JPH09139400A - Mounter for surface mount device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounter capable of accurately mounting an object on a specified position at a high speed and with high precision, when a printed board for mounting a surface mount device has warp and deflection, an object to be mounted has inclination, and a large-sized multipin object has lead terminals of narrow pitches. SOLUTION: In addition to a positioning sensor 7 for detecting a mount objective position, a second laser displacement gauge 8 is installed, and the distance NP15 from a nozzle lower end surface 14 to a cream solder 3 upper part is measured. When a nozzle 5 sucks an object by vacuum, the distance NG17 between the lower end surface of a lead terminal 11 and the lower end surface 14 of the nozzle is measured with a first laser displacement gauge installed on a base 16. The discending amount of the nozzle 5 is set by the difference between the distance NPl5 and the distance NGl7. When a specified indentation is reached, the object is separated from the nozzle 5 and mounted on the cream solder 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention makes it possible to mount a large-sized surface mounting device having a narrow lead terminal pitch and a large number of pins on a printed circuit board to be mounted with high accuracy. Mounting device for various surface mounting devices.

[0002]

2. Description of the Related Art In the prior art, a value obtained by adding a predetermined pushing amount to a height dimension based on a product standard dimension of a surface mounting device to be mounted and mounted on a printed circuit board or the like is a mounter. Input to the controller of
Thereby, the surface mounting device is mounted and mounted.

Referring to FIG. 5, the structure of the mounter for mounting the surface mounting device 4 of the prior art on the printed circuit board 1 is as follows: the land 2 formed on the printed circuit board 1 and the cream printed on the land 2. The positioning sensor 7 that detects the position of the solder 3, the nozzle 5 that is connected to the vacuum exhaust device by the vacuum suction hose 22 to suck the device 4 to be mounted, the positioning sensor 7 and the nozzle 5 that sucks the device 4 are fixed. The Z axis is moved so that the lead terminal 11 of the device 4 to be mounted is conveyed to a predetermined position on the XY axis of the printed circuit board 1 detected by the positioning sensor 7 and is pushed into the cream solder 3 by a predetermined pushing amount of 9 minutes. It consists of a head 6 that moves up and down.

As shown in FIG. 5, the cream solder 3 is printed on the land 2 on the printed board 1. Targeting there, the device 4 is transported and mounted using a mounter. That is, the position of the land 2 or the cream solder 3 is detected by the positioning sensor 7 provided on the head 6 of the mounter, and the device 4 vacuum-adsorbed by the nozzle 5 is carried onto the cream solder 3. Then, the nozzle 5 is lowered from above and the device 4 is inserted into the cream solder 3 by a predetermined pushing amount of 9 minutes.
In general, the method of pushing the lead terminal 11 is used.

As an option configuration of FIG. 5, as shown in FIG.
There is a mounter having a configuration in which the first laser displacement meter 13 is provided as shown in FIG. 1, which detects lead float (relative variation in the height direction of the lead) and rejects the device 4 having the lead defect. It is used when you want to (exclude).

However, as shown in FIG. 6, due to the warpage or the deflection of the printed circuit board 1, the mounting pressure when pushing by a predetermined pushing amount of 9 minutes is not constant, and the lateral force for one-sided pushing is applied. There was a problem that the F12 worked and the positional deviation occurred.

[0007]

Therefore, even if the printed circuit board is warped or warped or the device itself to be mounted is tilted, a mounter that can be accurately and correctly mounted at a predetermined position is provided. Aimed to achieve.

[0008]

