JPH0913173A - Sputtering device and method for exchanging its deposition preventive plate - Google Patents

Abstract

PURPOSE: To provide a sputtering device which is improved in a device moving rate and the reliability of film quality stabilization by exchanging a deposition preventive plate without opening a film forming chamber to the atm. CONSTITUTION: A vacuum transporting robot 5 having pawls 6 is inserted into the film forming chamber 1a and the deposition preventive plate 3 is removed from the film forming chamber 1a by a lifting mechanism section 12 and is mounted at the vacuum transporting robot 5. After the deposition preventive plate 3 is disconnected by swiveling a rotating mechanism section 11, the vacuum transporting robot 5 is transported to a take-out chamber and the deposition preventive plate is left therein. The deposition preventive plate previously charged into a charging chamber is fetched by the vacuum transporting robot 5 and is transported and fixed to the film forming chamber 1a by the procedure reverse from above.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus and a method for exchanging a deposition-preventing plate therefor, and more particularly, when a target is sputtered and scattered particles are deposited on a substrate surface to form a film, The present invention relates to a cluster type single-wafer type, a load-lock type or an in-line type sputter apparatus provided with an adhesion preventive plate that adheres most of sputter particles that do not deposit on the surface, and a method for exchanging the adhesion preventive plate.

[0002]

2. Description of the Related Art Sputtering apparatuses have been in increasing demand in various fields as one of means for thinning various materials. Especially recently, this sputtering technique has become particularly important in place of the conventional plating method in order to reproducibly form a thinner film.

In a mass-production sputtering apparatus, dust generation during film formation is one of the causes of impeding the improvement of yield and productivity. This is because when the target is sputtered, the scattered sputtered particles adhere to areas other than the substrate, which are separated and enter the substrate to become foreign matter (dust), which adversely affects the substrate. Therefore, it is necessary to make it possible to easily clean the film adhered to other than the substrate, or to make the adhered film difficult to peel off.

As one measure to solve this problem, it is general practice to dispose a plate called an adhesion-preventing plate around the inner wall of the film forming chamber and the target. That is, this is a method in which, of the sputtered particles generated by sputtering the target, most of the sputtered particles that do not adhere to the substrate are adhered to the deposition preventive plate, and the deposition preventive plate is periodically replaced.

However, since the deposition chamber must be returned to the atmosphere once in order to replace the deposition preventive plate, the next problem is how to replace the deposition preventive plate in a short time, which simplifies the structure of the deposition preventive plate. , The reduction of the number of adhesion-preventing plates has been earnestly studied.

From this point of view, the one in which the deposition preventive plate is replaced without breaking the vacuum is disclosed in JP-A-61-133378 and JP-A-SHO.
It is described in JP-A No. 61-210177 and JP-A No. 2-50962.

[0007]

However, in the above-mentioned Japanese Patent Laid-Open No. 61-133378, the structure for replacing the deposition preventive plate for preventing the sputtered particles from adhering to the heater is specifically described. The structure for exchanging the deposition preventive plate around the target is not specifically described, let alone the use of a transfer robot for transferring substrates or a transfer tray.

On the other hand, Japanese Patent Application Laid-Open No. 61-210177 and Japanese Patent Application Laid-Open No. 2-50962 specifically describe a structure in which the deposition preventive plate arranged around the target is replaced. Also in order to replace the adhesion-preventing plate, a special structure for carrying is added, and there is no description about using a carrying robot for carrying the substrate or a carrying tray.

The present invention has been made in view of the above points,
The purpose is to make it possible to easily replace the deposition preventive plate arranged around the target by using an existing transfer robot for transferring substrates or a transfer tray without breaking the vacuum. (EN) An apparatus and a method for exchanging a deposition preventive plate thereof.

[0010]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an attachment / detachment mechanism in which an attachment prevention plate disposed around a target is attached / detached to / from a conveyance means for conveying a substrate for conveyance / exchange. The attachment prevention plate, which is provided or arranged around the target, is provided with an attachment / detachment mechanism that is attached / detached to / from the conveyance means that conveys the substrate, and the attachment / detachment mechanism is moved up to raise the attachment / detachment mechanism. "Attach" to the transport means
At the same time, the attachment-prevention plate is lowered to "remove" the detachment mechanism from the transport means, and when the attachment-prevention plate is raised to a predetermined position, the elevation-prevention mechanism unit lowers the attachment-prevention plate. And a rotation mechanism portion for rotating an attachment-prevention plate fitting portion which is provided at a tip so as to fit into a pin provided on the attachment-prevention plate in order to "remove" the attachment-and-detachment mechanism from the transport means. It is characterized by having done.

Further, the detaching / attaching mechanism includes a plate hooked on a claw portion provided in a vacuum transfer robot for transferring the substrate,
It is characterized by comprising a guide plate for moving the plate in the horizontal direction, a plate spring for pressing the plate against the claw portion side of the vacuum transfer robot, and a stage for fixing the plate spring and the guide plate.

Further, there are provided a substrate which is placed in a vacuum container and on which a film is formed, a target which is placed so as to face the substrate and which is a base material on which a film is to be formed, and an adhesion preventing plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. The stored extraction chamber is connected to the film forming chamber, the charging chamber, and the extraction chamber via a sluice valve, and the substrate before the film formation is transferred from the charging chamber to the film formation chamber and the film formation is performed. Vacuum transfer robot that transfers the substrate after film formation from the chamber to the unloading chamber In a cluster type single-wafer sputtering apparatus having a transfer chamber in which is stored, a vacuum transfer robot in the transfer chamber, in a vacuum, the deposition-prevention plate to which the sputter particles in the film forming chamber adhere. A vacuum transfer robot that transfers the substrate to the unloading chamber, and also transfers the replacement deposition-inhibitory plate from the preparation chamber to the film formation chamber in vacuum, or the deposition-inhibition plate transports the substrate. And a detachment mechanism that is detached and transferred for replacement. The attachment prevention plate is lifted to "attach" the attachment / detachment mechanism to the vacuum transfer robot, and the attachment / detachment plate is moved down to remove the attachment / detachment mechanism. An elevating mechanism part for “releasing” from the vacuum transfer robot, and for removing the attaching / detaching mechanism from the vacuum transfer robot by lowering the attachment preventing plate by the elevating mechanism part when the deposition preventing plate is raised to a predetermined position. On the anti-stick plate The vacuum transfer robot has a claw portion on the target side in the film forming chamber near the tip of the vacuum transfer robot. On the other hand, the anti-adhesion plate is a plate that is hooked on the claw portion of the vacuum transfer robot, a guide plate that moves the plate in the horizontal direction, and a leaf spring that presses the plate toward the claw portion of the vacuum transfer robot. The vacuum transfer robot is provided with an attachment / detachment mechanism composed of the leaf spring and a stage for fixing the guide plate, or the vacuum transfer robot has a claw on the target side in the film forming chamber near its tip, while The mounting plate includes a plate that is hooked on the claw portion of the vacuum transfer robot, a guide plate that moves the plate in the horizontal direction, a leaf spring that presses the plate toward the claw portion of the vacuum transfer robot, the leaf spring and the Stage that fixes the guide plate And a desorption mechanism that raises the deposition prevention plate to "attach" the desorption mechanism to a claw provided on the vacuum transfer robot, and lowers the deposition prevention plate to remove the desorption mechanism. Is lifted from the claw portion provided on the vacuum transfer robot, and when the attachment-preventing plate is raised to a predetermined position, the attachment-and-detachment plate is lowered by the raising-and-lowering mechanism to remove the attaching and detaching mechanism. The vacuum transfer robot is provided with a rotation mechanism section for rotating the attachment plate fitting portion at the tip so as to fit into a pin provided on the attachment plate in order to "remove" it from the claw portion. It is characterized by

