JPH0892470A - Resin composition for container for transporting semiconductor element - Google Patents

Abstract

PURPOSE: To provide a container which, unlike conventional resin containers, withstands 150 deg.C long-term baking for volatile impurity removal from IC's, and which is reduced in the warpage caused by rapid cooling after the baking and is satisfactory in impact strength and antistatic properties. CONSTITUTION: This resin composition for use as a container for transporting semiconductor elements comprises 20-45wt.% thermoplastic polyester, 5-15wt.% propylene resin, 5-15wt.% propylene elastomer, 10-45wt.% mica, and 5-30wt.% conductive carbon black.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a resin composition for a semiconductor device carrying container. More specifically, the present invention relates to a resin composition for a tray or a transport container used in an IC manufacturing process such as an IC tray, a chip tray, a wafer carrier or a transportation operation process.

[0002]

2. Description of the Related Art In the manufacturing process of an IC, a small amount of water or Na contained in an IC assembly is heated by heating in an oven.
There is a baking process for degassing volatile impurities such as ions, Br ions, Cl ions. IC assembled
The baking step is one of the very important steps, because if moisture or gas components remain inside, it will cause a fatal defect in the accuracy of the IC. In this baking process, ICs are placed one by one in a dedicated container called a tray, and then the trays are stacked in multiple layers and placed in a baking chamber, and heated to volatilize and remove water and impurities. The temperature of the baking chamber is required to be 110 ° C. or higher, and recently, in order to improve the reliability accuracy of the IC, baking at an even higher temperature of 130 to 150 ° C. is required.

As described above, since trays or containers are stacked and baked in multiple layers, it is required that the trays or containers have a small amount of warp deformation during baking, and the impact resistance strength required during operation is required. Furthermore, since the IC is destroyed when charged with static electricity, a surface electrical resistance of 10 ⁴ to 10 ³ Ω is required.

Conventionally, polystyrene or the like, which is less warped at a baking temperature of 110 ° C. or lower, is mixed with various conductive fillers in a propylene resin or the like at around 130 ° C., or the surface is coated with a conductive coating. Has been used. When the baking temperature reaches about 150 ° C., application of various engineering plastics and thermosetting resins such as phenolic resins is being studied.

JP-A-4-83360 discloses polyethylene terephthalate as an engineering plastic, mica as an inorganic filler and carbon black as a conductive filler, and JP-A-1-13836.
Japanese Patent Publication No. 6 discloses a technique in which a thermoplastic resin, an inorganic filler, a conductive filler and a thermoplastic elastomer are mixed. However, even with these techniques, the baking temperature is high, the time is long,
If it is rapidly cooled after baking, the warpage becomes large, and the impact strength decreases, which is not sufficient.

[0006]

DISCLOSURE OF THE INVENTION The present invention solves the above-mentioned problems and improves the conventional resin as described above so that it can be baked at a higher temperature for a longer period of time, and is resistant to quenching after baking. Even so, it is an object of the present invention to provide a resin composition for a semiconductor device carrying container, which has less warpage of a molded product and less decrease in impact strength.

[0007]

As a result of intensive studies, the inventors of the present invention have combined thermoplastic polyester, mica and conductive carbon black with a propylene resin and a propylene elastomer in a specific compounding ratio. As a result, they have found that the above problems can be solved, and have reached the present invention. That is, the present invention provides the following components (A) to
A resin composition for a semiconductor element carrying container, characterized by containing (E) in the following mixing ratio. (A) Thermoplastic polyester 20-45% by weight (B) Propylene-based resin 5-15% by weight (C) Propylene-based elastomer 5-15% by weight (D) Mica 10-45% by weight (E) Conductive carbon black 5 -30% by weight Hereinafter, the present invention will be described in detail.

<Constituent Components> (A) Thermoplastic Polyester The thermoplastic polyester (A) used in the present invention is, for example, a dicarboxylic acid or a lower alkyl ester thereof, an acid halide or an acid anhydride derivative thereof, and a glycol according to a usual method. Alternatively, a thermoplastic polyester produced by condensing a dihydric phenol may be used.

