JPH08977A - Method for vacuum heat treatment and apparatus - Google Patents

Method for vacuum heat treatment and apparatus

Info

Publication number
JPH08977A
JPH08977A JP14315494A JP14315494A JPH08977A JP H08977 A JPH08977 A JP H08977A JP 14315494 A JP14315494 A JP 14315494A JP 14315494 A JP14315494 A JP 14315494A JP H08977 A JPH08977 A JP H08977A
Authority
JP
Japan
Prior art keywords
chamber
pressure
heat treatment
room
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14315494A
Other languages
Japanese (ja)
Other versions
JP2622356B2 (en
Inventor
Masaru Kawahara
勝 河原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoshin Engineering KK
Original Assignee
Kyoshin Engineering KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoshin Engineering KK filed Critical Kyoshin Engineering KK
Priority to JP6143154A priority Critical patent/JP2622356B2/en
Publication of JPH08977A publication Critical patent/JPH08977A/en
Application granted granted Critical
Publication of JP2622356B2 publication Critical patent/JP2622356B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Physical Vapour Deposition (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
  • Furnace Details (AREA)

Abstract

PURPOSE:To make the quality of an article const. and to shorten the heat treating time by a method wherein the temp. distribution in a room under high temp. and high pressure storing the article to be treated is made const. and, thereafter, while the room is made vacuum, the article is heated by using a heating means arranged to be close to the article. CONSTITUTION:A highly precise article 24 is arranged in a room 26 and heating means 28, 30, 31 and 44 provided on the periphery of the room 26 are actuated and, at the same time, inner pressure in the room is elevated. After the room temp. reaches a specified temp., while this temp. is kept at a const. temp. and the pressure in the room is kept at a high pressure atmosphere, a required heat treatment is performed while the article is kept at const. pressure and temp. After a specified time passes through, while the room temp. is kept const., the pressure in the room is decreased down to at most atmospheric pressure to perform degassing treatment. Then, the pressure in the room is elevated up to at least atmospheric pressure and while the room temp. is gradually lowered, aging treatment of the article 24 is performed. While the inside of the room is kept under a furthermore elevated pressure condition, the heating means is not actuated to quench the article 24 and the pressure in the room is decreased to atmospheric pressure and the article 24 is taken out.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ガラスやエポキシ樹脂
板の表面熱処理、液晶デイスプレイ素子の熱処理、種々
の電子部品等の高精密物品を熱処理するための加熱装置
に関し、特に真空下においてこれらの物品に蒸着又は焼
成等の熱処理を施し均質な所望の品質を得ることが出来
る熱処理の方法及び装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating apparatus for heat-treating surfaces of glass and epoxy resin plates, heat treatment of liquid crystal display elements, and heat treatment of high precision articles such as various electronic parts. The present invention relates to a heat treatment method and apparatus capable of subjecting an article to heat treatment such as vapor deposition or baking to obtain a desired uniform quality.

【0002】[0002]

【従来の技術】従来、この種の処理作業においては、図
3に概括的に正面図(図3A)及び側面図(図3B)に
て示すような真空加熱処理装置1が広く使用されてい
る。この装置1は、内部に各種の被熱処理ワーク(例え
ば液晶デイスプレイ素子)を収納する概ね円筒形の室2
が設けてある。この室2の周囲には加熱手段3が配置さ
れている。更に該室2の奥には風向きを調整する仕切板
4及びフィンヒータ等の加熱手段5が設けてある。ま
た、この室2内の熱を迅速に排出するための熱排気ダク
ト6、該室2内を真空状態にするための真空ポンプ7及
び該真空状態を迅速に大気圧まで戻すための真空排気ダ
クト8、該室2内に熱風を循環させるためのファンモー
タ9等が設けてある。
2. Description of the Related Art Conventionally, in this type of processing operation, a vacuum heating apparatus 1 as generally shown in a front view (FIG. 3A) and a side view (FIG. 3B) of FIG. 3 has been widely used. . The apparatus 1 has a generally cylindrical chamber 2 in which various workpieces to be heat-treated (for example, liquid crystal display elements) are housed.
Is provided. A heating means 3 is arranged around the chamber 2. Further, in the back of the chamber 2, a partition plate 4 for adjusting the wind direction and a heating means 5 such as a fin heater are provided. Further, a heat exhaust duct 6 for quickly discharging the heat in the chamber 2, a vacuum pump 7 for bringing the inside of the chamber 2 to a vacuum state, and a vacuum exhaust duct for returning the vacuum state to the atmospheric pressure quickly. 8. A fan motor 9 and the like for circulating hot air in the chamber 2 are provided.

