JPH091610A - Heater of transfer mold - Google Patents
Heater of transfer moldInfo
- Publication number
- JPH091610A JPH091610A JP15152795A JP15152795A JPH091610A JP H091610 A JPH091610 A JP H091610A JP 15152795 A JP15152795 A JP 15152795A JP 15152795 A JP15152795 A JP 15152795A JP H091610 A JPH091610 A JP H091610A
- Authority
- JP
- Japan
- Prior art keywords
- heater
- heat generation
- temperature
- heating
- longitudinal direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、トランスファ成形金型
の加熱ヒータに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heater for a transfer molding die.
【0002】[0002]
【従来の技術】まず、トランスファ成形金型,および金
型に装備した金型加熱用ヒータの従来構成を図2に示
す。図2(a)において、1はキャビティ1a,ランナ
1bを有するキャビティブロック、2はポット2a,ラ
ンナ2bを有するセンターブロック、3は複数のキャビ
ティブロック1とセンターブロック2を繋ぎ合わせて搭
載した取付け基台兼用の加熱プレート、4が加熱プレー
ト3に埋設した加熱ヒータであり、該加熱ヒータ4はキ
ャビティブロック1の配列に合わせて、各キャビティブ
ロックの直下位置に並ぶよう加熱プレート3のヒータ挿
入孔3aに1本ずつ挿入して設置した棒状のカートリッ
ジ形ヒータであり、該ヒータは図2(b)で示すよう
に、外筒4aの内部に長手方向に沿ってコイル状に巻装
した電熱線4bを布設した構造である。2. Description of the Related Art First, FIG. 2 shows a conventional structure of a transfer molding die and a die heating heater mounted on the die. In FIG. 2 (a), 1 is a cavity block having a cavity 1a and a runner 1b, 2 is a center block having a pot 2a and a runner 2b, 3 is a mounting base mounted by connecting a plurality of cavity blocks 1 and 2 together. The heating plate 4 also serving as a table is a heating heater embedded in the heating plate 3, and the heating heater 4 is aligned with the arrangement of the cavity blocks 1 so that the heater insertion holes 3a of the heating plate 3 are arranged so as to be arranged directly below the respective cavity blocks. 2 is a rod-shaped cartridge type heater installed by inserting the heaters into the outer cylinder 4a in a coil shape along the longitudinal direction, as shown in FIG. 2 (b). The structure is laid.
【0003】この加熱ヒータ4はキャビティブロック1
を所定の金型温度に保持するためのものであり、実際に
は加熱プレート3の内部に設置した温度センサ,制御器
と組合わせて金型の温度制御を行うようにしている。こ
こで、従来の加熱ヒータ4はコイル状の電熱線4bが全
長域で等ピッチに巻回されており、その全長で所定のジ
ュール発熱量(例えば電力量400W)を発熱してキャ
ビティブロック1を加熱するように設定されている。The heater 4 is a cavity block 1
Is maintained at a predetermined mold temperature, and in actuality, the temperature of the mold is controlled in combination with a temperature sensor and a controller installed inside the heating plate 3. Here, in the conventional heater 4, the coil-shaped heating wire 4b is wound at an equal pitch in the entire length region, and a predetermined Joule heat generation amount (for example, an electric power amount 400 W) is generated over the entire length thereof to generate the cavity block 1. It is set to heat.
【0004】[0004]
【発明が解決しようとする課題】ところで、トランスフ
ァ成形金型は、その金型表面温度ができるだけ均一であ
ることが望ましく、金型の表面温度が不均一で温度分布
に大きなバラツキがあると、モールド製品にボイド,ピ
ンホール,ピンチングなどの形成不良が発生し易くなる
ことが知られている。By the way, in the transfer molding die, it is desirable that the surface temperature of the die is as uniform as possible. If the surface temperature of the die is non-uniform and there is a large variation in the temperature distribution, the mold will be It is known that defects such as voids, pinholes, and pinching are likely to occur in products.