Specific examples of the aliphatic or aromatic dicarboxylic acid suitable for producing the thermoplastic polyester (A) include oxalic acid, malonic acid, succinic acid, glutaric acid,
Adipic acid, suberic acid, azelaic acid, sebacic acid,
Terephthalic acid, isophthalic acid, p, p'-dicarboxydiphenyl sulfone, p-carboxyphenoxyacetic acid,
p-carboxyphenoxypropionic acid, p-carboxyphenoxybutyric acid, p-carboxyphenoxyvaleric acid,
Examples thereof include 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid and the like, or a mixture of these carboxylic acids.

As the aliphatic glycol suitable for producing the thermoplastic polyester (A), a straight chain alkylene glycol having 2 to 12 carbon atoms such as ethylene glycol,
Examples are 1,3-propylene glycol, 1,4-butanediol, 1,6-hexanediol, and 1,12-dodecanediol. Examples of aromatic glycol compounds include p-xylylene glycol, and examples of dihydric phenols include pyrocatechol, resorcinol, hydroquinone, and alkyl-substituted derivatives of these compounds. Other suitable glycols include
1,4-cyclohexanedimethanol is also included.

Other preferred thermoplastic polyesters (A)
Examples of the polyester include polyesters obtained by ring-opening polymerization of lactone. For example, polypivalolactone, poly (ε-caprolactone) and the like.

[0012] Still another preferable thermoplastic polyester (A) is polyester as a polymer (TLCP) which forms a liquid crystal in a molten state. Typical examples of polyesters that fall into these categories are X7G manufactured by Eastman Kodak Co., Xydar manufactured by Dartco Co., Econor manufactured by Sumitomo Chemical Co., Ltd., and Vectra manufactured by Celanese Co., Ltd.

The above-mentioned thermoplastic polyester (A)
Among them, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), poly (1,4-cyclohexanedimethylene terephthalate) (PCT), liquid crystalline polyester and the like are preferable, and polyethylene terephthalate or polybutylene Terephthalate is particularly preferred.

The thermoplastic polyester (A) used in the present invention has an intrinsic viscosity of 0.4 to 40 measured at 35 ° C. in a phenol / tetrachloroethane (equal volume mixture) mixed solvent.
1.5 dl / g is preferable, more preferably 0.5 to 1.2
dl / g, more preferably 0.6 to 1.0 dl / g. When the intrinsic viscosity is less than 0.4 dl / g, impact resistance is insufficient, which is preferable, and when it exceeds 1.5 dl / g, moldability is difficult.

The blending amount of the thermoplastic polyester (A) is 20 to 45% by weight, preferably 25 to 45% by weight in the resin composition.
It is 43% by weight, more preferably 30 to 40% by weight.
If it is less than 20% by weight, the heat resistance of the composition is insufficient, and
If it exceeds the weight%, warp deformation occurs. These thermoplastic polyesters (A) can be easily produced by a usual production method, for example, a melt polycondensation reaction or a solid phase polymerization method.

(B) Propylene-based Resin The propylene-based resin (B) used in the present invention is a homopolymer of propylene, a copolymer of propylene and another α-olefin (a plurality of kinds may be used), or a main component thereof. As a component, if necessary, other unsaturated monomer (multiple types may be used)
Is a copolymer containing as a subcomponent. Here, the copolymer is
It may be any copolymer such as block, random or graft or a composite thereof.

Examples of the above-mentioned other α-olefins include ethylene, propylene, butene-1, pentene-1,
Hexene-1, heptene-1, octene-1, etc.,
From the viewpoint of easy availability, those having 2 to 8 carbon atoms are preferable. Examples of the other unsaturated monomer include unsaturated fatty acids such as (meth) acrylic acid, (meth) acrylic acid ester, and maleic acid, their esters, or their acid anhydrides. The tensile elastic modulus of the propylene resin (B) used in the present invention is 1 × 10 ⁸ dyne / cm ² or more, the melt flow rate (hereinafter referred to as “MFR”) is 0.1 to 100 g / 10 minutes, and other α The content of olefins or other unsaturated monomers is 0-20 mol%. The density is preferably 0.9 g / cm ³ or more. These propylene-based resins (B) are generally produced using a stereoregular catalyst.

