JPH0884397A - Ultrasonic wave probe - Google Patents
Ultrasonic wave probeInfo
- Publication number
- JPH0884397A JPH0884397A JP21975494A JP21975494A JPH0884397A JP H0884397 A JPH0884397 A JP H0884397A JP 21975494 A JP21975494 A JP 21975494A JP 21975494 A JP21975494 A JP 21975494A JP H0884397 A JPH0884397 A JP H0884397A
- Authority
- JP
- Japan
- Prior art keywords
- packing material
- vibrator
- strip
- ultrasonic probe
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は超音波プローブに係り、
さらに詳しくは、ほぼ一様な感度を呈し、コンパクト化
も容易に図り得る超音波プローブ（超音波探触子）に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe,
More specifically, the present invention relates to an ultrasonic probe (ultrasonic probe) that exhibits substantially uniform sensitivity and can be easily made compact.
【０００２】[0002]
【従来の技術】超音波の利用形態の一つとして、たとえ
ば生体に対して超音波を送波し、その反射波（エコー）
を受信（受波）して、この反射波の時間的なズレ分布か
ら、生体内部の形状などを映像化する超音波診断装置が
知られている。そして、このような超音波診断装置に利
用される超音波プローブは、図５に斜視的に示すごと
く、短冊状の振動子１を複数個並べ、超音波放射面に対
し反対面に防振性のパッキング材２を接合・一体化し、
アレイ化した構造を採っている。つまり、診断対象領域
に一様な超音波の送波を可能にする一方、反射波を対応
した形態での受信を可能とするため、短冊状の振動子１
を一定間隔で離隔配置し、本体部をアレイ構造としてい
る。ここで、振動子１は、たとえばジルコン酸チタン酸
鉛（ PbZrO3− PbTiO3 ）系，チタン酸鉛（ PbTiO3 ）
系，ニオブ酸鉛系などのセラミックス系圧電体を素材と
し、厚さ 0.1〜 2mm程度，幅 2〜30mm程度，長さ 2〜 1
00mm程度の短冊状を成し、かつ両主面にそれぞれ電極層
が形成されている。また、防振性のパッキング材２は、
前記振動子１群を互いに離隔して一体的に支持するとと
もに、各振動子１が送波した超音波の反射波を、的確に
受信（受波）し得るようにダンピングする役割を果たし
ており、一般的に、たとえばフェライトゴムや多孔質セ
ラミックスを素材として構成されている。2. Description of the Related Art As one of the usage modes of ultrasonic waves, for example, ultrasonic waves are transmitted to a living body and reflected waves (echoes) thereof are transmitted.
There is known an ultrasonic diagnostic apparatus that receives (receives) a wave, and visualizes the shape of the inside of a living body or the like from the time shift distribution of this reflected wave. An ultrasonic probe used in such an ultrasonic diagnostic apparatus has a plurality of strip-shaped transducers 1 arranged side by side as shown in a perspective view in FIG. Joining and unifying the packing material 2 of
It has an arrayed structure. In other words, the strip-shaped transducer 1 is provided in order to enable the uniform transmission of ultrasonic waves to the diagnosis target area and the reception of the reflected waves in a corresponding form.
Are arranged at regular intervals, and the main body has an array structure. Here, the vibrator 1 is, for example, lead zirconate titanate (PbZrO 3 —PbTiO 3 ) system, lead titanate (PbTiO 3 ).
, Ceramics such as lead niobate, piezoelectric material, thickness 0.1 ~ 2mm, width 2 ~ 30mm, length 2 ~ 1
It has a strip shape of about 00 mm and has electrode layers formed on both main surfaces. The vibration-proof packing material 2 is
The vibrators 1 support the vibrators 1 group separately from each other, and play a role of damping the reflected waves of the ultrasonic waves transmitted by the vibrators 1 so that they can be accurately received (received). Generally, for example, ferrite rubber or porous ceramics is used as a material.