【0005】かかる点、図2(b)の加熱ヒータ(発熱
容量400W)4を装備したトランスファ成形金型につ
いて、キャビティブロック1の温度分布を実測したとこ
ろ、図2(c)のような温度分布(図中の×点は温度測
定地点を表す)となり、最高温度地点と最低温度地点と
の間の16℃の温度差が生じている。この大きな温度差
の発生原因は、加熱ヒータ4の長手方向の発熱分布が均
一であるのに対して、キャビティブロック1は長手方向
の中央部分に較べて両端部分の方が放熱面積が大で放熱
量が多いことにある。In this regard, when the temperature distribution of the cavity block 1 is actually measured for the transfer molding die equipped with the heater (heat generation capacity 400 W) 4 of FIG. 2B, the temperature distribution as shown in FIG. 2C is obtained. (The point x in the figure represents the temperature measurement point), and there is a temperature difference of 16 ° C. between the highest temperature point and the lowest temperature point. The cause of this large temperature difference is that the heating heater 4 has a uniform heat generation distribution in the longitudinal direction, whereas the cavity block 1 has a larger heat radiation area at both end portions than in the central portion in the longitudinal direction. There is a lot of heat.
【0006】本発明は上記の点にかんがみなされたもの
であり、その目的は金型温度、特にキャビティブロック
を均一温度に加温できるよう改良して成形不良の少ない
モールド製品が成形できるようにしたトランスファ成形
金型の加熱ヒータを提供することにある。The present invention has been made in view of the above points, and an object thereof is to improve the mold temperature, in particular, to heat the cavity block to a uniform temperature so that a molded product with few molding defects can be molded. It is to provide a heater for a transfer molding die.
【0007】[0007]
【課題を解決するための手段】上記目的は、本発明によ
り、キャビティブロックと平行に沿わせて加熱プレート
に埋設した棒状の加熱ヒータに対し、加熱ヒータの長手
方向に沿って中央部を低発熱領域,両端部を高発熱領域
に設定することにより達成される。そして、加熱ヒータ
に前記した低発熱領域,高発熱領域を設定するために
は、コイル状に巻回した電熱線をヒータの長手方向に沿
った中央部を粗ピッチに,両端部を密ピッチに布設して
構成するものとする。According to the present invention, the above object is to reduce the heat generation in the central portion along the longitudinal direction of the rod-shaped heater embedded in the heating plate in parallel with the cavity block. This is achieved by setting the area and both ends to the high heat generation area. In order to set the low heat generation region and the high heat generation region in the heater, the heating wire wound in a coil shape has a coarse pitch at the center along the longitudinal direction of the heater and a fine pitch at both ends. It shall be installed and constructed.
【0008】[0008]
【作用】上記構成により、加熱ヒータの長手方向に沿っ
た発熱量の分布は中央部で小,両端部で大となる。つま
り、加熱プレートに搭載したキャビティブロックに対し
て、放熱量が少ない中央部分に対向するヒータの発熱量
が小、放熱量の多い両端部分に対向するヒータの発熱量
が大となる。これにより、キャビティブロックの長手方
向に沿った放熱量の高低分布を補償して、キャビティブ
ロックをその全長域で大きな温度差の発生を抑えて均温
加熱に近づけることができ、成形不良のない良質なモー
ルド製品の成形が可能となる。With the above structure, the distribution of the amount of heat generated along the longitudinal direction of the heater is small at the center and large at both ends. That is, with respect to the cavity block mounted on the heating plate, the heat generation amount of the heater facing the central portion where the heat radiation amount is small is small, and the heat generation amount of the heater facing the both end portions where the heat radiation amount is large is large. As a result, it is possible to compensate for the distribution of the amount of heat radiation along the longitudinal direction of the cavity block, suppress the occurrence of a large temperature difference in the entire length region of the cavity block, and bring it closer to soaking heating, and there is no molding defect. It is possible to mold various molded products.
