JPH0890670A - Heat-resistant resin vessel for transporting semiconductor element - Google Patents

Abstract

PURPOSE: To obtain a vessel for transporting a semiconductor element having excellent mechanical strength without deforming at a baking temperature or lower by specifying the composition ratio of thermoplastic polyester, epoxy resin, propylene resin, mica, conductive carbon black for forming a molded form and a heat treating temperature under the load. CONSTITUTION: A resin composition molded form containing mixing ratio of 20-45wt.% thermoplastic polyester, 1-12wt.% bisphenol epoxy resin, 3-20wt.% propylene resin, 10-45wt.% mica, and 5-30wt.% conductive carbon black is heat treated at 150-220 deg.C under the load. The polyester is particularly preferably polyethylene terephthalate or polybutylene terephthalate, and the epoxy resin is preferably bisphenol A type epoxy resin. A composition for a semiconductor element transporting vessel is manufactured by using a mixer, a kneader, etc. The resin composition can be molded by various molding method such as an injection molding, an extrusion molding, a compression molding, etc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-resistant resin container for transporting semiconductor elements. More specifically, the present invention relates to a heat-resistant resin container for transporting semiconductor elements used in an IC manufacturing process such as an IC tray, a chip tray, a wafer carrier, or a transportation work process.

[0002]

2. Description of the Related Art In the manufacturing process of an IC, a small amount of water or Na contained in an IC assembly is heated by heating in an oven.
There is a baking process for degassing volatile impurities such as ions, Br ions, Cl ions. IC assembled
The baking step is one of the very important steps, because if moisture or gas components remain inside, it will cause a fatal defect in the accuracy of the IC.

In this baking process, the ICs are placed one by one in a dedicated container called a tray, and then the trays are stacked in multiple layers and placed in a baking chamber. Then, it is heated to volatilize and remove water and impurities. Baking room temperature is 11
0 ° C or higher is required and in order to improve the reliability of IC,
Recently, baking at higher and higher temperatures from 150 ° C to 180 ° C is required. Baking temperature is 150
Container materials that withstand temperatures up to ℃ have been mainly studied based on general-purpose engineering plastics such as polyester, polyamide, and polyphenylene ether. 180 ° C
Techniques based on so-called super-engineering plastics such as polyphenylene sulfide and polyether sulfone have been studied as the ones that can withstand the above baking. However, materials based on super engineering plastics are expensive and have reduced practical value.

[0004]

The present invention solves the above problems and is based on general-purpose engineering plastics such as thermoplastic polyester and propylene-based resin,
An object of the present invention is to provide a heat-resistant resin container for transporting a semiconductor element, which has a small amount of warp deformation even when the baking temperature reaches 180 ° C. and has conductivity with excellent mechanical strength.

[0005]

As a result of intensive studies, the inventors of the present invention have found that a thermoplastic resin, an epoxy resin, a mica, and a conductive carbon black are combined with a propylene resin at a specific compounding ratio. The inventors have found that the above problems can be solved by the above and have reached the present invention. That is, the present invention provides a resin composition molded body containing the following components (A) to (E) in the following compounding ratio under a load of 150:
It is a heat-resistant resin container for transporting semiconductor elements, which is heat-treated at 220 ° C. (A) Thermoplastic polyester 20 to 45% by weight (B) Bisphenol type epoxy resin 1 to 12% by weight (C) Propylene resin 3 to 20% by weight (D) Mica 10 to 45% by weight (E) Conductive carbon black 5 to 30% by weight Hereinafter, the present invention will be described in detail.

<Constituent Components> (A) Thermoplastic Polyester The thermoplastic polyester (A) used in the present invention is, for example, a dicarboxylic acid or a lower alkyl ester thereof, an acid halide or an acid anhydride derivative thereof, and a glycol according to a usual method. Alternatively, a thermoplastic polyester produced by condensing a dihydric phenol may be used.

Specific examples of the aliphatic or aromatic dicarboxylic acid suitable for producing the thermoplastic polyester (A) include oxalic acid, malonic acid, succinic acid, glutaric acid,
Adipic acid, suberic acid, azelaic acid, sebacic acid,
Terephthalic acid, isophthalic acid, p, p'-dicarboxydiphenyl sulfone, p-carboxyphenoxyacetic acid,
p-carboxyphenoxypropionic acid, p-carboxyphenoxybutyric acid, p-carboxyphenoxyvaleric acid,
Examples thereof include 2,6-naphthalene dicarboxylic acid, 2,7-naphthalene dicarboxylic acid and the like, or a mixture of these carboxylic acids.

