JPH09102700A - Quality analysis monitoring method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To always instructs the maintenance adequately for each facility within the manufacturing process by knowing the situation of the occurrence of defects for each facility in synchronization with the time of occurrence. SOLUTION: Quality and operation information output from the mounting facility 1 or mounting inspecting machine is taken into an operation status database 5 through an animation and sound take-in device 2 with the timing of inspection day and time T. Also, the operating situation of each facility in a period ΔT before and after the inspection day and time T is taken in the operation status database 5 as same as the case of quality and operation information by a camera 4a and a microphone 4b provided in the animation and sound take-in devices 2 through a controller 3 connected to the devices.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a quality analysis / monitoring method for analyzing and monitoring quality based on quality / operation information obtained from processing equipment or inspection equipment in a manufacturing process.

[0002]

2. Description of the Related Art Conventionally, the quality of a product defect or the like that has occurred in the manufacturing process of a product is analyzed and monitored, and the maintenance of each facility in the manufacturing process is instructed based on the analysis and monitoring result. As the quality analysis and monitoring method for analysis and monitoring, the following methods are used.

In FIG. 5, equipment 1 in the manufacturing process is shown.
The quality control data used for controlling the operating state of the product or the product quality is regularly recorded and managed in the quality database 9 from the facility 1 through the communication means 8.

The contents recorded in the quality database 9 include, for example, an equipment number 10 for recognizing the equipment 1.
Inspection time 11, product serial number 12 flowing through the process, inspection position number 13 for identifying a defect occurring at a specific position of the product, defect code (others, measured value, etc.) 14, operation code indicating the operating state of the equipment 15 and the like are managed in a tabular form.

The contents recorded in the quality database 9 are as follows:
Various control charts, for example, Pareto charts showing the order of the frequency of occurrence of defects can be expressed, and the frequency of occurrence of defects can be grasped in time series. Also,
The recorded contents can also be viewed together with the operating state of the equipment 1 when a defect occurs.

The manufacturing manager who manages the manufacturing process empirically finds the cause of failure from the various control charts described above and performs maintenance of each facility in the manufacturing process. In such a case, especially in a manufacturing process having a plurality of processes, the manufacturing manager needs to make many analyzes and judgments extending over the steps, and the maintenance is postponed, so that the defective products cannot be found in the period until then. Will occur.

This is because it takes time for the manufacturing manager to refer to and analyze various control charts, and only the recorded data in the quality database 9 is used under the condition that the actual operating condition is not observed. The main reason is that only indirect analysis is performed.

In order to solve this, a method may be adopted in which a camera, a microphone, or the like for monitoring the operation of each equipment and product in the manufacturing process is provided, and is monitored step by step to observe the defect situation at the same time when the defect occurs.

[0009]

However, the conventional quality analysis and monitoring method as described above has the following problems.

First, it is unclear when and where a defect occurs and under what condition. Therefore, the surveillance cameras are arranged at a plurality of different places, and a manufacturing manager, for example, uses the images of the surveillance cameras. The operating condition of each facility must be continuously monitored, and such a monitoring method is not practical.

Therefore, secondly, the operating condition of each facility is recorded through a surveillance camera, and the operating condition of each facility thus recorded is observed, for example, by a production manager for several hours or every day. Although it is conceivable to grasp the defect occurrence status, this method makes it difficult to synchronize the defect occurrence with the time. If the defect occurrence is synchronized with the time, it is recorded in the quality database 9. As a content, it is necessary to record the defect occurrence time in advance and to extract and analyze only the necessary information from the recorded operation status of each equipment while watching it, which causes a lot of complicated work. Had.

In view of the above-mentioned conventional problems, the present invention does not require continuous monitoring of the operation status of each equipment and complicated operations in a manufacturing process having one or more steps. Provided is a quality analysis / monitoring method which can be grasped in synchronization with the occurrence time and can always instruct appropriately and properly for maintenance of each facility in a manufacturing process.