The blending amount of the propylene resin (B) is 5 to 15% by weight, preferably 7 to 14% by weight, more preferably 8 to 13% by weight in the resin composition. Compounding amount is 5
If less than 10% by weight, the impact strength is unsatisfactory, and 15% by weight
If it exceeds the limit, the heat resistance is insufficient.

(C) Propylene-based Elastomer The propylene-based elastomer (C) used in the present invention is produced using a vanadium-based catalyst composed of a vanadium compound and an organic aluminum compound, and has a propylene content of 30.
Propylene copolymer elastomer - 60 wt%, preferably 40 to 55 wt%, a tensile modulus of less than 1 × 10 ⁸ dyne / cm ² ethylene. If necessary, the above elastomer may be further copolymerized with another monomer, particularly a non-conjugated diene.

Examples of the non-conjugated diene include dicyclopentadiene, 1,4-hexadiene, cyclooctadiene, methylnorbornene and 5-ethylidene-2-norbornene. The amount of the propylene elastomer (C) compounded in the resin composition is 5 to 15% by weight, preferably 7 to 14% by weight, more preferably 8 to 1%.
It is 3% by weight. If the content is less than 5% by weight, the impact strength is unsatisfactory, and if it exceeds 15% by weight, the heat resistance is insufficient.

(D) Mica Mica used in the present invention is muscovite mica,
Examples include Szolite mica (trademark of Marletta). The particle size of mica (D) is preferably large in order to reduce the warp deformation of the molded product, but if it is too large, the impact strength decreases, so an average particle size of 500 to 10 mesh is preferable. Further, considering the kneading with polyester and the molding processing temperature, those having crystallization water or contained water are not preferable, and mica which does not release 1% or more of water at 300 ° C. or less by thermal balance (TGA) measurement is preferable.

The amount of mica (D) is 1 in the resin composition.
It is 0 to 45% by weight, preferably 15 to 40% by weight, more preferably 20 to 35% by weight. 10% by weight
If it is less than 45%, the warp deformation of the molded product is large, and if it exceeds 45% by weight, the kneading and molding process become difficult and the impact strength is significantly lowered.

(E) Conductive Carbon Black The conductive carbon black (E) used in the present invention is acetylene black or furnace black. Specifically, Mitsubishi Kasei's # 3050B, # 3600B, # 32
50B; Ketjen Black KE manufactured by Lion Akzo
C: MHS-500 manufactured by Asahi Carbon Co., Ltd .; Vulcan XC72 manufactured by Cabot Co., USA. The content of the conductive carbon black (E) in the resin composition is 5 to 30% by weight, preferably 6 to 28% by weight, more preferably 7 to 26% by weight.
Is. If it is less than 5% by weight, the surface electric resistance does not decrease to the level of dissipation of electrostatic charge. If it exceeds 30% by weight, the flowability of the molten resin is poor and it becomes difficult to obtain a molded product having a good appearance, and the impact strength is significantly lowered.

(F) Additional components In the resin composition of the present invention, a flame retardant, a flame retardant aid, a nucleating agent, a crystallization accelerator, a heat stabilizer, an antioxidant are contained in the resin composition of the present invention. , Foaming agents, lubricants, release agents, other inorganic fillers other than mica, such as calcium carbonate, clay,
Kaolin, various whiskers, milled fibers, glass flakes, glass beads, and other thermoplastic resins may be blended.

<Manufacturing and Molding of Resin Composition> The resin composition for a semiconductor element carrying container of the present invention can be manufactured using a mixer, a kneader, or the like that is generally used for thermoplastic resins. That is, each component is uniformly mixed with a V-type blender, a ribbon blender, a tumbler or the like together with an additional component, if necessary, and then melt-kneaded with an ordinary extruder such as a uniaxial or biaxial extruder, and after cooling, pellets are formed. Cut into pieces. At this time, a part of mica or other components may be added in the middle of the extruder cylinder. Also,
After a part of the components is mixed and kneaded in advance, the remaining components may be further added and kneaded and extruded.

