JPH0899267A - Polishing device - Google Patents

Abstract

PURPOSE: To keep a polishing pressure constant by installing a spindle arranged on a rotary base table freely movably in the vertical direction while preventing its rotation to a fixed spindle mounted in a rotary main spindle of a polishing device and arranging an elastic body between the spindle of the rotary base table and the fixed spindle. CONSTITUTION: A spindle 5 of a rotary base table 4 is inserted freely movably in the vertical direction while prevented from rotating to a fixed spindle 6 mounted in a rotary main spindle of a polishing device. The upper end part of the spindle 5 in the rotary base table 4 is pressed downward by means of an elastic body 8 stored in an operating chamber 7 formed in the inside of the fixed spindle 6. When a polishing pressure in a grinding wheel tip 2 by the rotary base table 4 is increased, the rotary base table 4 is pushed up against the elastic body 8, so that an unnecessarily intensive polishing pressure does not work on the polishing face of a workpiece. Therefore, the polishing pressure of the grinding wheel tool is kept constant toward the polishing face.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus, and more particularly to a polishing apparatus capable of maintaining a substantially constant polishing pressure of a grindstone used for precisely polishing a finely shaped portion.

[0002]

2. Description of the Related Art Conventionally, a polishing apparatus for a finely shaped portion comprises a grindstone portion and a shaft portion, one end of which is fixed to the grindstone portion and the other end of which is held by a chucking mechanism on a rotating main shaft of a polishing machine. Is attached to a polishing machine via the chucking mechanism, and the polishing device is pressed against the workpiece and rotated. Further, when a workpiece is polished by using the polishing apparatus, the stock removal by a grindstone is numerically controlled in advance, and after the grindstone of the polishing apparatus is positioned with respect to the workpiece, the polishing is performed.

For example, the case of mirror-finishing a finely shaped portion of a semiconductor member product made of silicon such as a semiconductor wafer will be described. First, a predetermined amount of polishing is performed with a grindstone having a large grain size. The polishing allowance is numerically controlled as described above. Next, polishing work is performed under numerical control using a grindstone with a finer grain size. By performing the polishing process stepwise in this way, a mirror finish is achieved.

More specifically, in order to mirror-finish a finely shaped portion, first, a metal bond grindstone is used for shaping, and then a resin bond (for example, #
(800) Intermediate finishing is performed with a whetstone, and further, final finishing is performed using a whetstone or the like using an elastic whetstone such as buffing or rubber, or a resin bond (for example, # 1500) whetstone to perform mirror finishing.

[0005]

However, as seen in the above-described conventional polishing process, when performing the polishing process stepwise using a grindstone in which the grain size of the grindstone is made finer, the grindstone used in one process is The state of wear and abrasion changes every time. Therefore, it is necessary to accurately align the grindstone of the polishing apparatus in the next step with the surface of each workpiece, which is also difficult. Moreover, the polishing process had to be started from a position where the grindstone of the polishing apparatus did not hit the work piece reliably.

In particular, in the final finishing process, a resin bond (for example, # 15) which is a grindstone having ultrafine grindstone grains.
00) is used, the cutting amount per cut is several μm
Therefore, it is extremely difficult to position the workpiece on the surface of the workpiece after the intermediate finishing, and it requires a considerable amount of setup time such as measuring the thickness of the grindstone. Further, if it is used once, the abrasion of the grindstone increases with respect to the cut amount, and the next positioning work becomes more difficult. Furthermore, when the polishing allowance is numerically controlled with a conventional polishing apparatus,
Since the resin-bonded grindstone itself is not easily deformed, a large amount of external force acts on the grindstone, which adversely affects the grinding state of the grindstone, and grindstone marks (machining marks) and chipping (chips) on the machined surface of the workpiece. ) Occurred, and in addition, there was a technical problem such as uneven wear of the grindstone.

As a means for solving this, it is conceivable to perform a final finishing process using an elastic grindstone such as buffing or rubber, but it takes a long time for the polishing process in the final finishing, and moreover, a finished shape is required. There are technical problems such as deformation such as sagging and uneven wear on the polishing surface of the grindstone.