Further, there are provided a substrate which is placed in a vacuum container and on which a film is formed, a target which is placed so as to face the substrate and which is a base material on which a film is to be formed, and an adhesion preventive plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading / unloading chamber for transporting a substrate before film deposition to the film deposition chamber, or a substrate after film deposition from the film deposition chamber, and a partition for partitioning the loading / unloading chamber and the film deposition chamber A valve, and a substrate transfer tray for transferring a substrate from the loading / unloading chamber to a filming chamber before deposition, and transporting a substrate after deposition from the deposition chamber to the loading / unloading chamber,
In a load-lock type sputtering apparatus provided with the film forming chamber and a transfer roller arranged in the loading / unloading chamber for moving the substrate transfer tray, the deposition preventive plate transfers the substrate. The substrate transport tray is equipped with a detachment mechanism that is detached and transported to be exchanged, and the deposition preventive plate is raised to "attach" the detachment mechanism to the substrate transport tray and the deposition preventive plate is lowered. And an elevating mechanism section for "detaching" the attachment / detachment mechanism from the substrate transfer tray,
When the attachment-preventing plate is raised to a predetermined position, the lifting mechanism lowers the attachment-preventing plate to attach and detach the attachment / detachment mechanism from the substrate transport tray to a pin provided on the attachment-preventing plate. Or a rotation mechanism portion for rotating the fitting-prevention plate fitting portion provided at the tip so as to fit, or the substrate transfer tray has a claw portion on the target side in the film forming chamber, and The plate includes a plate that is hooked on the claw portion of the substrate transport tray, a guide plate that moves the plate in the horizontal direction, a leaf spring that presses the plate toward the claw portion side of the substrate transport tray, and the leaf spring. Either a detaching mechanism including a stage for fixing the guide plate is provided, or the substrate transport tray has a claw portion on the target side in the film forming chamber, while the deposition preventing plate is the substrate. A plate that is hooked on the claws of the transport tray and that plate A guide plate that moves in a direction, a plate spring that presses the plate toward the claw portion of the substrate transport tray, and a detaching mechanism that includes a stage that fixes the plate spring and the guide plate, and the attachment plate And the attachment / detachment mechanism is "attached" to the claw portion provided on the substrate transport tray, and the attachment prevention plate is lowered to have the attachment / detachment mechanism provided on the substrate transport tray. And the attachment / detachment plate is lifted to a predetermined position, the attachment / detachment plate is lowered by the elevating / lowering mechanism part to detach the attachment / detachment mechanism from the claw portion provided on the substrate transport tray. It is characterized in that it is provided with a rotation mechanism portion for rotating the engagement portion of the deposition-inhibitory plate, which is provided at the tip so as to fit into a pin provided on the deposition-inhibition plate for "releasing".

Further, there are provided a substrate which is placed in a vacuum container and on which a film is formed, a target which is placed so as to face the substrate and which is a base material on which a film is to be formed, and an adhesion preventive plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. A unloading chamber that is stored, a gate valve that partitions the film forming chamber from the loading chamber, and the unloading chamber, transport of a substrate from the loading chamber before film deposition to the film deposition chamber, and from the film deposition chamber Substrate transport tray for transporting a substrate after film formation to a take-out chamber, and the substrate In an in-line type sputtering apparatus equipped with the film forming chamber, the charging chamber, and the transfer roller arranged in the unloading chamber for moving the transfer tray, the deposition preventive plate transfers the substrate. The substrate transport tray is equipped with a detachment mechanism that is detached and transported to be exchanged, and the deposition preventive plate is raised to "attach" the detachment mechanism to the substrate transport tray and the deposition preventive plate is lowered. Then, the lifting / lowering mechanism part for "releasing" the mounting / dismounting mechanism from the substrate transport tray, and when the deposition preventing plate is raised to a predetermined position, the lifting / lowering mechanism part lowers the deposition preventing plate to remove the mounting / demounting mechanism from the substrate. Is there a rotation mechanism for rotating the attachment plate fitting portion at the tip so as to fit into a pin provided on the attachment plate to "remove" from the transport tray?
The substrate transfer tray has a claw portion on the target side in the film forming chamber, while the adhesion-preventing plate is a plate to be hooked on the claw portion of the substrate transfer tray and the plate in the horizontal direction. A guide plate for moving, a plate spring for pressing the plate against the claw portion side of the substrate transfer tray, and a detaching mechanism including a stage for fixing the plate spring and the guide plate are provided, or the substrate transfer tray Has a claw portion on the target side in the film forming chamber, while the adhesion-preventing plate is a plate that is hooked on the claw portion of the substrate transport tray, and a guide plate that moves the plate horizontally. A detaching mechanism including a leaf spring for pressing the plate against the claw portion side of the substrate transport tray and a stage for fixing the leaf spring and the guide plate is provided. To the claws provided on the substrate transport tray. In addition to lowering the attachment-prevention plate, the attachment / detachment mechanism is lifted / lowered when the attachment / detachment plate is raised to a predetermined position. In order to lower the attachment prevention plate by means of a mechanism to "detach" the attachment / detachment mechanism from the claw portion provided on the substrate transport tray, the attachment / detachment end which is fitted to the pin provided on the attachment prevention plate is provided. And a rotation mechanism portion for rotating the fitting portion.

Further, in the present invention, in order to achieve the above-mentioned object, the deposition preventing plate to which the sputtered particles are attached inside the vacuum container in the vacuum state conveys the substrate by the desorption mechanism provided in the deposition preventing plate. The transfer robot is “loaded” and transferred to a room in a vacuum state different from that of the vacuum container, where the attachment / detachment plate attachment / detachment mechanism is “released” from the transfer robot, while being transferred to another room. Is pre-loaded with a new deposition plate, and this new deposition plate is placed in the vacuum container by the attachment / detachment mechanism provided on the new deposition plate being "attached" to the transfer robot that transfers the substrate. It is characterized in that the new attachment / detachment plate attachment / detachment mechanism is “detached” from the delivery robot, placed at a predetermined position and exchanged.

In the method of replacing the deposition-preventing plate in the cluster type single-wafer sputtering apparatus, the deposition-preventing plate to which the sputtered particles in the vacuum deposition chamber is attached is provided on the deposition-preventing plate. The attachment / detachment mechanism is “attached” to the substrate transfer robot and is transferred to the unloading chamber in a vacuum state, where the attachment / detachment plate attachment / detachment mechanism is “released” from the transfer robot.
On the other hand, in the atmospheric condition, a new deposition-inhibitory plate is preliminarily loaded in the preparation chamber, and this new deposition-inhibition plate is evacuated and provided on the new deposition-inhibition plate in the charging chamber in a vacuum state. The attachment / detachment mechanism is “attached” to the substrate transfer robot and transferred to the film forming chamber, and the new attachment / detachment plate attachment / detachment mechanism is “removed” from the transfer robot and placed at a predetermined position for replacement. It is characterized by being done.

