JPH0911526A - Multi-needle recording head - Google Patents

Abstract

PURPOSE: To enhance the workability of soldering work to a conductor wiring board after detached from a winding jig. CONSTITUTION: An electrode support block 2 wherein a large number of the conductors 16 constituting recording electrodes 8, 10 are arranged at a constant pitch to be fixed and a wiring board 4 wherein the conductors 16 drawn out of the electrode support block 2 to be grouped to be mutually connected are provided. The leading end parts of the collected conductor groups are bundled by soldering to form soldered wire parts 20 which are, in turn, fixed to a fixing plate 24 at a predetermined interval to be connected to the wiring board 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-needle recording head suitable as an electrostatic recording type recording head. More specifically, the present invention relates to an improvement in the connection structure of recording electrodes of a multi-needle recording head to a wiring board.

[0002]

2. Description of the Related Art A multi-needle recording head used in an electrostatic recording system, for example, as shown in FIG. 9, has two rows of recording electrodes composed of conductors 310 for recording electrodes arranged at high density with a constant pitch. 101a and 101b and corresponding control electrodes 102a and 102b, which are composed of blocks in two rows, are fixed by an electrode support block 103 such as an electrically insulating resin. Here, each recording electrode 101a,
In order to simplify the drive circuit (not shown), 101b is provided so as to be connected to the drive circuit collectively for each recording electrode that can be grouped. Therefore, the conductor 310
Are bundled for each group, and the binding portion 105 is connected to the wiring board 1.
After being connected to the drive circuit 09, each group is connected to the drive circuit.

A multi-needle recording head having such a structure is provided with a drum-shaped winding jig having a groove for casting an electrically insulating resin on the surface and being capable of winding a conductor wire across the groove. A technique is known in which two of them are used to enable efficient production (JP-A-2-239953). As shown in FIG. 10, the winding jig 301 for winding the control electrode 102
Resin casting grooves 305, 305 into which the resin for the electrode support block 103 is poured by mounting a and the resin casting groove 3
The jetty part 306,3 of the edge so as to cross 05,305
Lead wire holding grooves 309, ..., 3 for arranging the lead wires 310 for recording electrodes formed on the electrodes 07, 308 at a constant pitch.
09 and the conducting wire 310 on both side wall surfaces of the winding jig 301.
It is provided with pins 302, 303, 304 for hooking and pulling around in any direction and position. The control electrode 102a is mounted in the resin casting grooves 305, 305 of the winding jig 301, and one recording electrode is provided in the pins 302, 303, 304 on both sides outside the resin casting grooves 305, 305. The conductive wires 310 are sequentially entangled to form resin casting grooves 305, 30
Wrap it continuously across 5. Then, the recording electrodes 101a and 101b belonging to the same group are bundled so that the recording electrode conducting wires 310 are stretched over the resin casting grooves 305 and 305 at a constant pitch.

The conductor 310 is wound around the winding jig 301 by a back tension mechanism (not shown).
While applying a certain amount of tension to the wire, the reciprocating linear movement of the wire guide means 311 of the winding machine 312 in the axial direction (the direction indicated by the arrow in FIG. 10) and the swinging or rotating of the winding jig 301 are used. Then, the nozzle 3 of the conducting wire guide means 311
13 to draw the conducting wire 310 around the predetermined pins 302, 30
3, 304 and conducting wire holding grooves 309, ..., 309.

The winding machine 312 shown in FIG. 10 has a nozzle 31 for guiding the supply of the conductive wire 310 to the winding jig 301.
3 and a nozzle 313.
Screw 314 for reciprocating the wire along the winding jig 301
A first motor 315 for rotating the wire, a second motor 316 for rocking and rotating the winding jig 301 when winding the conducting wire 310, and a controller 317 for controlling the first and second motors 315, 316. Etc.

Thereafter, the conductor wire 310 is butted against another winding jig 301 (not shown) around which the conductor wire 310 is wound, and the two butted resin casting grooves 305, ..., 305.
The electrode support block 103 is formed by pouring resin into the space formed between the electrodes. Butt 3 for resin casting
, 305, the lead wire 310 for the recording electrode and the control electrodes 102a and 102b are centrally arranged in parallel with each other and in a fixed positional relationship, and the electrode support block 103 is formed around the conductor wire 310 and the control electrodes 102a and 102b. Resin is injected.

Then, the conductor wires 310 bundled in groups between the pins are bundled by soldering to form the solder wire portion 105. Solder wire part 105
Is then cut and removed from pins 304, 303, 302. After that, the electrode support block 103 and the conductive wire 310 are removed from the winding jig 301, and the solder wire portion 105 is soldered to the pattern of the wiring board 109.