As the aliphatic glycol suitable for producing the thermoplastic polyester (A), a straight chain alkylene glycol having 2 to 12 carbon atoms such as ethylene glycol,
Examples are 1,3-propylene glycol, 1,4-butanediol, 1,6-hexanediol, and 1,12-dodecanediol. Examples of aromatic glycol compounds include p-xylylene glycol, and examples of dihydric phenols include pyrocatechol, resorcinol, hydroquinone, and alkyl-substituted derivatives of these compounds. Other suitable glycols include
1,4-cyclohexanedimethanol is also included.

Other preferred thermoplastic polyesters (A)
Examples of the polyester include polyesters obtained by ring-opening polymerization of lactone. For example, polypivalolactone, poly (ε-caprolactone) and the like.

Still another preferred thermoplastic polyester (A) is polyester as a polymer (TLCP) which forms a liquid crystal in a molten state. Typical examples of polyesters that fall into these categories are X7G manufactured by Eastman Kodak Co., Xydar manufactured by Dartco Co., Econor manufactured by Sumitomo Chemical Co., Ltd., and Vectra manufactured by Celanese Co., Ltd.

The above-mentioned thermoplastic polyester (A)
Among them, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), poly (1,4-cyclohexanedimethylene terephthalate) (PCT), liquid crystalline polyester and the like are preferable, and polyethylene terephthalate or polybutylene Terephthalate is particularly preferred.

The thermoplastic polyester (A) used in the present invention has an intrinsic viscosity of 0.4 to 40 measured at 35 ° C. in a phenol / tetrachloroethane (equal volume mixture) mixed solvent.
1.5 dl / g is preferable, more preferably 0.5 to 1.2
dl / g, more preferably 0.6 to 1.0 dl / g. When the intrinsic viscosity is less than 0.4 dl / g, impact resistance is insufficient, which is preferable, and when it exceeds 1.5 dl / g, moldability is difficult.

The blending amount of the thermoplastic polyester (A) is 20 to 45% by weight, preferably 25 to 45% by weight in the resin composition.
It is 43% by weight, more preferably 30 to 40% by weight.
If it is less than 20% by weight, the heat resistance of the composition is insufficient, and
If it exceeds the weight%, warp deformation occurs. These thermoplastic polyesters (A) can be easily produced by a usual production method, for example, a melt polycondensation reaction or a solid phase polymerization method.

(B) Bisphenol type epoxy resin Bisphenol type epoxy resin used in the present invention (B)
Is particularly preferably a bisphenol A type epoxy resin obtained by reacting bisphenol A with epichlorohydrin. Its epoxy equivalent is 1000 or less, preferably 5
It is 00 or less. Examples of the bisphenol type epoxy resin (B) include Epicoat 828, Epicoat 834, Epicoat 836, Epicoat 1001, Epicoat 1004, Epicoat 1007 (all manufactured by Yuka Shell Epoxy Co., Ltd., trade name) DER331, DER332,
DER661, DER664, DER667 (manufactured by Dow Chemical Company, trade name), Araldite 260, Araldite 280, Araldite 6071, Araldite 6
084, Araldite 6097 (all manufactured by Ciba-Geigy, trade name) and the like can be used, and these can be used alone or in combination of two or more.

The compounding amount of the bisphenol type epoxy resin (B) is 1 to 12% by weight, preferably 2 to 12% by weight in the resin composition.
It is 10% by weight, more preferably 3 to 8% by weight. If it is less than 1% by weight, the heat resistance is unsatisfactory, and if it exceeds 12% by weight, the impact strength becomes problematic.

