 2 is a schematic process diagram showing a method for manufacturing a self-bonding assembly wire according to the present invention.

【図3】 同製造方法におけるダイス通過前の集合線の
断面図。
FIG. 3 is a sectional view of an assembly line before passing through a die in the manufacturing method.

【図4】 同製造方法にて得られる自己融着集合線の断
面図。
FIG. 4 is a sectional view of a self-bonding assembly line obtained by the same manufacturing method.

【符号の説明】[Explanation of symbols]

1 自己融着絶縁素線 2 導体 3 絶縁層 4 自己融着層 5 ダイス 6 目板 7 ガイドダイス 8 加熱装置 9 巻取り機 10 ダイス通過前の集合線 11 自己融着集合線 A ダイス通過前の集合線の最大直径 P 自己融着層の片側皮膜厚さ a 素線の仕上げ径 1 Self-Fusing Insulation Wire 2 Conductor 3 Insulating Layer 4 Self-Fusing Layer 5 Dice 6 Eye Plate 7 Guide Die 8 Heating Device 9 Winding Machine 10 Assembly Line Before Passing Dice 11 Self-Fusing Assembly Line A Before Passing Die Maximum diameter of wire assembly P P one-sided film thickness of self-bonding layer a Finished diameter of wire

───────────────────────────────────────────────────── フロントページの続き (72)発明者 原田 紀明 滋賀県甲賀郡信楽町大字江田1073番地 株 式会社オプテックディディ・メルコ・ラボ ラトリー内 (72)発明者 堂下 日出夫 兵庫県尼崎市猪名寺2丁目19番1号 第一 電工株式会社巻線技術開発部内 (72)発明者 小谷野 正宏 兵庫県尼崎市猪名寺2丁目19番1号 第一 電工株式会社巻線技術開発部内 (72)発明者 内田 哲雄 新潟県中頸城郡妙高高原町関川中川原70番 地 第一電工株式会社巻線事業部内 (72)発明者 木村 英男 東京都千代田区丸の内3−1−1国際ビル 9F 第一電工株式会社海外事業部内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Noriaki Harada 1073 Eda, Shigaraki-cho, Shiga Prefecture Oda Didy Melco Laboratory (72) Inventor Hideo Doshita Inodaji, Amagasaki-shi, Hyogo No. 19-1 Inside the winding technology development department, Daiichi Denko Co., Ltd. (72) Inventor Masahiro Oyano 2-19-1 Inadera, Amagasaki City, Hyogo Prefecture Inside the winding technology development department, Daiichi Denko Corporation (72) Inventor Tetsuo Uchida Niigata 70 Sekigawa Nakagawara, Myokokogen-cho, Nakakubiki-gun, Fukushima Daiichi Denko Corporation Winding Division (72) Inventor Hideo Kimura 3-1-1 Marunouchi, Chiyoda-ku, Tokyo International Building 9F Daiichi Denko Co., Ltd.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 導体上に絶縁層と自己融着層を順次形成
してなる自己融着絶縁素線の複数本を、平行に束ね合わ
せた状態で加熱しつつダイスに通すことにより、これら
素線の自己融着層相互を強制的に融着させて一体の集合
線とすることを特徴とする自己融着集合線の製造方法。
1. A plurality of self-fusing insulating element wires, which are formed by sequentially forming an insulating layer and a self-fusing layer on a conductor, are passed through a die while heating them while being bundled in parallel. A method for producing a self-bonding assembly line, characterized in that the self-bonding layers of the wires are forcibly fused together to form an integral assembly line.
【請求項2】 自己融着絶縁素線の導体径が0.1〜
0.3mm、該素線の自己融着層の片側皮膜厚さが5〜
30μmである請求項1記載の自己融着集合線の製造方
法。
2. The conductor diameter of the self-bonding insulating wire is 0.1 to 10.
0.3 mm, the thickness of one side of the self-bonding layer of the wire is 5
The method for producing a self-bonding assembly line according to claim 1, which has a thickness of 30 μm.
【請求項3】 ダイス通過時の電線表面温度を自己融着
絶縁素線の自己融着層に用いた樹脂成分の融点以上で且
つ該融点よりも60℃高い温度までの範囲に設定する請
求項1又は2に記載の自己融着集合線の製造方法。
3. The surface temperature of the electric wire when passing through the die is set to a range not lower than the melting point of the resin component used for the self-bonding layer of the self-bonding insulating strand and higher than the melting point by 60 ° C. 1. The method for producing the self-bonding assembly wire according to 1 or 2.
【請求項4】 ダイス通過前の束ね合わされた自己融着
絶縁素線の集合線の最大直径をA、この最大直径A内に
占める自己融着層の合計厚さをPn、ダイス径をDとし
たとき、(A−2/3・Pn)≦D≦(A−1/3・P
n)に設定することを特徴とする請求項1〜3のいずれ
かに記載の自己融着集合線の製造方法。
4. A is the maximum diameter of a bundle of self-bonding insulating wires bundled before passing through a die, Pn is the total thickness of the self-bonding layer in the maximum diameter A, and D is the die diameter. Then, (A-2 / 3 · Pn) ≦ D ≦ (A-1 / 3 · P
It sets to n), The manufacturing method of the self-bonding assembly line in any one of Claims 1-3 characterized by the above-mentioned.
【請求項5】 連続走行する導体上に塗料の塗布、焼付
けにより絶縁層と自己融着層を順次形成する工程に引き
続いて得られた自己融着素線を連続走行させつつ、その
複数本を平行に束ね合わせ、加熱下でダイスに通して一
体の集合線とすることを特徴とする請求項1〜4のいず
れかに記載の自己融着集合線の製造方法。
5. A self-bonding element wire obtained continuously following a step of sequentially forming an insulating layer and a self-bonding layer by coating and baking a coating material on a conductor that runs continuously, while continuously running a plurality of the self-bonding element wires. The method for producing a self-bonding assembly line according to any one of claims 1 to 4, wherein the assembly lines are bundled in parallel and passed through a die under heating to form an integrated assembly line.
JP31566495A 1995-12-04 1995-12-04 Manufacture of self fusion aggregate wire Withdrawn JPH09161564A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31566495A JPH09161564A (en) 1995-12-04 1995-12-04 Manufacture of self fusion aggregate wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31566495A JPH09161564A (en) 1995-12-04 1995-12-04 Manufacture of self fusion aggregate wire

Publications (1)

Publication Number Publication Date
JPH09161564A true JPH09161564A (en) 1997-06-20

Family

ID=18068104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31566495A Withdrawn JPH09161564A (en) 1995-12-04 1995-12-04 Manufacture of self fusion aggregate wire

Country Status (1)

Country Link
JP (1) JPH09161564A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227265A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227242A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227241A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227266A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227243A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Manufacturing method for assembled conductor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007227265A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227242A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227241A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227266A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Assembled conductor
JP2007227243A (en) * 2006-02-24 2007-09-06 Mitsubishi Cable Ind Ltd Manufacturing method for assembled conductor

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