【0003】しかして、このような公知の装置1による
真空加熱作業は図2Bに示すような挙動を呈していた。
即ち、時間経過を横軸に取り、室内におけるワーク各部
の温度変化及び室内の圧力変化を縦軸に取った場合、作
業開始と共に室2内の圧力を大気圧に維持したまま、加
熱手段3、5により室2内の温度を上昇し、更に当該室
2内においてファンモータ9によって、該室2内の空気
を当該室2の中心部分から奥に向かって移動し、次いで
フィンヒータ等の加熱手段5を介して半径方向外方に向
い、さらに当該室2を手前に向かって移動し、その後、
再び室2の中心部分を奥に向かうように空気流10を起
すと、該室2内に収納されたワークの各部分の温度が順
次上昇する。t1 時間(例えば1.5時間)後、ワーク
の各部の温度はある程度のばらつきを発生しながらも概
ね温度T1 (例えば200°C)に達する。この場合、
ワーク各部の温度のばらつき(v)は室2内に強制的な
空気循環流を施しても±5°〜15°Cである。この状
態でワークを約2〜3時間加熱保持し、このとき焼成、
蒸着その他の所望の熱処理作業が行われる。
[0003] However, the vacuum heating operation using such a known apparatus 1 exhibited a behavior as shown in FIG. 2B.
That is, when the time is plotted on the horizontal axis and the temperature change of each part of the work in the room and the pressure change in the room are plotted on the vertical axis, the heating means 3, while maintaining the pressure in the chamber 2 at atmospheric pressure with the start of the work, 5, the temperature in the chamber 2 is increased by the fan motor 9 in the chamber 2, and the air in the chamber 2 is moved from the center portion of the chamber 2 to the back. 5, is directed radially outward, and further moves the chamber 2 toward the user,
When the airflow 10 is generated again toward the center portion of the chamber 2 toward the back, the temperature of each portion of the work stored in the chamber 2 sequentially increases. After t 1 hour (for example, 1.5 hours), the temperature of each part of the work reaches the temperature T 1 (for example, 200 ° C.) with some variation. in this case,
The temperature variation (v) of each part of the work is ± 5 ° C. to 15 ° C. even if a forced air circulation flow is performed in the chamber 2. In this state, the work is heated and held for about 2 to 3 hours, and at this time, firing,
Deposition and other desired heat treatment operations are performed.

【0004】その後、室内の圧力を大気圧から1トール
程度まで減圧し、かつ加熱手段電源を順次オフ状態にし
ながら室内温度を下げ、ワークを所定時間(例えば約
0.5時間)熟成する。その後、室2内圧力を大気圧に
戻し、かつ室2内温度を常温まで下げ、こうしてワーク
の熱加工処理を完了していた。
After that, the pressure in the room is reduced from atmospheric pressure to about 1 Torr, and the room temperature is lowered while sequentially turning off the heating means power source, and the work is aged for a predetermined time (for example, about 0.5 hours). Thereafter, the pressure in the chamber 2 was returned to the atmospheric pressure, and the temperature in the chamber 2 was lowered to room temperature, thus completing the thermal processing of the workpiece.

【0005】[0005]

【発明が解決しようとする課題】このような公知の装置
1を使用したワークの真空加熱処理方法においては、図
2Bに示すようなワークを温度T1 まで加熱したAの部
分において、ワークの各部分において±約5゜〜15°
Cの温度のばらつき(v)が発生し、特に、加熱手段に
近い部分即ちワークの外側部分において温度が高く、加
熱手段から離れた部分即ちワーク内方部分において温度
が低い。このような温度のばらつき(v)は、ワークを
当該室2内にて一定温度T1 に保持していることにより
幾分減少傾向は示すものの、ワークが高温真空下にある
熟成過程開始時Bにおいて、減圧に伴う温度降下によっ
て更にこのワーク各部の温度のばらつきは大きくなる傾
向があった。更にまた、熟成過程後の冷却工程におい
て、ある場合には、ワークの外方部分において迅速に温
度が降下するが、ワーク内部においてはこの温度降下は
はかばかしくなかったり、またある場合には、反対に、
室2外壁のもつ潜熱によりワークの外方部分の温度がな
かなか下がらず、ワーク内部の温度が急速に降下し、こ
のため、熱処理されたワークの分子配列等が均一に処理
されず、しばしばその品質にばらつきが発生するという
課題があった。
In the vacuum heat treatment method for a work using such a known apparatus 1, each work of the work is heated in the portion A heated to the temperature T 1 as shown in FIG. 2B. ± 5 ° to 15 ° at the part
A variation (v) in the temperature of C occurs, and in particular, the temperature is high in the portion near the heating means, that is, the outer portion of the work, and low in the portion distant from the heating means, that is, the inner portion of the work. Although such a temperature variation (v) tends to decrease somewhat due to the fact that the work is maintained at the constant temperature T 1 in the chamber 2, at the start of the aging process when the work is under a high temperature vacuum. , The temperature variation of each part of the work tends to be further increased due to the temperature drop caused by the pressure reduction. Furthermore, in the cooling step after the aging process, in some cases, the temperature rapidly drops in the outer part of the work, but inside the work, the temperature drop is not so rapid, and in other cases, the opposite occurs. ,
Due to the latent heat of the outer wall of the chamber 2, the temperature of the outer part of the work is not lowered easily, and the temperature inside the work is rapidly decreased. Therefore, the molecular arrangement of the heat-treated work is not uniformly processed and its quality is often reduced. There was a problem that variation occurred in the.

【0006】更に、これまでの装置1においては、加熱
手段がワーク収容室2の外側にあるため、室内が所定温
度まで加熱されるまでの時間が長くかかり、またこのた
め大きい容量の加熱手段を使用する必要があり、更に当
該加熱手段の熱が装置全体に分散し、熟成後、放熱によ
り装置が室温に戻るまでの時間が約0.5時間以上もか
かり、全体としての処理加工時間が約5時間以上かかる
という課題もあった。
Furthermore, in the conventional apparatus 1, since the heating means is located outside the work accommodating chamber 2, it takes a long time to heat the inside of the chamber to a predetermined temperature. In addition, it takes about 0.5 hours or more for the heat of the heating means to be dissipated in the entire apparatus and for the apparatus to return to room temperature due to heat dissipation after aging. There was also a problem that it took more than 5 hours.

