JPH0911458A - Ink jet head and manufacture thereof - Google Patents

Abstract

PURPOSE: To impart to an ink jet head excellent response characteristics by heating and cooling and to make it suitable for high-speed printing, by constructing a pressure generating means of a buckled structure body and a heater layer and by providing a Peltier element between a base and the buckled structure body. CONSTITUTION: A heater circuit 3 is formed on the base side of a buckled structure body 1 with a second insulating film 4 interlaid and further a first insulating film 2 is formed between the heater circuit 3 and a base 7 so as to ensure insulation between the heater circuit 3 and the base 7. Besides, a diaphragm 5 is formed on the nozzle plate 10 side of the buckled structure body 1, constructing a pressure generating member. On the surface of a third insulating film 6 located on the base 7, a Peltier element 12 and power sources 13a and 13b for driving the Peltier element are provided at a position opposite to the buckled structure body and on the circumference thereof. Electrodes 14a and 14b are formed at the opposite end parts of the buckled structure body 1 and a voltage can be impressed on the electrode 14a by a power source 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head for applying a pressure to an ink liquid filled inside to eject the ink liquid from the inside to a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, an ink jet recording method has been known in which a recording liquid is ejected and jetted to perform recording. However, the method is capable of relatively high speed printing with low noise, downsizing of an apparatus and color printing. It has a number of advantages such as ease of recording. As a type of inkjet head used in such an ink jet recording method, several types have been conventionally used. For example, as shown in FIGS. 9 and 10, a heater is provided in the cavity, and the heater is rapidly heated to boil the ink to form bubbles, and the ink is ejected from the nozzle by the pressure change due to the generation of the bubbles. A so-called bubble jet method is used, or pressure is generated in the ink pressure chamber by using the displacement of a driving body driven by a temperature change, as in JP-A-2-30543 shown in FIG. There is a method of discharging.

[0003]

However, the above-mentioned prior art has the following problems.

First, in the bubble jet method, in order to boil ink to form bubbles, the heater is momentarily heated to 1000 ° C.
Therefore, there is a problem that the deterioration of the heater cannot be avoided and the life of the head is short.

In the system of Japanese Patent Laid-Open No. 30543/1993, the pressure generating member is displaced by heating and then cooled to return to its original shape. That is, heating and cooling of the compressing force generating member are continuously repeated in order to continuously repeat displacement and returning of the compressing force generating member. Due to the poor response characteristics of the pressure generating member, there is a problem that it is not suitable for high speed printing.

In view of these problems, it is an object of the present invention to provide an ink jet head having good response characteristics by heating and cooling and suitable for high speed printing. It is another object of the present invention to provide an inkjet head having a long life, which can obtain a large ejection force while maintaining a small size.

[0007]

In an ink jet head of the present application, a pressure generating means for generating a pressure for ejecting ink on a substrate and a nozzle for ejecting ink at a predetermined distance from the pressure generating means are provided. In the ink jet head including a nozzle plate having the buckling structure, the pressure generating unit includes a buckling structure body that causes buckling deformation due to thermal expansion, and a heater layer provided along the buckling structure body. A Peltier element is provided between and the buckling structure.

In the ink jet head, each head is provided with a Peltier element driving power source for driving the Peltier element and a buckling structure driving power source for driving the buckling structure, and the current is not supplied to the Peltier element. The current supply to the heater for driving the buckling structure is completed, and the current supply is immediately performed for a certain period of time.

Further, in the method of manufacturing an ink jet head of the present application, a step of forming and patterning an N-type semiconductor on a substrate by a sputtering method, a step of forming a P-type semiconductor and performing patterning, and the N-type A Peltier process comprising a step of filling an insulating film between a semiconductor and a P-type semiconductor by a sputtering method or a spin coating method, and a step of forming a copper film by a sputtering method so that the adjacent N-type semiconductor and P-type semiconductor are electrically connected. A step of forming an element, a step of forming a first sacrificial layer on the formed Peltier element by a sputtering method, and a step of forming the first sacrificial layer.
Forming a buckling structure first metal layer on the sacrificial layer by plating; forming a second sacrificial layer on the first metal layer; and plating on the second sacrificial layer by plating. A step of forming a second metal layer to be a diaphragm; a step of forming a window for etching the first and second sacrificial layers on the back surface of the substrate;
And a step of collectively etching the second sacrificial layer to separate the Peltier element from the buckling structure, and the buckling structure from the diaphragm, and patterning the second metal layer to form a diaphragm having a predetermined shape. And a forming step.