(C) Propylene-based Resin The propylene-based resin (C) used in the present invention is a homopolymer of propylene, a copolymer of propylene and other α-olefin (s) (or plural kinds thereof), or mainly these. As a component, if necessary, other unsaturated monomer (multiple types may be used)
And a copolymer containing as a subcomponent. Here, the copolymer may be any copolymer such as block, random or graft or a composite thereof. Other α-
Examples of the olefin include ethylene, propylene, butene-1, pentene-1, hexene-1, heptene-
1, octene-1, etc., and has 2 carbon atoms due to easy availability.
The thing of -8 is preferable. Examples of the other unsaturated monomer include unsaturated fatty acids such as (meth) acrylic acid, (meth) acrylic acid ester, and maleic acid, their esters, or their acid anhydrides.

Further, dicyclopentadiene, 1,4
-Hexadiene, cyclooctadiene, methylnorbornene, 5-ethylidene-2-norbornene and the like non-conjugated diene monomer copolymerized can be used. The blending amount of the propylene resin (C) is 3 to 20% by weight, preferably 4 to 15% by weight, more preferably 5 to 1%.
0% by weight. If it is less than 3% by weight, the warp is large and if it exceeds 20, the heat resistance is insufficient.

(D) Mica Mica used in the present invention is muscovite mica,
Examples include Szolite mica (trademark of Marletta). The particle size of mica (D) is preferably large in order to reduce the warp deformation of the molded product, but if it is too large, the impact strength decreases, so an average particle size of 500 to 10 mesh is preferable. Further, considering the kneading with polyester and the molding processing temperature, those having crystallization water or contained water are not preferable, and mica which does not release 1% or more of water at 300 ° C. or less by thermal balance (TGA) measurement is preferable.

The amount of mica (D) blended is 1 in the resin composition.
It is 0 to 45% by weight, preferably 15 to 40% by weight, more preferably 20 to 35% by weight. 10% by weight
If it is less than 45%, the warp deformation of the molded product is large, and if it exceeds 45% by weight, the kneading and molding process become difficult and the impact strength is significantly lowered.

(E) Conductive carbon black The conductive carbon black (E) used in the present invention is acetylene black or furnace black. Specifically, Mitsubishi Kasei's # 3050B, # 3600B, # 32
50B; Ketjen Black KE manufactured by Lion Akzo
C: MHS-500 manufactured by Asahi Carbon Co., Ltd .; Vulcan XC72 manufactured by Cabot Co., USA. The content of the conductive carbon black (E) in the resin composition is 5 to 30% by weight, preferably 6 to 28% by weight, more preferably 7 to 26% by weight.
Is. If it is less than 5% by weight, the surface electric resistance does not decrease to the level of dissipation of electrostatic charge. If it exceeds 30% by weight, the flowability of the molten resin is poor, and it becomes difficult to obtain a molded product having a good appearance, and the impact strength is significantly lowered.

(F) Additional component In the resin composition of the present invention, a flame retardant, a flame retardant aid, a nucleating agent, a crystallization accelerator, a heat stabilizer, an antioxidant is contained in the resin composition of the present invention. , Foaming agents, lubricants, release agents, other inorganic fillers other than mica, such as calcium carbonate, clay,
Kaolin, various whiskers, milled fibers, glass flakes, glass beads, and other thermoplastic resins may be blended.

<Manufacturing and Molding of Resin Composition> The resin composition for a semiconductor element carrying container of the present invention can be manufactured using a mixer, a kneader, or the like that is generally used for thermoplastic resins. That is, each component is uniformly mixed with a V-type blender, a ribbon blender, a tumbler or the like together with an additional component, if necessary, and then melt-kneaded with an ordinary extruder such as a uniaxial or biaxial extruder, and after cooling, pellets are formed. Cut into pieces. At this time, a part of mica or other components may be added in the middle of the extruder cylinder. Also,
After a part of the components is mixed and kneaded in advance, the remaining components may be further added and kneaded and extruded.

The resin composition of the present invention can be molded by various molding methods such as injection molding, extrusion molding and compression molding. The molded body for a container thus obtained was previously subjected to a load of 15
Aging is performed by heat treatment at 0 to 220 ° C., preferably 160 to 210 ° C. If the heat treatment temperature is lower than 150 ° C, the warp deformation amount of the molded body is large, and if it exceeds 220 ° C, the impact strength of the molded body decreases. The preferable properties of the heat-resistant resin container for semiconductor device transportation obtained as above are: surface resistivity: 10 ⁶ Ω / □ or less, warp deformation amount: 0.5 mm or less, and Izod impact strength (with notch): 3 kg · cm / cm ² or more (measurement method described later).