In the method of exchanging the deposition preventive plate in the load lock type sputtering apparatus, the deposition preventive plate to which the sputtered particles adhere in the vacuum deposition chamber is attached to the deposition preventive plate. Is “loaded” on the substrate transport tray that transports the substrate and transported to the loading and unloading chamber in a vacuum state.
Here, the attachment-and-detachment mechanism of the adhesion-preventing plate is “detached” from the substrate transport tray, while a new attachment-preventing plate is preliminarily charged in the loading / unloading chamber in the atmospheric state.
In the loading / unloading chamber that is evacuated to a vacuum state, the attachment / detachment mechanism provided on the new deposition-inhibitory plate is “attached” to the substrate transport tray that transports the substrate and transported to the film formation chamber, It is characterized in that the attachment / detachment mechanism of the attachment-preventing plate is “detached” from the substrate carrying tray, arranged at a predetermined position and exchanged. In the method of exchanging the deposition preventive plate in the in-line type sputtering apparatus, the deposition preventive plate in the vacuum film forming chamber to which the sputtered particles adhere is transferred by the desorption mechanism provided in the deposition preventive plate. The substrate transfer tray is “loaded” and transferred to the unloading chamber in a vacuum state, where the attachment / detachment plate attachment / detachment mechanism is “detached” from the substrate transfer tray, while it is fresh in the loading chamber in the atmospheric state. A new deposition preventive plate is placed in the substrate transport tray for transporting the substrate by the desorption mechanism provided on the new deposition preventive plate in the charging chamber that is evacuated to a vacuum state. It is characterized in that it is “loaded” and transported to the film forming chamber, and the new attachment / detachment mechanism of the deposition preventive plate is “detached” from the substrate transport tray and placed at a predetermined position and replaced.

[0018]

In the present invention, the sputtering apparatus such as the cluster type single wafer type sputtering apparatus, the load lock type sputtering apparatus, and the in-line type sputtering apparatus carries out all the deposited substrates after the deposition is completed. However, all rooms are waiting in a vacuum state. Then, the preparation chamber in which a preliminarily prepared preliminary deposition-inhibitory plate is installed at a predetermined position is exhausted, and a vacuum transfer robot, or a transfer mechanism including rollers, bearings and gears, or a tune, and the transfer mechanism are used to move. Move the transfer tray to the film formation chamber, and remove the used deposition-prevention plate (those with sputtered particles attached) from the deposition chamber by the deposition-plate detachment mechanism and fix it to the vacuum transfer robot or the transfer tray. To do. The vacuum transfer robot or the transfer tray that has received this deposition prevention plate moves to the extraction chamber and is installed in the extraction chamber by the deposition prevention plate attachment / detachment mechanism in the extraction chamber. After that, open the extraction chamber where the used anti-adhesion plate is installed to the atmosphere, remove the used anti-adhesion plate,
Exhaust again.

With the vacuum in the charging chamber, the vacuum transfer robot, or the transfer mechanism and transfer tray composed of rollers, bearings and gears, or tune,
The deposition preventive plate installed in the preparation room is transferred to the film formation room. In the film forming chamber, the deposition preventing plate is fixed to the film forming chamber by a mechanism for removing the deposition preventing plate, and the vacuum transfer robot is returned to the transfer chamber, and the transfer tray is returned to the unloading chamber or the loading / unloading chamber.

Therefore, the deposition preventive plate can be replaced by using the vacuum transfer robot or the transfer tray without opening the vacuum container, which is the film forming chamber, to the atmosphere. Is significantly improved, and a film having good film quality can be stably formed, and reliability is improved.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

FIG. 2 shows an outline of a cluster type single wafer type sputtering apparatus which is an embodiment of the present invention.

As shown in the figure, 1a is a film forming chamber for forming a film on a substrate, 1b is a preparation chamber for keeping the substrate before film forming on standby, 1
Reference numeral c denotes an unloading chamber for carrying out the film-formed substrate to the outside, 1d denotes the film-forming substrate in the film-forming chamber 1a being transferred to the unloading chamber 1c, or the substrate before film-forming in the preparation chamber 1b. Membrane chamber 1a
Is a transfer chamber that houses a vacuum transfer robot 5 that transfers the film to a film forming chamber 1a, a preparation chamber 1b, and an extraction chamber 1.
c is connected in a plane with a sluice valve (gate valve) 9 centered on the transfer chamber 1d.

FIG. 1 shows a detailed structure of the film forming chamber 1a in the above-mentioned cluster type single-wafer sputtering apparatus.

As shown in the figure, the film forming chamber 1a is
a substrate (not shown) which is placed in the vacuum container 1 constituting a and is formed on the surface thereof, and a substrate which is placed so as to face the substrate and serves as a base material for film formation, and which is a part of the film forming chamber 1a. The target 2 forming a part and the deposition-inhibitory plate 3 arranged around the target 2 are roughly configured, and sputtered particles sputtered from the target 2 are deposited on the surface of the substrate to form a film. Most of the sputtered particles that are not deposited on the substrate surface are attached to the deposition preventing plate 3.

Further, a substrate transfer mechanism 7a is provided in the film forming chamber 1a, and the rotation mechanism section 11 and the lifting mechanism section 1 are provided.
An attachment-prevention plate attaching / detaching mechanism composed of 2 is provided, and the attachment-prevention plate 3 itself can be moved up and down while delivering the substrate.

That is, regarding the transfer of the substrate, the vacuum transfer robot 5 has a claw 6 on the side of the target 2 and the claw 6 transfers the deposition-inhibitory plate 3 in the transfer chamber. Vacuum transfer robot 5 in 1d
However, with the sluice valve 9 open, the substrate before film formation, which is previously arranged in the charging chamber 1b, is supported by the claws 6 and extends into the film forming chamber 1a to convey the substrate. The substrate is transferred to and from the substrate transfer mechanism 7a.

For raising and lowering the deposition-inhibiting plate 3 itself, as shown in the relationship between the deposition-inhibiting plate 3 and the vacuum transfer robot 5 in FIG. 3, the deposition-inhibiting plate 3 is a plate for catching on the claw 6 of the vacuum transfer robot 5. 33, a guide plate 34 for moving the plate 33 in the horizontal direction, and a plate spring 35 for pressing the plate 33 toward the claw 6 side.
And a stage 36 for fixing the guide plate 34 and the leaf spring 35.
It is composed of

When the attachment / detachment portion is provided with a plurality of attachment / detachment portions and the nail 6 of the vacuum transfer robot 5 and the attachment / detachment portion of the attachment-prevention plate 3 are aligned in the angular position, the taper portion of the nail 6 and the attachment-prevention portion Lapping of the tapered portion of the plate 33 of the plate 3 and the plate spring 35
By the action, the vacuum transfer robot 5 can attach and detach the deposition preventive plate 3.

