JPH09129995A - Three dimensional circuit and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To promptly and easily deal with the design change, etc., of an electric circuit. SOLUTION: A required electric circuit is constituted of an electrically conductive layer provided on the surface 21 of an electrically insulating molded layer 20. Namely, an electrically conductive composite material is printed on the surface 21 of the electrically insulating molded layer 20 and a required circuit pattern is formed as an electrically conductive layer before a plate-shaped electrically insulating molded layer 20 is bent into a required three dimensional form. Thus, an electric circuit can be modified only by modifying a printed form of an electrically conductive composite material to be the circuit pattern without modifying the electrically insulating molded layer 20 requiring an expensive metal mold when it is manufactured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a busbar type three-dimensional electric circuit body which is preferably used as a joint absorption as a constituent electric circuit component of a wire harness of an automobile, and a method for manufacturing the same, and more specifically, a design change of the electric circuit The present invention relates to a structure and a manufacturing method for quickly and easily responding to the above.

[0002]

2. Description of the Related Art Conventionally, as a bus bar type three-dimensional electric circuit body, as shown in FIG. 7, there are joint terminals 60, 61 and 62 made of a metal conductor having a required three-dimensional shape, and the electric circuit to be constituted. 10P 60, 6P + 4P 61, 3P + 3 with 10 contact parts corresponding to
62 of P + 4P and the like are used in combination with the joint connector 63. Also, as shown in FIG.
Japanese Patent Publication No. 2-21107 also describes a joint terminal 64 of the same type as that shown in FIG. These joint terminals 60, 61, 62, 64 are bent into a desired three-dimensional shape by press-molding a two-dimensional metal plate in which tab-shaped contact portions 66 are formed on both sides of the connecting plate 65. It is processed.

[0003]

SUMMARY OF THE INVENTION Joint terminals 60, 61, 62, 6 which are the above-mentioned conventional three-dimensional electric circuit bodies.
In 4, when changing the design of the electric circuit from, for example, 10P to 6P + 4P or 3P + 3P + 4P, various molds corresponding to the respective pole numbers are used. It needs to be press molded. Therefore, there is a problem that it is not possible to easily cope with the design change of the electric circuit. Further, even if the design change of the electric circuit is dealt with, there is a problem that an increase in the number of parts and an increase in cost are unavoidable because a new production of a plurality of types of molds is required.

The present invention can be manufactured easily and inexpensively, and can easily form a three-dimensional circuit, which allows quick and quick change of the electric circuit without increasing the cost. It is an object of the present invention to provide a three-dimensional electric circuit body which can be easily dealt with and a manufacturing method thereof.

[0005]

The above object of the present invention comprises a composite film having an electrically insulating molding layer and a conductive layer provided on at least one of the front surface and the back surface of the electrically insulating molding layer. It is achieved by a three-dimensional electric circuit body characterized in that

The electrically insulating molding layer of the composite film is
The thickness is 500 μm or less, preferably 10 to 400 μm, and is preferably formed of a thermoplastic resin such as PVC, PET, polyimide, or a thermosetting resin.

The conductive layer of the composite film has a thickness of 10
It is preferably formed of a conductive composite material having a thickness of 0 μm or less and an electrical resistivity of 10 ⁻² Ω · cm or less. When the thickness of the conductive composite material exceeds 100 μm, the strength (hardness) increases, and cracking or peeling may occur when the two-dimensional shape is bent into a required three-dimensional shape. When the electrical resistivity of the conductive composite material exceeds 10 ^-2 Ω · cm, it becomes difficult to subject the conductive layer to electrolytic plating.

A conductive paste is preferably used as the conductive composite material. Examples of the binder include thermoplastic resins such as polyolefin, polyester and fluororesin, and thermosetting resins such as epoxy, phenol and urea. The liquid resin is mixed as it is by a conventional method. Solid resin is dissolved in a solvent and mixed,
Alternatively, it is dissolved in a solvent after mixing. As the conductive filler, metallic particles of Al, Ni, Cu, Ag, Au, etc.,
Bulk or fiber may be mentioned, and carbon-based ones include carbon black such as feeling black and acetylene black, natural or artificial graphite powder, PAN-based, pitch-based,
Alternatively, carbon fibers such as chitosan and graphite fibers thereof can be used. Generally, noble metal-based materials such as Ag and Au have high conductivity but are expensive, and Al, Ni, Cu and the like are inexpensive but inferior in corrosion stability. In addition, the carbon type is
Excellent corrosion stability, but high electrical resistance. The amount of the conductive filler added is preferably 50 to 800 parts by weight with respect to 100 parts by weight of the resin in the case of a metal type, and 10 to 70 parts by weight with respect to 100 parts by weight of the resin in the case of a carbon type.