【0007】[0007]

【課題を解決するための手段】本発明は、上記課題を解
決するため、加熱手段を室の外側に設けると共に、更に
室内にも別の加熱手段を設け、また、加熱工程を大気圧
下ではなく、高圧力下において行い、特に最初の加熱工
程を室内外の加熱手段全てを使用すると共に室内圧力の
上昇を同時に行ない、更に、室内を真空にしたときに室
内部の加熱手段によってワークに予熱を与えながらワー
クの温度を均一化させ、また温度降下時に室内圧力を更
にあげることにより、特に温度降下時に熟成する被処理
物はその被処理物固有の熟成に最適な温度降下パターン
を経ることが出来ようにその温度降下パターンを自在に
制御出来ると共に、ワーク取り出し時には室内を加圧し
ながらガス排気弁を開くことにより急速冷却が出来る。
これによりワークの品質を一定化し、更にその熱処理加
工時間の短縮を図るものである。
According to the present invention, in order to solve the above-mentioned problems, a heating means is provided outside a room, another heating means is further provided in the room, and the heating step is performed under atmospheric pressure. In particular, the process is performed under high pressure.In particular, the first heating step uses all the heating means inside and outside the room and simultaneously raises the indoor pressure.Furthermore, when the room is evacuated, the heating means inside the room preheats the work. The temperature of the workpiece is made uniform while the temperature is reduced, and the indoor pressure is further increased when the temperature drops. The temperature drop pattern can be freely controlled as much as possible, and rapid cooling can be performed by opening the gas exhaust valve while pressurizing the room when taking out the work.
This makes the quality of the work constant and further shortens the heat treatment processing time.

【0008】[0008]

【作用】被処理物品を収容している高温高圧下にある室
内の温度分布を、一定にし、その後、当該室内を真空状
態にしながら、該物品に近接して配置した加熱手段を用
いて物品を保温することにより物品の物理化学的に均質
な熱処理を行う。
The temperature distribution in the room under the high temperature and high pressure accommodating the article to be treated is kept constant, and then, while the chamber is kept in a vacuum state, the article is heated using the heating means arranged close to the article. Physicochemically uniform heat treatment of the article is performed by keeping the temperature.

【0009】[0009]

【実施例】以下、本発明の一実施例につき図面を参照し
ながら詳細に述べる。本件発明の真空加熱処理装置20
を示す図1において、図1Aはその概括表面図、図1B
は被処理物であるワークを当該装置内へ移送する移送架
台の側面図、図1Cは当該装置の側面図で内部構造を示
している図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings. Vacuum heat treatment apparatus 20 of the present invention
1A is a schematic surface view thereof, and FIG.
FIG. 1C is a side view of a transfer gantry for transferring a workpiece to be processed into the apparatus, and FIG. 1C is a side view of the apparatus showing an internal structure.

【0010】本件装置18は、加熱真空室26を有する
装置本体20と、該加熱真空室26へ液晶デイスプレイ
素子等の被処理物品即ちワーク24を供給する架台22
と、から構成されている。ワーク24を受け入れる当該
装置本体20の室26の外周部分に、図3に示す公知の
装置1の加熱手段3と同様の作用をするコイルヒータ又
はパネルヒータ等から成る加熱手段28が設けてあると
共に、当該室26の内側であってワーク24に対置する
部所に更にコイルヒータ又はパネルヒータ等の別の加熱
手段30が設けてある。更に、当該室26の奥側の壁面
にも同様の加熱手段31が配置されているのが好まし
い。該室26内には矢印32で示す方向に気流を流すた
めのファン及びこれを駆動する駆動源34及び当該室2
6内の圧力を増大するための加圧ガス導入弁36、該気
流が通るフィルタ38、HEPAフィルタ40、風向板
42が取り付けてある。また、前記架台22のワーク2
4の手前側にも加熱手段44が取り付けてある。更に当
該室26内の圧力を減少するためのガス排気弁35、及
び当該室26内を真空雰囲気にするための真空ポンプ4
6が設けてある。
The present apparatus 18 includes an apparatus main body 20 having a heating vacuum chamber 26, and a gantry 22 for supplying an article to be processed such as a liquid crystal display element, that is, a work 24 to the heating vacuum chamber 26.
It consists of and. A heating means 28 such as a coil heater or a panel heater having the same function as the heating means 3 of the known apparatus 1 shown in FIG. Further, another heating means 30 such as a coil heater or a panel heater is provided in a portion inside the chamber 26 and opposed to the work 24. Further, it is preferable that a similar heating means 31 is arranged on the inner wall surface of the chamber 26. In the chamber 26, a fan for flowing an airflow in a direction indicated by an arrow 32, a driving source 34 for driving the fan, and the chamber 2
A pressurized gas introduction valve 36 for increasing the pressure inside 6, a filter 38 through which the air flows, a HEPA filter 40, and a wind direction plate 42 are attached. Further, the work 2 of the gantry 22
The heating means 44 is also attached to the front side of 4. Further, a gas exhaust valve 35 for reducing the pressure in the chamber 26, and a vacuum pump 4 for creating a vacuum atmosphere in the chamber 26.
6 is provided.

【0011】被処理ワーク24を室26内へ供給し又は
処理済ワークをそこから取り出すための架台22は、室
26内へのワークの接近を容易にするため、好ましくは
装置本体20の下方まで伸びているレール上を移動出来
るようにローラ等によって支持案内されていることが望
ましい。またこの架台22は、ワーク24を所定の状態
で保持するためのワーク支持台23を有している。更に
この架台22には、前記加熱真空室26を遮蔽するため
の遮蔽扉25が設けてある。この扉25とワーク24と
の間にはワーク支持台23から立ち上がっている立上片
が設けてあり、この立上片の内側にはコイルヒータ、又
はパネルヒータ等の加熱手段44が取り付けてある。
The pedestal 22 for supplying the workpiece 24 to be processed into the chamber 26 or taking out the processed workpiece from the chamber 26 is preferably provided below the apparatus main body 20 in order to facilitate the approach of the workpiece into the chamber 26. It is desirable to be supported and guided by rollers or the like so as to be able to move on the extending rail. The gantry 22 has a work support 23 for holding the work 24 in a predetermined state. Further, the gantry 22 is provided with a shielding door 25 for shielding the heating vacuum chamber 26. A rising piece rising from the work support 23 is provided between the door 25 and the work 24, and a heating means 44 such as a coil heater or a panel heater is attached inside the rising piece. .