In the structure of the mounter which is the machine for mounting the surface mounting device according to the present invention, the head 6 is not used to detect the position on the printed circuit board 1 where the device 4 to be mounted is to be mounted. In addition to the contact type positioning sensor 7, a non-contact type second laser displacement meter 8 is provided so that the device 4 to be mounted is mounted on the printed circuit board 1 from the nozzle lower end surface N14 at the tip of the head 6. The distance NP15 to the upper portion of the cream solder 3 is measured, then the device 4 is vacuum-sucked by the nozzle 5, and the surface is brought into contact with the cream solder 3 by the first laser displacement meter 13 provided on the base 16 of the mounter. All lead terminals 11
The distance NG17 between the lower end surface of the nozzle and the lower end surface N14 of the nozzle, which is the vacuum suction surface, is measured. If the distance NG17 is out of the predetermined size range, the device 4 is removed in advance so as to stop the mounting of the device 4, stored in a predetermined position and rejected, and the nozzle 5 is lowered by obtaining the difference between the distance NP and the distance NG17. When the operation amount is set, and the position of the nozzle 5 reaches the set lowering operation amount and the predetermined pushing amount 9 is reached, the vacuum suction of the nozzle 5 is stopped, the device 4 to be mounted is separated from the nozzle 5 and placed on the cream solder 3. It is configured to be installed.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below in detail with examples.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the structure of a mounter for mounting a surface mounting device of the present invention on a printed circuit board.
As shown in (A) to (E), the positioning sensor 7 for detecting the positions of the land 2 formed on the printed board 1 and the cream solder 3 printed on the land 2 and the printed board from the nozzle lower end surface N14. Distance N to the mounting position on 1
The second laser displacement meter 8 for measuring P15 and the device 4 to be mounted, which is connected to the vacuum exhaust device by the vacuum suction hose 22.
The nozzle 5 for adsorbing, the positioning sensor 7, the second laser displacement gauge 8 and the nozzle 5 are fixed and have a vacuum adsorbing hose to move back and forth and left and right on the XY axis on the printed circuit board 1 and to move the Z axis. The lower and upper heads 6 and the lower end surfaces of all the lead terminals 11 of the device 4 vacuum-sucked by the nozzles 5 at predetermined positions of the base 16 and the lower end surface N14 of the vacuum suction surface.
First laser displacement meter 13 for measuring the distance NG17 between
And This is a main part configuration in which a second laser displacement meter 8 is added to the conventional configuration. Here, the second laser displacement meter 8 is an example of vertical displacement measuring means for measuring vertical displacement with respect to the printed circuit board 1, and other measuring devices may be used.

(1) FIGS. 1A to 1E show a mounting process diagram for explaining an embodiment of an embodiment of the present invention. According to the present invention, the lead terminal 11 is the optimum condition for the cream solder 3 even if the height of the printed circuit board 1 varies depending on the warp or the warp or the lower end surface of the lead terminal 11 of the device 4 fluctuates. It is a mounter that realizes mounting of device 4 at the pressing height. As shown in FIG. 1A, first, the position of the land 2 and the cream solder 3 on the printed circuit board 1 is confirmed by the positioning sensor 7 as in the prior art. Next, using the non-contact type second laser displacement meter 8 provided in the present invention, the nozzle 5 attached to the tip of the head 6 is moved from the nozzle lower end surface N14 to the printed circuit board 1.
The distance NP15 to the upper mounting position is measured. As a result, a displacement corresponding to the amount of warp or the amount of deflection of the printed circuit board 1 at this location can be obtained.

(2) Next, as shown in FIG. 1 (B), the device 4 is vacuum-sucked by the nozzle 5 and is provided at a predetermined position on the base 16 of the mounter shown in FIG. 1 (C). 1
The laser displacement meter 13 measures the distance NG17 between the lower surface of all the lead terminals 11 which is the surface in contact with the cream solder 3 and the lower end surface N14 of the nozzle 5 which is the vacuum suction surface.

(3) If the distance NG17 is out of the predetermined size range, it is rejected and the process returns to step (2) to use a new device 4 by suction.

(4) Then, the relationship between the distance NP15 and the distance NG17 obtained by measuring with the second laser displacement meter 8 provided according to the present invention shown in FIG. 1A is utilized. That is, as shown in FIG. 1 (D), the wafer is conveyed to a predetermined mounting position on the printed circuit board 1 while being vacuum-sucked, where the distance NP15 and the distance N obtained by the previous measurement are measured.
The difference from G17 is calculated by the controller of the mounter and set as the amount of downward movement of the nozzle 5.
When the position of the nozzle 5 reaches the set lowering operation amount, the nozzle 5 releases the vacuum suction and mounts it on the cream solder 3.

(5) The set lowering operation amount can be arbitrarily set. Therefore, the contact amount with the cream solder 3 is 0 and the pushing amount 9 is 0.
At the position where the device 4 to be mounted is dropped or when a predetermined amount is pushed into the cream solder 3, vacuum suction by the nozzle 5 is stopped and the device 4 is moved to the nozzle 5
By disconnecting from the lateral force F shown in FIG.
Since No. 12 is not generated, it is possible to prevent positional deviation due to the mounting pressure applied by pushing. Therefore, as shown in FIG. 1E, even if the printed circuit board 1 is warped or warped or the device 4 itself is tilted to some extent, the pressing height can be controlled to a desired optimum condition, so that the pressing condition is stable. It became possible to mount the device 4.

