JPH0888064A - Ic socket - Google Patents

Abstract

PURPOSE: To obtain an IC socket which can meet the multiple pin condition and the minute pitch condition of IC elements effectively, can be formed and assembled easily, and has an excellent reliability. CONSTITUTION: By loading and connecting the lead end of an IC element to numerous circular contact pins arranged to a socket main body, and closing a lid body with a pad pivoted to the socket main body, the main body of the IC element or a lead terminal is pressed so as to pressure contact the lead terminal and the contact pin 2. While a support shaft 5 to which a guide wall 4 is attached and formed is inserted to the inner side of the circular form of the contact pin 2, the support shaft 5 is fixed to the socket main body, so as to maintain the insulation between the contact pins 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an IC socket in which an electronic component such as an IC element is mounted so as to be electrically connected to an external circuit or the like.

[0002]

2. Description of the Related Art In recent years, with the expansion of functions of electronic devices, for example, in a camera-integrated VTR, a portable telephone, and the like, in response to demands for downsizing of the device and enhancement of functionality, the IC element used for them has been improved. The number of pins and the fine pitch of the connection terminals are increasing.

FIG. 4 and FIG. 5 show a conventional IC socket of this type. In the figures, a large number of contact pins 12, 12 'are provided in the socket body 11 corresponding to the connection terminals of the IC element to be mounted. It is arranged in a row and the socket body 1
By closing the cover 14 pivotally attached to the No. 1 via the shaft 13, the pads 15, 1 provided inside the cover 14 are closed.
5'is a connecting terminal of the IC element and contact pins 12, 1
It is designed to make 2'contact. In the conventional IC socket, the plate thickness of the contact pins 12 and 12 'is 0.2.
The mainstream is about 0.4 mm, and a large number of guide walls 16 are provided on the socket body 11 in order to prevent contact accidents between adjacent contact pins 12 and 12 '. Since the arrangement pitch of the guide walls 16 is set to be relatively large, when the guide wall 16 is formed on the socket body 11, it is formed integrally with the socket body 11 by a synthetic resin.

By the way, the above-mentioned increase in the number of pins of the IC element,
In order to cope with the miniaturization of the pitch, the present applicant has already filed a practical application 3-
No. 41476 proposes an IC socket contact pin whose thickness is extremely thin and whose strength is guaranteed. The contact pin has an annular contact arm composed of a pair of opposing arm portions, and a contact portion for contacting the lead terminal of the IC element is formed at the front free end of the contact arm. The rear fixed end is joined to the contact pin body via the neck. According to such a contact pin, the arm portion is effectively dispersed with respect to the external force applied from above, so that the contact pin has a plate thickness of 0.13.
Even if it is formed as thin as about 0.18 mm, I
Proper contact operation with the lead terminal of the C element is guaranteed.

[0005]

However, the conventional I
In the C socket, although the plate thickness of the contact pin itself can be reduced as described above, for example, in the case of the IC socket of the example shown in FIGS. 4 and 5, the contact pins 12, 12 'are particularly guided. Since a large number of guide walls 16 are formed integrally with the socket body 11 by a synthetic resin, it is extremely difficult to form the guide walls 16 thinly and with a fine pitch. In other words, there is a problem that the guide wall 16 is not filled with the molding material during the injection molding process.

In view of the above situation, the present invention is to provide an IC socket which can effectively cope with the increase in the number of pins and the fine pitch of the IC element, which is easy to mold and assemble and which is excellent in reliability. To aim.

[0007]

SUMMARY OF THE INVENTION An IC socket according to the present invention has a padded lid body pivotally supported on the socket body by mounting lead terminals of IC elements on a plurality of annular contact pins arranged in a row on the socket body. By closing the main body of the IC element or the lead terminal to press the lead terminal and the contact pin into contact with each other, a support wall provided with a guide wall that can be arranged between the contact pins is formed. The shaft is inserted inside the annular portion of the contact pin, and the support shaft is fixed to the socket body so as to maintain insulation between the contact pins.

[0008]

According to the present invention, a large number of guide walls for the contact pins are formed separately from the socket body by injection molding together with their supporting shafts. Therefore, in forming such a guide wall, the guide wall can be formed with an extremely fine pitch as compared with the case where it is formed integrally with the socket body, and there is no problem in terms of quality as a synthetic resin product. Further, when the contact pin is assembled in the socket body, it is accurately and surely fixed to a predetermined position of the socket body via the support shaft, so that an appropriate insulating effect for the contact pin can be guaranteed.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an IC socket according to the present invention will be described below with reference to FIGS. In the figure, 1 is a socket body having a large number of grooves 1a and 1a 'for arranging contact pins, 2 is an annular contact arm 2a consisting of a pair of opposing arm portions, and a contact for contacting a lead terminal of an IC element (not shown). A contact pin 3 having a portion 2b and a neck 2d that joins the contact arm 2a to the base 2c includes a plurality of guide walls 4 for guiding and insulating the contact pin 2 and a support for supporting the guide wall 4. A guide wall assembly consisting of the shaft 5 is a column for erection of the guide wall assembly 3 standing on each corner of the socket body 1.