【0012】本件発明の装置20が、公知の装置1と大
きく異なる点は、ワーク24を熱処理加工する室26内
に、付加的加熱手段30、31を備えていること、ワー
ク24を室26内へ出し入れ容易としている架台22を
有していること、該架台22に付加的な加熱手段44を
有していること及び室内の圧力を調整するための加圧ガ
ス導入弁36が設けてあること、であり、その他の点で
は公知の装置1と概ね同様である。
The device 20 according to the present invention is significantly different from the known device 1 in that additional heating means 30 and 31 are provided in a chamber 26 for heat-treating the work 24. It has a gantry 22 that facilitates taking in and out, the gantry 22 has an additional heating means 44, and a pressurized gas introduction valve 36 for adjusting the pressure in the room is provided. In other respects, it is substantially the same as the known device 1.

【0013】本発明装置20によるワーク24の熱処理
加工における挙動について、図2Aを参照しながら述べ
る。図2Bと同様に、時間を横軸に取り、室26内にお
けるワーク24の各点の温度変化及び室内圧力の変化を
縦軸に取った図2Aに示すように、本件発明の熱処理工
程即ち焼成工程は、初期処理領域、圧力温度調整領域、
加熱処理工程(焼成工程)、脱気工程、熟成工程、冷却
工程、及び開放工程から構成されている。
The behavior in the heat treatment of the work 24 by the apparatus 20 of the present invention will be described with reference to FIG. 2A. As in FIG. 2B, the time is plotted on the horizontal axis, and the temperature change at each point of the work 24 in the chamber 26 and the change in room pressure are plotted on the vertical axis. The process includes an initial processing area, a pressure and temperature adjustment area,
It is composed of a heat treatment step (firing step), a deaeration step, an aging step, a cooling step, and an opening step.

【0014】初期処理領域においては、作業開始と共に
加圧ガス導入弁36を開き、室26内に例えば窒素ガス
を供給することにより当該室26内の圧力を大気圧以上
の圧力に急速に上昇する。この圧力値は被処理物品の特
性、寸法、用途その他の条件により異なるが、概ね2.
5〜3気圧程度が一般的であろう。しかしながらこの圧
力は単なる例示であり、本発明はこれに制限されるもの
ではない。これと共に当該室26内の温度を、加熱手段
28、30、31、44を使用することによって、急激
に前述と同様のT1 付近まで上げる。この際、ファンモ
ータ34により、該室26内に矢印32方向の気流を発
生させる。本発明装置においては、加熱手段が公知の装
置の場合に比較してワークの周囲に近接した位置にも付
加的に配置されているため該室26内に収納されたワー
ク24の各部分の温度を迅速に上昇させることが出来
る。
In the initial processing region, the pressurized gas introduction valve 36 is opened at the same time as the operation is started, and the pressure in the chamber 26 is rapidly increased to a pressure higher than the atmospheric pressure by supplying, for example, nitrogen gas into the chamber 26. . This pressure value varies depending on the characteristics, dimensions, applications and other conditions of the article to be treated, but is generally about 2.
About 5 to 3 atmospheres will be common. However, this pressure is merely an example, and the present invention is not limited thereto. The temperature of the chamber 26 along with this, by using a heating means 28,30,31,44, rapidly raised to the vicinity of T 1 of the same as described above. At this time, an airflow in the direction of arrow 32 is generated in the chamber 26 by the fan motor 34. In the apparatus of the present invention, since the heating means is additionally arranged at a position closer to the periphery of the work as compared with the known apparatus, the temperature of each part of the work 24 stored in the chamber 26 is reduced. Can be raised quickly.

【0015】次いで、圧力温度調整領域において、ガス
排気弁35を調整して室内圧力を幾分下げる。このとき
の圧力は限定的なものではないが概ね2気圧程度であろ
う。しかしながら室内の温度は、このようなガス抜きに
もかかわらず、加熱手段からの輻射熱または対流熱によ
りその温度が、T1 に至る。この温度T1 は所望の被処
理物品の特性、寸法、用途その他の条件により異なる
が、概ね200°C程度が一般的である。しかしながら
この温度は単なる例示であり、本発明はこれに制限され
るものではない。本装置によれば、高圧力雰囲気下での
加熱のため、熱媒体が、迅速に満遍なくワーク24の周
囲全体に行き渡り、その結果、ワーク24は、図2Bの
時間t1 よりも短かい時間ta で所定の温度域に到達出
来るのである。
Next, in the pressure temperature adjustment region, the gas exhaust valve 35 is adjusted to lower the room pressure to some extent. The pressure at this time is not limited, but may be about 2 atm. However the temperature in the room, despite such degassing, the temperature by radiation heat or convection heat from the heating means, leading to T 1. This temperature T 1 is generally about 200 ° C., though it varies depending on the desired characteristics of the article to be treated, dimensions, use and other conditions. However, this temperature is merely an example, and the present invention is not limited thereto. According to the present apparatus, the heating medium quickly and evenly spreads around the entire circumference of the work 24 due to the heating under the high pressure atmosphere, and as a result, the work 24 is shorter than the time t 1 in FIG. 2B by the time t 1 . is able reach a predetermined temperature range in a.