【０００３】しかしながら、前記構成の超音波プローブ
の場合、図６に示すごとく、中央部に対し、両端部側に
おける感度の低下が認められている。この理由は、アレ
イ化構造を採った短冊状の振動子１の配列においては、
中央部の振動子1aが対称的であるのに対し、両端部側の
振動子1bが非対称的てあることに起因している。前記両
端部側の感度が低いという事情に基づいて、この種のア
レイ化構造を採る超音波プローブにおいては、実用上、
両端部側の振動子1bをダミーチャンネルとして構成する
ことによって、前記感度低下の問題を回避している。However, in the case of the ultrasonic probe having the above-mentioned structure, as shown in FIG. 6, it is recognized that the sensitivity is decreased at both end portions with respect to the central portion. The reason for this is that in the arrangement of the strip-shaped vibrators 1 having the arrayed structure,
This is because the vibrator 1a at the center is symmetrical, whereas the vibrators 1b at both ends are asymmetric. Based on the fact that the sensitivity at both ends is low, in an ultrasonic probe adopting this type of arrayed structure, in practice,
By configuring the vibrators 1b on both end sides as dummy channels, the problem of sensitivity deterioration is avoided.
【０００４】[0004]
【発明が解決しようとする課題】前記アレイ化構造を採
る超音波プローブで、両端部側振動子1bをダミーチャン
ネルとして構成することにより、感度問題は一応解決し
得る。しかし、ここで、ダミーチャンネルを構成してお
くことは、実質的には短冊状の振動子１のアレイ化構造
がそれだけ大形化することを意味する。つまり、高性
能，コンパクト化などの要望に反するばかりでなく、各
素材の使用量増加や加工工程の増加などによってコスト
アップを招来するし、特に、加工工程の増加は歩留まり
などにも影響する。In the ultrasonic probe having the arrayed structure, the sensitivity problem can be temporarily solved by configuring both end side transducers 1b as dummy channels. However, forming the dummy channels here means that the arrayed structure of the strip-shaped vibrators 1 is substantially increased in size. That is, not only is it against the demands for high performance and compactness, but the cost is also increased due to an increase in the amount of each material used and an increase in the number of processing steps. In particular, an increase in the number of processing steps also affects the yield.
【０００５】さらに、前記構成の超音波プローブには、
次ぎのような問題も認められる。すなわち、製造・組み
立て工程、あるいは実用過程で、アレイ化構造されてい
る短冊状の振動子１の一部が破損を起こし易いという問
題である。図７は前記超音波プローブの作成工程で、短
冊状振動子１化の加工前に、短冊状振動子１構成部１′
の一部が破損した状態例を模式的に示したものである。
そして、この破損現象は、前記アレイ化構造において並
列された短冊状の振動子１とパッキング材２とを、たと
えば熱処理によって接合・一体化したときに、両者の熱
収縮差などに起因し、接合・一体化後に残留応力が発生
し、この残留応力によって、短冊状の振動子１の一部が
破損を起こすといえる。Further, the ultrasonic probe having the above-mentioned structure is
The following problems are also recognized. That is, there is a problem that a part of the strip-shaped vibrator 1 having an array structure is likely to be damaged during the manufacturing / assembling process or the practical process. FIG. 7 shows a process of producing the ultrasonic probe, which is a component 1 ′ of the strip-shaped oscillator 1 before being processed into the strip-shaped oscillator 1.
3 schematically shows an example of a state in which a part of is damaged.
The damage phenomenon is caused by a difference in thermal contraction between the strip-shaped vibrators 1 and the packing material 2 arranged in parallel in the arrayed structure when they are joined and integrated by, for example, heat treatment. -It can be said that residual stress occurs after the integration, and the residual stress causes a part of the strip-shaped vibrator 1 to be damaged.
【０００６】本発明は上記事情に対処してなされたもの
で、ダミーチャンネルを排除してコンパクト化を図りな
がら、振動子群全域が一様な所要感度を呈するととも
に、短冊状振動子の破損発生も解消され、常時、信頼性
の高い機能を果たす超音波プローブの提供を目的とす
る。The present invention has been made in consideration of the above circumstances. While eliminating dummy channels to achieve compactness, the entire transducer group exhibits a uniform required sensitivity and breakage of strip-shaped transducers occurs. It is also an object of the present invention to provide an ultrasonic probe that can always perform a highly reliable function.