【0009】[0009]
【実施例】以下、本発明の実施例を図1(a)〜(c)
に基づいて説明する。なお、図中で図2に対応する同一
部材には同じ符号が付してある。すなわち、図1におい
てトランスファ金型の構成は図2と同様であるが、加熱
プレート3に埋設した棒状の加熱ヒータ4は、図1
(b)で示すように長手方向に沿って分けた三つの区分
でコイル状電熱線4bの巻回ピッチが変えてある。すな
わち、中央の低発熱領域Aでは電熱線4bが粗ピッチ
に,両端の高発熱領域Bでは電熱線4bが密ピッチに巻
回されており、ヒータ全体での発熱量を400Wとし
て、領域Aの発熱量が100W,領域Bの発熱量が15
0Wとなるように配分されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
It will be described based on. In the figure, the same members corresponding to those in FIG. 2 are designated by the same reference numerals. That is, the structure of the transfer mold in FIG. 1 is the same as that in FIG. 2, but the rod-shaped heater 4 embedded in the heating plate 3 is similar to that in FIG.
As shown in (b), the winding pitch of the coil-shaped heating wire 4b is changed in three sections divided along the longitudinal direction. That is, the heating wire 4b is wound in a coarse pitch in the central low heat generation area A, and the heating wire 4b is wound in a high pitch in the high heat generation areas B at both ends. The amount of heat generated is 100 W, and the amount of heat generated in region B is 15
It is distributed so that it becomes 0W.
【0010】上記のように、キャビティブロック1の長
手方向に沿った放熱量の分布を考慮して発熱量分布を設
定した図1(b)の加熱ヒータ4を図1(a)の金型に
装備し、実際にヒータ4に通電して金型を加熱した状態
でキャビティブロック1の各地点(6地点)の温度を実
測したところ、図1(c)のような温度分布が得られ
た。As described above, the heater 4 of FIG. 1 (b) in which the heat generation amount distribution is set in consideration of the heat radiation amount distribution along the longitudinal direction of the cavity block 1 is used in the mold of FIG. 1 (a). When the temperature was measured at each point (6 points) of the cavity block 1 in a state where the cavity block 1 was equipped and the mold was heated by actually energizing the heater 4, the temperature distribution as shown in FIG. 1C was obtained.
【0011】この温度分布から明らかなように、最高温
度地点(173℃)と最低温度地点(168℃)との間
の温度差は僅か5℃であり、図1(c)で表した従来の
もの(最高温度差16℃)と較べて金型温度のバラツキ
が小さく、均温加熱に近づいていることが判る。また、
実際に金型を稼働して成形したモールド製品について検
査した結果でも、ボイド,ピンホール,ピンチングなど
の成形不良が殆ど生じないことが確認されている。As is clear from this temperature distribution, the temperature difference between the highest temperature point (173 ° C.) and the lowest temperature point (168 ° C.) is only 5 ° C., which is the conventional temperature difference shown in FIG. It can be seen that the mold temperature variation is smaller than that of the one (maximum temperature difference of 16 ° C.), and the temperature approaches uniform heating. Also,
The result of inspecting the molded product formed by actually operating the mold has also confirmed that molding defects such as voids, pinholes, and pinching hardly occur.
【0012】[0012]
【発明の効果】以上述べたように、本発明の加熱ヒータ
を採用することにより、トランスファ成形金型、特に金
型の主要部であるキャビティブロックを均温加熱するこ
とができ、これによりボイド,ピンホール,ピンチング
などの成形不良の発生を防いでモールド製品の品質向上
化が図れる。As described above, by adopting the heater of the present invention, the transfer molding die, particularly the cavity block which is the main part of the die, can be heated uniformly, and thereby the void, By preventing the occurrence of molding defects such as pinholes and pinching, the quality of molded products can be improved.
【図1】本発明実施例の説明図であり、(a)はモール
ド成形金型全体の構成図、(b)は加熱ヒータの構造
図、(c)はキャビティブロックの温度分布図FIG. 1 is an explanatory view of an embodiment of the present invention, in which (a) is a configuration diagram of an entire molding die, (b) is a structural diagram of a heater, and (c) is a temperature distribution diagram of a cavity block.
【図2】従来例の説明図であり、(a)はモールド成形
金型全体の構成図、(b)は加熱ヒータの構造図、
(c)はキャビティブロックの温度分布図2A and 2B are explanatory views of a conventional example, FIG. 2A is a configuration diagram of an entire molding die, and FIG. 2B is a structural diagram of a heater.