The conductive layer of the composite film has a thickness of 10
It is composed of a conductive layer formed of a conductive composite material having an electric resistivity of 0 μm or less and an electric resistivity of 10 ⁻² Ω · cm or less, and a metal layer having a thickness of 0.5 μm or more laminated on at least a part of the conductive layer. It is preferable. When the thickness of the metal layer of the conductive layer is less than 0.5 μm, the electric resistance becomes too large,
It cannot be used as an electric circuit.

The conductive layer of the composite film is preferably formed by printing a conductive composite material on the electrically insulating molding layer.

The conductive layer of the conductive layer is formed by printing a conductive composite material on the electrically insulating molding layer,
In addition, the metal layer of the conductive layer is preferably laminated on the conductive layer by subjecting at least a part of the conductive layer to at least one type of electrolytic plating treatment.

Another object of the present invention is to provide a conductive layer on at least one of the front surface and the back surface of a two-dimensionally formed electrically insulating molding layer, and transform the electrically insulating molding layer into a desired three-dimensional shape. This is achieved by a method for manufacturing a three-dimensional electric circuit body, which is characterized in that

Further, the above object of the present invention is to form an electrically insulating layer by printing an electrically conductive composite material on at least one of the front surface and the back surface of the two-dimensionally formed electrically insulating molding layer, and then forming the electrically insulating layer. Three-dimensional electric circuit characterized in that a metal layer is laminated on the conductive layer by deforming the conductive molding layer into a required three-dimensional shape and further subjecting at least a part of the conductive layer to at least one type of electrolytic plating treatment. Achieved by a method of manufacturing the body.

[0014]

In the three-dimensional electric circuit body according to the first aspect of the present invention, the conductive layer is provided on at least one of the front surface and the back surface of the electrically insulating molding layer.

In the three-dimensional electric circuit body according to claim 2 of the present invention, a conductive layer is provided on at least one of the front surface and the back surface of the electrically insulating molding layer, and the conductive layer comprises:
It is formed of a conductive composite material having a thickness of 100 μm or less and an electrical resistivity of 10 ⁻² Ω · cm or less.

In the three-dimensional electric circuit body according to claim 3 of the present invention, a conductive layer is provided on at least one of the front surface and the back surface of the electrically insulating molding layer, and the conductive layer comprises:
A conductive layer formed of a conductive composite material having a thickness of 100 μm or less and an electrical resistivity of 10 ⁻² Ω · cm or less, and at least one kind of metal having a thickness of 0.5 μm or more laminated on at least a part of the conductive layer. And layers.

In the four-dimensional electric circuit body according to claim 4 of the present invention, the conductive layer is formed by printing a conductive composite material on at least one of the front surface and the back surface of the electrically insulating molding layer. .

In the three-dimensional electric circuit body according to the fifth aspect of the present invention, the conductive layer is provided on at least one of the front surface and the back surface of the electrically insulating molding layer. The conductive layer is
A conductive layer formed of a conductive composite material having a thickness of 100 μm or less and an electrical resistivity of 10 ⁻² Ω · cm or less, and at least one kind of metal having a thickness of 0.5 μm or more laminated on at least a part of the conductive layer. And layers. The conductive layer is formed by printing a conductive composite material on the electrically insulating molding layer, and the metal layer is laminated on the conductive layer by subjecting at least a part of the conductive layer to at least one electrolytic plating treatment. To be done.

In the method for manufacturing a three-dimensional electric circuit body according to a sixth aspect of the present invention, a conductive layer is provided on at least one of the front surface and the back surface of the two-dimensionally formed electrically insulating molding layer. , Electric insulation molding layer required 3
Transform into a three-dimensional shape.

