JPH0892792A - Lead wire for electroplating - Google Patents
Lead wire for electroplatingInfo
- Publication number
- JPH0892792A JPH0892792A JP22704994A JP22704994A JPH0892792A JP H0892792 A JPH0892792 A JP H0892792A JP 22704994 A JP22704994 A JP 22704994A JP 22704994 A JP22704994 A JP 22704994A JP H0892792 A JPH0892792 A JP H0892792A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- electrode
- collar
- ring
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、小型の被処理物をバレ
ルなどに入れ電気めっきする際に用いるリード線に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire used when a small object to be processed is placed in a barrel or the like and electroplated.
【0002】[0002]
【従来の技術】小型の被処理物を多数一度に電気めっき
するときは、これらの被処理物を、バレルに入れ、バレ
ルを電解めっき液に浸漬し、陽極をめっき液中に、また
陰極を被処理物に接触させた状態で通電する。バレルは
正多角柱、たとえば正六角柱で側板は多孔板で構成さ
れ、この孔からめっき液が内部に入る。バレルは回転さ
れることによって、内部の被処理物は撹拌され、常に新
しいめっき液と接触する。陰極は被処理物によって完全
に覆われることが理想的であるが、実際にはその一部が
被処理物と接触するだけである。このため陰極の被処理
物と接触しない面上、一般に被処理物は撹拌しているの
で、電極の全面にめっき金属が析出する。2. Description of the Related Art When electroplating a large number of small objects to be processed at one time, these objects are placed in a barrel, the barrel is immersed in an electrolytic plating solution, and the anode is placed in the plating solution and the cathode is placed in the plating solution. Energize while in contact with the object to be processed. The barrel is a regular polygonal column, for example, a regular hexagonal column, and the side plate is a porous plate, and the plating solution enters the inside through this hole. By rotating the barrel, the object to be treated is agitated and constantly comes into contact with a new plating solution. Ideally, the cathode is completely covered by the object to be treated, but in reality, only a part of it contacts the object to be treated. For this reason, since the object to be processed is generally stirred on the surface of the cathode that does not come into contact with the object to be processed, the plating metal is deposited on the entire surface of the electrode.
【0003】図2は、従来から一般に広く用いられてい
る電解めっき用リード線11である。リード線16と電
極12とは、半田付け、ねじ接合などで接合され、リー
ド線16は絶縁被覆18されている。この電気めっき用
リード線11を用いて電気めっきを行うと、電極12上
に仮想線で示すようにめっき金属が析出する。めっき金
属は電極12上だけでなく、絶縁被覆17上にも析出す
る。電極12上に析出しためっき金属の量が或る程度以
上になると、被処理物と電極との接触が悪くなるので、
電極を取替えねばならないが、電極だけが簡単に取外せ
ないので、電気めっき用リード線11全体を交換する必
要がある。FIG. 2 shows a lead wire 11 for electrolytic plating which has been widely used in the past. The lead wire 16 and the electrode 12 are joined by soldering, screw joining or the like, and the lead wire 16 is covered with an insulating coating 18. When electroplating is performed using this electroplating lead wire 11, a plating metal is deposited on the electrode 12 as indicated by a virtual line. The plating metal is deposited not only on the electrode 12 but also on the insulating coating 17. If the amount of the plated metal deposited on the electrode 12 exceeds a certain level, the contact between the object to be processed and the electrode deteriorates.
Although the electrodes must be replaced, only the electrodes cannot be easily removed, so the entire electroplating lead wire 11 must be replaced.
【0004】[0004]
【発明が解決しようとする課題】本発明の目的は、電極
上にめっき金属が析出したとき、電極部のみを簡単に交
換できる電気めっき用リード線を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a lead wire for electroplating in which only the electrode portion can be easily replaced when the plating metal is deposited on the electrode.
【0005】[0005]
【課題を解決するための手段】本発明は、外ねじを刻し
た電極接続部を軸線方向に有する電極と、内ねじを刻し
た電気絶縁性合成樹脂製カラーと、内ねじを刻したリー
ド線接続部を有し、電気絶縁性合成樹脂で被覆されたリ
ード線と、Oリングとから成り、電極接続部にカラーを
螺合させ、Oリングを挿んでリード線接続部を螺合させ
たことを特徴とする電気めっき用リード線である。SUMMARY OF THE INVENTION According to the present invention, an electrode having an electrode connecting portion with an external thread in the axial direction, an electrically insulating synthetic resin collar with an internal thread, and a lead wire with an internal thread are provided. A lead wire having a connecting portion and covered with an electrically insulating synthetic resin; and an O-ring; a collar is screwed onto the electrode connecting portion; and the O-ring is inserted to screw the lead wire connecting portion. Is a lead wire for electroplating.
