JPH09159539A - Resin surface temperature sensor - Google Patents

Resin surface temperature sensor

Info

Publication number
JPH09159539A
JPH09159539A JP34655095A JP34655095A JPH09159539A JP H09159539 A JPH09159539 A JP H09159539A JP 34655095 A JP34655095 A JP 34655095A JP 34655095 A JP34655095 A JP 34655095A JP H09159539 A JPH09159539 A JP H09159539A
Authority
JP
Japan
Prior art keywords
pin
resin
temperature
sensor part
temperature sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34655095A
Other languages
Japanese (ja)
Inventor
Kazue Sasaki
一衛 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IKEGAMI SEIKO KK
Original Assignee
IKEGAMI SEIKO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IKEGAMI SEIKO KK filed Critical IKEGAMI SEIKO KK
Priority to JP34655095A priority Critical patent/JPH09159539A/en
Publication of JPH09159539A publication Critical patent/JPH09159539A/en
Pending legal-status Critical Current

Links

Landscapes

  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To increase response speed and accurately measure even a small temperature change for the improvement of the quality of a resin injection molded product and the reduction of a molding time by providing a temperature measuring sensor part on the ends of the projection pin and the inert pin of a resin molding die. SOLUTION: A sensor part made of a temperature measuring thermocouple (d) is provided on the ends (c) of the projection pin (e) and the insert pin (f) of a resin molding die. A compensation lead wire (h) is connected to the sensor part for sending out the output signal thereof to the control device of a molding machine. Also, after a resin molding die is filled with molten resin and this resin is solidified, the projection pin (e) operates to take out a molded product. Furthermore, the sensor part having the thermocouple (d) functions both as a projection pin and a means for directly measuring molten resin temperature, and the length of the projection pin (e) is freely adjustable. Also, the sensor part laid on the end of the insert pin (f) is capable of measuring temperature at the arbitrary position of the molding die, and not restricted by a die structure and a molding shape.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は樹脂成形金型内に埋め込
まれて金型キャビテー内を流れる溶融樹脂の温度を測定
する樹脂温度センサーに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin temperature sensor which is embedded in a resin molding die and measures the temperature of a molten resin flowing in a cavity of a die.

【0002】[0002]

【従来の技術】樹脂射出成形金型内に埋め込まれた熱電
対による表面温度センサーの従来例を第2図A,B,C
によって説明する。
2. Description of the Related Art A conventional example of a surface temperature sensor using a thermocouple embedded in a resin injection molding die is shown in FIGS. 2A, 2B and 2C.
It will be explained by.

【0003】第2図は樹脂射出成形金型の全体図を示
す。第2図Aにおいて、樹脂成形金型の固定側1内に溶
融樹脂5がながれ樹脂成形金型の固定側又は、可動側型
板の側面に穴明けし成形圧力に強度保持できる板厚7を
残して穴4を明け、そのなかにステンレス保護管2付き
熱電対温度センサー3によって測定される、熱電対素子
は絶縁された状態で熱電対3が保護管2に挿入されてい
る。
FIG. 2 shows an overall view of a resin injection molding die. In FIG. 2A, the molten resin 5 flows in the fixed side 1 of the resin molding die, and a plate thickness 7 capable of maintaining strength at the molding pressure by punching holes on the fixed side of the resin molding die or on the side surface of the movable side mold plate. The hole 4 is left behind, and the thermocouple 3 is inserted into the protective tube 2 in a state in which the thermocouple element is insulated, which is measured by the thermocouple temperature sensor 3 with the stainless steel protective tube 2 therein.

【0004】第2図Bは第2図Aの改良型で入子部品1
6に熱伝導性の優れた金属で覆いキャビティ内の溶融樹
脂15に近い温度を測定する方法である。
FIG. 2B is an improved version of FIG.
6 is a method in which the temperature is close to that of the molten resin 15 in the cavity, which is covered with a metal having excellent thermal conductivity.

【0005】第2図Cは上記の第2図Bのさらなる改良
型で保護管をなくすことでより溶融樹脂25に近い温度
を計測する方法である。
FIG. 2C shows a method of measuring the temperature closer to the molten resin 25 by eliminating the protective tube, which is a further improvement of the above-mentioned FIG. 2B.

【0006】[0006]

【発明が解決しようとする課題】上記の従来例の構成で
は次に示す問題点を有している。
The configuration of the above-mentioned conventional example has the following problems.