In the method for manufacturing a three-dimensional electric circuit body according to a seventh aspect of the present invention, a conductive composite material material is printed on at least one of the front surface and the back surface of the two-dimensionally formed electrically insulating molding layer. By doing so, a conductive layer is formed.
Then, the electrically insulating molding layer is deformed into a desired three-dimensional shape. Further, at least a part of the conductive layer is subjected to at least one type of electrolytic plating treatment to stack the metal layer on the conductive layer.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to illustrated embodiments. 1A and 1B are perspective views showing a three-dimensional electric circuit body which is an embodiment of the present invention. FIG. 1A shows a state in which an electrically insulating molding layer is molded, and FIG. 1B shows an electrically insulating molding layer. A state in which the conductive composite material is printed on the upper surface and a state in which the conductive composite material is bent into a required three-dimensional shape are shown in (c).
2 is a perspective view showing the three-dimensional electric circuit body and the cover of FIG. 1, (a) shows the state before the cover is fitted to the three-dimensional electric circuit body, and (b) shows the three-dimensional electric circuit. The state which fitted the cover to the body is shown, respectively. Further, FIG. 3 is a perspective view showing a three-dimensional electric circuit body fitted with a cover and a joint connector, and FIG. 4 is a partial sectional view showing a laminated structure of the three-dimensional electric circuit body.

1 to 4, the three-dimensional electric circuit body 1
0 is composed of a composite film 30 composed of an electrically insulating molding layer 20 and a conductive layer 31 constituting a required electric circuit, and is jointed with the cover 11 fitted through an adhesive layer 40. Joint connector 1 as terminal
Combined with 2, it is suitable for use in automobile wire harnesses and the like.

The electrically insulating molding layer 20 includes a plurality of contact portions 2.
3 are formed at predetermined positions (in this embodiment, 5 on each of the left and right sides in FIG. 1, a total of 10).

The electrically insulating molding layer 20 is made of PVC, PE.
It is formed as a molded body made of a thermoplastic resin such as T or polyimide, or a thermosetting resin. Electric insulating molding layer 20
Has a thickness of 500 μm or less, preferably 10 to 400 μm.
m. In this embodiment, the electrically insulating molding layer 20 is used.
Is formed from polyethylene terephthalate (PET),
Its thickness was 75 μm.

A conductive layer 31 is provided on at least one of the front surface 21 and the back surface 22 of the electrically insulating molding layer 20 (the upper surface in FIG. 4, which is the front surface 21 in this embodiment).

The conductive layer 31 of the composite film 30 is the conductive layer 32 formed on the upper surface of the electrically insulating molding layer 20 in FIG.
And a metal layer 33 formed on the upper surface of the conductive layer 32 in FIG. The conductive layer 32 is formed by printing a paste-like conductive composite material (hereinafter referred to as a conductive composite material) having a thickness of 100 μm or less and an electrical resistivity of 10 ⁻² Ω · cm or less on the electrically insulating molding layer 20. Has been done,
Configure the required circuit pattern. The metal layer 33 is a layer stacked on the conductive layer 32 and having a thickness of 0.5 μm or more. After the bending of the electrically insulating molding layer 20, at least a part of the conductive layer 32 (in this embodiment, a hatched line in FIG. 2). (Part) is subjected to electrolytic plating treatment. In this embodiment, the conductive layer 31 of the composite film 30 is made of a composite material of epoxy resin and silver particles, and the amount of silver added is 600.
phr, thickness 35 μm and electric resistivity 10 ⁻³ Ω · c
m. Further, the metal layer 33 was formed by copper plating and had a thickness of 200 μm.

The conductive layer 32 has a thickness of the conductive composite material of 1
When the thickness is not more than 00 μm, the strength (hardness) can be appropriately suppressed, and the flat (two-dimensional) electrically insulating molding layer 2 can be obtained.
When 0 is bent into a required three-dimensional shape (two-fold shape in this embodiment), cracking or peeling is prevented. Also, the electric resistivity of the conductive composite material is 10 ^-2 Ω.
When it is not more than cm, the conductive layer 32 can be subjected to electrolytic plating treatment, and the metal layer 33 can be laminated on the conductive layer 32 by electrolytic plating treatment. Since the metal layer 33 has a thickness of 0.5 μm or more,
The electric resistance is moderately suppressed and it can be used as an electric circuit. Although the metal layer 33 is laminated on the conductive layer 32 in this embodiment, it may be omitted depending on the application of the present three-dimensional electric circuit body.

The adhesive layer 40 is provided on the bent portion of the back surface 22 (the upper surface in FIG. 2 (a)) of the electrically insulating molding layer 20, and is electrically insulated by being bent into a desired three-dimensional shape. The cover 11 fitted to the molding layer 20 from above in FIG. 2 is adhered to the electrically insulating molding layer 20.