FIG. 4 shows the relationship between the deposition preventive plate 3 and the deposition preventive plate detaching mechanism shown in FIG. As shown in the figure, the attachment-preventing plate 3 is composed of a pin 31 that engages with the attachment-preventing plate detaching mechanism and a spring mechanism portion 32 that engages with the vacuum transfer robot 5. Vacuum transfer robot 5
Thus, when the deposition-prevention plate 3 is conveyed onto the target 2, the elevating mechanism section 12 of the deposition-prevention plate detachment mechanism operates and the entire deposition-prevention plate detachment mechanism is raised. When the lifting of the attachment-preventing plate attaching / detaching mechanism is completed, the rotation mechanism portion 11 turns and fits into the pin 31 of the attachment-preventing plate 3. When the elevating mechanism 12 descends in this state, the deposition-preventing plate 3
Is removed from the vacuum transfer robot 5 and fixed in the film forming chamber 1a. At this time, the lower part of the deposition preventive plate 3 has a taper, and the deposition preventive plate 3 is brought to the ground potential by rubbing against the taper on the film forming chamber 1a side and pressing it.

The anti-adhesion plate attachment / detachment mechanism including the rotation mechanism section 11 and the elevating / lowering mechanism section 12 has the same structure in the loading chamber 1b and the ejection chamber 1c. When transferred to the chamber 1b and the take-out chamber 1c, the deposition preventive plate is removed from the vacuum transfer robot 5 in the same manner as above.

Next, a method of replacing the deposition-prevention plate in the cluster type single-wafer sputtering apparatus will be described.

The deposition-preventing plate 3 to which the sputtered particles adhere in the deposition chamber 1a in the vacuum state is moved up and down by the elevating mechanism 12 so that the vacuum transfer robot 5 provided on the deposition-preventing plate 3 can be used.
A plate 33 for hooking the claw 6 on the claw 6, a guide plate 34 for moving the plate 33 in the horizontal direction, a plate spring 35 for pressing the plate 33 toward the claw 6, and a guide plate 34 and a plate spring 35.
The plate 3 of the attachment / detachment mechanism including the stage 36 for fixing the
3 is transferred to the unloading chamber 1c in a vacuum state by being “attached” to the claw 6 of the vacuum transfer robot 5 that transfers the substrate, and by lowering the elevating mechanism section 12 here, the plate 33 of the deposition-preventing plate is removed. The claw 6 of the vacuum transfer robot 5 is "disengaged", while a new deposition plate having the same structure as above is previously loaded in the charging chamber 1b in the atmospheric state. By raising the elevating mechanism section 12 in the charging chamber 1b which is in a vacuum state, the plate 33 provided on the new deposition-inhibiting plate is "attached" to the claw 6 of the vacuum transfer robot 5 and the film forming chamber 1a. When the elevator 33 is transported to the inside and the elevator mechanism 12 is lowered, the plate 33 of the new attachment-preventing plate is “disengaged” from the claw 6 of the vacuum transfer robot 5 and placed at a predetermined position for replacement. Become.

Hereinafter, when it comes time to replace the deposition-inhibitory plate 3, the above-mentioned operation is sequentially repeated.

FIG. 5 shows a schematic configuration example of a load lock type sputtering apparatus which is another embodiment of the present invention.

As shown in the figure, the load-lock type sputtering apparatus is arranged in a vacuum container, a substrate (not shown) on the surface of which a film is formed, a base material which is arranged to face the substrate and is to be formed. The target 2 and the deposition preventive plate 3 arranged around the target 2 are provided, and the sputtered particles scattered by the sputtering of the target 2 are deposited on the surface of the substrate to form a film, and on the surface of the substrate. Film deposition chamber 21a for depositing most of the sputtered particles that do not deposit on the deposition prevention plate 3 and the substrate before film deposition is transported to this film deposition chamber 21a, or after film deposition from the film deposition chamber 21a To the film forming chamber 21a for depositing the substrate before film formation from the charge / unload chamber 21b, the partition valve 9 for partitioning the charge / unload chamber 21b from the film forming chamber 21a. Transport,
A substrate loading / unloading chamber 21 after film deposition from the film deposition chamber 21a
Substrate transport tray 8 for transporting to substrate b, and transport rollers 7b arranged in film forming chamber 21a and loading / unloading chamber 21b for moving substrate transport tray 8 are generally configured. There is. The substrate transfer tray 8 is provided with a mechanism that handles the claws 6 provided on the vacuum transfer robot 5 of the above-described embodiment. In addition, the film forming chamber 2
1a is equipped with an adhesion preventive plate and an adhesion preventive plate attaching / detaching mechanism as in the film forming chamber of the above-mentioned cluster type single-wafer sputtering apparatus.

FIG. 6 shows the detailed structure of the film forming chamber in the load lock type sputtering apparatus. As shown in the figure, the substrate transfer tray 8 has a target 2 in the film forming chamber 21a.
On the other hand, there is a claw 6 on the side, and on the other hand, the adhesion-preventing plate 3 includes a plate 33 which is hooked on the claw 6 of the substrate transport tray 8 and a guide plate 34 for moving the plate 33 in the horizontal direction, as in FIG. A plate spring 35 for pressing the plate 33 against the claw 6 side of the substrate transfer tray 8;
Stage 3 for fixing the leaf spring 35 and the guide plate 34
6 is provided, and the deposition-inhibiting plate 3 is lifted to "attach" the desorption mechanism to the claw 6 provided on the substrate transport tray 8 and the deposition-inhibiting plate 3 is lowered. Then, the lifting / lowering mechanism section 12 for "releasing" the attachment / detachment mechanism from the claws 6 provided on the substrate transfer tray 8 and the lifting / lowering mechanism section 12 for preventing the attachment / detachment plate 3 from being lifted to a predetermined position. The attachment plate 3 is lowered so that the attachment / detachment mechanism can be fitted into the pin 31 (see FIG. 4) provided on the attachment prevention plate 3 in order to “remove” the attachment / detachment mechanism from the claw 6 provided on the substrate carrying tray 8. Attachment plate fitting portion 41 at the tip (see FIG. 4)
And a rotation mechanism section 11 for rotating the.

7 and 8 show the relationship between the substrate carrying tray 8 and the carrying roller 7b. As shown in the figure, the transport roller 7 is configured to be rotatable by a drive source 23 and is covered with transport covers 22a and 22b. The ends of the substrate carrying tray 8 extend from the openings of the carrying covers 22a and 22b, and the ends of the substrate carrying tray 8 are supported by the carrying rollers 7b. By rotating the transport roller 7b, the substrate transport tray 8 moves and the deposition-preventing plate 3 can be transported.

Next, a method of replacing the deposition preventive plate in the load lock type sputtering apparatus will be described.

The deposition preventing plate 3 to which the sputtered particles adhere in the film forming chamber 21a in the vacuum state conveys the substrate when the plate 33 provided on the deposition preventing plate 3 moves up and down the elevating mechanism 12. It is “attached” to the claws 6 of the substrate transfer tray 8 and transferred to the loading / unloading chamber 21b in a vacuum state, where the plate 33 of the deposition-inhibiting plate 3 is lowered by the elevating mechanism 12 to move the substrate transfer tray 8 to On the other hand, a new deposition-prevention plate is preliminarily charged in the loading / unloading chamber 21b in the atmospheric state after being removed from the claw 6, and this new deposition-proof plate is evacuated to a vacuum in the loading / unloading chamber 21b. The plate provided on the new deposition-prevention plate is “attached” to the claw 6 of the substrate transport tray 8 that transports the substrate by raising the elevating mechanism section 12 and transported to the film forming chamber 21a, where The plate 33 of the attachment plate lowers the lifting mechanism section 12. Is "de" from the substrate conveying tray 8 is intended to be exchanged is put in place by Rukoto.