【０００７】[0007]
【課題を解決するための手段】本発明に係る超音波プロ
ーブは、超音波放射面を一定方向に揃え、かつ互いに離
隔・配置された圧電体製の短冊状振動子群と、前記短冊
状振動子群の超音波放射面の反対面側に短冊状振動子群
を突設させ接合・一体化されたパッキング材とを具備し
て成る超音波プローブにおいて、前記パッキング材の短
冊状振動子群突設面および短冊状振動子群の接合面を含
むコーナー部に面取り加工を施しておくことを特徴とす
る。SUMMARY OF THE INVENTION An ultrasonic probe according to the present invention is provided with a group of piezoelectric vibrators having ultrasonic wave emitting surfaces aligned in a certain direction and separated and arranged from each other, and the strip vibrations. An ultrasonic probe comprising a packing material which is formed by projecting a strip-shaped transducer group on the opposite side of the ultrasonic wave emitting surface of the child group and joining and integrating the strip-shaped transducer group with the packing material. It is characterized in that a chamfering process is performed on the corner portion including the installation surface and the bonding surface of the strip-shaped vibrator group.
【０００８】本発明において、前記パッキング材の少な
くとも短冊状振動子群の突設側に面取り加工が施されて
いるが、さらには、パッキング材の面取り加工面を曲率
半径Ｒとしたときは、前記面取り加工面の短冊状振動子
群に対する接合面長さを曲率半径Ｒの 1／20〜 1／2.5
と設定し、また、パッキング材の面取りを平面加工とし
たときには、前記面取り加工面が短冊状振動子群に対し
て角度10〜60度で斜交していることが望ましい。In the present invention, at least the protruding side of the strip-shaped vibrator group of the packing material is chamfered. Further, when the chamfered surface of the packing material has a radius of curvature R, The bonding surface length of the chamfered surface to the strip-shaped vibrator group is 1/20 to 1 / 2.5 of the radius of curvature R.
When the chamfering of the packing material is flattened, it is desirable that the chamfered surface be oblique to the strip-shaped vibrator group at an angle of 10 to 60 degrees.
【０００９】本発明は、上記構成の超音波プローブにお
いて、パッキング材の面取り加工が、感度向上や耐破損
性の改善などに有効であることに着目してなされたもの
である。すなわち、アレイ化構造を構成するために、並
列的に配置された振動子のうち、両端部側の振動子に接
合・一体化しているパッキング材の短冊状振動子群突設
側コーナー部の一部を面取り加工して、相当する両端部
側振動子の一部を露出させると、両端部側振動子の感度
低下が防止されること、さらには、パッキング材の接合
・一体化に伴う残留応力の発生も低減されて、振動子の
破損なども効果的に回避し得ることを実験的に確認し、
本発明に至ったものである。The present invention has been made by paying attention to the fact that the chamfering process of the packing material is effective for improving the sensitivity and the damage resistance of the ultrasonic probe having the above-mentioned structure. That is, in order to form an arrayed structure, one of the strip-shaped vibrator group projecting-side corners of the packing material, which is joined and integrated with the vibrators on both ends of the vibrators arranged in parallel, is formed. Chamfering the parts to expose a part of the corresponding vibrators on both ends prevents deterioration of the sensitivity of the vibrators on both ends, and further, residual stress due to joining and unifying of packing materials. It is experimentally confirmed that the occurrence of noise can be reduced and damage to the oscillator can be effectively avoided.
The present invention has been achieved.