The operation of this embodiment will be described. In the three-dimensional electric circuit body 10, the conductive layer 31 is provided on the surface 21 of the electrically insulating molding layer 20. Electric insulating molding layer 20
Is formed as a molded body made of a thermoplastic resin or a thermosetting resin. The thickness of the electrically insulating molding layer 20 is 500.
μm or less. The conductive layer 31 of the composite film 30 is
A conductive layer 32 formed of a conductive composite material having a thickness of 100 μm or less and an electrical resistivity of 10 ⁻² Ω · cm or less, and a metal layer 33 having a thickness of 0.5 μm or more laminated on at least a part of the conductive layer 32. Composed of and. The conductive layer 32 is formed by printing a conductive composite material on the electrically insulating layer 31. The metal layer 33 is laminated on the conductive layer 32 by subjecting the electrically insulating molding layer 20 to bending and then subjecting the shaded portion in FIG. 2 of the conductive layer 32 to electrolytic plating.

FIG. 5 is a process chart showing a method of manufacturing the three-dimensional electric circuit body 10. Hereinafter, referring to FIGS. 4 and 5,
A method of manufacturing the three-dimensional electric circuit body 10 will be described. First, the electrically insulating molding layer 20 is molded as a flat plate-shaped molded body made of a thermoplastic resin or a thermosetting resin (step 50).
Then, a conductive composite material is printed on at least one of the front surface 21 and the back surface 22 of the electrically insulating molding layer 20 to form a required circuit pattern as the conductive layer 32 (step 51). Next, when the electrically insulating molding layer 20 is molded from a solvent type thermoplastic resin, it is subjected to a solvent removal treatment (step 52) and then subjected to a bending process by heating (step 53). On the other hand, when the electrically insulating molding layer 20 is molded with a thermosetting resin, it is bent (step 54).
After (or at the same time), heating is performed to cure (step 55). Then, at least a part of the conductive layer 32 is subjected to electrolytic plating treatment (step 56), whereby the conductive layer 32 is formed.
Then, the metal layer 33 is laminated. In addition, it is preferable to prevent the damage or the like due to stress concentration by giving a required radius to a corner portion by the bending process so that the corner portion has an arc shape. Although the metal layer 33 is laminated on the conductive layer 32 in this embodiment, this step may be omitted depending on the application of the three-dimensional electric circuit body.

As described above, according to the above-mentioned embodiment, the required electric circuit is constituted by the composite film 30 provided on the surface 21 of the electrically insulating molding layer 20, that is, the flat electrically insulating molding layer 20 is required. Since the conductive composite material is printed on the surface 21 of the electrically insulative molding layer 20 and the required circuit pattern is formed as the conductive layer 32 before being bent into the three-dimensional shape of FIG. In addition, it is possible to easily form a three-dimensional circuit. In addition, the electrically insulating molding layer 20 which requires an expensive mold for manufacturing does not need to be changed, and the printed shape of the conductive composite material to be the circuit pattern is changed.
The electric circuit can be changed. As a result, it is possible to quickly and easily cope with the design change of the electric circuit without increasing the cost.

That is, for example, 10P is 6P + 4
Even when changing to P, when a conductive composite material is printed on the electric insulating layer 31 to form the conductive layer 32, by masking required portions with a mask member 41 as shown in FIG. The printed shape of the conductive composite material can be changed very easily, and the circuit pattern of the conductive layer 32 can be changed very easily without causing an increase in the number of parts. Therefore, it is extremely easy to set an arbitrary number of poles corresponding to the connection configuration with the joint connector 12 (FIG. 3) to be combined, and a great degree of freedom can be given to the design of the electric circuit configuration of the joint connector 12. it can.

In the above embodiment, the conductive layer 31 is provided only on one surface of the electrically insulating molding layer 20, but by providing it on both surfaces of the electrically insulating molding layer 20, electrical connection with a mating terminal to be connected is formed. May be performed on both sides, and the connection reliability may be improved.