FIG. 9 shows a schematic configuration example of an in-line type sputtering apparatus which is another embodiment of the present invention.

As shown in the figure, the in-line type sputtering apparatus is arranged in a vacuum container, a substrate (not shown) on the surface of which a film is formed, and a base material which is arranged to face the substrate and is to be formed. The target 2 and the deposition preventive plate 3 arranged around the target 2 are provided, and the sputtered particles scattered by the sputtering of the target 2 are deposited on the surface of the substrate to form a film, and the substrate is also formed. A deposition chamber 31a for depositing most of the sputtered particles not deposited on the surface to the deposition-inhibitory plate 3, and a substrate before deposition for carrying in the deposition chamber 31a in advance so as to carry out the substrate before deposition. A deposition chamber 31b, a take-out chamber 31c for transporting the film-formed substrate from the film-forming chamber 31a to the outside, a film-forming chamber 31a, a loading chamber 31b, and a take-out chamber 31c. And a sluice valve 9 that separates A substrate transfer tray 8 for transferring a substrate before film formation from the preparation chamber 31b to the film formation chamber 31a and a substrate after film formation from the film formation chamber 31a to an ejection chamber 31c, and the substrate. It is provided with the film forming chamber 31a, the charging chamber 31b, and the transfer roller 7b arranged in the unloading chamber 31c for moving the transfer tray 8.

Since the composition of the film forming chamber 31a in this in-line type sputtering apparatus is exactly the same as the structure shown in FIG. 6 described above, its explanation is omitted here.

Next, a method of replacing the deposition preventive plate in the in-line type sputtering apparatus will be described.

The deposition-preventing plate 3 to which the sputtered particles adhere in the deposition chamber 31a in the vacuum state is a substrate which conveys the substrate when the plate provided on the deposition-preventing plate 3 ascends the elevating mechanism section 12. The “adhesion” plate 3 is “attached” to the transfer tray 8 and is transferred to the evacuating chamber 31c in a vacuum state. In the atmospheric condition, a new deposition-prevention plate is preliminarily charged in the charging chamber 41b, and this new deposition-prevention plate is a plate provided on the new deposition-proof plate in the charging chamber 41b that has been evacuated and is in a vacuum state. By being lifted up and down by the elevating mechanism section 12 to be “loaded” on the substrate transport tray 8 for transporting the substrate and transported to the film forming chamber 31a, and the new deposition-prevention plate is
The substrate transport tray 8 is moved when the elevating mechanism 12 is lowered.
Are “removed” from, and are placed in place and replaced.

The relationship between the rotating mechanism 11 and the pin 31 provided on the deposition-preventing plate in the above-described load-lock type sputtering apparatus and in-line type sputtering apparatus was not particularly described, but a cluster type single wafer was used. It goes without saying that this is the same as in the case of the sputtering system.

As described above, according to each sputtering apparatus described in the present embodiment, the vacuum transfer robot or the substrate transfer tray is kept in vacuum without opening the film forming chamber to the atmosphere for replacing the deposition preventive plate. Since the anti-adhesion plate can be replaced by using, the equipment downtime is almost zero, the transfer rate is greatly improved, the film quality is stabilized, and the reliability is greatly improved. This has the effect of improving the quality or dramatically improving the film quality.

[0048]

According to the sputtering apparatus of the present invention and the method of exchanging the deposition preventive plate thereof described above, the deposition preventive plate disposed around the target is detached from the transport means for transporting the substrate, and the transport is exchanged. The attachment-prevention plate provided around the target is attached or detached by the conveyance means for conveying the substrate, and the attachment-prevention plate is lifted. When the attachment / detachment mechanism is “attached” to the transport means, and the attachment-prevention plate is lowered to “remove” the attachment / detachment mechanism from the transport means, and when the attachment-prevention plate is raised to a predetermined position. The attachment-proof plate fitting portion at the tip is rotated so that the attachment-and-detachment plate is lowered by the elevating mechanism part to "remove" the attachment-and-detachment mechanism from the transport means. With rotating mechanism part The sputtering device provided, or the deposition preventive plate inside the vacuum container in a vacuum state to which the sputtered particles are adhered, is attached to the transfer robot for transferring the substrate by the attachment / detachment mechanism provided on the adhesion preventive plate. It is transferred to a room in a vacuum state different from that of the vacuum container, where the attachment / detachment mechanism of the deposition preventive plate is “detached” from the transfer robot, while a new deposition preventive plate is preliminarily charged in the another room. The new adhesion-preventing plate is transferred to the inside of the vacuum container by the attachment / detachment mechanism provided on the new adhesion-preventing plate being “loaded” by the transfer robot for transferring the substrate, Since the attachment / detachment mechanism is the attachment / detachment plate replacement method for the sputtering device that is “detached” from the transfer robot and placed at a predetermined position and replaced, the attachment / detachment plate placed around the target is the existing one. Board transport Transfer robot use, or by using the transfer tray, so to simplify it replaced without breaking the vacuum of the film forming chamber, the effect is significantly large.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a film forming chamber in a cluster type single-wafer sputtering apparatus that is an embodiment of the present invention.

FIG. 2 is a diagram showing an overall configuration of a cluster type single-wafer sputtering apparatus in FIG.

FIG. 3 is a partial configuration diagram showing a vacuum transfer robot and an attachment / detachment mechanism of an attachment prevention plate in the embodiment of FIG.

FIG. 4 is a perspective view showing a structure of an attachment prevention plate in the embodiment of FIG.

FIG. 5 is an overall configuration diagram showing a load-lock type sputtering apparatus which is another embodiment of the present invention.

6 is a cross-sectional view showing a film forming chamber in the load lock type sputtering apparatus shown in FIG.

FIG. 7 is a plan view showing the relationship between substrate transfer trays and transfer rollers in a load lock type sputtering apparatus that is another embodiment of the present invention.

FIG. 8 is a partial sectional view of FIG. 7;

FIG. 9 is an overall configuration diagram showing an in-line type sputtering apparatus which is still another embodiment of the present invention.

[Explanation of symbols]

1a, 21a, 31a ... Film forming chamber, 1b, 31b ... Preparation chamber, 1c, 31c ... Extraction chamber, 1d ... Transfer chamber, 2 ... Target, 3 ... Protective plate, 5 ... Vacuum transfer robot, 6 ... Claw, 7
a ... Substrate delivery mechanism, 7b ... Transport roller, 8 ... Substrate transport tray, 9 ... Gate valve, 11 ... Rotation mechanism section, 12 ... Elevating mechanism section, 21b ... Charge / unload chamber, 31 ... Pin, 32 ... Spring mechanism Part, 33 ... Plate, 34 ... Guide plate, 35 ... Leaf spring, 3
6 ... Stage, 41 ... Fitting plate fitting part.

