JPH0882507A - Thermal displacement transducer controller - Google Patents

Abstract

PURPOSE: To obtain an apparatus which enables the minimizing of deterioration in a displacement sensor with easier miniaturization by method wherein light energy is supplied to a shape memory alloy film to cause a thermal displacement and the film is irradiated with illumination light to measure a displacement obtained. CONSTITUTION: A multi-joint manipulator is constituted of a shape memory alloy film 101 as actuator, a shape memory alloy film heating means 102 and a displacement detection means 103 of the actuator for each joint. The surface of the alloy film 101 is coated with a quantity of reflected light changing means 106 adapted to change in concentration gradually from the end thereof and the rear thereof with a blackbody paint 107. A drive data corresponding to a displacement value of the alloy film 101 is supplied to a voltage setting circuit 112 from outside. The circuit 112 applies a voltage given in the drive data to a semiconductor laser 111 of each joint. The changing means 106 applied on the alloy film 101 is irradiated with a laser light of the laser and the reflected light is converted to a current corresponding to the intensity of the reflected light with a photodiode 113 to be detected with a detection circuit 114.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal displacement conversion element control device used for driving a thermal displacement conversion element.

[0002]

2. Description of the Related Art For position control of a thermal displacement conversion element such as a shape memory alloy, a potentiometer or a strain gauge is used as a position sensor to measure the displacement, and the value is fed back for position control. .

[0003]

However, in the conventional thermal displacement conversion element control device, for example, when the thermal displacement conversion element is used for the actuator of each joint of the manipulator and the displacement feedback control is performed at each joint, Since the potentiometer has a complicated structure, it is difficult to miniaturize the manipulator, and the contact type sensor such as a strain gauge has a problem that the adhesive surface is deteriorated due to a temperature change when the thermal displacement conversion element is driven.

The thermal displacement conversion element control device of the present invention has been focused on such a problem, and its purpose is to overcome the above-mentioned conventional problems and to easily downsize the displacement sensor. To provide a thermal displacement conversion element control device with less deterioration.

[0005]

In order to achieve the above object, a thermal displacement conversion element control device of the present invention comprises a thermal displacement conversion element and a thermal displacement conversion element for heating and displacing the thermal displacement conversion element. Light energy supplying means for supplying light energy to the conversion element, light irradiation means for irradiating the thermal displacement conversion element with illumination light for displacement measurement, a sensor for receiving reflected light from the thermal displacement conversion element, and And a supply light energy adjusting means for adjusting the amount of light energy supplied by the light energy supplying means to the thermal displacement conversion element according to the intensity of light received by the sensor which is changed by the displacement of the thermal displacement conversion element.

[0006]

That is, the thermal displacement conversion element control device of the present invention supplies the optical energy to the thermal displacement conversion element by the optical energy supply means in order to heat and displace the thermal displacement conversion element. Further, the light irradiation means irradiates the thermal displacement conversion element with illumination light for displacement measurement, and the sensor receives the reflected light from the thermal displacement conversion element. Then, according to the received light intensity of the sensor changed by the displacement of the thermal displacement conversion element, the supply amount of light energy to the thermal displacement conversion element by the optical energy supply means is adjusted by the supplied light energy adjusting means.

[0007]

Embodiments of the present invention will be described below in detail with reference to the drawings. 1 to 5 show a first embodiment of the thermal displacement conversion element control device of the present invention. This embodiment relates to an articulated manipulator device. The present multi-joint manipulator device has a shape memory alloy film 101 as an actuator, a bias spring (not shown), and a shape memory alloy film heating means 102 for each joint (first and second joints are shown in the figure).
And actuator displacement detection means 103. The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount in the process of heating from the low temperature side to the high temperature side, and is fixed by crimping with an SMA fixing tool 104 as shown in FIG. Body 105
(Fig. 2 (a)). The shape memory alloy film 101 is coated with the reflected light amount changing means 106 on the front surface so that the concentration gradually changes from the end, and the black body coating material 107 is coated on the back surface. As shown in FIG. 3, the reflected light amount changing means 106 is provided with shading so that the reflected light of the semiconductor laser becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 102 comprises an Ar laser light source 108 at the base of the manipulator, optical fibers 109 for the number of joints for transmitting the laser light to each joint,
The optical modulator 110 is configured to switch the laser light from the optical fiber 109 to irradiate the shape memory alloy film 101 with light.