【0016】加熱処理領域において、ワーク24が所定
の温度領域T1 に達した後、例えばヒータ28及びヒー
タ31のみを使って室26内の温度をその値に維持する
と共に、被処理物品に所定の加熱処理が例えば約2〜3
時間施され、適切な焼成が達成される。本発明の装置に
おいては、高圧力熱媒体下での作業のため、被処理物品
としてのワーク24の内側又は外側等の位置的な違いに
よって、ワーク表面に温度のばらつきが発生するという
ことはほとんど無く、あってもその温度差wは、±2〜
5°程度であることが出願人の実験により判明してい
る。この値は、公知の装置における場合に比べて、その
ばらつきが半分以下になっていることを意味している。
[0016] In the heat treatment area, after the workpiece 24 has reached a predetermined temperature range T 1, for example, while maintaining using only heaters 28 and the heater 31 to the temperature in the chamber 26 to the value, the article to be treated predetermined Heat treatment is, for example, about 2-3
Time is applied to achieve proper firing. In the apparatus of the present invention, since the work is performed under a high-pressure heat medium, it is almost impossible that temperature variation occurs on the work surface due to a positional difference between the inside and outside of the work 24 as the article to be processed. No, even if there is, the temperature difference w is ± 2
It has been found by the applicant's experiment that the angle is about 5 °. This value means that the variation is less than half that in the known device.

【0017】次いで、脱気領域において、ガス排気弁3
5によって室26内のガス抜きを行い、真空ポンプ46
を稼働することによって当該室26内の圧力を前記2気
圧程度から1トール程度まで減圧する。この時、ガスと
一緒に室内の熱も抜き取られる。このため、ワーク24
に近接して位置している室内ヒータ30、31、44を
オンにして当該室内の温度を一定に保持する。図2Aに
示すように、減圧時に室温が一時的に下がるためにワー
ク各部の温度にばらつきが発生するが、該ヒータの作用
によりすぐにそのばらつきが補償される。こうして減圧
時におけるワーク24各部の温度のばらつき発生が防止
されるのである。この点について、図2Bに示す公知の
装置の場合では、このようにワーク24に近接した部所
に加熱手段が存在していないので、減圧時に発生する温
度降下に迅速に応答することが出来ず、このためこの減
圧によって発生する室内の温度降下に伴うワーク各部の
温度のばらつきの増大を阻止することが出来なかった
(図2BのB部分参照)。本件装置では、このような欠
点を完全に解消しているのである。この工程によって、
ワーク表面からの脱気処理が完了する。
Next, in the degassing region, the gas exhaust valve 3
5, the chamber 26 is degassed, and the vacuum pump 46
The pressure in the chamber 26 is reduced from about 2 atm to about 1 torr by operating the. At this time, the heat in the room is extracted together with the gas. Therefore, the work 24
The indoor heaters 30, 31, and 44, which are located close to the room, are turned on to keep the temperature of the room constant. As shown in FIG. 2A, the temperature of each part of the work varies due to a temporary drop in room temperature when the pressure is reduced, and the variation is immediately compensated by the action of the heater. In this way, the occurrence of temperature variation of each part of the work 24 during pressure reduction is prevented. In this regard, in the case of the known apparatus shown in FIG. 2B, since the heating means does not exist in the portion close to the work 24, it is not possible to quickly respond to the temperature drop generated at the time of decompression. For this reason, it was not possible to prevent an increase in variation in the temperature of each part of the work due to the temperature drop in the room caused by the decompression (see the portion B in FIG. 2B). The device of the present invention completely eliminates such drawbacks. By this process,
The deaeration process from the work surface is completed.

【0018】所定の時間経過後、再度、室26内の圧力
を例えば2気圧程度まで上昇してワーク24を所定時間
(例えば約0.5時間)熟成即ちアニール処理するため
の熟成工程に入る。このとき、ワーク24各部分におけ
る温度分散は著しく小さくなっており、約±1〜4°程
度であることが出願人の実験により判明している。
After the lapse of a predetermined time, the pressure in the chamber 26 is again raised to, for example, about 2 atm, and the aging process for aging the work 24 for a predetermined time (for example, about 0.5 hours), that is, for annealing is started. At this time, the temperature dispersion in each part of the work 24 is remarkably small, and it is found by the experiment of the applicant that it is about ± 1 to 4 °.

【0019】その後、冷却工程において、当該室26内
の圧力を例えば2.5〜3気圧程度まで上げ、好ましく
は加圧ガス導入弁36を開きかつまたガス排気弁35を
適切に開放調節しながら室内圧力を一定に保持しつつ当
該室内のガス全体を入れ替えながら室内ヒータ30を順
次オフの状態にすることによって室26内温度を急速に
室温まで下げる。
Thereafter, in the cooling step, the pressure in the chamber 26 is increased to, for example, about 2.5 to 3 atm. Preferably, the pressurized gas introduction valve 36 is opened and the gas exhaust valve 35 is appropriately opened and adjusted. The temperature inside the chamber 26 is rapidly lowered to room temperature by sequentially turning off the indoor heaters 30 while replacing the entire gas in the room while maintaining the room pressure constant.

【0020】最後に開放領域において、室内を開放し室
内圧力を大気圧状態とするとともにワークを放冷し、そ
の後ワークを取り出すのである。
Finally, in the open area, the inside of the chamber is opened to bring the pressure in the chamber to the atmospheric pressure, the work is allowed to cool, and then the work is taken out.