【0007】従来例第2図Aでは溶解樹脂5の温度を計
測するのにキャビティ1側面部の穴明け時、強度保持7
の厚みを介して2の保護管さらに3の熱電対で測定する
方法である、そのために実際の溶融樹脂温度を測定して
いない。さらに溶融樹脂温度が強度保持部7、保護管
2、熱電対3と熱が伝わる時間、時間遅れがある。
Conventional Example In FIG. 2A, the strength of the molten resin 5 is measured when the side surface of the cavity 1 is drilled to measure the temperature of the molten resin 7.
It is a method of measuring with a protective tube of 2 and a thermocouple of 3 via the thickness of the above, and therefore the actual molten resin temperature is not measured. Furthermore, there is a time delay and a time delay in which the temperature of the molten resin is transferred to the strength holding portion 7, the protective tube 2, and the thermocouple 3.

【0008】第2図B、第2図Cは熱伝導性の優れた金
属の入子部品16、26で計測しているが前記の直接溶
融樹脂温度を測ってないこと又測定時間遅れがある。
2B and 2C are measured with the metal insert parts 16 and 26 having excellent thermal conductivity, but the above-mentioned molten resin temperature is not directly measured, and there is a measurement time delay. .

【0009】温度検出箇所は樹脂成形品の形状、金型の
構造から制限される。
The location of temperature detection is limited by the shape of the resin molded product and the structure of the mold.

【0010】[0010]

【課題を解決する手段】この様な課題を解決するために
本発明の温度センサーは、樹脂成形金型における突出ピ
ン、入子ピンの先端に温度測定用のセンサー部を備えた
ことを特長とする。
In order to solve such a problem, the temperature sensor of the present invention is characterized in that a temperature measuring sensor portion is provided at the tip of the protruding pin and the insert pin in the resin molding die. To do.

【0011】[0011]

【作用】本発明の温度センサーは上記した構成によって
金型内の溶融樹脂温度を、任意の場所で測定できる。
The temperature sensor of the present invention can measure the temperature of the molten resin in the mold at any place by the above-mentioned structure.

【0012】金型内の溶融樹脂温度を直接樹脂に接触さ
せて測ることができる。
The temperature of the molten resin in the mold can be measured by directly contacting the resin.

【0013】上記どおり溶融樹脂温度を直接測ることで
従来より正確な温度制御が可能になり成形時間の短縮、
成形品の品質、精度があがる。
By directly measuring the temperature of the molten resin as described above, it becomes possible to perform more accurate temperature control than before, and shorten the molding time.
The quality and accuracy of molded products are improved.

【0014】[0014]

【実施例】本発明の実施例を図面参照して説明する。第
1図は温度センサーが樹脂成形金型に装着されている様
子を示している、第1図において突出ピン(ホ)入子ピ
ン(ヘ)を示しその先端(ハ)には熱電対(ニ)による
センサー部がある、補償導線(チ)はセンサーかたの信
号を成形機の制御装置に接続されている、樹脂成形金型
に溶融樹脂が充填され固化したのち成形品を取出すため
に突出ピンが作動する。本発明の温度センサーは突出ピ
ンの役割と溶融樹脂温度を直接計測することを兼用して
いることに特長がある、又突出ピンの長さを自由に変え
られる構造の突出ピン温度センサーである。
Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a state in which a temperature sensor is mounted on a resin molding die. In FIG. 1, a protruding pin (e) and a nesting pin (f) are shown, and a thermocouple (ni) is provided at the tip (c). ) Sensor part, the compensating lead wire (h) is connected to the control device of the molding machine with the signal from the sensor, and it projects to take out the molded product after the molten resin is filled in the resin molding die and solidified Pin works. The temperature sensor of the present invention is characterized in that it functions as both the role of the projecting pin and the direct measurement of the molten resin temperature, and the length of the projecting pin can be freely changed.

【0015】入子ピン温度センサーは上記と性能は同じ
で、入子ピン温度センサーの長さは一定形であるが、入
子ピン温度センサーは金型の任意の場所で計測でき金型
構造、成形品の形状に制限されない。
The insert pin temperature sensor has the same performance as the above, and the insert pin temperature sensor has a fixed length, but the insert pin temperature sensor can measure at any place of the mold, and the mold structure, The shape of the molded product is not limited.

【0016】第1図Aは突出ピン温度センサーの拡大図
であり、図によって突出ピン温度センサーの詳細を説明
する。Cu−Ni合金(コンスタンタン)の受熱部7は
突出ピン表面積の50%前後と広くすることで、受熱効
果をあげている。
FIG. 1A is an enlarged view of the protruding pin temperature sensor, and the details of the protruding pin temperature sensor will be described with reference to the drawing. The heat receiving portion 7 of the Cu—Ni alloy (Constantan) has a large heat receiving effect by being widened to about 50% of the surface area of the protruding pin.