The optical modulator 110 is set so that the higher the voltage applied within the range of the voltage that can be output by the detection circuit 114, the larger the amount of light applied to the shape memory alloy film 101 for heating. This optical modulator 110 is GaAs / Al
It is an optical modulator using the GaAs electric field effect.

The displacement detecting means 103 of the actuator is
The semiconductor laser 111, a voltage setting circuit 112 applied to the semiconductor laser 111, a photodiode 113 for detecting the reflected light from the reflected light amount changing means 106, and a detection circuit 114 for converting the output of the photodiode 113 into a voltage. The voltage setting circuit 112, as shown in FIG.
Sample and hold circuits 42 and 42 ', flip-flops 41 and 41', switching elements 40 and 40 ',
It is composed of a semiconductor laser or optical modulators 43 and 43 '. Further, the detection circuit 114 outputs a larger voltage as the input current is larger. As shown in FIG. 2C, the voltage setting circuit 112, the semiconductor laser 111, the detection circuit 114 that converts the output of the photodiode 113 into a voltage, and the optical modulator 110 are assembled on a Si substrate 115.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 101 corresponding to that angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 applies the voltage given by the drive data to the semiconductor laser 111 of each joint. The laser light is applied to the reflected light amount changing means 106 coated on the shape memory alloy film 101, and the reflected light is converted into a current corresponding to the reflected light intensity by the photodiode 113. The current is converted into a voltage by the detection circuit 114.
By applying the voltage to the optical modulator 110, the amount of laser light applied to the shape memory alloy film 101 for heating is determined. The laser light is applied to the surface coated with the black body paint 107.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the semiconductor laser 111 changes and the shape memory alloy film 101 contracts, so that the intensity of the reflected light is weakened and the output current of the photodiode 113 is reduced. Drop,
Since the output voltage of the detection circuit 114, that is, the input voltage of the optical modulator 110 decreases, the shape memory alloy film 10 is heated for heating.
1 is weakened by the laser light and the shape memory alloy film 101
The temperature of is lowered, and the displacement is restored.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop from the reflected light intensity of the semiconductor laser light, and the drive data applied to the semiconductor laser 111 and the displacement of the shape memory alloy film 101 have a one-to-one relationship. Holds.

The first embodiment described above has the following effects. 1. The optical modulator can be downsized, and the manipulator can be downsized. 2. Since the light energy sent to each joint is constant, proportional control is possible.

Next, a second embodiment of the thermal displacement conversion element control device of the present invention will be described with reference to FIGS. 6 and 7. This embodiment relates to an articulated manipulator device. This multi-joint manipulator device has a shape memory alloy film 101 as an actuator for each joint (first and second joints are shown in the figure).
A bias spring (not shown), shape memory alloy film heating means 202, and actuator displacement detection means 103.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount during the process of heating from the low temperature side to the high temperature side, and as shown in FIG.
Manipulator structure 1 fixed by crimping at 04
05 (Fig. 7 (a)). Further, the shape memory alloy film 101 is coated with the reflected light quantity changing means 106 on the surface so that the concentration gradually changes from the end, and the black body paint 10 is applied on the back surface.
7 is applied. As shown in FIG. 3, the reflected light amount changing means 106 is provided with shading so that the reflected light of the semiconductor laser becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 202 is an Ar laser light source 208 at the base of the manipulator, an optical fiber 209 for transmitting the laser light to each joint, and a Y-type for branching the laser light from the optical fiber 209 at each joint. The branch waveguide 216 and the optical modulator 110 for adjusting the laser light from the Y-shaped branch waveguide 216 and irradiating the shape memory alloy film 101 with the light are configured.

The optical modulator 110 is set such that the higher the voltage applied within the range of the voltage that can be output by the detection circuit 114, the larger the amount of light applied to the shape memory alloy film 101 for heating. This optical modulator 110 is GaAs / Al
It is an optical modulator using the GaAs electric field effect.