【0006】[0006]
【作用】本発明に従えば、電極とリード線とはねじ接合
され、リード線と電極との間には、電気絶縁性合成樹脂
でできたカラーがあり、さらにカラーとリード線の間に
はOリングが挿入されている。したがってリード線と電
極との接続部には電気めっき液が浸入することがない。
電極上にめっき金属が析出する場合、電極上とカラー上
にしか析出せず、リード線の被覆上には析出しない。According to the present invention, the electrode and the lead wire are screwed together, the lead wire and the electrode have a collar made of an electrically insulating synthetic resin, and the collar and the lead wire further have a collar. The O-ring is inserted. Therefore, the electroplating solution does not enter the connection between the lead wire and the electrode.
When the plating metal is deposited on the electrode, it is deposited only on the electrode and the collar, not on the lead wire coating.
【0007】[0007]
【実施例】以下、実施例でもって本発明をより具体的に
説明する。The present invention will be described in more detail below with reference to examples.
【0008】図1は、本発明の一実施例の電気めっき用
リード線1の断面図である。電極2とリード線6との間
には、電気絶縁性合成樹脂、たとえばPVC製の中空円
筒状のカラー3が設けられている。電極2には、軸線方
向に延びる電極接続部4が設けられ、外ねじが設けられ
ている。また前記カラー3には内ねじが設けられ、接続
部4の外ねじと螺合している。電極接続部4は、カラー
3の先へさらに延び、ここにOリング5を介して、リー
ド線接続部7に設けられた内ねじと螺合する。電極接続
部4をリード線接続部7に充分に締込むことによって、
Oリング5の作用で前記両接続部4,7は気密に螺合さ
れる。この電気めっき用リード線1を用いて小型の被処
理物を電気めっきすると、めっき金属は電極2とカラー
3の上にだけ仮想線10で示すように析出する。この状
態で電極2とカラー3とをねじで外し、新しい電極2と
カラー3とに取替える。なお、Oリング5も変形、変質
している場合が多いので、交換する。FIG. 1 is a sectional view of a lead wire 1 for electroplating according to an embodiment of the present invention. Between the electrode 2 and the lead wire 6, a hollow cylindrical collar 3 made of electrically insulating synthetic resin such as PVC is provided. The electrode 2 is provided with an electrode connecting portion 4 extending in the axial direction and is provided with an external screw. Further, the collar 3 is provided with an internal thread, and is screwed with an external thread of the connecting portion 4. The electrode connecting portion 4 further extends to the tip of the collar 3 and is screwed with an internal screw provided on the lead wire connecting portion 7 via an O-ring 5 there. By sufficiently tightening the electrode connecting portion 4 into the lead wire connecting portion 7,
Due to the action of the O-ring 5, both the connecting portions 4 and 7 are screwed airtightly. When a small object is electroplated using this electroplating lead wire 1, the plating metal is deposited only on the electrode 2 and the collar 3 as shown by a virtual line 10. In this state, the electrode 2 and the collar 3 are unscrewed and replaced with a new electrode 2 and the collar 3. Since the O-ring 5 is also often deformed or altered, it is replaced.
【0009】径10mm、長さ25mmの従来から用い
られているものと略同じ大きさの電極2を用いた場合
は、適切なカラー3の長さは、めっき金属の種類によっ
て異なるが、最もめっき金属が析出しやすいニッケルの
場合、約20mmである。めっき金属がニッケルの場
合、従来の電気めっき用リード線11を用いれば数時間
で、電極すなわち電気めっき用リード線11全体を取替
える必要があるが、本発明の電気めっき用リード線1を
用いれば、1日に数回の電極2とカラー3とOリング5
とを取替えるだけで、長期にわたってリード線部を取替
えずに使用できる。When the electrode 2 having a diameter of 10 mm and a length of 25 mm and having a size substantially the same as that used conventionally is used, the appropriate length of the collar 3 varies depending on the type of plating metal, but is most plated. In the case of nickel where metal is likely to be deposited, it is about 20 mm. When the plating metal is nickel, it is necessary to replace the electrode, that is, the entire electroplating lead wire 11 within several hours if the conventional electroplating lead wire 11 is used. However, if the electroplating lead wire 1 of the present invention is used, Electrode 2 and collar 3 and O-ring 5 several times a day
You can use it for a long time without replacing the lead wire by simply replacing.