【0017】上記Cu−Ni合金(コンスタンタン)1
は受熱部外径を大きくすることで、金型内の成形圧力に
たいする耐圧構造になっている。
The above Cu-Ni alloy (Constantan) 1
Has a pressure resistant structure against the molding pressure in the mold by increasing the outer diameter of the heat receiving part.

【00118】上記温度センサー本体3とCu−Ni合
金(コンスタンタン)1は耐熱性無機接着材8で固定さ
れている。
The temperature sensor body 3 and the Cu--Ni alloy (constantan) 1 are fixed by a heat resistant inorganic adhesive material 8.

【0019】上記突出ピン温度センサーは長さを自由に
変えられる構造である、補助管4と温度センサー本体3
とはネジ締付方式又は、側面からピン9で固定する、補
助管4の長さは自由に可変できる。
The protruding pin temperature sensor has a structure in which the length can be freely changed. The auxiliary pipe 4 and the temperature sensor main body 3 are provided.
Is a screw tightening method or is fixed by a pin 9 from the side, and the length of the auxiliary tube 4 can be freely changed.

【0020】第1図Aの入子ピン温度センサーは上記突
出ピン温度センサーと同じ性能であるが入子ピン温度セ
ンサー長が固定形であり、金型の任意の場所に設置でき
る構造である。
The insert pin temperature sensor of FIG. 1A has the same performance as the protruding pin temperature sensor, but the insert pin temperature sensor length is fixed, and the insert pin temperature sensor has a structure that can be installed at an arbitrary position of the mold.

【0021】[0021]

【発明の効果】以上のように本発明は突出ピン、入子ピ
ン樹脂成形用金型に使われる部品と兼用でき、温度セン
サー素子が直接樹脂に接触して計測でき、応答速度が早
く、僅かな温度変化も正確に計測できるこで樹脂射出成
形品の品質をたかめ、成形時間の短縮が可能になる。
INDUSTRIAL APPLICABILITY As described above, the present invention can be used also as a part used in a resin molding die for a protruding pin and a nesting pin, and a temperature sensor element can directly contact the resin for measurement, and the response speed is fast and small. Since accurate temperature changes can be accurately measured, the quality of resin injection molded products can be improved and the molding time can be shortened.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の実施ず及び突出ピン温度センサー、入
子ピン温度センサーの拡大図である。第2図は従来の温
度測定の図、及び温度測定センサーの拡大図である。
FIG. 1 is an enlarged view of a protrusion pin temperature sensor and a nesting pin temperature sensor without implementing the present invention. FIG. 2 is a diagram of a conventional temperature measurement and an enlarged view of the temperature measurement sensor.

【符号の説明】[Explanation of symbols]

第1図 イ、キャビティ ロ、コア ハ、先端 ニ、熱電対 ホ、突出ピン ヘ、入子ピン ト、溶融樹脂 チ、補償導線 第1図AB 1.11 Cu−Ni合金(コンスタンタン) 2.12 絶縁用セラミックチューブ 3.13 温度センサー本体 4 補助管(スリーブ) 5.15 +極補償導線 6.16 −極補償導線 7.17 受熱部 8.18 耐熱性無機溶接材 9 ピン 第2図ABC 1.11.21 固定側(キャビティ) 2.12.22 保護管(スリーブ) 3.13.23 熱電対 4.14.24 穴 5.15.25 溶融樹脂 6.16.26 入子部品 7 板厚 8.18.28 可動側(コア) Figure 1 b, cavity b, core c, tip d, thermocouple h, projecting pin f, nesting pin, molten resin, compensating lead wire Figure 1 AB 1.11 Cu-Ni alloy (Constantan) 2.12. Insulating ceramic tube 3.13 Temperature sensor body 4 Auxiliary tube (sleeve) 5.15 + pole compensating lead wire 6.16-pole compensating lead wire 7.17 Heat receiving part 8.18 Heat-resistant inorganic welding material 9-pin Fig. 2 ABC 1 11.21 Fixed side (cavity) 2.12.22 Protective tube (sleeve) 3.13.23 Thermocouple 4.14.24 hole 5.15.25 Molten resin 6.16.26 Nesting part 7 Plate thickness 8.18.28 Movable side (core)