[0013]

In order to solve the above problems, the quality analysis monitoring method according to claim 1 of the present invention comprises:
In the processing / inspection process that performs quality inspection of the quality target by the processing facility and inspection equipment by the processing facility, the quality target quality and the processing facility detected from the processing facility and the inspection facility during the processing / inspection process. The first step of managing the quality / operation information indicating the operating state of the inspection equipment in a database together with the detection time, and the operation by the video or voice showing the operation status of the processing equipment and the inspection equipment in the period before and after the detection time. A second process for converting information into a database and managing it in synchronization with the detection time, and a management process in the second process using the detection time or quality / operation information managed in the first process as a search key. And a third step of outputting the information stored in the database in the first and second steps.

A quality analysis and monitoring method according to a second aspect has a plurality of processing and inspection steps according to the first aspect, and as a first step for each of the steps, a manufacturing number of a quality object is also stored in a database. As a third step, the operation information managed in the second step is searched by using the manufacturing number managed in the first step as a search key.
In this step, the information stored in the database will be output.

According to the quality analysis and monitoring method of the third aspect, in the various processing / inspecting steps for mounting the electronic component on the printed circuit board, each processing / inspecting step is performed by the first method of the first or second aspect. The method includes a step, a second step, and a third step.

According to the first aspect of the invention, the operating condition before and after the occurrence time is output at any time by using the quality / operation information, which is a characteristic of a defect that changes moment by moment, as a search key.

According to the second aspect of the present invention, a database of various operating conditions when a defect has occurred in the past is stored in a database. Also,
According to the configuration of claim 3, the amount of information such as a moving image is generally very large, but only the operation status before and after the occurrence time is handled.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION A quality analysis and monitoring method showing an embodiment of the present invention will be described below with reference to the drawings. In addition, here, a case where the invention is applied to a mounting process of an electronic component will be described as an example.

In FIG. 1, the quality / operation information obtained from the mounting equipment 1 in the electronic component mounting process or the mounting inspection machine for the product processed by the main mounting equipment 1 is transmitted via the moving image / audio capturing device 2. Then, at the timing of the inspection date and time T set at a predetermined time interval, the inspection date and time T, that is, the detection time of the quality / operation information is taken into the operation status database 5.

The operation status of each equipment in the period ΔT before and after the inspection date T is determined by the camera 4a and the microphone 4b provided in the moving image / sound capturing device 2 via the controller 3 connected to them. Like the quality / operation information, it is taken into the operation status database 5. In this case, the operation status in the period ΔT is recorded as moving image information from the camera 4a and is recorded as voice / vibration information from the microphone 4b. Further, the period ΔT may change its value before and after the occurrence of the event.

Although there may be a plurality of cameras 4a and microphones 4b, it is assumed here that the mounting process of electronic components including the mounting equipment 1 and the mounting inspection machine is monitored. If the monitoring target is the mounting equipment 1, for example, the operation of the nozzles mounting the electronic components and the transport status of the printed circuit board are monitored.

If the monitoring target in the above embodiment is a printing process, the operating status of the printing equipment provided in the printing process is monitored. Alternatively, the timing at which a specific event occurs may be used as the inspection date and time T, and the operating status of each facility may be monitored only at this timing. For example, when the defect rate exceeds a predetermined quality control limit, the detection means can detect the defect rate, and only in this case, the operation status of each facility can be captured.

FIG. 2 shows the structure of the operation status database 5. A pointer 7 for accessing the operation status database 5 is provided in the quality database 9 shown in the conventional example of FIG. 5, and the operation status data 6 which is the operation information is searched at high speed in each data item of the quality database 9. .

Although the operation status database 5 is accessed by the pointer 7 here, the pointer 7 is not always necessary, and another mechanism depending on the system configuration may be used depending on the database management system.

FIG. 3 illustrates the flow of the database loading process. Here, the quality / operation information and the operation status data are synchronized, and the timing of occurrence of a specific event such as when the defect rate exceeds the quality control limit is taken as the inspection date and time T, and each data before and after that is captured and recorded. The method of creating a database by doing this will be described.