[0010]

In the ink jet head according to claim 1,
When the buckling structure reaches the maximum displacement, the heating is completed and the cooling period is started, the heat of the buckling body and the heater layer passes through the Peltier element on the substrate or the mounting portion of the buckling structure, and the Peltier of the peripheral portion. Since it is absorbed by the element and discharged through the substrate to the outside of the ink chamber, the cooling rate of the pressure generating member is increased.

In the ink jet head according to the second aspect of the present invention, the heating rate and the cooling rate of the buckling structure are increased by immediately supplying the current to the Peltier element for a certain time at the same time when the power supply to the heater is finished. Moreover, it can be performed with a small amount of power. Further, since each head has its own power source, it is possible to control so that the Peltier element is driven only for the driven buckling structure, and it is possible to prevent overheating and overcooling of the buckling structure.

In the ink jet head manufacturing method according to the third aspect of the present invention, since the pressure generating member can be manufactured by a semiconductor process, the alignment between the Peltier element and the buckling structure can be controlled with high accuracy. In addition, the gap between the Peltier element and the buckling structure and the gap between the buckling structure and the diaphragm are removed by continuously etching the first sacrificial layer and the second sacrificial layer. Since they can be formed collectively, the manufacturing process can be simplified.

[0013]

EXAMPLES The ink jet head of the present invention will be described in detail below with reference to examples.

FIG. 1 is a sectional view schematically showing the structure of an ink jet head of the present invention in a standby state.
FIG. 2 is an exploded perspective view of the inkjet head of the present invention.

The ink jet head of the present invention comprises a buckling structure 1, a first insulating film 2, a heater circuit 3, a second insulating film 4,
Diaphragm 5, third insulating film 6, substrate 7, spacer 8, housing 9, nozzle plate 10, nozzle 11, Peltier element 12, Peltier element drive electrodes 13a, 13b, buckling structure drive electrodes 14a, 14b, Peltier element drive Power supply 15, buckling structure drive power supply 16, and ink supply port 1
7.

A heater circuit 3 is formed on the substrate side of the buckling structure 1 with a second insulating film 4 interposed therebetween. Further, in order to ensure insulation between the heater circuit 3 and the substrate 7, The first insulating film 2 is formed between the substrates 7. A diaphragm 5 is formed on the side of the nozzle plate 10 of the buckling structure 1, and the buckling structure 1 and the diaphragm 5 constitute a pressure generating member. On the surface of the third insulating film 6 on the substrate 7, a Peltier element 12 and a Peltier element driving power supply 13 are provided at a position facing the buckling structure and in the vicinity thereof.
a and 13b are provided.

Both ends of the buckling structure 1 are fixed to one surface of the substrate 7 via the third insulating film 6. The periphery of the diaphragm 5 is fixed to the substrate 7. Further, the substrate 7 is provided with an ink supply port 17 for supplying ink between the pressure generating member and the nozzle plate 10.

Electrodes 14a and 1 are provided at both ends of the buckling structure 1.
4b is formed, and a voltage can be applied to the electrode 14a by the power supply 16. The electrode 14b is grounded. Further, electrodes 13 are provided on both ends of the Peltier device 12.
a and 13b are formed, and a power source 15 is provided on the electrode 13a.
Can apply a voltage. The electrode 13b is grounded.

A nozzle plate 10 is attached via a spacer 8 to the side of the substrate 7 to which the buckling structure 1 is attached. Nozzles 11 are formed on the nozzle plate 10. A housing 9 is attached to the opposite side of the substrate 7 to which the buckling structure 1 is attached. Ink 18 is filled between the buckling structure 1 and the diaphragm 5, between the diaphragm 5 and the nozzle plate 10, and between the first insulating film 2 and the housing 9.

The buckling structure 1 is made of a metal material such as nickel and is provided so as to correspond to each nozzle orifice 11. Second insulating film 4 and first insulating film 2
Is formed of an insulating material such as silicon oxide or alumina, and the heater circuit 3 is formed of a material having high resistance such as nickel or a nickel chrome alloy.
The diaphragm 5 is made of a ductile material such as nickel, and the substrate 7 is made of silicon or glass. However, the material of the substrate 7 has a thermal conductivity of 5
Any material may be used as long as it is 0J (msK) ^-1 or more.