【００１０】上記パッキング材の面取り加工において、
面取り加工面の曲率半径Ｒに対して、短冊状振動子群の
接合面長さが曲率半径Ｒの 1／20未満では、並列的に配
置された短冊状振動子群両端部の感度向上が不十分な傾
向が認められ、また振動子破損防止のうえでも十分とい
えない。一方、短冊状振動子群の接合面長さが曲率半径
Ｒの 1／2.5 を超えると、面取り加工の領域が大きくな
るうえ、中央部の振動子の感度上昇が起こって、反って
感度のばらつきを発生し易い傾向があるので、前記範囲
に選択・設定することが好ましい。また、パッキング材
の面取りが平面加工としたときは、前記面取り加工面が
短冊状振動子群に対して角度10〜60度の範囲外で斜交し
ていると、パッキング材の接合面が両端部側振動子の残
留応力によってクラックを発生し易い方向に接近し、振
動子の破損防止を十分に図れないことも起こるからであ
る。In chamfering the packing material,
If the bonding surface length of the strip-shaped transducer group is less than 1/20 of the radius of curvature R with respect to the radius of curvature R of the chamfered surface, the sensitivity of both ends of the strip-shaped transducer group arranged in parallel cannot be improved. A sufficient tendency is recognized, and it cannot be said to be sufficient for preventing damage to the oscillator. On the other hand, when the bonding surface length of the strip-shaped vibrator group exceeds 1 / 2.5 of the radius of curvature R, the chamfering area becomes large and the sensitivity of the vibrator in the central part increases, causing a variation in sensitivity. Since it tends to occur, it is preferable to select and set in the above range. Further, when the packing material is chamfered flat, if the chamfered surface crosses the strip-shaped vibrator group at an angle outside the range of 10 to 60 degrees, the joining surfaces of the packing material are at both ends. This is because the residual stress of the resonator on the side approaches the direction in which cracks are likely to occur, and it may not be possible to sufficiently prevent damage to the resonator.
【００１１】[0011]
【作用】短冊状の振動子を複数並列させ、アレイ化構成
を採った超音波プローブにおいて、前記振動子群を一体
的に接合・保持するパッキング材の少なくとも振動子群
突設側の一部が面取り加工されている。そして、前記面
取り加工部に対応する振動子群の両端部側では、振動子
とパッキング材との接合面積が中央部に比べて低減化
し、この低減化に伴って感度も維持される。つまり、パ
ッキング材に対する振動子群の接合面積が、中央部と同
じであった場合に比較して、前記面取り加工で接合面積
が低減したことにより、感度の低下が抑制され、結果的
には中央部に対して遜色のない感度を呈する。したがっ
て、ダミーチャンネルも不要となり、超音波プローブの
コンパクト化および低コスト化なども可能となる。In the ultrasonic probe adopting an array configuration in which a plurality of strip-shaped vibrators are arranged in parallel, at least a part of the packing material for joining and holding the vibrator groups at least on the projecting side of the vibrator group is used. It is chamfered. Then, on both end sides of the vibrator group corresponding to the chamfered portion, the bonding area between the vibrator and the packing material is reduced as compared with the central portion, and the sensitivity is maintained with this reduction. That is, compared with the case where the bonding area of the vibrator group to the packing material is the same as the central portion, the decrease in the bonding area due to the chamfering process suppresses the decrease in sensitivity, and as a result, the central area is reduced. Exhibits sensitivity comparable to that of parts. Therefore, the dummy channel is not required, and the ultrasonic probe can be made compact and the cost can be reduced.
【００１２】また、前記パッキング材が面取りされ、振
動子群の両端部側では接合面が緩やかな角度を採ってい
るため、振動子とパッキング材との熱収縮差に起因して
発生する残留応力が、振動子の破損し易い方向に働かな
くなる。結果的に、特にセラミック圧電体を用いた高硬
度を有する振動子で生じ易い振動子の破損現象が解消さ
れる。Further, since the packing material is chamfered and the joint surfaces have a gentle angle on both end sides of the vibrator group, residual stress caused by the difference in thermal contraction between the vibrator and the packing material is caused. However, it does not work in the direction in which the oscillator is easily damaged. As a result, the breakage phenomenon of the vibrator, which is likely to occur in the vibrator having a high hardness using the ceramic piezoelectric body, is eliminated.
【００１３】[0013]
【実施例】以下図１〜図４を参照して本発明の実施例を
説明する。Embodiments of the present invention will be described below with reference to FIGS.
【００１４】実施例１ 長さ64mm，幅20mm，厚さ 0.4mmのチタン酸鉛（ PbTi
O3 ）系の圧電体の両主面に、それぞれ銀電極層を焼き
付け形成して成る素振動子３と、長さ64mm，幅18mm，厚
さ10mmのチタン酸鉛アルミから成り、かつ四隅のうち二
隅をほぼ45度の平面面取り4a加工したパッキング材４と
を用意した。Example 1 Lead titanate (PbTi) having a length of 64 mm, a width of 20 mm and a thickness of 0.4 mm
O 3 ) -based piezoelectric body is formed by baking silver electrode layers on both main surfaces, and an element vibrator 3 made of lead aluminum titanate with a length of 64 mm, a width of 18 mm, and a thickness of 10 mm. A packing material 4 in which two corners were chamfered 4a at approximately 45 degrees was prepared.