[0024]

【Example】

Examples 1-9 and Comparative Examples 1-11 The components used are as follows. Component (A): Polyethylene terephthalate having an intrinsic viscosity of 0.7 dl / g (Bellpet PBK-1 manufactured by Kanebo) Component (B): Bisphenol A epoxy resin (Epicote 828 manufactured by Yuka Shell Co.) Component (C) : Ethylene-propylene block copolymer (Mitsubishi Petrochemical Co., Ltd., Mitsubishi Noblene BC8Q) Component (D): Mica (Kuraray Co., 60C) Component (E): Acetylene Black (Mitsubishi Kasei Co., # 3)
050B) According to the blending composition shown in Table 1, after mixing all components with a tumbler, using a uniaxial extruder having a diameter of 40 mm and L / D = 30, a cylinder temperature of 265 ° C. and a screw rotation speed of 75 rp
The mixture was kneaded and extruded at m and pelletized.

The pellets obtained were dried at 130 ° C. for 5 hours, and then the temperature of the cylinder was 265 with a 150-ton injection molding machine.
The IC tray having the shape shown in FIG. Twenty molded trays were stacked, a load of 5 kg was applied to the upper portion, and the tray was heated at 200 ° C. for 3 hours. Next, the load was removed, baking was carried out at 180 ° C. for 3 hours, the mixture was immediately moved to a room at 25 ° C., and it was forcibly cooled by a fan from 4 directions for 1 hour. The obtained tray was evaluated according to the following evaluation test method, and the results are shown in Table 1.

Warp Deformation Amount (mm): The trays were placed one by one on a surface plate, and the warp deformation amount was measured at 6 positions shown in FIG. 1 by using a clearance gauge. The corresponding points (20 × 6 = 120 points) of all 20 trays were measured, and the maximum value was defined as the warp deformation amount. Drop strength: Hold the tray horizontally and let it fall freely on a concrete floor from a height of 1.5 m in a room at 25 ° C.
The number of cracks when 10 sheets were carried out was recorded. Surface resistivity (Ω): The surface electrical resistivity was measured in a room at 25 ° C. and 50% RH using a surface resistivity meter Lorester Ap manufactured by Mitsubishi Petrochemical Co., Ltd.

[0027]

[Table 1]

[0028]

[Table 2]

Example 10 and Comparative Examples 12-14 In Example 2, 5 before the baking treatment at 180 ° C.
When heat treatment under kg load is not performed (Comparative Example 12)
Table 2 shows the case of performing the treatment at 140 ° C. (Comparative Example 13), 170 ° C. (Example 10) and 230 ° C. (Comparative Example 14) for 3 hours.

[0030]

[Table 3]

Example 11 The procedure of Example 2 was repeated, except that polybutylene terephthalate (Novadul 5010, manufactured by Mitsubishi Kasei) was used as the component (A). Example 2 except that the cylinder temperature was 240 ° C. and the mold temperature was 60 ° C. from the obtained pellets.
The tray was molded and evaluated in the same manner as in, and the results are shown in Table 3.

Example 12 Example 12 was repeated except that Ketchen Black KEC (manufactured by Lion Akzo) was used as the component (E). The results are shown in Table 3.

[0033]

[Table 4]

[0034]

According to the present invention, it is possible to obtain a heat-resistant resin container for transporting semiconductor devices, which can withstand baking at a high temperature of 180 ° C., which is impossible in the prior art, and at the same time, has good drop impact strength and electrostatic level. it can.

[Brief description of drawings]

FIG. 1 is a plan view and a side view of an IC tray used for physical property evaluation in Examples.

[Explanation of Codes] -Indicates the position where the warp deformation amount is measured.

Claims (1)

[Claims] 1. A resin composition molding containing the following components (A) to (E) in the following compounding ratio under a load of 150 to 2
A heat-resistant resin container for semiconductor device transportation that has been heat treated at 20 ° C. (A) Thermoplastic polyester 20 to 45% by weight (B) Bisphenol type epoxy resin 1 to 12% by weight (C) Propylene resin 3 to 20% by weight (D) Mica 10 to 45% by weight (E) Conductive carbon black 5-30% by weight