According to the present invention, since the elastic grindstone is not used as the grindstone, deformation of the finished shape such as sagging is prevented, and even if the polishing pressure acting on the grindstone becomes unnecessarily large, the work surface of the workpiece is machined. It is an object of the present invention to provide a polishing apparatus which does not cause grindstone marking (machining marks) or chipping (chipping) and which can easily align a workpiece and a grindstone.

[0009]

In order to achieve the above-mentioned object, a polishing apparatus according to the present invention is a grindstone for polishing the surface of a work material in a polishing apparatus mounted on a rotating spindle of a polishing machine. A rotary base to which the grindstone is attached, a shaft provided on the surface opposite to the grindstone attachment surface of the rotary base, a shaft of the rotary base that cannot be rotated, and a fixed shaft that is vertically movable. It has a basic structure in which an elastic body is provided between the shaft of the rotary base and the fixed shaft, and the fixed shaft is mounted on the rotary main shaft of the polishing machine.

Further, in a polishing apparatus mounted on a rotary spindle of a polishing machine, a grindstone for polishing the surface of a workpiece, a grindstone sticking plate to which the grindstone is stuck, and a grindstone sticking surface of the grindstone sticking plate. A rotating base that is assembled to the opposite surface, a shaft that is provided on the opposite surface of the assembly surface of the grindstone sticking plate of the rotating base, and a shaft that is fixed to the rotary base shaft so that it cannot rotate and can move up and down. It has a shaft and an elastic body arranged between the shaft of the rotary base and the fixed shaft, and the fixed shaft is mounted on the rotary main shaft of the polishing machine.

Further, the polishing apparatus according to the present invention has a construction in which the grindstone for polishing the surface of the workpiece is a resin bond, and the upper end of the shaft of the rotary base is mounted on the rotary main shaft of the polishing machine. It is configured to be pressed downward by an elastic body inside the working chamber formed inside the fixed shaft. The elastic body is configured to use any one of a coil spring, rubber, a pneumatic damper, and a hydraulic damper.

[0012]

As is apparent from the above-described structure, in the polishing apparatus according to the present invention, the grindstone is attached to the rotary base, or the grindstone attaching plate with the grindstone attached is assembled to the rotary base. The provided shaft does not rotate with respect to the fixed shaft mounted on the rotating main shaft of the polishing machine,
In addition, it is assembled so that it can move up and down, and because an elastic body is arranged between the shaft of the rotating base and the fixed shaft, the rotating base moves upward even if a large grinding pressure is applied to the grindstone. It is possible to escape, and the polishing pressure is kept almost constant with respect to the polishing surface.

As a result, it is possible to prevent deterioration of the grindstone's shaving state due to a large polishing pressure, grindstone marks and chipping (chips) formed on the polished surface of the workpiece, and to prevent uneven wear of the grindstone. Moreover, even if the positional alignment between the work material and the grindstone is slightly deviated, the positional deviation can be absorbed by the clearance above the grindstone attachment plate. Therefore, it is possible to easily perform a precise and highly accurate polishing process even on a finely shaped portion of the work material.

[0014]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a partially cutaway front view showing the structure of a polishing apparatus according to a first embodiment of the present invention. In the figure, a polishing apparatus 1 according to the present invention includes a grindstone 2 and the grindstone 2
Is uniformly attached with an adhesive or the like, a rotary base 4, a shaft 5 provided on the upper surface of the rotary base 4, and the rotary base 4
Fixed shaft 6 which is not rotatable but can be vertically moved
The fixed shaft 6 is mounted on a rotating main shaft of a polishing machine (not shown) through a chucking mechanism.

The shaft 5 of the rotary base 4 constituting the polishing apparatus 1 is non-rotatably and vertically movably inserted into the fixed shaft 6 mounted on the rotary main shaft of the polishing machine as described above. The upper end of the shaft 5 of the rotary base 4 is pressed downward by the elastic body 8 housed in the working chamber 7 formed inside the fixed shaft 6. In the first embodiment and the second embodiment described later, a large number of grindstone chips were used instead of the grindstone 2, and the grindstone 2 was attached to the rotary base 4, whereas the grindstone was Since the only difference is that it is attached to the grindstone attachment plate, the operation and action will be described in detail in the second embodiment.