【００１５】次いで、前記パッキング材４面に、Ag−Cu
系ロウ材層を介して素振動子３の厚さ面を対接させ、 8
00℃，15分間熱処理を施して、素振動子３とパッキング
材４とが接合・一体化して成る超音波プローブ素体を作
成した。なお、この超音波プローブ作成においては、パ
ッキング材４の面取り加工してない辺を、素振動子３の
長さ方向の端面と一致させた。つまり、パッキング材４
の面取り加工平面4aが、素振動子３に対して45度の角度
で斜交する形態を採った。Next, Ag-Cu is applied to the surface of the packing material 4.
The thickness surfaces of the element vibrators 3 are contacted with each other through the system brazing material layer,
Heat treatment was carried out at 00 ° C. for 15 minutes to prepare an ultrasonic probe element body in which the element vibrator 3 and the packing material 4 were joined and integrated. In the production of this ultrasonic probe, the side of the packing material 4 which was not chamfered was aligned with the end face of the element vibrator 3 in the length direction. That is, packing material 4
The chamfered flat surface 4a of (3) obliquely intersects the element vibrator 3 at an angle of 45 degrees.
【００１６】次に、前記超音波プローブ素体の素振動子
３について、電界冷却により分極処理を行った。すなわ
ち、超音波プローブ素体の素振動子３をシリコーンオイ
ル中に浸し、 170℃に昇温した後、5 kV／mmの電界を15
分間印加し、電界印加のまま40℃まで冷却した。その
後、前記分極処理した素振動子３を、ダイサにより厚さ
50μm のブレードで、長さ方向に 1mmのピッチで短冊状
振動子3aに切の離し、アレイ化してから、各短冊状の振
動子3aにリード線（図示省略）を接続して、図１に斜視
的に示すような構成を採った超音波プローブを得た。Next, the element vibrator 3 of the ultrasonic probe element was subjected to polarization treatment by electric field cooling. That is, the element 3 of the ultrasonic probe element is dipped in silicone oil and heated to 170 ° C., and then an electric field of 5 kV / mm is applied to the element 15.
It was applied for a minute and cooled to 40 ° C. with the electric field applied. After that, the polarization-processed element vibrator 3 is thickened with a dicer.
Using a 50 μm blade, cut the strip-shaped oscillators 3a apart at a pitch of 1 mm in the length direction to form an array, and then connect a lead wire (not shown) to each strip-shaped oscillator 3a. An ultrasonic probe having a configuration shown in perspective was obtained.
【００１７】前記超音波プローブについて、パルスエコ
ー法によって反射エコーを測定したところ、全ての短冊
状振動子3aから約 5 MHzの中心周波数で、図２に示すご
とく、反射エコーレベルは、相対感度14.5〜16dBであ
り、そのばらつき程度も10％以下であった。また、前記
短冊状振動子3aは、パッキング材４とのろう付けから、
アレイ加工、分極処理およびパルスエコー測定の過程
で、何等の破損・損傷も認められなかった。Reflection echoes of the ultrasonic probe were measured by the pulse echo method. As a result, as shown in FIG. 2, the reflection echo level had a relative sensitivity of 14.5 at a center frequency of about 5 MHz from all the strip-shaped transducers 3a. It was ~ 16 dB, and the variation was less than 10%. Further, the strip-shaped vibrator 3a is brazed with the packing material 4,
No damage was observed during the array processing, polarization processing and pulse echo measurement.
【００１８】実施例２ 長さ32mm，幅10mm，厚さ 0.4mmのチタン酸鉛（ PbTi
O3 ）系の圧電体の両主面に、それぞれ銀電極層を焼き
付け形成して成る素振動子３と、長さ32mm，幅 8mm，厚
さ10mmのチタン酸鉛アルミから成り、かつ四隅のうち二
隅を曲率半径 3mmの曲面4bを成すように面取り加工した
パッキング材とを用意した。Example 2 Lead titanate (PbTi) having a length of 32 mm, a width of 10 mm and a thickness of 0.4 mm
An element vibrator 3 formed by baking silver electrode layers on both main surfaces of an O 3 ) -based piezoelectric body and a lead aluminum aluminium titanate having a length of 32 mm, a width of 8 mm, and a thickness of 10 mm, and having four corners. A packing material whose two corners were chamfered to form a curved surface 4b having a curvature radius of 3 mm was prepared.