【0021】本件発明の装置は、室26内にパネルヒー
タ等の加熱手段30、31を備えている。ワーク24に
直接対置して配置されるこの加熱手段は、アルミニュー
ム等の出来るだけ暖めやすく冷え易い熱容量の小さい材
料によって形成されるのが好ましい。これによりワーク
24の立ち上げ時の加熱時間及び放熱時の冷却時間が短
くなるからである。現実にこの発明の装置においてはワ
ークの処理時間tb が、これまでの装置よりも1時間以
上の短くなった。また、加熱手段からの輻射熱のエネル
ギ量が加熱手段からの距離の二乗に反比例するため、本
発明装置のように、加熱手段をワークに近接した位置に
配置することにより加熱手段からの熱の利用が著しく改
良されるのである。
The apparatus of the present invention has heating means 30 and 31 such as a panel heater in the chamber 26. The heating means disposed directly opposite the work 24 is preferably made of a material having a small heat capacity, such as aluminum, which is easily heated and cooled as much as possible. This is because the heating time at the time of starting the work 24 and the cooling time at the time of heat radiation are shortened. Actually, in the apparatus of the present invention, the processing time t b of the work is shortened by 1 hour or more as compared with the conventional apparatuses. In addition, since the amount of energy of radiant heat from the heating means is inversely proportional to the square of the distance from the heating means, the heat from the heating means is utilized by disposing the heating means at a position close to the work as in the apparatus of the present invention. Is significantly improved.

【0022】[0022]

【発明の効果】ワークの温度上昇が非常に早くまた、ワ
ークの加熱を高圧力雰囲気下にて行うことによりワーク
の配置位置によるワーク各部の温度分布に差がほとんど
発生せず、均一化した温度分布が得られる。更に、熟成
即ちアニール工程において室内加熱手段により室内温度
を降下しないように維持することによりワーク全体にほ
ぼ均一なアニール処理が施されるので、この装置によっ
て処理されるワーク全体にわたり物理化学的に均質化し
た品質が得られる。このため歩留まりが極めてよい。更
に、本発明装置によれば、所定の熱処理時間がこれまで
の場合に比較して1〜2時間短縮出来、作業時間及び消
費エネルギの減少が図れる。
According to the present invention, the temperature of the work rises very quickly, and the temperature distribution of each part of the work according to the arrangement position of the work hardly differs due to the heating of the work in a high-pressure atmosphere. A distribution is obtained. Further, in the aging or annealing step, the room temperature is maintained so as not to drop by the room heating means, so that a substantially uniform annealing process is performed on the whole work, so that the whole work processed by this apparatus is physicochemically homogeneous. Quality can be obtained. Therefore, the yield is extremely good. Further, according to the apparatus of the present invention, the predetermined heat treatment time can be shortened by 1 to 2 hours as compared with the conventional case, and the working time and energy consumption can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の装置を示す図であり、図1Aは当該装
置の正面図、図1Bはワークを装置へ移送するための架
台を示す側面図、図1Cは当該装置の側面図である。
FIG. 1 is a view showing an apparatus of the present invention, FIG. 1A is a front view of the apparatus, FIG. 1B is a side view showing a gantry for transferring a work to the apparatus, and FIG. 1C is a side view of the apparatus. .

【図2】ワーク処理室内の圧力と、ワーク処理室内のワ
ーク各部の温度状態と、を時間との関連にて示したグラ
フであり、図2Aは本件装置における場合を示すグラフ
で、図2Bは公知の装置における場合を示すグラフであ
る。
FIG. 2 is a graph showing a pressure in a work processing chamber and a temperature state of each part of a work in the work processing chamber in relation to time, FIG. 2A is a graph showing a case in the present apparatus, and FIG. 2B is a graph. It is a graph which shows the case in a known device.

【図3】公知の同種の装置を示す図であり、図1Aは公
知装置の正面図、図1Bは公知装置の側面図である。
FIG. 3 is a view showing a known device of the same kind, FIG. 1A is a front view of the known device, and FIG. 1B is a side view of the known device.

【符号の説明】[Explanation of symbols]

18:真空加熱処理装置 20:装置本体 22:架台 23:ワーク支
持台 24:ワーク 25:遮蔽扉 26:室 28、30、3
1:加熱手段 34:ファン及び駆動源 35:ガス排気
弁 36:加圧ガス導入弁 44:加熱手段 46:真空ポンプ
18: vacuum heat treatment apparatus 20: apparatus main body 22: gantry 23: work support base 24: work 25: shielding door 26: chamber 28, 30, 3
1: Heating means 34: Fan and drive source 35: Gas exhaust valve 36: Pressurized gas introduction valve 44: Heating means 46: Vacuum pump

フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 F27B 5/05 8926−4K 5/16 8926−4K 5/18 8926−4K F27D 7/06 C 8926−4K Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI Technical display location F27B 5/05 8926-4K 5/16 8926-4K 5/18 8926-4K F27D 7/06 C 8926-4K

Claims (10)