Next, a second embodiment of the present invention will be described with reference to FIGS. 2 is a partially cutaway front view showing the structure of the polishing apparatus according to the first embodiment of the present invention, FIG. 3 is a side view of FIG. 2, and FIG. 4 is a partially cutaway front view of the essential parts of FIG. Since the polishing machine used in the present invention is the same as a normal polishing machine, its description is omitted.

In the figure, the polishing apparatus 1 according to the present invention is
A large number of grindstone chips 2, a grindstone sticking plate 3 on which the grindstone chips 2 are evenly stuck with an adhesive agent, a rotary base 4 on which the grindstone sticker plate 3 is assembled, and an upper surface of the rotary base 4. The shaft 5 and the rotating base 4
Fixed shaft 6 which is not rotatable but can be vertically moved
The fixed shaft 6 is mounted on a rotating main shaft of a polishing machine (not shown) through a chucking mechanism.

The rotary base 4 constituting the polishing apparatus 1
The shaft 5 of the rotary base 4 is inserted into the fixed shaft 6 mounted on the rotary main shaft of the polishing machine so as to be non-rotatable and movable up and down as described above, and the upper end of the shaft 5 of the rotary base 4 is fixed to the fixed shaft 6 It is pressed downward by the elastic body 8 housed in the working chamber 7 formed inside.

As the elastic body 8, a coil spring, rubber, a damper by air pressure or hydraulic pressure, etc. are used, and the polishing pressure of the grindstone tip 2 by the rotary base 4 is increased during polishing by the polishing apparatus 1. In this case, the rotary base 4 is pushed up against the elastic body 8 so that unnecessary polishing pressure does not act on the polishing surface of the workpiece.

On the other hand, in order to rotate the shaft 5 of the rotary base 4 integrally with the fixed shaft 6, as shown in FIGS. 2 and 3, for example, an elongated hole 9 penetrating a predetermined position of the fixed shaft 6 is formed, A pin 10 penetrating the shaft 5 of the rotary base 4 is inserted through the slot 9. The shaft 5 of the rotary base 4 is a fixed shaft 6.
At the same time as being able to rotate integrally with, it can be moved up and down within the range of the elongated hole 9 of the fixed shaft 6.

5 and 6 show the shaft 5 of the rotary base 4.
FIG. 6 is a partially cutaway front view showing a polishing apparatus according to a third embodiment in which a shaft 5 of a rotary base 4 is formed in a spline shape and the shaft 5 is inserted. The fixed shaft 6 has a spline-shaped sliding hole formed therein, both of which rotate integrally, and the shaft 5 is vertically movable relative to the fixed shaft 6.

FIG. 7 is a partially cutaway front view showing the structure of the polishing apparatus according to the fourth embodiment in which the shaft 5 of the rotary base 4 and the fixed shaft 6 can rotate together. By forming the key grooves 12 and 13 in the sliding holes of the shaft 5 and the fixed shaft 6 of the base 4 respectively, and inserting the key 14 into the key grooves 12 and 13, both of them rotate together and the fixed shaft The shaft 5 can be slid up and down with respect to the shaft 6.

The operation and operation of the present invention will be described. When the polishing tool 1 polishes a workpiece, or during polishing, when the polishing pressure of the grindstone tip 2 by the rotary base 4 becomes large, the elastic body 8 is used. Against this, the rotary base 4 is pushed up, and an unnecessary polishing pressure does not act on the polishing surface of the workpiece.

Therefore, the polishing pressure of the grindstone tool is kept constant with respect to the polishing surface, and even if a hard grindstone is used, grindstone marks (machining marks) and chipping (chips) are produced in the work material. In addition, high-precision polishing can be performed, uneven wear of the grindstone is prevented, and precise and high-precision polishing can be performed even on a finely-shaped portion of the workpiece. Moreover, even if there is a slight misalignment between the workpiece and the grindstone, it is possible to absorb the misalignment due to the clearance above the grindstone attachment plate, which facilitates the alignment and improves work efficiency. To do.