【0010】[0010]
【発明の効果】以上のように本発明によれば、電極とリ
ード線との間にカラーとOリングとを設けたので、めっ
き金属は電極上とカラーとにだけ析出する。したがって
電極とカラーとOリングとを交換するだけでリード線部
を取替えずに長期にわたって使用できる。As described above, according to the present invention, since the collar and the O-ring are provided between the electrode and the lead wire, the plated metal is deposited only on the electrode and on the collar. Therefore, it can be used for a long period of time without replacing the lead wire portion only by exchanging the electrode, the collar and the O-ring.
【図1】本発明の一実施例の電気めっき用リード線1の
断面図である。FIG. 1 is a sectional view of a lead wire 1 for electroplating according to an embodiment of the present invention.
【図2】従来用いられている電気めっき用リード線11
の断面図である。FIG. 2 Conventionally used lead wire 11 for electroplating
FIG.
1 電気めっき用リード線 2 電極 3 カラー 4 電極接続部 5 Oリング 6 リード線 7 リード線接続部 8 リード線の被覆 1 Electroplating lead wire 2 Electrode 3 Color 4 Electrode connection part 5 O-ring 6 Lead wire 7 Lead wire connection part 8 Covering of lead wire
Claims (1)
有する電極と、 内ねじを刻した電気絶縁性合成樹脂製カラーと、 内ねじを刻したリード線接続部を有し、電気絶縁性合成
樹脂で被覆されたリード線と、 Oリングとから成り、 電極接続部にカラーを螺合させ、Oリングを挿んでリー
ド線接続部を螺合させたことを特徴とする電気めっき用
リード線。1. An electrode having an electrode connecting part with an external thread in the axial direction, an electrically insulating synthetic resin collar with an internal thread, and a lead wire connecting part with an internal thread, and electrically insulating. A lead for electroplating, comprising a lead wire coated with a synthetic resin and an O-ring. The collar is screwed onto the electrode connecting portion, and the O-ring is inserted to screw the lead wire connecting portion. line.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22704994A JPH0892792A (en) | 1994-09-21 | 1994-09-21 | Lead wire for electroplating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22704994A JPH0892792A (en) | 1994-09-21 | 1994-09-21 | Lead wire for electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0892792A true JPH0892792A (en) | 1996-04-09 |
Family
ID=16854733
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22704994A Pending JPH0892792A (en) | 1994-09-21 | 1994-09-21 | Lead wire for electroplating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0892792A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200427364Y1 (en) * | 2006-06-30 | 2006-09-25 | 한국 고덴시 주식회사 | Barrel plating apparatus |
KR100924026B1 (en) * | 2002-12-31 | 2009-10-27 | 하이디스 테크놀로지 주식회사 | Combination structure of lamp and wire |
JP2010007114A (en) * | 2008-06-25 | 2010-01-14 | Suzuki Motor Corp | Electrode mounting structure of surface treatment apparatus |
JP2011106022A (en) * | 2009-11-13 | 2011-06-02 | Samsung Electro-Mechanics Co Ltd | Barrel plating apparatus |
WO2011149144A1 (en) * | 2010-05-24 | 2011-12-01 | 주식회사 광성금속 | Dangler assembly for use in a plating barrel |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681700A (en) * | 1979-12-03 | 1981-07-03 | Kanou Seisakusho:Kk | Electrode for barrel plating |
JPS5886031A (en) * | 1981-11-16 | 1983-05-23 | 上田 義彦 | Cleaner of sludge and sand layer of pond |
JPS61193093A (en) * | 1985-02-21 | 1986-08-27 | 三菱重工業株式会社 | Nuclear reactor |
-
1994
- 1994-09-21 JP JP22704994A patent/JPH0892792A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5681700A (en) * | 1979-12-03 | 1981-07-03 | Kanou Seisakusho:Kk | Electrode for barrel plating |
JPS5886031A (en) * | 1981-11-16 | 1983-05-23 | 上田 義彦 | Cleaner of sludge and sand layer of pond |
JPS61193093A (en) * | 1985-02-21 | 1986-08-27 | 三菱重工業株式会社 | Nuclear reactor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100924026B1 (en) * | 2002-12-31 | 2009-10-27 | 하이디스 테크놀로지 주식회사 | Combination structure of lamp and wire |
KR200427364Y1 (en) * | 2006-06-30 | 2006-09-25 | 한국 고덴시 주식회사 | Barrel plating apparatus |
JP2010007114A (en) * | 2008-06-25 | 2010-01-14 | Suzuki Motor Corp | Electrode mounting structure of surface treatment apparatus |
JP2011106022A (en) * | 2009-11-13 | 2011-06-02 | Samsung Electro-Mechanics Co Ltd | Barrel plating apparatus |
WO2011149144A1 (en) * | 2010-05-24 | 2011-12-01 | 주식회사 광성금속 | Dangler assembly for use in a plating barrel |
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