In this connection structure, however, the binding portions themselves of the conductive wires 310 bundled for each group are hardened with solder so as not to fall apart, but the positional relationship between the bundles of conductive wires 310 is fixed. Therefore, when the conductor wire 310 is removed from the pin of the winding jig 301, the conductor wire 310 is released from the tension state and contracts in each direction, so that the solder wire portion 105 moves to various positions. Therefore, when soldering the solder wire portion to a predetermined pattern, the solder wire portion must be checked while confirming the solder wire portion, which complicates the work and hinders reduction of the manufacturing cost.

Therefore, as in Japanese Patent Laid-Open No. 6-25166, an auxiliary substrate is adopted, and the solder wire portion 105 of the conducting wire 310 bundled on the auxiliary substrate is once soldered, and then the auxiliary substrate and the wiring substrate are soldered. I thought about attaching it. The auxiliary board has a through hole, and the solder wire portion 105 is passed therethrough before soldering.

[0010]

However, after the conductors are passed through the through-holes so as to penetrate the auxiliary substrate and then soldered, the auxiliary substrate is raised so that a large number of conductors are bent at 90 degrees, and then the auxiliary substrate and the wiring are connected. Since it is soldered side by side with the board, the work is difficult and the workability is poor.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a multi-needle recording head that improves the workability of soldering a conductor to a wiring board after it has been removed from the winding jig.

[0012]

In order to achieve the above object, a multi-needle recording head according to a first aspect of the present invention comprises an electrode supporting block in which a large number of conducting wires forming recording electrodes are arranged at a fixed pitch and fixed. In a multi-needle recording head including a wiring board in which lead wires forming recording electrodes are pulled out from an electrode support block and are grouped and connected together, a solder wire portion obtained by binding the grouped and combined lead wires with solder is predetermined. Fixing plates fixed at intervals are provided, and the solder wire portions fixed to the fixing plates are connected to the wiring board.

According to the second aspect of the present invention, the boundary portion between the solder wire portion and the conductor wire group is located substantially in the center of the fixing plate or on the electrode support block side of the fixing plate.

Further, in the invention of claim 3, the solder wire portion is bonded to the fixing plate with a resin or an elastic adhesive having elasticity, and the solder wire portion is slightly moved by deformation of the resin or elastic adhesive having elasticity. It is fixed so that it can be done.

[0015]

Therefore, in the multi-needle recording head according to the first aspect of the invention, the connection to the wiring board is performed in the state where the solder wire portions are fixed to the fixing plate at a predetermined interval.

According to the second aspect of the invention, when the boundary portion is fixed at substantially the center of the fixing plate, the fixing plate is attached to the wiring board side edge among the edges of the surface of the fixing plate to which the solder wire portion is fixed. The solder wire portion abuts and is bent, and the conductor wire group abuts on the other edge. In addition, when the boundary is fixed on the electrode support block side of the fixing plate,
Since only the solder wire portion is fixed to the fixing plate, the solder wire portion abuts on both edges of the fixing plate and is bent.

Further, in the invention of claim 3, the solder wire portion adhered to the fixing plate can be slightly moved. Therefore, even when the solder wire part is bent or twisted due to external force applied when connecting the solder wire part to the wiring board or mounting it on another device after connection, the adhesive part is deformed flexibly and slightly. Since the external force is absorbed by moving to, there is no unreasonable force applied to the boundary.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of the present invention will be described below in detail with reference to the embodiments shown in the drawings.

FIGS. 1, 2, and 4 show an embodiment of a multi-needle recording head to which the present invention is applied. This multi-needle recording head 1 has no feature in the basic structure of the electrode supporting block 2 itself including each electrode except for the structure of the wiring leading portion 6 that connects the electrode supporting block 2 and the wiring substrate 4, and is shown in FIG. It has the same head structure as the conventional multi-needle recording head. The multi-needle recording head 1 of this embodiment is also of the same surface control type, and has two rows of recording electrodes 8 and 10 arranged at a high density with a constant pitch and two rows of control electrodes 12 and 14 corresponding thereto.
And are fixed by an electrode support block 2 such as an electrically insulating resin. In addition, the lead wires 16 and 16 that form the recording electrodes 8 and 10 are drawn out from the electrode support block 2. Then, in order to simplify a drive circuit (not shown), the conductors 16 and 16 can be grouped for each recording electrode 8 and 10.
Are put together and soldered to the wiring pattern 4a of the wiring board 4. These wiring patterns 4a are connected to a drive circuit via a connector 18.