In the above embodiment, the case where a plurality of grindstone tips are used as the grindstone has been described, but the present invention is naturally applicable to the case where one grindstone is used as in the first embodiment. The present invention can be applied to a so-called cup-shaped grindstone having a concave portion at its center. That is, the present invention can be applied to any whetstone shape.

[0026]

As described above in detail, in the polishing apparatus according to the present invention, the axis of the rotary base on which the grindstone is stuck or the grindstone sticking plate on which the grindstone is stuck is assembled to the rotary base and the axis of the rotary base is mounted. However, since it is non-rotatably attached to the fixed shaft attached to the rotary main shaft of the polishing machine so as to be vertically movable, and the elastic body is arranged between the rotary base shaft and the fixed shaft, the polishing pressure is Is kept almost constant, grinding stone marks (machining marks) and chipping (chips) do not occur on the work material, high-precision polishing processing can be performed, and uneven wear of the grinding stone can be prevented. It never happens.

Further, it is possible to perform a precise and highly accurate polishing process even on a finely shaped portion of the work material. Moreover, even if the work piece and the grindstone are slightly misaligned, the misalignment can be absorbed by the escape above the grindstone attachment plate, so that the alignment can be easily performed.
Work efficiency is improved.

In particular, in order to mirror-finish a finely-shaped portion such as a semiconductor wafer, even when polishing is performed stepwise by using a grindstone device having a different grain size, the grindstone device in the next step is used. This has the effect of facilitating positioning.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing the structure of a polishing apparatus according to a first embodiment of the present invention.

FIG. 2 is a partially cutaway front view showing the structure of a polishing apparatus according to a second embodiment of the present invention.

FIG. 3 is a side view of FIG.

FIG. 4 is a partially cutaway front view showing a main part of FIG.

FIG. 5 is a partially cutaway front view showing the structure of a polishing apparatus according to a third embodiment of the present invention.

6 is a cross-sectional view taken along line VV of FIG.

FIG. 7 is a partially cutaway front view showing the structure of a polishing apparatus according to a fourth embodiment of the present invention.

[Explanation of symbols]

 1 Polishing Device 2 Grinding Stone (Chip) 3 Grinding Stone Attachment Plate 4 Rotating Base 5 Axis 6 Fixed Axis 7 Working Chamber 8 Elastic Body

Claims (5)

[Claims] 1. A grindstone for grinding a surface of a workpiece in a grinding device mounted on a rotary spindle of a grinding machine, a rotary base on which the grindstone is stuck, and an opposite surface of the grindstone sticking surface of the rotary base. A shaft provided on the surface, a fixed shaft on which the shaft of the rotary base is non-rotatably and vertically movable, and an elastic body arranged between the shaft of the rotary base and the fixed shaft. A polishing apparatus comprising the fixed shaft mounted on a rotating main shaft of a polishing machine. 2. A grindstone that grinds the surface of a workpiece in a grinder mounted to a rotary spindle of a grinder, a grindstone sticking plate to which the grindstone is stuck, and a grindstone sticking surface of the grindstone sticking plate. Of the rotary base to be mounted on the opposite surface of the rotary base, the shaft provided on the surface of the rotary base opposite to the mounting surface of the grindstone attaching plate, and the shaft of the rotary base to be fixed so that the shaft cannot rotate and can move up and down. A polishing apparatus comprising: a shaft; and an elastic body arranged between the shaft of the rotary base and the fixed shaft, wherein the fixed shaft is mounted on a rotary main shaft of a polishing machine. 3. The polishing apparatus according to claim 1, wherein the grindstone for polishing the surface of the work material is a resin bond. 4. The upper end of the shaft of the rotary base is pressed downward by an elastic body in the working chamber formed inside a fixed shaft mounted on the rotary main shaft of the polishing machine. The polishing apparatus according to any one of claims 1 to 3. 5. The polishing apparatus according to claim 1, wherein any one of a coil spring, rubber, a pneumatic damper, and a hydraulic damper is used for the elastic body.