Claims (18)

[Claims] 1. A vacuum container, a substrate arranged in the vacuum container and having a film formed on the surface thereof, a target which is arranged so as to face the substrate and serves as a base material on which a film is formed, and a target surrounding the target. An anti-adhesion plate arranged to deposit the sputtered particles scattered by sputtering the target on the substrate surface to form a film, and to prevent most of the sputtered particles not deposited on the substrate surface from adhering to the anti-adhesion plate. In the sputtering apparatus for adhering to a plate, the deposition preventive plate is equipped with an attachment / detachment mechanism that is detached from a transport unit that transports the substrate and transports and replaces the substrate. 2. A vacuum container, a substrate arranged in the vacuum container and having a film formed on its surface, a target which is arranged so as to face the substrate and serves as a base material on which a film is formed, and around the target. An anti-adhesion plate arranged to deposit the sputtered particles scattered by sputtering the target on the substrate surface to form a film, and to prevent most of the sputtered particles not deposited on the substrate surface from adhering to the anti-adhesion plate. In the sputtering device for adhering to a plate, the adhesion-preventing plate is a plate that is hooked on a claw portion provided in a vacuum transfer robot that transfers the substrate, a guide plate that moves the plate in a horizontal direction, and the plate. A sputtering apparatus comprising: a leaf spring that is pressed against a claw portion of a vacuum transfer robot; and a detaching mechanism that includes a stage that fixes the leaf spring and the guide plate. 3. A vacuum container, a substrate arranged in the vacuum container and having a film formed on its surface, a target which is arranged so as to face the substrate and serves as a base material for forming a film, and around the target. An anti-adhesion plate arranged to deposit the sputtered particles scattered by sputtering the target on the substrate surface to form a film, and to prevent most of the sputtered particles not deposited on the substrate surface from adhering to the anti-adhesion plate. In the sputtering apparatus for adhering to a plate, the deposition preventive plate is provided with a detachment mechanism that is detached by a transport means for transporting the substrate and is transported and exchanged, and the deposition preventive plate is raised to transport the detachment mechanism to the transport device. When the attachment plate is raised to a predetermined position, the elevating mechanism part is "attached" to the means, and the attachment preventing plate is lowered to "remove" the attaching / detaching mechanism from the conveying means. Down the board And a rotation mechanism portion for rotating the attachment plate fitting portion at the tip so as to fit into a pin provided on the attachment plate for lowering and removing the attachment / detachment mechanism from the transport means. A sputtering apparatus characterized by: 4. A vacuum container, a substrate arranged in the vacuum container and having a film formed on its surface, a target which is arranged so as to face the substrate and serves as a base material for forming a film, and around the target. An anti-adhesion plate arranged to deposit the sputtered particles scattered by sputtering the target on the substrate surface to form a film, and to prevent most of the sputtered particles not deposited on the substrate surface from adhering to the anti-adhesion plate. In the sputtering device for adhering to a plate, the adhesion-preventing plate is a plate that is hooked on a claw portion provided in a vacuum transfer robot that transfers the substrate, a guide plate that moves the plate in a horizontal direction, and the plate. The vacuum transfer robot is provided with a detaching mechanism composed of a leaf spring pressed against the claw portion side and a stage for fixing the leaf spring and the guide plate. An elevating mechanism part that "attaches" to the claw portion provided on the bot, lowers the attachment prevention plate to "detach" the attachment / detachment mechanism from the claw portion provided on the vacuum transfer robot; When the plate is lifted to a predetermined position, the elevating mechanism lowers the deposition-inhibiting plate and the detachment mechanism is provided on the deposition-inhibiting plate to "detach" from the claw portion provided on the vacuum transfer robot. A sputtering apparatus, comprising: a rotation mechanism section for rotating an engagement portion of an adhesion-preventing plate that fits into a pin. 5. A substrate placed in a vacuum container, on the surface of which a film is to be formed, a target which is placed so as to face the substrate and serves as a base material on which a film is to be formed, and an adhesion preventive plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. The stored extraction chamber is connected to the film forming chamber, the charging chamber, and the extraction chamber via a sluice valve, and the substrate from the charging chamber is transferred to the film forming chamber before film formation,
In a cluster-type single-wafer sputtering apparatus including a transfer chamber in which a vacuum transfer robot that transfers a substrate after film formation from the film formation chamber to an extraction chamber is stored, the vacuum transfer robot in the transfer chamber is Transferring the deposition preventive plate to which the sputtered particles adhere in the film forming chamber to the take-out chamber in vacuum, and transferring the replacement preventive plate from the charging chamber to the film forming chamber in vacuum A cluster-type single-wafer sputtering apparatus characterized in that 6. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is formed, and a deposition preventive plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. The stored extraction chamber is connected to the film forming chamber, the charging chamber, and the extraction chamber via a sluice valve, and the substrate from the charging chamber is transferred to the film forming chamber before film formation,
In a cluster-type single-wafer sputtering including a transfer chamber in which a vacuum transfer robot that transfers a substrate after film formation from the film formation chamber to an extraction chamber is stored, the deposition-preventing plate is configured to A vacuum transfer robot for transfer, which is equipped with an attachment / detachment mechanism that is detached and is exchanged for transfer;
An elevating mechanism section for raising and lowering the attachment prevention plate to "attach" the attachment / detachment mechanism to the vacuum transfer robot, and for lowering the attachment attachment plate to "release" the attachment / detachment mechanism from the vacuum transfer robot; When the attachment plate rises to a predetermined position, the elevating mechanism lowers the attachment prevention plate so that the attachment / detachment mechanism can be “detached” from the vacuum transfer robot. And a rotation mechanism portion for rotating the fitting portion of the deposition-prevention plate, the cluster type single-wafer sputtering apparatus. 7. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is formed, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. The stored extraction chamber is connected to the film forming chamber, the charging chamber, and the extraction chamber via a sluice valve, and the substrate from the charging chamber is transferred to the film forming chamber before film formation,
In a cluster type single-wafer sputtering comprising a transfer chamber in which a vacuum transfer robot that transfers a substrate after film formation from the film formation chamber to an unloading chamber is housed, the vacuum transfer robot is provided near the tip thereof. Has a claw portion on the target side in the film forming chamber, while the adhesion-preventing plate includes a plate hooked on the claw portion of the vacuum transfer robot, a guide plate for moving the plate in the horizontal direction, and the plate. A cluster-type single-wafer sputtering apparatus comprising: a leaf spring that is pressed against the claw portion side of the vacuum transfer robot; and a desorption mechanism that includes a stage that fixes the leaf spring and the guide plate. 8. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is formed, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. The stored extraction chamber is connected to the film forming chamber, the charging chamber, and the extraction chamber via a sluice valve, and the substrate from the charging chamber is transferred to the film forming chamber before film formation,
In a cluster type single-wafer sputtering comprising a transfer chamber in which a vacuum transfer robot that transfers a substrate after film formation from the film formation chamber to an unloading chamber is housed, the vacuum transfer robot is provided near the tip thereof. Has a claw portion on the target side in the film forming chamber, while the adhesion-preventing plate includes a plate hooked on the claw portion of the vacuum transfer robot, a guide plate for moving the plate in the horizontal direction, and the plate. A detachable mechanism including a leaf spring that is pressed against the claw portion of the vacuum transfer robot, and a stage that fixes the leaf spring and the guide plate, and