The nozzle plate 10 is made of glass, plastic sheet or metal material such as nickel having a thickness of 0.2 mm or less. A plurality of nozzles 11 penetrating the nozzle plate 10 and arranged in a certain direction are formed in the nozzle plate 10 in a conical field or funnel shape.

The spacer 8 is made of an insulating material such as polyimide or acrylic photosensitive adhesive. Further, an ink supply port 17 for guiding the ink is formed between the nozzle plate 10 and the diaphragm 5.

Next, the structure and operation of the Peltier device will be described with reference to FIGS. The Peltier element is an insulating substrate 20 such as glass, a driving power source 21 such as copper, a P-type semiconductor 22 made of a group iii element such as indium, an N-type semiconductor 23 made of a group V element such as bismuth, an insulating member 24, copper. Etc. and an upper insulating member 26. When an electric current is passed in the direction of the arrow in FIG.
The lower part becomes hot and heat can flow. And heat is absorbed in the upper part and heat is generated in the lower part.

Next, the operation of the ink jet head of the present invention will be described with reference to FIGS. 1, 5 and 6. First, as shown in FIG. 1, the ink 18 is supplied through the ink supply port 17, and the diaphragm 5 is immersed in the ink 18. After that, a voltage is applied to the electrode 14a by the power supply 16. As a result, a current flows through the heater 3 and the heater 3
The buckling structure body 1 is heated by the resistance heat generation of 1, and tends to extend in the longitudinal direction. However, both ends of the buckling structure 1 in the longitudinal direction are fixed to the substrate 7, and the buckling structure 1 cannot extend in the longitudinal direction. Therefore, a compressive force P ₀ is generated and accumulated in the buckling structure body 1 as its reaction force. When this compressive force P ₀ exceeds the buckling load, the buckling structure 1
Causes buckling deformation as shown in FIG.

As for the deformation of the buckling structure 1, as shown in FIG. 5, the central portion of the buckling structure 1 is deformed toward the nozzle plate 10. At this time, the diaphragm 5 connected to the buckling structure 1 is also deformed toward the nozzle plate 10. Therefore, the ink 18 is pushed out through the nozzle 11 and an ink droplet is formed outside the inkjet head. Printing on the print surface is performed by the ejection of the ink droplets.

Next, the current to the electrodes 14a and 14b is cut off,
At the same time as heating of the buckling structure 1 is stopped, a voltage is applied to the electrode 13a by the power supply 15 as shown in FIG. Then, a current flows through the Peltier element 12 and the Peltier element 12
The upper side of the Peltier element becomes low temperature and heat absorption occurs, and the substrate side of the Peltier element becomes high temperature and heat generation occurs. Therefore, the heat of the buckling structure 1 and the heater 3 is absorbed by the Peltier element 12 through the ink 18, and is radiated to the outside of the head through the substrate 7. Further, part of the heat of the buckling structure 1 and the heater 3 passes through the mounting portion 19 of the buckling structure 1 and the Peltier element 12.
Is absorbed by the substrate and is emitted to the outside of the head through the substrate. As a result, the buckling structure 1 can be quickly cooled and returned to the standby state shown in FIG. 1, so that the response characteristics of the inkjet head are improved and high-speed printing is possible.

For example, the temperature rise of the buckling structure 1 is set to 100
The rising response speed (t _r ), the falling response speed (t _d ), and the power consumption were calculated by simulation by heat conduction analysis. Here, the rising response speed (t _r ) is the time when the buckling structure body 1 rises by 100 deg temperature, and the falling response speed (t _d ) is the temperature when the buckling structure body 1 rises down to the buckling temperature (40 deg). It's time to do it. The reason why the temperature rise is set to 100 deg is that the energy required for ejecting the ink droplet in another energy calculation is set to be ten times the “kinetic energy + surface energy” of the ink droplet.

Energy consumption per unit volume of the buckling structure body 1 is 6.4 × 10 ⁸ J / m ³ and power consumption is 4 × 10 ^13.
The buckling structure 1 was driven with W / m ³ and a pulse width of 16 μs. In addition, the current of the electrodes 14a and 14b is cut off, the heating of the buckling structure 1 is stopped, and at the same time, the power supply 15 is applied to the electrode 13a.
Voltage was applied to drive the Peltier device.