The displacement detecting means 103 of the actuator is
A semiconductor laser 111, a voltage setting circuit 112 applied to this semiconductor laser 111, a photodiode 113 for detecting the reflected light from the reflected light amount changing means 106, and a detection circuit 11 for converting the output of this photodiode 113 into a voltage.
It is composed of 4.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. Further, the detection circuit 114 outputs a larger voltage as the input current is larger. Figure 7
As shown in (c), the voltage setting circuit 112, the semiconductor laser 111, the detection circuit 114 that converts the output of the photodiode 113 into a voltage, the Y-type branch waveguide 216, and the optical modulator 110 are mounted on a Si substrate 215. Has been.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 101 corresponding to that angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 applies the voltage given by the drive data to the semiconductor laser 111 of each joint. The laser light is applied to the reflected light amount changing means 106 coated on the shape memory alloy film 101, and the reflected light is converted into a current corresponding to the reflected light intensity by the photodiode 113. The current is converted into a voltage by the detection circuit 114. By applying the voltage to the optical modulator 110,
The amount of laser light emitted from the Ar laser light source 208 to the shape memory alloy film 101 for heating branched by the Y-shaped branch waveguide 216 through the optical fiber 209 is determined. The laser light is applied to the surface coated with the black body paint 107.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the semiconductor laser 111 changes and the shape memory alloy film 101 contracts, so that the intensity of the reflected light is weakened and the output current of the photodiode 113 is reduced. Drop,
Since the output voltage of the detection circuit 114, that is, the input voltage of the optical modulator 110 decreases, the shape memory alloy film 10 is heated for heating.
1 is weakened by the laser light and the shape memory alloy film 101
The temperature of is lowered, and the displacement is restored.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop from the reflected light intensity of the semiconductor laser light, and the drive data applied to the semiconductor laser 111 and the displacement of the shape memory alloy film 101 have a one-to-one relationship. Holds.

The second embodiment described above has the following effects. 1. Since the light energy sent to each joint is constant, proportional control is possible. 2. A single energy transfer path to a plurality of shape memory alloy films is sufficient, and the manipulator can be miniaturized.

Naturally, various modifications and changes can be made to the respective structures of this embodiment. For example, the method of giving the displacement command from the outside may be given to any place in the closed loop.

Next, a third embodiment of the thermal displacement conversion element controller of the present invention will be described with reference to FIGS. 8 and 9. This embodiment relates to an articulated manipulator device. This multi-joint manipulator device has a shape memory alloy film 101 as an actuator for each joint (first and second joints are shown in the figure).
A bias spring (not shown), shape memory alloy film heating means 239, and actuator displacement detection means 238.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount in the process of heating from the low temperature side to the high temperature side, and as shown in FIG.
Manipulator structure 1 fixed by crimping at 04
05 (Fig. 9 (a)). Further, the shape memory alloy film 101 is coated with the reflected light quantity changing means 106 on the surface so that the concentration gradually changes from the end, and the black body paint 10 is applied on the back surface.
7 is applied. As shown in FIG. 3, the reflected light amount changing means 106 is provided with shading so that the reflected light becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 202 has an Ar laser light source 208 at the base of the manipulator, an optical fiber 240 for transmitting the laser light to each joint, and a Y for branching the laser light from this optical fiber 240 at each joint. Type 3
One of the two optical paths branched by the branch waveguide 241 and the Y-type three-branch waveguide 241 has a shape memory alloy film 1 for heating.
01 is connected to an optical modulator 110 which adjusts and irradiates the light amount.

The optical modulator 110 is set so that the higher the voltage applied within the range of the voltage that can be output by the detection calculation circuit 243, the larger the amount of light applied to the shape memory alloy film 101 for heating. This optical modulator 110 is GaAs /
This is an optical modulator utilizing the AlGaAs type electric field effect.

The displacement detecting means 238 of the actuator is
Of the two optical paths branched by the Y-type three-branch waveguide 241, another optical path other than the above is applied to the reflected light amount changing means 106 via the mirror 242. Further, the photodiode 1 for detecting the reflected light from the reflected light amount changing means 106.
13, a voltage setting circuit 112 for inputting a voltage from the outside,
It is composed of a detection calculation circuit 243 which converts the output of the photodiode 113 into a voltage and adds the output of the voltage setting circuit 112.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. As shown in FIG. 9C, the voltage setting circuit 112, the mirror 242, the lens 244, the photodiode 113, the detection arithmetic circuit 114, the Y-type three-branch waveguide 241, and the optical modulator 110 are mounted on the Si substrate 315. Has been.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 101 corresponding to that angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 inputs the voltage given by the drive data to the detection calculation circuit 243. On the other hand, the output of the photodiode 113 for detecting the reflected light of the laser light applied to the reflected light amount changing means 106 via the mirror 242 is also input to the detection calculation circuit 243. The detection calculation circuit 243 adds those inputs, amplifies them, and applies the output to the optical modulator 110. With this output, the shape memory alloy film 101 for heating is branched from the Ar laser light source 208 through the optical fiber 240 and the Y-type three-branching waveguide 241.
The amount of laser light that is irradiated on the surface is determined. The laser light is applied to the surface coated with the black body paint 107.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the laser light emitted through the mirror 242 changes and the shape memory alloy film 101 contracts, so that the intensity of the reflected light weakens. Photodiode 113
Output current of the detection arithmetic circuit 243, that is, the input voltage of the optical modulator 110 decreases, the laser light irradiated to the shape memory alloy film 101 for heating weakens, and the temperature of the shape memory alloy film 101 decreases. Goes down and the displacement returns.