Here, as the lead wire 16 for the recording electrode,
Wires with an electrically insulating coating have been used, for example wires with a urethane coating. The conductive wires 16 are drawn out from the electrode support block 2 and bundled in groups, and molten solder is hung on the bundled portions to be solidified to form a binding portion. As a result, the urethane coating is peeled off and the wires inside are bundled by soldering,
0 is formed. At the boundary portion 22 between the solder wire portion 20 and the conductive wire group, although the solder has not penetrated, the heat of the molten solder is conducted and the urethane is melted to expose the wire.

The wiring lead-out portion 6 has a solder wire portion 20 on the ODD side and the EVEN side immediately before the wiring board 4.
The fixing plates 24 and 24 for fixing each of them are arranged, and the separation sheet 26 which is sandwiched between the fixing plates 24 and 24 and extends to the vicinity of the electrode support block 2 and separates the ODD-side and EVEN-side conductors 16 from each other. ing. Here, the material of the fixing plate 24 is preferably an insulating plate such as a glass epoxy substrate or a plastic substrate. According to this,
A short circuit between the solder wire portions 20 fixed to the fixing plate 24 is prevented.

The base end portions of the solder wire portions 20 are bonded and fixed to the fixing plate 24 at substantially regular intervals. Here, as shown in FIG. 4, the boundary portion 22 where the wire is exposed is shown.
It is preferable to position and fix the fixing plate 24 at substantially the center of the fixing plate 24. According to this, when the solder wire portion 20 is soldered to the pattern 4a of the wiring board 4, the fixing plate 2
Even if the solder wire portion 20 is bent at the edge of No. 4, since the solder wire portion 20 is bound by soldering, there is no risk of disconnection. Since the boundary portion 22 between the solder wire portion 20 solidified by solder and the portion protected by the urethane coating is weaker in strength than the solder wire portion 20 and the urethane coating portion, the boundary portion 22 is fixed by the fixing plate 24. If it is located near the edge of, the wire may be broken during bending. For example, according to a test conducted by the inventors, about 30% of disconnection defects occurred. For this reason, more cautious wiring work is required and workability becomes poor. However, when the solder wire portion 20 was positioned at the edge of the fixing plate 24 and bent under the same conditions, the rate of occurrence of disconnection defects was 0. In addition,
Reference numeral 28 in the figure is a resin-based adhesive, a rubber-based adhesive, or another synthetic adhesive that bonds the conducting wire 16 including the solder wire portion 20 and the fixing plate 24.

Further, if the angle at which the solder wire portion 20 is bent at the edge becomes too large due to the large thickness of the fixing plate 24, the boundary portion 22 during bending is increased.
May be pulled and broken. Therefore, it is necessary to reduce the thickness of the fixing plate 24 to reduce the angle at which the solder wire portion 20 bends. On the other hand, the fixed plate 2
If 4 is too thin, the solder wire portions 20 of the recording electrodes 8 and 10 located from the fixed plate 24 to the wiring board 4 are likely to be short-circuited. Therefore, it is preferable to set the angle at which the solder wire portion 20 is bent at the edge to about 15 degrees or less. According to this, the boundary portion 22 is not pulled by the bending of the solder wire portion 20 and is not broken, and the solder wire portions 20 are not short-circuited with each other.

The solder wire portion 20 to the fixing plate 24
The fixing is not particularly limited, but an adhesive 28 such as a resin-based or rubber-based or other synthetic adhesive is preferable, and more preferably a soft material having elasticity with a Shore hardness of 60 or less when cured. It is desirable to use an adhesive. For example, silicone resin, silicone rubber (Shin-Etsu Silicone KE347W, manufactured by Shin-Etsu Chemical Co., Ltd.), silicone adhesive sealant (SE9187)
L Clear, Toray Dow Corning Silicone Co., Ltd.
It is preferable to use an epoxy resin-based elastic adhesive (EP001, manufactured by Cemedine Co., Ltd.), a UV resin, or the like.

On the other hand, the separation sheet 26 is in the form of an elastic film and is fixed to the fixing plate 24 with a double-sided tape or the like. Then, the separation sheet 26 is arranged between the portions of the lead wires 16 and 16 forming the first recording electrode 8 and the second recording electrode 10 that are pulled out from the electrode support block 2.