FIG. 7A shows the buckling structure 1 under the above conditions.
FIG. 7B shows a driving waveform of the Peltier device when the Peltier device is driven. Further, FIG. 7C is a graph showing a result of calculation by simulation of a change in the temperature rise of the buckling structure body with respect to time when the buckling structure body 1 is driven under the above conditions.

When the response speed is calculated from the rising temperature curve of FIG. 7 (c), the rising response speed (t _r ) is 14 μm.
s, the fall response speed (t _d ) is 130 μs,
As a result, it was found that driving at a driving frequency of 6.9 kHz is possible.

The faster drive frequency is mainly due to the faster fall response. That is, the heat of the buckling structure 1 and the heater 3 is absorbed by the Peltier element 12 through the ink 18, and is radiated to the outside of the head through the substrate. Further, part of the heat of the buckling structure 1 and the heater 3 is
It is absorbed by the Peltier element 12 through the mounting portion of the buckling structure 1, and is emitted to the outside of the head through the substrate. As a result, the buckling structure pair is quickly cooled and can be returned to the standby state shown in FIG. Therefore, high-speed printing is possible. In particular, as shown in FIG. 7, when the electric current is supplied to the Peltier element immediately after the electric current is supplied to the heater, when the buckling structure 1 is being heated, the Peltier element is heated. Since the buckling structure 12 is not driven, the buckling structure is quickly heated. Then, when the cooling period of the buckling structure is started, the Peltier element is immediately driven, so that the buckling structure is quickly cooled. Therefore, the response speed is increased and high-speed printing can be performed. Further, in the inkjet head of the present application, since each head has its own power source, it is possible to control the Peltier device to drive only the driven buckling structure.

FIG. 7 (c) also shows the result of simulation calculation of changes in the temperature rise of the buckling structure 1 with respect to time when the Peltier device is not driven. When the response speed is calculated from this rising temperature curve, the rising response speed (t _r ) is 14 μs, the falling response speed (t _d ) is 170 μs, and the driving frequency is 5.4 kHz, which is faster than when the Peltier element is driven. It turns out that is slow.

In this embodiment, the simulation is performed with the structure in which the diaphragm is formed on the buckling structure. However, the effect of driving the Peltier element is not limited to the case where the diaphragm is formed, but the diaphragm is used. The same effect is exhibited even when there is no. Further, the same effect is exhibited in the case where the diaphragm is directly buckled without the buckling structure.

Next, a method of manufacturing the pressure generating member according to the ink jet head of the present invention will be described in the order of steps with reference to FIG. It should be noted that the substance used, the film thickness, etc. are not limited to these.

First, as shown in FIG. 8A, the plane orientation (1
00) on both front and back surfaces of the silicon substrate 100.
10 is formed to have a predetermined thickness (for example, 1 μm).

Next, as shown in FIG. 8B, a photoresist is applied to the back surface of the substrate (not shown), and patterning corresponding to the shape of the ink circulation port to be formed is performed.
The thermal oxide film 110 is etched with HF ₃ . Subsequently, when this silicon substrate is dipped in a potassium hydroxide solution, the (111) surface with a slow etching rate remains, and the ink circulation port 18
Is partially created. After that, the resist is peeled off.

Next, as shown in FIG. 8C, a thickness of 1 μm is formed on the surface of the substrate opposite to the surface on which the ink circulation port is formed.
Of copper 120 is formed by a sputtering method, a photoresist is applied thereon (not shown), and patterning corresponding to the shape of the electrode of the Peltier element to be formed is performed by etching with a nitric acid solution or the like to remove the resist. .

Next, as shown in FIG. 8D, an N-type semiconductor 130, which is a group V element such as bismuth, is formed on the surface by a sputtering method, and a photoresist 140 is applied thereon.
Patterning corresponding to the shape of the Peltier element to be formed is performed by a method such as ion milling.

Next, as shown in FIG. 8E, a P-type semiconductor 150, which is a group iii element such as indium, is formed on the surface by a sputtering method, and a photoresist 160 is applied on the P-type semiconductor 150 to form a film. Patterning corresponding to the shape of the Peltier element is performed by a method such as ion milling.

Next, as shown in FIG. 8F, the resists 140 and 160 are peeled off, and subsequently an insulating film 170 of silicon oxide, polyimide or the like is formed on the surface by a sputtering method or a spin coating method. Type semiconductor 130 and P
The patterning is performed so that the space between the mold semiconductors 150 is filled and the surface is exposed.