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】樹脂成形金型の突出ピン及び入子ピンの先
端に温度測定用センサーを備えたことを特長とする金型
内温度センサー。
1. An in-mold temperature sensor, characterized in that a temperature measuring sensor is provided at the tip of a protruding pin and a nesting pin of a resin molding die.
【請求項2】前記突出ピン及び入子ピンには鉄−コンス
タンタン熱電対を備えている。
2. The iron-constantan thermocouple is provided on the protruding pin and the insert pin.
【請求項3】前記熱電対は突出ピン及び入子ピン本体F
e(鉄)が+極になり、Cu−Ni合金(コンスタンタ
ン)が−極となる。
3. The thermocouple comprises a protruding pin and a nesting pin body F.
e (iron) becomes a positive electrode, and Cu-Ni alloy (constantan) becomes a negative electrode.
【請求項4】前記突出ピン及び入子ピンFe(鉄)とC
u−Ni合金(コンスタンタン)とは対熱性無機接着剤
ど固定された請求項1記載の金型内温度センサー。
4. The protruding pin and the nesting pin Fe (iron) and C
The temperature sensor in a mold according to claim 1, wherein a heat-resistant inorganic adhesive and a u-Ni alloy (Constantan) are fixed.
JP34655095A 1995-12-04 1995-12-04 Resin surface temperature sensor Pending JPH09159539A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34655095A JPH09159539A (en) 1995-12-04 1995-12-04 Resin surface temperature sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34655095A JPH09159539A (en) 1995-12-04 1995-12-04 Resin surface temperature sensor

Publications (1)

Publication Number Publication Date
JPH09159539A true JPH09159539A (en) 1997-06-20

Family

ID=18384195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34655095A Pending JPH09159539A (en) 1995-12-04 1995-12-04 Resin surface temperature sensor

Country Status (1)

Country Link
JP (1) JPH09159539A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005515084A (en) * 2002-01-09 2005-05-26 モールド‐マスターズ、リミテッド Method and apparatus for measuring the temperature of molten material in a mold cavity
JP2007518993A (en) * 2004-01-21 2007-07-12 プリーアムス ジステーム テヒノロギース アーゲー Sensor with modular connection
JP4767955B2 (en) * 2004-09-06 2011-09-07 プリーアムス ジステーム テヒノロギース アーゲー Molding device with connectable pressure or temperature sensor
WO2013002297A1 (en) * 2011-06-30 2013-01-03 Canon Kabushiki Kaisha Manufacturing method of molding and mold

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005515084A (en) * 2002-01-09 2005-05-26 モールド‐マスターズ、リミテッド Method and apparatus for measuring the temperature of molten material in a mold cavity
USRE40952E1 (en) 2002-01-09 2009-11-10 Mold-Masters (2007) Limited Method and apparatus for measuring the temperature of molten material in a mold cavity
JP2007518993A (en) * 2004-01-21 2007-07-12 プリーアムス ジステーム テヒノロギース アーゲー Sensor with modular connection
JP4767955B2 (en) * 2004-09-06 2011-09-07 プリーアムス ジステーム テヒノロギース アーゲー Molding device with connectable pressure or temperature sensor
WO2013002297A1 (en) * 2011-06-30 2013-01-03 Canon Kabushiki Kaisha Manufacturing method of molding and mold
JP2013014022A (en) * 2011-06-30 2013-01-24 Canon Inc Method of manufacturing molding
CN103648745A (en) * 2011-06-30 2014-03-19 佳能株式会社 Manufacturing method of molding and mold

Similar Documents

Publication Publication Date Title
JP5503717B1 (en) Temperature detector, temperature sensor, and method of manufacturing temperature detector
TW200800562A (en) Hot runner nozzle
JPH09159539A (en) Resin surface temperature sensor
JP2668389B2 (en) Temperature sensor using thermoelectric material
CN108387320B (en) A kind of permanent mold casting quick response temperature thermocouple
CN203053599U (en) Melt temperature sensor having fast response characteristic under high temperature and high pressure
JP3124998B2 (en) Thermocouple device for tube wall temperature measurement and method of manufacturing the same
JPH04225126A (en) Resin-temperature measuring apparatus
JPH09210807A (en) Device for measuring multi-point temperatures
JPH0610640B2 (en) Pressure / temperature measurement sensor for high temperature fluids
JPH051364Y2 (en)
JP2668331B2 (en) Pressure casting equipment
JP2008164518A (en) Displacement measuring method and device
JPH08114520A (en) Pressure measuring device and pressure casting method using pressure measuring device
JPH09184769A (en) Thermocouple for measuring temperature of molten metal
JP2764474B2 (en) Melt temperature measuring device
JP3077531B2 (en) Temperature sensor and temperature measurement structure
JP3073288B2 (en) Resin surface temperature sensor
JPH0316049Y2 (en)
JP2990984B2 (en) Sensor connection structure
JPH01178429A (en) Device for detecting temperature of molten material in injection mold by means of metal pipe
JPH0536224Y2 (en)
JP2001088169A (en) Temperature measuring device of inner surface of runner of hot nozzle
KR100193234B1 (en) Melt filling time measuring device in mold
SU969447A1 (en) Device for measuring linear shrinkage and cracking resistance of alloys