(C) Temperature distribution diagram of cavity block
1 キャビティブロック 2 センターブロック 3 加熱プレート 3a ヒータ挿入孔 4 加熱ヒータ 4b 電熱線 A 低発熱領域 B 高発熱領域 1 Cavity Block 2 Center Block 3 Heating Plate 3a Heater Insertion Hole 4 Heating Heater 4b Heating Wire A Low Heat Generation Area B High Heat Generation Area
Claims (2)
ク,センターブロックを取付けた加熱プレートの内部に
配置してキャビティブロックを所定温度に加熱する加熱
ヒータであり、該加熱ヒータがその長手方向に沿って電
熱線をコイル状に布設した棒状のカートリッジヒータと
してなり、かつキャビティブロックと平行に沿わせてそ
の直下位置に埋設したものにおいて、加熱ヒータの長手
方向に沿って中央部を低発熱領域,両端部を高発熱領域
に設定したことを特徴とするトランスファ成形金型の加
熱ヒータ。1. A heater for heating a cavity block to a predetermined temperature by arranging it inside a heating plate to which a cavity block and a center block of a transfer molding die are attached, the heater being an electric heater along its longitudinal direction. In the case of a rod-shaped cartridge heater in which heat wires are laid in a coil shape and embedded in a position directly below the cavity block in parallel with the cavity block, the central portion along the longitudinal direction of the heater is a low heat generation region, and both ends are A heater for a transfer molding die characterized by being set in a high heat generation region.
ル状に巻回した電熱線を、ヒータの長手方向に沿った中
央部を粗ピッチに,両端部を密ピッチに布設したことを
特徴とするトランスファ成形金型の加熱ヒータ。2. The heating heater according to claim 1, wherein the heating wire wound in a coil shape is laid at a coarse pitch at the central portion along the longitudinal direction of the heater and at a fine pitch at both ends. Heater for transfer mold.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15152795A JPH091610A (en) | 1995-06-19 | 1995-06-19 | Heater of transfer mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15152795A JPH091610A (en) | 1995-06-19 | 1995-06-19 | Heater of transfer mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH091610A true JPH091610A (en) | 1997-01-07 |
Family
ID=15520469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15152795A Pending JPH091610A (en) | 1995-06-19 | 1995-06-19 | Heater of transfer mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH091610A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007103225A (en) * | 2005-10-06 | 2007-04-19 | Nikon Corp | Device for conveying wafer, device for conveying wafer laminated body, and method of manufacturing lamination type semiconductor device |
KR100761212B1 (en) * | 2006-06-09 | 2007-09-21 | 한국기계연구원 | Hot plate and hot embossing nano imprinting lithography apparatus using above hot plate |
KR100923251B1 (en) * | 2008-02-21 | 2009-10-27 | 세크론 주식회사 | Method and apparatus for molding a electronic component |
JP2016528530A (en) * | 2013-06-28 | 2016-09-15 | エーエスエムエル ネザーランズ ビー.ブイ. | Radiation source for EUV optical lithographic apparatus and lithographic apparatus comprising said radiation source |
-
1995
- 1995-06-19 JP JP15152795A patent/JPH091610A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007103225A (en) * | 2005-10-06 | 2007-04-19 | Nikon Corp | Device for conveying wafer, device for conveying wafer laminated body, and method of manufacturing lamination type semiconductor device |
KR100761212B1 (en) * | 2006-06-09 | 2007-09-21 | 한국기계연구원 | Hot plate and hot embossing nano imprinting lithography apparatus using above hot plate |
KR100923251B1 (en) * | 2008-02-21 | 2009-10-27 | 세크론 주식회사 | Method and apparatus for molding a electronic component |
JP2016528530A (en) * | 2013-06-28 | 2016-09-15 | エーエスエムエル ネザーランズ ビー.ブイ. | Radiation source for EUV optical lithographic apparatus and lithographic apparatus comprising said radiation source |
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