【００１９】次いで、前記実施例１の場合と同様の条件
で、素振動子３とパッキング材４とが接合・一体化し
て、分極処理、 0.5mmのピッチでアレイ化してから、各
短冊状の振動子3aにリード線（図示省略）を接続して、
図３に斜視的に示すような構成を採った超音波プローブ
を得た。Next, under the same conditions as in the case of the first embodiment, the element vibrators 3 and the packing material 4 are joined and integrated, polarized, arrayed at a pitch of 0.5 mm, and then strip-shaped. Connect a lead wire (not shown) to the vibrator 3a,
An ultrasonic probe having a configuration shown in a perspective view in FIG. 3 was obtained.
【００２０】前記超音波プローブについて、パルスエコ
ー法によって反射エコーを測定したところ、全ての短冊
状振動子3aから約 5 MHzの中心周波数で、図４に示すご
とく、反射エコーレベルは相対感度11.8〜13dBであり、
そのばらつき程度も10％以下であった。また、前記短冊
状振動子3aは、防振性パッキング材４とのろう付けか
ら、アレイ加工、分極処理およびパルスエコー測定の過
程で、何等の破損・損傷も認められなかった。Reflection echoes of the ultrasonic probe were measured by the pulse echo method. As a result, as shown in FIG. 4, the reflection echo level showed a relative sensitivity of 11.8 to 5 at a center frequency of about 5 MHz from all the strip-shaped transducers 3a. 13 dB,
The degree of variation was less than 10%. Further, the strip-shaped vibrator 3a was not brazed with the vibration-proof packing material 4, and no damage or damage was observed in the process of array processing, polarization treatment and pulse echo measurement.
【００２１】比較例 長さ64mm，幅20mm，厚さ 0.4mmのチタン酸鉛（ PbTi
O3 ）系の圧電体の両主面に、それぞれ銀電極層を焼き
付け形成して成る素振動子と、長さ64mm，幅18mm，厚さ
10mmのチタン酸鉛アルミから成るパッキング材とを用意
した。Comparative Example Lead titanate (PbTi) with a length of 64 mm, a width of 20 mm and a thickness of 0.4 mm
An element vibrator formed by baking silver electrode layers on both main surfaces of an O 3 ) -based piezoelectric material, with a length of 64 mm, a width of 18 mm, and a thickness.
A packing material made of 10 mm lead aluminum titanate was prepared.
【００２２】次いで、前記パッキング材面に、Ag−Cu系
ロウ材層を介して素振動子の厚さ面を対接させ、 800
℃，15分間熱処理を施して、素振動子とパッキング材と
が接合・一体化して成る超音波プローブ素体を作成し
た。なお、この超音波プローブ作成においては、パッキ
ング材の長辺を、素振動子の長辺と一致させたので、パ
ッキング材の端面が、素振動子に対して90度の角度で直
交する形態を採った。Next, the thickness surface of the element vibrator is brought into contact with the surface of the packing material through an Ag-Cu brazing material layer,
Heat treatment was performed at 15 ° C for 15 minutes to create an ultrasonic probe element body in which the element vibrator and the packing material were joined and integrated. In the production of this ultrasonic probe, the long side of the packing material was made to coincide with the long side of the element vibrator, so that the end surface of the packing material is orthogonal to the element vibrator at an angle of 90 degrees. I took it.
【００２３】次いで、前記実施例１の場合と同様の条件
で、分極処理、 1mmのピッチでアレイ化してから、各短
冊状の振動子にリード線（図示省略）を接続して、前記
図５に斜視的に示すような構成を採った超音波プローブ
を得た。Next, under the same conditions as in the case of the first embodiment, after polarization treatment and arraying at a pitch of 1 mm, lead wires (not shown) are connected to each strip-shaped vibrator, and then, as shown in FIG. An ultrasonic probe having a configuration shown in perspective in FIG.