【特許請求の範囲】[Claims] 【請求項1】 所定の室26内において高精密物品24
を真空加熱処理する真空加熱処理方法において、 室26内へ被処理物品を配置すること、 該室26の周囲に設けた加熱手段を作動させると同時に
当該室内の内部圧力を上昇すること、 室内温度が所定の温度に達した後、当該室内温度を一定
温度に保持すると共に当該室内圧力を高圧雰囲気に維持
しながら物品を定圧定温状態に保持し所望の加熱処理を
行うこと、 所定時間が経過後、室内温度を一定に保持しながら室内
圧力を大気圧以下まで減圧し脱気処理を行うこと、 室内の圧力を再び大気圧以上まで上昇しかつ室内温度を
徐々に降下しながら被処理物品に熟成処理を行うこと、 室内を更に上昇した圧力状態に維持しながら加熱手段を
不作動とし被処理物品を急冷すること、 室内の圧力を大気圧まで減圧すること、 室26から真空加熱処理済みの被処理物品を取り出すこ
と、 の各工程によって高精密物品24を真空加熱処理する真
空加熱処理方法。
1. A high-precision article 24 in a predetermined chamber 26
In a vacuum heat treatment method for subjecting a chamber to a vacuum heat treatment, arranging an article to be treated in a chamber 26, operating a heating means provided around the chamber 26, and simultaneously increasing an internal pressure in the chamber, After the temperature reaches a predetermined temperature, the room temperature is maintained at a constant temperature and the article is kept at a constant pressure and a constant temperature while the room pressure is maintained in a high pressure atmosphere, and a desired heat treatment is performed. Depressurize the room pressure to below atmospheric pressure while keeping the room temperature constant, and increase the room pressure to above atmospheric pressure and gradually lower the room temperature to age the article to be processed. Performing treatment, quenching the article to be treated by disabling the heating means while maintaining the chamber in a further elevated pressure state, reducing the pressure in the chamber to atmospheric pressure, and vacuum heating from the chamber 26 Retrieving the physical already an article to be treated, the vacuum heat treatment method of high precision article 24 to a vacuum heat treatment by the steps of.
【請求項2】 所定の室26内において高精密物品24
を真空加熱処理する真空加熱処理方法において、 室26内へ被処理物品を配置すること、 該室26の外周及び内周に配置した加熱手段を作動させ
ること、 加熱手段の作動と同時に当該室内の圧力を少なくとも2
気圧以上の圧力まで上昇すること、 室内温度が所定の温度に達した後、主に室の外周加熱手
段によって当該室内温度を一定温度に保持すると共に当
該室内圧力を約2気圧程度に維持しながら物品を加熱保
持すること、 所定時間が経過後、室内圧力を約1トールまで減圧する
こと、 室の内周加熱手段によって室内温度を当該所定温度に保
持すること、 室内の圧力を再び少なくとも2気圧以上の圧力まで上昇
しかつ室の内周加熱手段を不作動とすることにより室内
温度を徐々に降下しながら被処理物品を熟成処理するこ
と、 室内圧力を更に上昇した圧力状態に維持しながら加熱手
段を不作動としかつ加圧ガス導入弁36とガス排気弁3
5とを開放することにより被処理物品を急冷すること、 室内の圧力を大気圧まで減圧すること、 室26から真空加熱処理済みの被処理物品を取り出すこ
と、 の各工程によって高精密物品24を真空加熱処理する真
空加熱処理方法。
2. A high precision article 24 in a predetermined chamber 26.
In a vacuum heat treatment method of subjecting a chamber to a vacuum heat treatment, arranging an article to be treated in a chamber 26, activating heating means arranged on the outer and inner circumferences of the chamber 26, Pressure at least 2
After the room temperature reaches a predetermined temperature, the room temperature is maintained at a constant temperature mainly by the outer periphery heating means of the room, and the room pressure is maintained at about 2 atm. Heating and holding the article, reducing the indoor pressure to about 1 Torr after a predetermined time has elapsed, maintaining the indoor temperature at the predetermined temperature by means of the inner circumference of the chamber, and reducing the indoor pressure to at least 2 atm. Aging treatment of articles to be processed while gradually lowering the room temperature by raising the pressure to the above pressure and disabling the inner circumference heating means, heating while maintaining the room pressure at a further increased pressure state Disabling means and pressurized gas introduction valve 36 and gas exhaust valve 3
5, the object to be treated is rapidly cooled by opening the step 5; the pressure in the room is reduced to the atmospheric pressure; and the object to be treated after vacuum heating is taken out of the chamber 26. A vacuum heat treatment method for performing vacuum heat treatment.
【請求項3】 熱処理が蒸着又は焼成処理であることを
特徴とする請求項1又は2の真空加熱処理方法。
3. The vacuum heat treatment method according to claim 1 or 2, wherein the heat treatment is vapor deposition or baking treatment.
【請求項4】 所定の室26内において高精密物品24
を真空加熱処理する真空加熱処理装置において、 高精密物品24を収容する室26と、 該室26の外部に設けた加熱手段28と、 該室26の内部に設けた少なくとも1つの付加的加熱手
段(30、31、44)と、 該室26を加圧状態に調整することが出来る加圧ガス導
入弁36と、 該室26を減圧状態に調整することが出来るガス排気弁
35と、 該室26を真空状態に調整することが出来るポンプ手段
46と、 該加熱手段28、及び、30及び/又は31及び/又は
44と加圧ガス導入弁36とガス排気弁35とポンプ手
段46とを独立して制御することが出来る制御手段と、 を備えていることを特徴とする室26内において高精密
物品24を真空加熱処理する真空加熱処理装置。
4. A high precision article 24 in a predetermined chamber 26.
In a vacuum heat treatment apparatus for performing vacuum heat treatment on a chamber, a chamber 26 accommodating a high-precision article 24, a heating means 28 provided outside the chamber 26, and at least one additional heating means provided inside the chamber 26. (30, 31, 44), a pressurized gas introduction valve 36 that can adjust the chamber 26 to a pressurized state, a gas exhaust valve 35 that can adjust the chamber 26 to a depressurized state, and the chamber The pump means 46 capable of adjusting 26 to a vacuum state, the heating means 28, and 30 and / or 31 and / or 44, the pressurized gas introduction valve 36, the gas exhaust valve 35, and the pump means 46 are independent. A vacuum heat treatment apparatus for heat-treating the high-precision article 24 in a chamber 26 by vacuum heat treatment, which comprises:
【請求項5】 高精密物品24を載置する架台22が設
けてあり、該架台22が当該真空加熱処理装置20の室
26内に出し入れ自在に移動可能となっていることを特
徴とする請求項4の真空加熱処理装置。
5. A gantry 22 on which a high-precision article 24 is placed is provided, and the gantry 22 is movable in and out of a chamber 26 of the vacuum heat treatment apparatus 20. Item 4. The vacuum heat treatment apparatus according to item 4.
【請求項6】 架台22に加熱手段44が取り付けてあ
ることを特徴とする請求項5の真空加熱処理装置。
6. The vacuum heat treatment apparatus according to claim 5, wherein a heating means 44 is attached to the gantry 22.
【請求項7】 加熱手段がコイルヒータであることを特
徴とする請求項1〜6の真空加熱処理装置。
7. The vacuum heat treatment apparatus according to claim 1, wherein the heating means is a coil heater.
【請求項8】 加熱手段がパネルヒータであることを特
徴とする請求項1〜6の真空加熱処理装置。
8. The vacuum heat treatment apparatus according to claim 1, wherein the heating means is a panel heater.
【請求項9】 被処理高精密物品24が液晶デイスプレ
イ素子であることを特徴とする請求項1〜8の真空加熱
処理装置。
9. The vacuum heat treatment apparatus according to claim 1, wherein the high-precision article to be treated 24 is a liquid crystal display element.
【請求項10】 熱処理が蒸着又は焼成処理であること
を特徴とする請求項4〜9の真空加熱処理装置。
10. The vacuum heat treatment apparatus according to claim 4, wherein the heat treatment is vapor deposition or baking treatment.
JP6143154A 1994-06-24 1994-06-24 Vacuum heat treatment method Expired - Fee Related JP2622356B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6143154A JP2622356B2 (en) 1994-06-24 1994-06-24 Vacuum heat treatment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6143154A JP2622356B2 (en) 1994-06-24 1994-06-24 Vacuum heat treatment method