In the above case, the leg 2e of the contact pin 2 is planted in the socket body 1 by inserting it into the socket body 1. However, the contact of the planted contact pin 2 In this state, the arm 2a is not specially guided. On the other hand, the guide wall assembly 3 is integrally formed of synthetic resin or hard rubber having excellent insulation properties, but is formed so as to be skewered by the support shaft 5 with the guide walls 4 aligned as shown in the drawing. It Further, each guide wall 4 is formed to be slightly smaller than such an annular inner dimension of the substantially elliptical shape so that it can be inserted into the annular inner side of the contact arm 2a. They are arranged on the support shaft 5 in a row at the same pitch as the row pitch. A receiving groove 7 for supporting both end portions of the support shaft 5 of the guide wall assembly 3 is formed in the support column 6 of the socket body 1, and the both end portions of the support shaft 5 are fitted into the receiving groove 7. By fitting the guide wall assembly 3, the guide wall assembly 3 is laid horizontally at a predetermined position above the row of grooves 1a and 1a 'provided in the socket body 1. Each of the guide walls 4 of the guide wall assembly 3 laid on the socket body 1 further has the key 8 engaged with the key groove 9 provided on the support 6 and the key grooves 5a provided on both ends of the support shaft 5. , Are arranged between the arm portions 2a of the adjacent contact pins 2.

Further, in the figure, 10 is a cover attached to the support 6 so as to cover both ends of the support shaft 5 fitted in the receiving groove 7, and 11 is a cover to which the attached cover 10 is fixed. It is an eyelet for. A through hole 11a is formed at the center of the eyelet 11, and a through hole 13 is formed below the mounting hole 12 for the eyelet 11 in the support column 6, so that the eyelet 11 penetrates through. The socket body 1 is attached to a base or the like (not shown) using the holes 11a and the through holes 13.

Since the IC socket according to the present invention is constructed as described above, the multiple guide walls 4 are formed separately from the socket body 1 by injection molding together with the support shafts 5 thereof. That is, since the guide wall assembly 3 is formed independently in this way, when the guide wall 4 is formed, it is possible to form the guide wall 4 at an extremely fine pitch without causing defective filling of the molding material in the molding die. It can be formed with high accuracy. Then, the molding process becomes easy and reliable. On the other hand, since the socket body 1 and the guide wall assembly 3 are separated as described above, it goes without saying that the socket body 1 itself can be easily molded.

Next, when assembling the present IC socket, the guide wall assembly 3 is brought into contact with each contact pin 2 by using a predetermined jig for each row of the contact pins 2 to be implanted in the socket body 1. The arm 2a is inserted inside the annular portion. Then, the inserted guide walls 4 are interposed between the adjacent contact pins 2 as shown in FIG. 3, and in this inserted / intervened state, the contact pins 2 and the guide wall assembly 3 further use a jig. Is mounted on the socket body 1, that is, each contact pin 2 has its base portion 2c engaged with the groove 1a, 1a 'of the socket body 1 through its leg portion 2e, whereby each contact pin 2 is inserted into the socket body 1. Are arranged and arranged at a predetermined pitch. On the other hand, the guide wall assembly 3 is substantially in alignment with each guide wall 4 and the inner side of the annular portion of the contact arm 2a in the above-mentioned insertion / intervention state, that is, in this state. As shown by the arrow A, the contact arm 2a is slightly moved to the front free end side, and thereafter, both ends of the support shaft 5 are fitted into the receiving grooves 7 of the support column 6 so that the socket is moved as described above. The main body 1 is horizontally mounted at a predetermined position above two rows of contact pins provided in a row. Then, the key groove 9 of the column 6 and the key grooves 5a at both ends of the support shaft 5 are aligned with each other, the key 8 is engaged with these key grooves 9 and 5a, and the cover 10 is further attached thereon. Along with eyelet 11, it is fixed.

Thus, each guide wall 4 of the guide wall assembly 3 which is installed between the columns 6 and 6 via the support shaft 5 is interposed between the adjacent contact pins 2 and the front part of the contact arm 2a is free. Positioned and held so as to face the end region. In this way, since the guide wall 4 is arranged especially between the contact arm 2a of the contact pin 2 and the front free end side,
When the contact pin 2 is brought into contact with the lead terminal of the IC element, the contact arm 2a is surely guided by the guide wall 4 and is completely insulated from each other.

[0015]

As described above, according to the present invention, since the guide wall assembly is formed separately from the socket body, a thin and extremely large number of contact pins can be reliably guided. As a result, there are advantages such as being able to effectively cope with the increase in the number of pins of the IC element and the fine pitch.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a socket body and a guide wall assembly according to an embodiment of an IC socket according to the present invention.

FIG. 2 is a partially exploded perspective view showing a support structure for a guide wall assembly in an embodiment of an IC socket according to the present invention.

FIG. 3 is a partial perspective view showing an inserted state of a guide wall assembly and a contact pin in one embodiment of an IC socket according to the present invention.

FIG. 4 is a plan view of a conventional IC socket.

FIG. 5 is a partially cutaway side view of a conventional IC socket.

[Explanation of symbols]

 1 Socket Main Body 2 Contact Pin 3 Guide Wall Assembly 4 Guide Wall 5 Support Shaft 6 Support 7 Receiving Groove 8 Key 9 Key Groove 10 Cover 11 Eyelet 12 Mounting Hole 13 Through Hole

Claims (2)

[Claims] 1. A body or a lead of the IC element by mounting a lead terminal of an IC element on an annular contact pin arranged in a large number in a socket body and closing a padded lid body pivotally supported on the socket body. In an IC socket in which a terminal is pressed so that the lead terminal and the contact pin are brought into pressure contact with each other, a spindle having a guide wall that can be arranged between the contact pins is inserted into the annular portion of the contact pin. An IC socket, characterized in that the supporting shaft is fixed to the socket body and the contact pins are insulated from each other. 2. Both ends of the support shaft are fitted in receiving grooves formed in columns of the corners of the socket body, and both ends of the support shaft and the receiving grooves formed in the fitting parts are respectively keys. The support shaft is locked by engaging a key in the groove, and both ends of the support shaft in the fitted / locked state are covered with cover means and are integrated with the socket body by the stopper means. IC socket to do.