【００２４】前記超音波プローブについて、パルスエコ
ー法によって反射エコーを測定したところ、全ての短冊
状振動子から約 5 MHzの中心周波数で、前記図６に示す
ごとく、反射エコーレベルが相対感度 9〜16dBであり、
そのばらつき程度は40％にも及んだ。また、前記短冊状
振動子は、パッキング材とのろう付けから、アレイ加
工、分極処理およびパルスエコー測定の過程で、破損・
損傷も認められ、パルスエコーを測定し得ないものもあ
った。Reflection echoes of the ultrasonic probe were measured by the pulse echo method. As a result, as shown in FIG. 6, the reflection echo level showed a relative sensitivity of 9 to 9 at a center frequency of about 5 MHz from all strip-shaped transducers. 16 dB,
The degree of variation reached 40%. In addition, the strip-shaped vibrator may be damaged or broken during the processes of brazing with the packing material, array processing, polarization processing and pulse echo measurement.
Damage was also noted, and some were unable to measure pulse echo.
【００２５】なお、本発明は、前記実施例に限定される
ものでなく、発明の趣旨を逸脱しない範囲でいろいろの
変形を採り得る。たとえば、圧電体はチタン酸鉛（ PbT
iO3）系以外の他のセラミック系圧電体、たとえばジル
コン酸チタン酸鉛（ ZrTiO3− PbTiO3 ），ニオブ酸鉛
などでもよい。なお、チタン酸鉛系やニオブ酸鉛系の場
合は、たとえば 250℃程度の高温でも超音波プローブと
して機能し、また、ジルコン酸チタン酸鉛系の場合は、
たとえば 190℃程度以下の温度で超音波プローブとし良
好な性能を呈する。さらに、パッキング材もチタン酸ア
ルミ系以外の他のセラミック系を用いた構成を採ること
もできるし、フェライトゴムを用いることも可能であ
る。また、その面取り加工も二隅に限定されず、一隅，
三隅もしくは四隅部であってもよい。The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the invention. For example, the piezoelectric material is lead titanate (PbT
Other ceramic piezoelectric materials other than iO 3 ) such as lead zirconate titanate (ZrTiO 3 —PbTiO 3 ) and lead niobate may be used. In the case of lead titanate-based or lead niobate-based, it functions as an ultrasonic probe even at a high temperature of about 250 ° C, and in the case of lead zirconate-titanate-based,
For example, it exhibits good performance as an ultrasonic probe at temperatures below 190 ° C. Further, the packing material may be made of a ceramic material other than the aluminum titanate material, or ferrite rubber may be used. Also, the chamfering process is not limited to two corners, one corner,
It may be at three or four corners.
【００２６】[0026]
【発明の効果】上記説明から分かるように、本発明によ
れば、アレイ化構造を採る短冊状振動子の一部を、パッ
キング材から一部突設させた構成の超音波プローブにお
いて、パッキング材の一部を面取り加工しておくことを
骨子としている。そして、前記アレイ化された両端部側
の短冊状振動子の感度低下が防止され、短冊状振動子群
全域に亘ってほぼ一様な（ばらつきの少ない）感度を保
持・発揮する。つまり、全チャンネルで均一な感度を有
するため、ダミーチャンネルの設置など不要となり、少
なくともその分のコンパクト化やコストダウンなど図る
ことが可能となる。また、前記パッキング材の一部面取
りは、両者の熱収縮率の相違に伴う残留応力を緩和し、
アレイ化前の素振動子やアレイ化後の短冊状振動子の破
損などの防止も図られ、歩留まりや信頼性の向上にも寄
与する。As can be seen from the above description, according to the present invention, in the ultrasonic probe having a structure in which a part of the strip-shaped vibrator having the arrayed structure is projected from the packing material, The main idea is to chamfer a part of the. Then, the sensitivity of the arrayed strip-shaped transducers on both end sides is prevented from being lowered, and substantially uniform (with little variation) sensitivity is maintained and exhibited over the entire strip-shaped transducer group. In other words, since the sensitivity is uniform in all channels, it is not necessary to install dummy channels, and it is possible to achieve at least the size reduction and cost reduction. Further, the partial chamfering of the packing material relieves the residual stress due to the difference in thermal shrinkage between the two,
It is possible to prevent damage to the element oscillators before arraying and the strip-shaped oscillators after arraying, which also contributes to improvement in yield and reliability.