Next, as shown in FIG. 8 (g), the thickness is 1 μm.
Of copper 180 is sputtered and a photoresist is applied (not shown) on the copper 180 so as to correspond to the shape of the electrodes of the Peltier device to be formed, that is, N adjacent
So that the p-type semiconductor 130 and the p-type semiconductor 150 are electrically connected,
Patterning is performed by etching with a nitric acid solution or the like to remove the resist.

Next, as shown in FIG. 8H, a first sacrificial layer is formed on the surface by sputtering aluminum 190 having a thickness of 0.5 μm.

Next, as shown in FIG. 8I, a silicon oxide film 200 having a thickness of 0.5 μm is formed on the surface by a sputtering method to form a first insulating film. Then 0.01 on the surface
A film of tantalum having a thickness of 0.1 μm and nickel having a thickness of 0.1 μm is formed by a sputtering method, a photoresist is applied thereon (not shown), and patterning corresponding to the shape of the heater 210 to be formed is performed to remove the resist. Tantalum is formed to increase the adhesion between silicon oxide 200 and nickel.

Next, as shown in FIG. 8J, a silicon oxide 220 having a thickness of 0.3 μm is formed on the surface by sputtering to form a second insulating film. Then, patterning is performed to open the electrode extraction window.

Next, as shown in FIG. 8 (k), tantalum having a thickness of 0.01 μm and nickel having a thickness of 0.1 μm are formed on the surface by a sputtering method, and a photoresist is applied thereon to form a film. Patterning corresponding to the shape of the buckling structure to be performed is performed (not shown). Then, using the nickel film as an electrode, a predetermined thickness (for example, 5 μm) is formed by electrolytic plating.
m) nickel plating 230 is performed. For electrolytic plating,
For example, nickel plating with a nickel sulfamate bath can be used.

Next, as shown in FIG. 8 (l), the photoresist is peeled off, and a thickness of 0.5 is formed as a second sacrificial layer on the surface.
A 240 μm thick aluminum film is formed by a sputtering method, a photoresist is applied on the film (not shown), patterning is performed corresponding to the gap between the buckling structure to be formed and the diaphragm, and the resist is peeled off. The thickness of the second sacrificial layer determines the distance between the diaphragm and the buckling structure.

Next, as shown in FIG. 8 (m), the thickness is 0.0
Tantalum of 1 μm and nickel of 0.1 μm in thickness are formed by sputtering (not shown), and this is used as an electrode to perform nickel plating 250 of a predetermined thickness (for example, 4 μm) by electrolytic plating. For the electrolytic plating, for example, nickel plating using a nickel sulfamate bath can be used. Tantalum is nickel 230 and nickel 25
A film is formed in order to increase the adhesion of 0.

Next, as shown in FIG. 8 (n), when the silicon substrate 100 in the above state is immersed in a potassium hydroxide solution,
The (111) plane having a slow etching rate remains, and the ink circulation port 18 is completed.

Next, as shown in FIG. 8O, when the silicon substrate 100 in this state is further dipped in a hydrofluoric acid solution, the thermal oxide film 110 in a portion not covered with the silicon substrate 100.
Is etched.

Next, as shown in FIG. 8P, when the silicon substrate 100 in this state is immersed in a potassium hydroxide solution, the aluminum 190 of the first sacrificial layer is etched and the buckling structure is separated from the substrate. It At the same time, the aluminum 240 of the second sacrificial layer is also etched, and the diaphragm is separated from the buckling structure. Subsequently, a photoresist is applied on the surface, patterning is performed corresponding to the shape of the diaphragm to be formed (not shown), and the photoresist is peeled off to complete the pressure generator.

Finally, the nozzle head 10 as shown in FIG. 1, the spacer 8 having the pressure chamber and the ink supply port 16, the pressure generator and the housing 9 are joined to complete the ink jet head.

[0052]

In the ink jet head according to the first aspect of the present invention, when the buckling structure reaches the maximum displacement, heating is completed and the cooling period starts, the Peltier element is driven, and the heat of the buckling structure and the heater layer is released. It is absorbed by the Peltier element, or absorbed by the Peltier element in the peripheral portion through the mounting portion of the buckling structure body, and is discharged to the outside of the ink chamber through the substrate. Therefore, the cooling rate of the pressure generating member is increased. As a result, the response characteristics are improved and high-speed printing becomes possible.