[0034]

As described above, according to the three-dimensional electric circuit body of the first aspect of the present invention, the electrically conductive layer is provided on at least one of the front surface and the back surface of the electrically insulating molding layer. It can be manufactured at low cost and 3
It is possible to easily form a three-dimensional circuit. As a result, it is possible to quickly and easily cope with the design change of the electric circuit without increasing the cost. According to the three-dimensional electric circuit body of claim 2 of the present invention, the conductive layer of the composite film has a thickness of 100 μm or less and an electric resistivity of 1
It is formed of a conductive composite material of 0 ⁻² Ω · cm or less. Therefore, it is possible to easily and inexpensively manufacture, and it is possible to easily form a three-dimensional circuit, so that it is possible to quickly and easily cope with a design change of an electric circuit without incurring a high cost. In addition, the conductive layer has a conductive composite material thickness of 100 μm.
The strength (hardness) can be appropriately suppressed by the following. This prevents cracks, peeling, and the like from occurring during bending, for example. Further, since the electric resistivity of the conductive composite material is 10 ⁻² Ω · cm or less, the conductive layer can be subjected to electrolytic plating treatment. According to the three-dimensional electric circuit body of claim 3 of the present invention, the conductive layer of the composite film has a thickness of 100 μm.
Hereinafter, it is composed of a conductive layer formed of a conductive composite material having an electric resistivity of 10 ⁻² Ω · cm or less, and a metal layer having a thickness of 0.5 μm or more laminated on at least a part of the conductive layer. Therefore, it is possible to easily and inexpensively manufacture, and it is possible to easily form a three-dimensional circuit, so that it is possible to quickly and easily cope with a design change of an electric circuit without incurring a high cost. In addition, the conductive layer has a thickness of 100 μm of the conductive composite material.
The strength (hardness) can be appropriately suppressed by the following. This prevents cracks, peeling, and the like from occurring during bending, for example. Further, since the electric resistivity of the conductive composite material is 10 ⁻² Ω · cm or less, the conductive layer can be subjected to electrolytic plating treatment, and a metal layer is laminated on the conductive layer by the electrolytic plating treatment. be able to. Since the metal layer has a thickness of 0.5 μm or more, the electric resistance is appropriately suppressed and it can be used as an electric circuit. According to the four-dimensional electric circuit body of claim 4 of the present invention, since the conductive layer is formed by printing the conductive composite material on the electric insulating layer,
It can be manufactured easily and inexpensively, and a three-dimensional circuit can be easily formed. In addition, it is possible to change the electric circuit by simply changing the printed shape of the conductive composite material that will be the circuit pattern, without making any changes to the electrically insulating molding layer that requires an expensive mold for manufacturing. it can. As a result, it is possible to quickly and easily cope with the design change of the electric circuit without increasing the cost. That is, for example, even if the 10P type is changed to the 6P + 4P type, by masking the required portions when printing the conductive composite material on the electrical insulating layer,
The printed shape of the conductive composite material can be changed very easily. As a result, the circuit pattern can be changed extremely easily without increasing the number of components. Therefore, it is extremely easy to set an arbitrary number of poles corresponding to the connection configuration with the joint connector to be combined, and a great degree of freedom can be given to the design of the electrical circuit configuration of the joint connector. According to the three-dimensional electric circuit body of claim 5 of the present invention, the conductive layer of the conductive layer is formed by printing a conductive composite material on the electrically insulating molding layer, and the conductive layer is formed. Since the metal layer of the layer is laminated on the conductive layer by subjecting at least a part of the conductive layer to electrolytic plating, the metal layer can be manufactured easily and inexpensively, and three-dimensional circuit formation can be easily performed. be able to. In addition, it is possible to change the electric circuit by simply changing the printed shape of the conductive composite material that will be the circuit pattern, without making any changes to the electrically insulating molding layer that requires an expensive mold for manufacturing. it can.
As a result, it is possible to quickly and easily cope with the design change of the electric circuit without increasing the cost. That is, for example, even when changing from 10P to 6P + 4P, when the conductive composite material is printed on the electric insulating layer,
By masking required portions, the printed shape of the conductive composite material can be changed extremely easily.
As a result, the circuit pattern of the conductive layer can be changed very easily without causing an increase in the number of parts. Therefore, it is extremely easy to set an arbitrary number of poles corresponding to the connection configuration with the joint connector to be combined, and a great degree of freedom can be given to the design of the electrical circuit configuration of the joint connector. According to the method for manufacturing a three-dimensional electric circuit body according to claim 6 of the present invention,
A conductive layer is provided on at least one of the front surface and the back surface of the two-dimensionally formed electrically insulative molding layer, and the electrically insulative molding layer is transformed into a required three-dimensional shape. In addition, it is possible to easily form a three-dimensional circuit. As a result, it is possible to quickly and easily cope with the design change of the electric circuit without increasing the cost. According to the method for producing a three-dimensional electric circuit body according to claim 7 of the present invention, the conductive composite material is printed on at least one of the front surface and the back surface of the two-dimensionally formed electrically insulating molding layer. After the conductive layer is formed by the method, the electrically insulating molding layer is deformed into a desired three-dimensional shape, and at least a part of the conductive layer is subjected to electrolytic plating treatment to stack the metal layer on the conductive layer.
Therefore, it can be easily and inexpensively manufactured, and the three-dimensional circuit can be easily formed.
In addition, it is possible to change the electric circuit by simply changing the printed shape of the conductive composite material that will be the circuit pattern, without making any changes to the electrically insulating molding layer that requires an expensive mold for manufacturing. it can. As a result, it is possible to quickly and easily cope with the design change of the electric circuit without increasing the cost. That is, for example, even when changing from 10P to 6P + 4P, the printed shape of the conductive composite material can be extremely easily made by masking a required portion when printing the conductive composite material on the electrical insulating layer. It can be changed, and the circuit pattern of the conductive layer can be changed very easily without increasing the number of parts. Therefore, it is extremely easy to set an arbitrary number of poles corresponding to the connection configuration with the joint connector to be combined, and a great degree of freedom can be given to the design of the electrical circuit configuration of the joint connector.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a three-dimensional electric circuit body which is an embodiment of the present invention.