(6) As shown in FIG. 2 (A), since the device 4 to be mounted recently has become large in size, the power consumed there generates heat and the temperature rises to a high temperature. Appears, and the device 4 is attached to the device 4 mainly by using an adhesive 21. However, depending on the result of the bonding work, as shown in FIG.
The device 4 itself becomes the nozzle 5
It shows that it has tilted when it is vacuum-adsorbed.

(7) Further, in FIG. 3, in the second non-contact type laser displacement meter 8 provided according to the present invention, on the printed circuit board 1 from the lower end surface N14 of the nozzle attached to the tip of the head 6. To measure the distance NP15 to the mounting position, a space 19 other than the land 2 or the cream solder 3 is used.
It shows that it may be a surface or a surface of the land 2 on which the cream solder 3 is not printed.

(8) And FIG. 4 shows FIG. 1 (C).
It is a principle diagram which measures the distance NG17 by the 1st laser displacement meter 13 shown in FIG. That is, if the height of the lead terminal 11 of the device 4 to be mounted is changed due to the bending indicated by the broken line, the reflection angle of the laser beam emitted from the first laser displacement meter 13 is changed, and is also indicated by the broken line. Since it is the position of the incident light, the amount of deformation of the lead terminal 11 is measured by this, the bending angle of the lead terminal 11 is obtained from this, and the distance NG17 is calculated from it.

[0019]

Since the present invention is configured as described above, it has the following effects. (1) In the present invention, the height of the mounting surface of the printed circuit board 1 on which the device 4 for surface mounting is mounted is accurately and accurately measured by the second laser displacement meter 8 provided in the present invention,
Further, the height of the device 4 to be mounted is accurately and accurately measured by the first laser displacement meter 13 provided conventionally, and the data is used to measure the nozzle 5 of the mounter.
Determine the amount of lowering movement of the lead terminal 11 cream solder 3
By controlling the amount of pushing into the device, even if the lead terminal 11 of the device 4 is only one-sided at the time of mounting, there is no displacement due to the mounting pressure due to pushing. (2) With the configuration of the present invention, even if there is a warp or a warp on the mounting target surface of the printed circuit board 1 on which the surface mounting device is mounted, the pitch of the lead terminals 11 is narrow and the number of pins is increased to increase the mounting target. The device 4 can be correctly and accurately mounted at a predetermined position without causing positional deviation.

[Brief description of the drawings]

FIG. 1 is a mounting process diagram (A) to (E) corresponding to a warp of a substrate and a device suction displacement according to an embodiment of the present invention.

2A and 2B are a side view of a device mounting having a radiation fin, and FIG. 2B is a side view of a device mounting having a tilted radiation fin.

FIG. 3 is a perspective view showing a reference plane on a printed circuit board for measuring a distance NP by a second laser displacement meter provided in the present invention.

FIG. 4 is a principle diagram for measuring an amount of lead angle change by a laser displacement meter.

FIG. 5 is a side view for explaining device mounting on a conventional printed circuit board in a horizontal state.

FIG. 6 is a side view illustrating device mounting on a conventional printed circuit board having a warp.

[Explanation of symbols]

 1 printed circuit board 2 land 3 cream solder 4 device 5 nozzle 6 head 7 positioning sensor 8 second laser displacement meter 9 pushing amount 11 lead terminal F12 lateral force 13 first laser displacement meter 14 nozzle lower end surface N 15 distance NP 16 base 17 Distance NG 18 Radiating fin 19 Space 21 Adhesive 22 Vacuum suction hose

Claims (2)

[Claims] 1. A mounter for mounting a surface mounting device, wherein a moving head (6) having a position detecting positioning sensor (7) on a printed circuit board (1) is provided with the printed circuit board (1). A vertical displacement measuring means for measuring vertical displacement is provided, and the second laser displacement meter (8) measures the distance NP (15) to the upper end of the cream solder (3) or the substrate surface, and the first laser displacement meter ( From the distance NG (17) to the lower end surface of the lead terminal (11) obtained in 13), the amount of descending movement of the nozzle (5) is determined by calculation, and a device mounting control means is provided on the cream solder (3). A mounter for a surface-mounting device comprising the above. 2. The mounter for a surface mounting device according to claim 1, wherein the vertical displacement measuring means uses a second laser displacement meter (8).