【図１】本発明に係る超音波プローブの構成例の要部を
示す斜視図。FIG. 1 is a perspective view showing a main part of a configuration example of an ultrasonic probe according to the present invention.
【図２】図１に図示した超音波プローブの相対感度図。FIG. 2 is a relative sensitivity diagram of the ultrasonic probe shown in FIG.
【図３】本発明に係る超音波プローブの他の構成例の要
部を示す斜視図。FIG. 3 is a perspective view showing a main part of another configuration example of the ultrasonic probe according to the present invention.
【図４】図３に図示した超音波プローブの相対感度図。4 is a relative sensitivity diagram of the ultrasonic probe illustrated in FIG.
【図５】従来の超音波プローブの構成の要部を示す斜視
図。FIG. 5 is a perspective view showing a main part of a configuration of a conventional ultrasonic probe.
【図６】図５に図示した超音波プローブの相対感度図。6 is a relative sensitivity diagram of the ultrasonic probe shown in FIG.
【図７】従来の超音波プローブにおける振動子群の破損
例を模式的に示す斜視図。FIG. 7 is a perspective view schematically showing an example of breakage of a transducer group in a conventional ultrasonic probe.
１，3a……短冊状振動子 1a……中央部振動子
1b……両端部側振動子 ２，４……防振性パッキ
ング材 ３……素振動子 4a……平面面取り
4b……曲面面取り1,3a …… Strip vibrator 1a …… Central vibrator
1b …… Both ends side vibrator 2,4 …… Vibration-proof packing material 3 …… Element vibrator 4a …… Chamfer
4b …… Curved chamfer
Claims (1)
いに離隔・配置された圧電体製の短冊状振動子群と、 前記短冊状振動子群の一端側を突設させ、超音波放射面
の反対面側に接合・一体化されたパッキング材とを具備
して成る超音波プローブにおいて、 前記パッキング材の短冊状振動子群突設面および短冊状
振動子群の接合面を含むコーナー部が面取り加工されて
いることを特徴とする超音波プローブ。1. A group of strip-shaped vibrators made of piezoelectric material, which have ultrasonic wave emission surfaces aligned in a certain direction and are separated and arranged from each other, and one end side of the strip-shaped vibrator group is projectingly provided so as to emit ultrasonic waves. An ultrasonic probe including a packing material bonded and integrated on the side opposite to the surface, the corner portion including the protruding surface of the strip-shaped vibrator group of the packing material and the bonding surface of the strip-shaped vibrator group. An ultrasonic probe characterized by being chamfered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21975494A JPH0884397A (en) | 1994-09-14 | 1994-09-14 | Ultrasonic wave probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21975494A JPH0884397A (en) | 1994-09-14 | 1994-09-14 | Ultrasonic wave probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0884397A true JPH0884397A (en) | 1996-03-26 |
Family
ID=16740483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21975494A Withdrawn JPH0884397A (en) | 1994-09-14 | 1994-09-14 | Ultrasonic wave probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0884397A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11085816B2 (en) | 2018-03-28 | 2021-08-10 | Seiko Epson Corporation | Ultrasonic wave sensor and ultrasonic wave device |
| US11233188B2 (en) | 2018-03-28 | 2022-01-25 | Seiko Epson Corporation | Ultrasonic wave sensor and ultrasonic wave device |
| US11867665B2 (en) | 2021-09-07 | 2024-01-09 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic inspection device |
-
1994
- 1994-09-14 JP JP21975494A patent/JPH0884397A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11085816B2 (en) | 2018-03-28 | 2021-08-10 | Seiko Epson Corporation | Ultrasonic wave sensor and ultrasonic wave device |
| US11233188B2 (en) | 2018-03-28 | 2022-01-25 | Seiko Epson Corporation | Ultrasonic wave sensor and ultrasonic wave device |
| US11867665B2 (en) | 2021-09-07 | 2024-01-09 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic inspection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20011120 |