In FIG. 3 (a), first, the database is initialized (step S1), and as shown in FIG. 3 (b), the arbitrary date and time t is increased by a period Δτ, and the subsequent processing is performed. I do.

Next, the operation status data for a period of ± ΔT from the current date and time tc shown in FIG. 3B as the inspection date and time T is stored in the buffer # 1 (step S2). In this case, the operation status data is recorded in the buffer # 1 as one frame for each period Δτ as shown in FIG. 3B, so that 2ΔT / Δτ frames are stored. Normally, 20 frames / second can reproduce a smooth operation situation, but when recording a high-speed operation, it is necessary to increase the number of frames.

Finally, the quality / operation status is judged (t = tc
? ) (Step S3), and if necessary (t = t
c), the quality of the operation status data stored in the buffer # 1
It is stored in the operation status database together with the operation data (step S4).

Thereafter, as shown in FIG. 3B, the date and time t is increased by Δτ (step S5), and the process is repeated from step S2. FIG. 4 is a diagram in which the quality analysis and monitoring method as described above is applied to a series of mounting steps composed of a plurality of mounting equipments 1. In this case, quality from each mounting equipment 1
When the operation information and the operation status of each mounting facility 1 are loaded into the operation status database 5 via each video / audio import device 2, the operation status database 5 is stored in the quality database 9 shown in the conventional example of FIG. By assigning the manufacturing number 12 of the product in FIG. 1, the operation status data 6 can be searched for the same product in addition to the inspection date and time.

[0030]

As described above, according to the present invention, the operation status before and after the occurrence time can be output at any time by using the quality / operation information, which is a characteristic of a defect that changes moment by moment, as a search key.

Therefore, it is possible to eliminate the need for the administrator to constantly monitor the operating status. In addition, it is possible to make a database of various operation states when past defects have occurred.

Therefore, the causal relationship between the defect tendency and the maintenance method can be easily arranged and analyzed. Also, in general, the amount of information such as videos will be extremely large,
Only the operation status before and after the occurrence time can be handled.

Therefore, the capacity of the operation status database for fetching information can be reduced. As a result, in a manufacturing process that has more than one process, the defect occurrence status of each equipment can be grasped in synchronization with the occurrence time without constantly monitoring the operating status of each equipment or performing complicated work. Therefore, maintenance of each facility in the manufacturing process can be always instructed accurately.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a quality analysis monitoring method according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram of an operation status database according to the same embodiment.

FIG. 3 is an explanatory diagram showing a processing flow of the embodiment.

FIG. 4 is an explanatory diagram of a mounting process including a plurality of equipments to which the same embodiment is applied.

FIG. 5 is an explanatory diagram of a conventional quality analysis and monitoring method.

[Explanation of symbols]

 1 Mounting Equipment (Mounting Inspection Machine) 2 Video / Sound Capture Device 5 Operation Status Database 4a Camera 4b Microphone

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuhiro Okada 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. In a processing / inspection process of processing a quality target by a processing facility and performing a quality inspection of the quality target by an inspection facility, a quality target detected from the processing facility and the inspection facility during the processing / inspection process. A first step of managing quality and operation information indicating quality and operation status of processing equipment and inspection equipment in a database together with the detection time, and
A second step of creating a database of operation information in the form of a moving image or voice that indicates the operating conditions of the processing equipment and inspection equipment before and after the detection time, and managing the information in synchronization with the detection time; and managing in the first step. A third operation for searching the operation information managed in the second step by using the detected time or the quality / operation information as a search key and outputting the information stored in the database in the first and second steps. A quality analysis and monitoring method comprising steps and. 2. A plurality of processing / inspection steps are provided, and as a first step for each step, a manufacturing number of a quality object is also managed in a database, and a third step is managed by the first step. The operation information managed in the second step is searched using the serial number that is registered as a search key, and the first and second operation information is searched.
The information stored in a database is output in the step of 1.
Quality analysis monitoring method described in. 3. The quality analysis monitoring method according to claim 1, wherein the processing / inspection step is each step in various processing / inspection steps for mounting an electronic component on a printed circuit board.