The separating sheet 26 is not particularly limited to the material, and the first recording electrode side conducting wire 16 is used.
It is sufficient if it is possible to shield between the second recording electrode side conductor 16 and the second recording electrode side conductor 16. If the insulating coating of the conductors 16, 16 may be damaged, it is preferable to use an insulating material or an insulating film. Further, as the separation sheet 26, it is preferable to use a material having a dielectric constant lower than that of air. Further, it is preferable that the conductor 16 is connected to the wiring board 4 in such a manner that the conductor 16 is not strained, that is, is loosened as in this embodiment, in order to reduce the stray capacitance between the conductors 16. With such a structure, the entanglement between the first and second recording electrode lead wires 16 and 16 is eliminated and the first and second recording electrodes 8 and 1 are not entangled.
The floating capacitance between 0 is also small.

A protective sheet 30 is provided by connecting the lower end of the electrode support block 2 and the side of the fixed plate 24. It is preferable that the protective sheet 30, the electrode support block 2 and the fixing plate 24 are bonded to each other with an appropriate adhesive. The material of the protective sheet 30 may be the same as that of the separation sheet 26, and is preferably an insulating material in order to prevent a short circuit between the conductor 16 and another device.

The multi-needle recording head 1 having such a structure uses a winding jig as illustrated in FIG. 10, for example, to perform the winding method shown in Japanese Patent Laid-Open No. 2-239953, or Other winding methods not shown (for example, Japanese Patent Application No. 5-2
16897). For example, a case where a single winding jig 32 as shown in FIG. 3 is used will be described as an example. After arranging the blocks of the control electrodes 12, 14 in the resin casting groove 34 of the winding jig 32, the conductor wire holding groove formed in the jetty portions 36, 36 so as to cross the resin casting groove 34 (shown in the drawing) The lead wires 16 are wound at a constant pitch using (omitted). At this time, the conductive wire 16 is sorted into groups using the pins 38 to 48 protruding around the winding jig 32, and is bundled between the pins 42 and 44.

Next, the two winding jigs 32, 32 each wound with the conductive wire 16 are butted against each other via the spacer 50, and the electrically insulating resin is cast into the resin casting grooves 34, 34 to conduct the conductive wire. 16 is solidified to form the electrode supporting block 2. Then, the conductor wires 16 grouped between the third pin 42 and the fourth pin 44 are bundled by soldering to form the solder wire portion 20. This soldering is done manually or automatically.

Then, the fixing plate 24 is adhered to the fourth pin 44 side of each solder wire portion 20, 20, and the separation sheet 26 is attached to the surface opposite to the adhering surface via the double-sided tape, and then the soldering is performed. The wire portion 20 is cut. After that, a bundle of the lead wires 16 of one recording electrode 10 is placed on one surface of the wiring substrate 4 with the separation sheet 26 attached, and the solder wire portion 20 is soldered to the wiring pattern 4a. And
The fixing plates 24 are attached to each other so as to sandwich the separation sheet 26, the wiring board 4 is turned upside down, the bundle of the conductor wires 16 of the other recording electrode 8 is placed on the other surface, and the solder wire portion 20 is soldered to the wiring pattern 4a. To do. In this way, the conductors 16 and 16 of the recording electrodes 8 and 10 are separated by the separation sheet 26.

Therefore, since the conductive wire 16 forming the first recording electrode 8 and the conductive wire 16 forming the second recording electrode 10 are securely separated by the insulating separation sheet 26 and are not in contact with each other, Even if the insulating coating of the conductor 16 is damaged, a short circuit will not occur between the conductors 16 and 16 of the recording electrodes 8 and 10. In addition, since the conductors 16 and 16 are completely separated without being entangled with each other, even when the recording electrodes 8 and 10 have poor electrical continuity or disconnection, the first recording electrode 8 side and the second recording electrode 8 It can be clearly distinguished from the 10 side, and it is easy to determine and specify whether the disconnection is a poor conduction, and the repair work does not take time. Furthermore, each conductor 16,
Since the conducting wire 16 on the side of the first recording electrode 8 and the conducting wire 16 on the side of the second recording electrode 10 are not entangled even when 16 is removed from the drum-shaped winding jig 32, the work is facilitated. .

The above-mentioned embodiment is an example of the preferred embodiment of the present invention, but the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention. For example, as shown in FIG. 5, the solder wire portion 20 is fixed to the fixing plate 2 so that the boundary portion 22 continuing to the solder wire portion 20 is located between the fixing plate 24 and the electrode support block 2.
4 can be adhered to the structure. Also with this structure, when an external force is applied to the solder wire portion 20, the solder wire portion 20 having high strength comes into contact with both edges of the bonding surface of the fixing plate 24, and the boundary portion 22 having low strength is formed. It is possible to reliably prevent disconnection.