The attachment prevention plate is raised to "attach" the attachment / detachment mechanism to a claw portion provided on the vacuum transfer robot, and the attachment prevention plate is lowered to provide the attachment / detachment mechanism on the vacuum transfer robot. An elevating mechanism part that "disengages" from the claw part, and a claw part provided with the attachment / detachment mechanism in the vacuum transfer robot by lowering the attachment preventing plate by the elevating mechanism part when the attachment preventing plate rises to a predetermined position. Cluster-type single-wafer type, characterized in that it has a rotation mechanism part for rotating the engagement part of the adhesion-preventing plate which is provided at the tip so as to fit into the pin provided on the adhesion-preventing plate Sputtering equipment. 9. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material for forming a film, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading / unloading chamber for transporting a substrate before film deposition to the film deposition chamber, or a substrate after film deposition from the film deposition chamber, and a partition for partitioning the loading / unloading chamber and the film deposition chamber A valve, a substrate transfer tray for transferring a substrate before film formation from the loading / unloading chamber to the film deposition chamber, and a substrate for film deposition from the film deposition chamber to the loading / unloading chamber, and the substrate In order to move the transfer tray, it is arranged in the film formation chamber and the loading / unloading chamber. In the load lock type sputtering apparatus having a conveying roller that, the deposition preventing plate is provided with a detachable mechanism that is conveyed exchanged is desorbed to the substrate carrying tray for transporting the substrate, and,
An elevating mechanism section that raises the deposition preventive plate to "attach" the attachment / detachment mechanism to the substrate transport tray, and lowers the deposition preventive plate to "remove" the attachment / detachment mechanism from the substrate transport tray; When the attachment-preventing plate is raised to a predetermined position, the lifting mechanism lowers the attachment-preventing plate to attach and detach the attachment / detachment mechanism from the substrate transport tray to a pin provided on the attachment-preventing plate. A load-lock type sputtering apparatus, comprising: a rotation mechanism section that rotates a fitting part of an adhesion-preventing plate that fits at the tip. 10. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is formed, and an adhesion preventive plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading / unloading chamber for transporting a substrate before film deposition to the film deposition chamber, or a substrate after film deposition from the film deposition chamber, and a partition for partitioning the loading / unloading chamber and the film deposition chamber A valve, a substrate transfer tray for transferring a substrate before film formation from the loading / unloading chamber to the film deposition chamber, and a substrate for film deposition from the film deposition chamber to the loading / unloading chamber, and the substrate Arranged in the film forming chamber and the loading / unloading chamber to move the transfer tray. In the load-lock type sputtering apparatus including a transfer roller that is provided, the substrate transfer tray has a claw portion on the target side in the film forming chamber, while the adhesion-preventing plate is the substrate transfer tray. A plate to be hooked on the claw portion of the plate, a guide plate for moving the plate in the horizontal direction, a plate spring for pressing the plate against the claw portion side of the substrate transport tray, and a stage for fixing the plate spring and the guide plate. A load-lock type sputtering apparatus having a desorption mechanism including 11. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is formed, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading / unloading chamber for transporting a substrate before film deposition to the film deposition chamber, or a substrate after film deposition from the film deposition chamber, and a partition for partitioning the loading / unloading chamber and the film deposition chamber A valve, a substrate transfer tray for transferring a substrate before film formation from the loading / unloading chamber to the film deposition chamber, and a substrate for film deposition from the film deposition chamber to the loading / unloading chamber, and the substrate Arranged in the film forming chamber and the loading / unloading chamber to move the transfer tray. In the load-lock type sputtering apparatus including a transfer roller that is provided, the substrate transfer tray has a claw portion on the target side in the film forming chamber, while the adhesion-preventing plate is the substrate transfer tray. A plate to be hooked on the claw portion of the plate, a guide plate for moving the plate in the horizontal direction, a plate spring for pressing the plate against the claw portion side of the substrate transport tray, and a stage for fixing the plate spring and the guide plate. And an attachment / detachment mechanism that is configured to raise the attachment-prevention plate to "attach" the attachment / detachment mechanism to a claw portion provided on the substrate transport tray, and lower the attachment-prevention plate to remove the attachment / detachment mechanism. And a lifting mechanism section that "removes" the board from the claw provided on the substrate transport tray, and when the deposition prevention plate rises to a predetermined position, the lifting mechanism section lowers the deposition prevention plate to remove the removal mechanism. Installed on the substrate transfer tray And a rotation mechanism portion for rotating the engagement portion of the deposition-inhibition plate, which is provided at the tip so as to fit into a pin provided on the deposition-inhibition plate in order to "remove" from the claw portion. Load-lock type sputtering system. 12. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material for film formation, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. A unloading chamber that is stored, a gate valve that partitions the film forming chamber from the loading chamber, and the unloading chamber, transport of a substrate from the loading chamber before film deposition to the film deposition chamber, and from the film deposition chamber A substrate transfer tray for transferring the substrate after film formation to the take-out chamber, and the substrate transfer In an in-line type sputtering apparatus comprising a film forming chamber, a charging chamber, and a transfer roller arranged in the unloading chamber for moving a tray, the deposition-preventing plate is for transferring the substrate. Equipped with a detachment mechanism that is detached from the tray and transported and exchanged, and
An elevating mechanism section that raises the deposition preventive plate to "attach" the attachment / detachment mechanism to the substrate transport tray, and lowers the deposition preventive plate to "remove" the attachment / detachment mechanism from the substrate transport tray; When the attachment-preventing plate is raised to a predetermined position, the lifting mechanism lowers the attachment-preventing plate to attach and detach the attachment / detachment mechanism from the substrate transport tray to a pin provided on the attachment-preventing plate. An in-line type sputtering apparatus, comprising: a rotation mechanism section for rotating a fitting portion of an adhesion-preventing plate having a tip to fit. 13. A substrate placed in a vacuum container, on the surface of which a film is formed, a target which is placed so as to face the substrate and serves as a base material on which a film is formed, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. A unloading chamber that is stored, a gate valve that partitions the film forming chamber from the loading chamber, and the unloading chamber, transport of a substrate from the loading chamber before film deposition to the film deposition chamber, and from the film deposition chamber A substrate transfer tray for transferring the substrate after film formation to the take-out chamber, and the substrate transfer In an in-line type sputtering apparatus provided with the film forming chamber for moving the tray, the charging chamber, and a transfer roller arranged in the unloading chamber, the substrate transfer tray is a target side in the film forming chamber. On the other hand, the attachment-preventing plate has a plate for hooking on the claw portion of the substrate carrying tray, a guide plate for moving the plate in the horizontal direction, and a plate for holding the plate on the substrate carrying tray. An in-line type sputtering apparatus comprising: a leaf spring that is pressed against the side of the unit and a desorption mechanism that includes a stage that fixes the leaf spring and the guide plate. 