FIG. 2 is a perspective view showing a three-dimensional electric circuit body and a cover of FIG.

FIG. 3 is a perspective view showing a three-dimensional electric circuit body and a joint connector fitted with a cover.

FIG. 4 is a partial cross-sectional view showing a laminated structure of a three-dimensional electric circuit body.

FIG. 5 is a process drawing showing the method for manufacturing a three-dimensional electric circuit body.

FIG. 6 is a perspective view showing a state in which required portions of an electric insulating layer of a three-dimensional electric circuit body are masked.

FIG. 7 is a perspective view showing an example of a joint terminal which is a conventional three-dimensional electric circuit body.

FIG. 8 is a perspective view showing another example of a joint terminal which is a conventional three-dimensional electric circuit body.

[Explanation of symbols]

 10 3 dimensional electric circuit body (joint terminal) 11 cover 12 joint connector 20 electric insulating molding layer 21 front surface 22 back surface 30 composite film 31 conductive layer 32 conductive layer 33 metal layer 40 adhesive layer 50 to 56 manufacturing process

Claims (7)

[Claims] 1. A three-dimensional electric circuit comprising a composite film having an electrically insulating molding layer and a conductive layer provided on at least one of a front surface and a back surface of the electrically insulating molding layer. body. 2. The conductive layer of the composite film has a thickness of 10
The three-dimensional electric circuit body according to claim 1, wherein the three-dimensional electric circuit body is formed of a conductive composite material having an electric resistance of 0 μm or less and an electric resistivity of 10 ⁻² Ω · cm or less. 3. The conductive layer of the composite film has a thickness of 10
A conductive layer formed of a conductive composite material having an electric resistivity of 0 μm or less and an electric resistivity of 10 ⁻² Ω · cm or less, and at least one kind of metal having a thickness of 0.5 μm or more laminated on at least a part of the conductive layer. The three-dimensional electric circuit body according to claim 1, comprising a layer. 4. The three-dimensional electric circuit body according to claim 1, wherein the conductive layer of the composite film is formed by printing a conductive composite material on the electrically insulating layer. 5. The conductive layer of the conductive layer is formed by printing a conductive composite material on the electrically insulating molding layer, and the metal layer of the conductive layer is formed on at least a part of the conductive layer. The three-dimensional electric circuit body according to claim 3, wherein the three-dimensional electric circuit body is laminated on the conductive layer by performing at least one kind of electrolytic plating treatment. 6. A conductive layer is provided on at least one of a front surface and a back surface of an electrically insulating molding layer formed two-dimensionally, and the electrically insulating molding layer is deformed into a required three-dimensional shape. A method for manufacturing a characteristic three-dimensional electric circuit body. 7. A conductive layer is formed by printing a conductive composite material on at least one of the front surface and the back surface of a two-dimensionally formed electrically insulating molding layer, and then the electrically insulating molding layer is formed. A method for manufacturing a three-dimensional electric circuit body, which comprises deforming a desired three-dimensional shape and further subjecting at least a part of the conductive layer to at least one type of electrolytic plating treatment to stack a metal layer on the conductive layer. .