The resin composition of the present invention can be molded by various molding methods such as injection molding, extrusion molding and compression molding. The preferred characteristics of the semiconductor device carrying container obtained as above are: surface resistivity: 10 ⁶ Ω / □ or less, warpage deformation amount: 0.5 mm or less, and Izod impact strength (with notch): 3 kg · cm / cm ² or more. Yes (the measurement method is described later).

[0027]

【Example】

Examples 1-9 and Comparative Examples 1-16 The components used are as follows. Component (A): Polyethylene terephthalate having an intrinsic viscosity of 0.7 dl / g (Bellpet PBK-1, manufactured by Kanebo) Component (B): Ethylene-propylene block copolymer (Mitsubishi Noblene BC8Q, manufactured by Mitsubishi Petrochemical Co., Ltd.) (C): Ethylene-propylene random copolymer (Nippon Synthetic Rubber Co., Ltd., EP02P) Component (D): Mica (Kuraray Co., 60C) Component (E): Acetylene Black (Mitsubishi Kasei Co., Ltd., 30)
50B) Each component was mixed according to the compounding composition shown in Table 1 with a tumbler, and then a single screw extruder with a diameter of 40 mm and L / D = 30 was used, with a cylinder temperature of 265 ° C. and a screw rotation speed of 75 rp.
The mixture was kneaded and extruded at m and pelletized.

The pellets thus obtained were dried at 130 ° C. for 5 hours, and then the temperature of the cylinder was 265 ° C. in a 150-ton injection molding machine.
An IC tray having the shape shown in FIG. 1 was formed at a mold temperature of 130 ° C. Stacked 20 molded trays, 150 ℃
After heating for 3 hours in the baking chamber, the product was immediately taken out of the room at 25 ° C. and forcibly cooled by a fan from 4 directions for 1 hour. The obtained tray was evaluated according to the following evaluation test method, and the results are shown in Table 1.

Warp Deformation Amount (mm): The trays were placed one by one on a surface plate, and the warp deformation amount was measured at 6 positions shown in FIG. 1 by using a clearance gauge. The corresponding points (20 × 6 = 120 points) of all 20 trays were measured, and the maximum value was defined as the warp deformation amount. Drop strength: Hold the tray horizontally and let it fall freely on a concrete floor from a height of 1.5 m in a room at 25 ° C.
The number of cracks when 10 sheets were carried out was recorded. Surface resistivity (Ω / □): Surface electrical resistivity was measured in a room at 25 ° C. and 50% RH using a surface resistivity meter Lorester Ap manufactured by Mitsubishi Petrochemical Co., Ltd.

[0030]

[Table 1]

[0031]

[Table 2]

Example 10 The procedure of Example 2 was repeated except that polybutylene terephthalate (Novadul 5010, manufactured by Mitsubishi Kasei) was used as the component (A). Example 2 except that the cylinder temperature was 240 ° C. and the mold temperature was 60 ° C. from the obtained pellets.
A tray was molded and evaluated in the same manner as in, and the results are shown in Table 2.

Example 11 The procedure of Example 2 was repeated except that Ketchen Black KEC (manufactured by Lion Akzo) was used as the component (E). The results are shown in Table 2.

[0034]

[Table 3]

[0035]

EFFECTS OF THE INVENTION The container of the resin composition for a semiconductor element carrying container of the present invention is capable of being baked at a high temperature of 150 ° C. for a long time, which is impossible in the prior art, because of deaeration of volatile impurities. The warp deformation due to the quenching treatment after baking is improved, and at the same time, the impact strength and electrostatic level are also good. Further, it is economically significant because it is based on a general-purpose resin such as thermoplastic polyester and propylene resin.

[Brief description of drawings]

FIG. 1 is a plan view and a side view of an IC tray used for physical property evaluation in Examples.

[Explanation of Codes] -Indicates the position where the warp deformation amount is measured.

Claims (1)

[Claims] 1. A resin composition for a semiconductor device carrying container, which comprises the following components (A) to (E) in the following compounding ratio. (A) Thermoplastic polyester 20-45% by weight (B) Propylene-based resin 5-15% by weight (C) Propylene-based elastomer 5-15% by weight (D) Mica 10-45% by weight (E) Conductive carbon black 5 ~ 30% by weight