14. A substrate disposed in a vacuum container, on the surface of which a film is to be formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is to be formed, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. A unloading chamber that is stored, a gate valve that partitions the film forming chamber from the loading chamber, and the unloading chamber, transport of a substrate from the loading chamber before film deposition to the film deposition chamber, and from the film deposition chamber A substrate transfer tray for transferring the substrate after film formation to the take-out chamber, and the substrate transfer In an in-line type sputtering apparatus provided with the film forming chamber for moving the tray, the charging chamber, and a transfer roller arranged in the unloading chamber, the substrate transfer tray is a target side in the film forming chamber. On the other hand, the attachment-preventing plate has a plate for hooking on the claw portion of the substrate carrying tray, a guide plate for moving the plate in the horizontal direction, and a plate for holding the plate on the substrate carrying tray. A plate spring for pushing the plate spring and a guide plate and a stage for fixing the guide plate; and a mounting mechanism for mounting the plate on the substrate transport tray by elevating the attachment plate. The attaching / detaching plate is attached to the existing claw portion, and the attachment / detachment plate is lowered to remove the attachment / detachment mechanism from the claw portion provided on the substrate transport tray. When you reach the position, move up and down In order to lower the attachment-preventing plate by means of the structural portion and to "detach" the attachment / detachment mechanism from the claw portion provided on the substrate transport tray, the attachment-prevention tip is fitted to the pin provided on the attachment-prevention plate. An in-line type sputtering apparatus, comprising: a rotation mechanism section that rotates a fitting plate fitting section. 15. When depositing sputtered particles scattered by sputtering a target arranged opposite to the substrate on the surface of the substrate in the vacuum container, most of the sputtered particles not deposited on the surface of the substrate are deposited. In the method of replacing the deposition-inhibitory plate arranged around the target for attachment, the deposition-inhibition plate to which the sputtered particles are attached inside the vacuum container in a vacuum state is provided in the deposition-inhibition plate. The attachment / detachment mechanism is “attached” to the transfer robot that conveys the substrate and transferred to a room in a vacuum state different from that of the vacuum container, where the attachment / detachment plate attachment / detachment mechanism is “released” from the transfer robot.
On the other hand, on the other hand, a new deposition preventive plate is preliminarily set in the another room, and the new deposition preventive plate is attached to the transfer robot for transporting the substrate by the detachment mechanism provided in the new deposition preventive plate. The attachment plate of the sputtering apparatus is characterized in that it is "attached" and conveyed to the inside of the vacuum container, and the new attachment / detachment mechanism of the attachment-prevention plate is "released" from the conveyance robot and placed at a predetermined position and replaced. method of exchange. 16. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material for film formation, and an adhesion prevention plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. The stored extraction chamber is connected to the film forming chamber, the charging chamber, and the extraction chamber via a sluice valve, and the substrate from the charging chamber is transferred to the film forming chamber before film formation,
In a method of replacing the deposition-preventing plate in a cluster type single-wafer sputtering apparatus having a transfer chamber in which a vacuum transfer robot for transferring a substrate after film formation from the film formation chamber to an extraction chamber is housed The deposition preventing plate in the film forming chamber in the vacuum state, to which the sputtered particles are attached, is in a vacuum state because the desorption mechanism provided on the deposition preventing plate is “attached” to the transfer robot that transfers the substrate. It is transferred to the unloading chamber, where the attachment / detachment plate attachment / detachment mechanism is “detached” from the transfer robot, while a new attachment plate is preliminarily charged in the charging chamber in the atmospheric state,
The new deposition preventive plate is evacuated to a vacuum state, and the attachment / detachment mechanism provided in the new deposition preventive plate is “attached” to the transfer robot for transferring the substrate to the deposition chamber. A method of exchanging a deposition preventive plate for a cluster type single-wafer sputtering apparatus, which is transported, and the new mechanism for removing the deposition preventive plate is "dismounted" from the transport robot and placed at a predetermined position for replacement. 17. A substrate disposed in a vacuum container, on the surface of which a film is formed, a target which is disposed so as to face the substrate and serves as a base material on which a film is formed, and an adhesion-preventing plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading / unloading chamber for transporting a substrate before film deposition to the film deposition chamber, or a substrate after film deposition from the film deposition chamber, and a partition for partitioning the loading / unloading chamber and the film deposition chamber A valve, a substrate transfer tray for transferring a substrate before film formation from the loading / unloading chamber to the film deposition chamber, and a substrate for film deposition from the film deposition chamber to the loading / unloading chamber, and the substrate Arranged in the film forming chamber and the loading / unloading chamber to move the transfer tray. In the method for replacing the deposition-preventing plate in a load-lock type sputtering apparatus having a transporting roller, the deposition-preventing plate to which the sputter particles in the film forming chamber in a vacuum state are attached The attachment / detachment mechanism is “attached” to the substrate transport tray for transporting the substrate and transported to the loading / unloading chamber in a vacuum state, where the attachment / detachment plate detachment mechanism is “detached” from the substrate transport tray. While meanwhile,
In the atmospheric condition, a new deposition-inhibitory plate is preliminarily loaded in the loading / unloading chamber, and this new deposition-inhibitory plate is provided on the new deposition-inhibiting plate in the loading / unloading chamber which is evacuated and is in a vacuum state. The attachment / detachment mechanism is “attached” to the substrate transport tray for transporting the substrate and is transported to the film forming chamber, and the new attachment / detachment plate detachment mechanism is “detached” from the substrate transport tray and arranged at a predetermined position. A method for replacing a deposition-prevention plate of a load-lock type sputtering device, which is characterized in that the replacement is performed. 18. A substrate which is disposed in a vacuum container and on which a film is formed, a target which is disposed so as to face the substrate and serves as a base material for film formation, and a deposition preventive plate which is arranged around the target. A deposition chamber for depositing sputtered particles scattered by sputtering the target on the substrate surface to form a film, and for adhering most of the sputtered particles not deposited on the substrate surface to the deposition preventive plate. A loading chamber in which a substrate before film formation is previously loaded and stored in order to carry out the substrate before film formation into the film formation chamber, and a substrate after film formation from the film formation chamber is transferred to the outside. A unloading chamber that is stored, a gate valve that partitions the film forming chamber from the loading chamber, and the unloading chamber, transport of a substrate from the loading chamber before film deposition to the film deposition chamber, and from the film deposition chamber A substrate transfer tray for transferring the substrate after film formation to the take-out chamber, and the substrate transfer A method for replacing a deposition-preventing plate in an in-line type sputtering apparatus comprising a film forming chamber for moving a tray, a charging chamber, and a transfer roller arranged in a take-out chamber, wherein the film forming chamber is in a vacuum state. The deposition-inhibiting plate to which the sputtered particles are attached is transported to the ejection chamber in a vacuum state by being attached to a substrate transport tray that transports the substrate by a desorption mechanism provided in the deposition-inhibiting plate, Here, the attachment / detachment plate detaching mechanism is “detached” from the substrate transport tray, while a new attachment plate is preliminarily charged in the charging chamber in an atmospheric state, and the new attachment plate is evacuated. The desorption mechanism provided on the new deposition preventive plate in the charging chamber in a vacuum state is “loaded” to the substrate transport tray for transporting the substrate and transported to the film forming chamber, and the new deposition shield plate The detachment mechanism of the above Preventing plate replacing in-line sputtering apparatus characterized by being "de" from the plate carrier tray is disposed in a predetermined position replacement.