Further, as shown in FIG. 6, it is possible to form a structure in which an inclined surface 24a is provided by chamfering a corner portion of the adhesive surface of the fixing plate 24 close to the wiring board 4. According to this structure, the base end portion of the solder wire portion 20 adhered to the fixed plate 24 and the solder wire portion 2 not adhered to the fixed plate 24
There is almost no bending between the tip of 0.
Therefore, it is possible to reliably prevent the boundary portion 22 from being pulled and broken by bending the solder wire portion 20.

Furthermore, as shown in FIG. 7, the thickness of the wiring board 4 can be made substantially equal to the thickness of the fixing plate 24. According to this structure, even if the bonding surfaces of the fixing plate 24 are substantially parallel to each other, the solder wire portion 20 is not bent, and the disconnection due to the pulling of the boundary portion 22 is reliably prevented. Further, since the thickness of the wiring board 4 is increased, the solder wire portions 20 of the recording electrodes 8 and 10 do not come close to each other, and there is no possibility of short circuit.

In addition, as shown in FIG.
It is also possible to use two sheets and arrange them at a position approximately equal to the thickness of the fixing plate 24.

[0036]

As is apparent from the above description, in the multi-needle recording head according to the first aspect of the invention, the solder wire portions are fixed to the fixing plate at predetermined intervals and are connected to the wiring board. The soldering work can be performed extremely efficiently and without the occurrence of disconnection due to the entanglement of the conductive wires between the different recording electrodes. Therefore, even if the lead wire is loosened and swelled when the tension is released by removing it from the pin of the winding jig, the solder wire part is fixed in place by the fixing plate, The soldering work is extremely efficiently performed.

In addition, a certain space is secured between the lead wires between different recording electrodes, and the lead wires are connected in a loosened form. For this reason, the conductive wire between the electrode support block and the wiring board swells in a narrow shape, the floating electrostatic capacitance becomes small, the applied voltage is prevented from decreasing, and high-quality and high-density drawing can be performed.

According to the second aspect of the invention, the solder wire portion or the lead wire group contacts the edge of the fixing plate and is bent. Therefore, when the solder wire portion is connected to the wiring board or when the multi-needle recording head is attached to another device, the boundary portion does not come into contact with the edge and is bent, and the disconnection can be reliably prevented. it can.

Further, in the invention of claim 3, even if the solder wire portion is bent or twisted by an external force,
Since a slight movement of the adhesive portion does not apply an unreasonable force to the boundary portion, disconnection is prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a multi-needle recording head of the present invention.

FIG. 2 is a vertical sectional view of the multi-needle recording head of FIG.

3 is a side view showing a winding jig and a manufacturing process for manufacturing the multi-needle recording head of FIG. 1. FIG.

FIG. 4 is a side view showing an example of a bonded state of a fixing plate and a conductive wire according to the present invention.

FIG. 5 is a side view showing another embodiment of the adhesive portion of the head of the present invention.

FIG. 6 is a side view showing a relationship between an adhesive portion, a solder wire portion, and a wiring board according to another embodiment of the present invention.

FIG. 7 is a side view showing a relationship between an adhesive portion, a solder wire portion, and a wiring board according to still another embodiment of the present invention.

FIG. 8 is a side view showing a relationship between an adhesive portion, a solder wire portion, and a wiring board according to another embodiment of the present invention.

FIG. 9 is a schematic perspective view showing a conventional multi-needle recording head.

FIG. 10 is a schematic perspective view showing a winding jig for manufacturing a conventional multi-needle recording head.

[Explanation of symbols]

 1 Multi-needle recording head 2 Electrode support block 4 Wiring board 8 First recording electrode 10 Second recording electrode 16 Conductive wire 20 Solder wire part 22 Boundary part 24 Fixing plate

Claims (3)

[Claims] 1. An electrode support block in which a large number of conducting wires forming recording electrodes are arranged at a fixed pitch and solidified, and a wiring in which conducting wires forming the recording electrodes are drawn out from the electrode supporting block and are grouped and connected together. In a multi-needle recording head comprising a substrate, a solder wire portion obtained by bundling the conductor wires grouped and grouped together with solder is provided with a fixing plate fixed at a predetermined interval, and the solder wire portion fixed to this fixing plate is A multi-needle recording head which is connected to a wiring board. 2. The boundary portion between the solder wire portion and the conductor wire group is located substantially in the center of the fixing plate or on the electrode support block side with respect to the fixing plate. Needle recording head. 3. The solder wire portion is adhered to the fixing plate with a resin or elastic adhesive having elasticity, and the solder wire portion is fixed so as to be slightly movable by the deformation of the resin or elastic adhesive having elasticity. The multi-needle recording head according to claim 1 or 2, wherein.