Publications (2)

Publication Number Publication Date
JPH08977A true JPH08977A (en) 1996-01-09
JP2622356B2 JP2622356B2 (en) 1997-06-18

Family

ID=15332183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6143154A Expired - Fee Related JP2622356B2 (en) 1994-06-24 1994-06-24 Vacuum heat treatment method

Country Status (1)

Country Link
JP (1) JP2622356B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6772537B2 (en) 2002-02-01 2004-08-10 Koy Engineering Corporation Pressure-heat drying method and an apparatus therefor
JP2006075690A (en) * 2004-09-08 2006-03-23 Kyoshin Engineering:Kk Method and apparatus for protecting reaction container of high pressure annealing apparatus
WO2010047246A1 (en) 2008-10-24 2010-04-29 三菱重工業株式会社 Variable capacity turbine
JP2011021846A (en) * 2009-07-17 2011-02-03 Kyoshin Engineering:Kk Pressurizing and cooling treatment method of high precision component

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0672771A (en) * 1992-07-07 1994-03-15 Nikku Ind Co Ltd Carbonizing method for pitch containing refractory

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0672771A (en) * 1992-07-07 1994-03-15 Nikku Ind Co Ltd Carbonizing method for pitch containing refractory

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6772537B2 (en) 2002-02-01 2004-08-10 Koy Engineering Corporation Pressure-heat drying method and an apparatus therefor
JP2006075690A (en) * 2004-09-08 2006-03-23 Kyoshin Engineering:Kk Method and apparatus for protecting reaction container of high pressure annealing apparatus
JP4593210B2 (en) * 2004-09-08 2010-12-08 株式会社協真エンジニアリング Method and apparatus for protecting reaction vessel of high pressure annealing apparatus
WO2010047246A1 (en) 2008-10-24 2010-04-29 三菱重工業株式会社 Variable capacity turbine
JP2011021846A (en) * 2009-07-17 2011-02-03 Kyoshin Engineering:Kk Pressurizing and cooling treatment method of high precision component

Also Published As

Publication number Publication date
JP2622356B2 (en) 1997-06-18

Similar Documents

Publication Publication Date Title
JP3380988B2 (en) Heat treatment equipment
CN200985338Y (en) Multifunctional heat treating vacuum furnace
JPH0711400A (en) Method and equipment of heat treatment
CN108028213A (en) Pre-heating mean for Millisecond annealing system
CN102007588B (en) Method for reducing temperature of substrate placing table and substrate processing system
JP4929657B2 (en) Carburizing treatment apparatus and method
JP2006518445A (en) Method and system for uniform heat treatment of materials
JP2006266615A (en) Heat treatment furnace
JP2622356B2 (en) Vacuum heat treatment method
JPH0533059A (en) Device for restrict-quenching outer diameter of thin ring
KR100608214B1 (en) Heat treatment method of semiconductor wafer
JP2000129341A (en) Low strain quenching method
JPH0826760A (en) Method for bending and tempering of sheet glass
JP3274089B2 (en) Hybrid type heat treatment equipment
US5882371A (en) Method for heat-treating a glass substrate
US4009872A (en) Energy-conserving, fast-cooling heat treating furnace
JPH1081913A (en) Isothermal quenching apparatus by gas cooling
US4832887A (en) Process for firing green moldings of ceramic pastes
JP2002105532A (en) Heat treatment apparatus for deformed work
JP3948038B2 (en) Furnace core tube type heat treatment furnace
JP7256034B2 (en) Heat treatment apparatus and heat treatment method
JPH098049A (en) Board heating device
JP3609156B2 (en) Substrate heating device
KR100530310B1 (en) Heat treatment system
KR200159498Y1 (en) Wafer pin driving apparatus

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090404

Year of fee payment: 12

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090404

Year of fee payment: 12

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100404

Year of fee payment: 13

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100404

Year of fee payment: 13

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110404

Year of fee payment: 14

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120404

Year of fee payment: 15

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130404

Year of fee payment: 16

FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140404

Year of fee payment: 17

LAPS Cancellation because of no payment of annual fees