In the ink jet head according to the second aspect, the heating speed and the cooling speed of the buckling structure can be increased, and the operation can be performed with a small electric power. In particular, by controlling the Peltier element to drive only the driven buckling structure, it is possible to prevent the buckling structure from overheating and overcooling. As a result, the response characteristics are improved and high-speed printing becomes possible.

In the ink jet head manufacturing method according to the third aspect, the Peltier element and the buckling structure can be formed with high positional accuracy, and integration can be achieved. Also,
By removing the sacrificial layer, the gap can be collectively formed, and the manufacturing process can be simplified. Further, since the gap is formed according to the thickness of the sacrificial layer, it can be set with high accuracy.

[Brief description of the drawings]

FIG. 1 is a diagram showing a structure of an inkjet head of the present invention.

FIG. 2 is an exploded perspective view of the inkjet head of FIG.

FIG. 3 is a diagram showing a Peltier device according to the inkjet head of the present invention.

FIG. 4 is a diagram showing heat transfer in an operating state of the Peltier device of FIG.

5 is a diagram showing a driven state of the inkjet head of FIG. 1. FIG.

FIG. 6 is a diagram showing another driving state of the inkjet head of FIG.

FIG. 7 is a diagram showing a drive waveform of a buckling structure and changes in temperature rise with time.

FIG. 8 is a diagram illustrating a method of manufacturing a pressure generating member according to the present invention.

FIG. 9 is a diagram showing a structure of a conventional inkjet head.

FIG. 10 is a diagram illustrating a recording principle of a conventional inkjet head.

FIG. 11 is a diagram showing the structure of another conventional inkjet head.

[Explanation of symbols]

 1 Buckling Structure 2 First Insulating Film 3 Heater Layer 4 Second Insulating Film 5 Diaphragm 6 Third Insulating Film 7 Substrate 8 Spacer 9 Housing 10 Nozzle Plate 11 Nozzle 12 Peltier Element 13 Peltier Element Drive Circuit 14 Buckling Structure Drive Electrode 15 Peltier element drive power supply 16 Buckling structure drive power supply 17 Ink supply port

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yorisei Ishii 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka Within Sharp Co., Ltd. (72) Inventor Yutaka Onda 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka Prefecture Sharp Corporation (72) In-house Shoji Kimura 22-22, Nagaike-cho, Abeno-ku, Osaka City, Osaka Prefecture 72) Inventor Dai Horinaka 22-22 Nagaike-cho, Abeno-ku, Osaka-shi, Osaka Prefecture

Claims (3)

[Claims] 1. An ink jet system comprising: a substrate; pressure generating means for generating a pressure for ejecting ink; and a nozzle plate having a nozzle for ejecting ink at a predetermined distance from the pressure generating means. In the head, the pressure generating means includes a buckling structure body that causes buckling deformation due to thermal expansion, and a heater layer provided along the buckling structure body, and the pressure generating means is provided between the substrate and the buckling structure body. The inkjet head is characterized in that a Peltier element is provided in the. 2. The inkjet head according to claim 1, wherein each head includes a Peltier element drive power source for driving a Peltier element and a buckling structure drive power source for driving a buckling structure, The inkjet head is characterized in that the current is supplied for a certain period of time immediately after the current supply to the heater for driving the buckling structure is completed. 3. A step of depositing and patterning an N-type semiconductor on a substrate by sputtering, a step of depositing a P-type semiconductor and patterning, and a step between the N-type semiconductor and the P-type semiconductor. A step of forming a Peltier element comprising a step of filling an insulating film by a sputtering method or a spin coating method, and a step of forming a copper film by a sputtering method so that the adjacent N-type semiconductor and P-type semiconductor are electrically connected, and the formation thereof. Forming a first sacrificial layer on the Peltier element by sputtering, forming a first metal layer to be a buckling structure on the first sacrificial layer by plating, and forming a first metal layer on the first metal layer Forming a second sacrificial layer on the second sacrificial layer, forming a second metal layer to be a diaphragm on the second sacrificial layer by plating,
And a step of forming a window for etching the second sacrificial layer on the back surface of the substrate, etching from the window to collectively etch the first and second sacrificial layers, and a Peltier element and a buckling structure body. And a step of separating the buckling structure body and the diaphragm, and a step of patterning the second metal layer to form a diaphragm having a predetermined shape, the method of manufacturing an inkjet head.