Therefore, a closed loop is formed from the received light intensity of the photodiode 113 to the displacement of the shape memory alloy film 101, and the drive data applied to the semiconductor laser 111 and the displacement of the shape memory alloy film 101 have a one-to-one relationship. Holds.

The third embodiment described above has the following effects. 1. Since the light energy sent to each joint is constant, control can be performed by proportional control. 2. A single energy transfer path to a plurality of shape memory alloy films is sufficient, and the manipulator can be miniaturized. 3. It is not necessary to provide a light source at the joint, the structure is simplified, and the energy consumption of the joint can be suppressed.

Next, a fourth embodiment of the thermal displacement conversion element controller of the present invention will be described with reference to FIGS. This embodiment relates to an articulated manipulator device. This multi-joint manipulator device has a shape memory alloy film 1 as an actuator for each joint (first and second joints are shown in the figure).
01, a bias spring (not shown), a shape memory alloy film heating means 250, and an actuator displacement detection means 251.
Composed of and.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount in the process of heating from the low temperature side to the high temperature side, and is fixed by pressure bonding with an SMA fixing tool 104 as shown in FIG. , And is fixed to the manipulator structure 105 (FIG. 11A). Further, the reflected light amount changing means 25 is arranged so that the density gradually changes on a part of the surface.
2 is applied, and the black body paint 107 is applied to the remaining portion. As shown in FIG. 12, the reflected light amount changing means 252 is provided with shading so that the reflected light becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 250 comprises an Ar laser light source 208 at the base of the manipulator, optical fibers 209 for the number of joints for transmitting the laser light to each joint,
It is composed of an optical modulator 110 for adjusting the laser light from the optical fiber 209 to irradiate the shape memory alloy film 101 with light and a lens 255.

The optical modulator 110 is set so that the amount of light applied to the shape memory alloy film 101 for heating increases as the applied voltage increases within the range of the voltage that can be output by the detection calculation means 214. This optical modulator 110 is GaAs /
This is an optical modulator utilizing the AlGaAs type electric field effect.

The displacement detecting means 251 of the actuator is
Irradiation light amount detector 25 attached to the light modulator 110
3. The output of the photodiode 113 that detects the reflected light from the reflected light amount changing means 252 is converted into a voltage, the voltage from the voltage setting circuit 112 is added, the output from the irradiation light amount detector 253 is subtracted, and the voltage is amplified. Detection arithmetic circuit 25
It is composed of 4.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. As shown in FIG. 11C, the voltage setting circuit 112, the photodiode 113, the detection arithmetic circuit 254, the optical modulator 110, the irradiation light amount detector 253, the lens 255, and the Y-type branch waveguide 216 are on the Si substrate 260. Is installed in.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 101 corresponding to that angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 amplifies the voltage given by the drive data by the detection calculation circuit 254 and applies it to the optical modulator 110 of each joint. The laser light is applied to the reflected light amount changing means 106 coated on the shape memory alloy film 101, and the reflected light is converted into a current corresponding to the reflected light intensity by the photodiode 113. The current is converted into a voltage by the detection calculation circuit 254, the voltage from the voltage setting circuit 112 is added, and the output from the irradiation light amount detector 253 is pulled and amplified. By applying the voltage to the optical modulator 110, the amount of laser light applied to the shape memory alloy film 101 for heating is determined. The laser light is transmitted to the black body paint 107 and the reflected light amount changing means 252 via the lens 255, as shown in FIG.
It is irradiated in the spot shape as shown in. The spot position moves between the low temperature and the high temperature in FIG. 12 due to the deformation of the shape memory alloy film 101.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the optical modulator 110 changes and the shape memory alloy film 101 contracts, so that the photodiode 1
The intensity of light received by 13 is weakened and the photodiode 1
13 decreases, and the output voltage of the detection calculation circuit 254, that is, the input voltage of the optical modulator 110 decreases.
The laser light applied to the shape memory alloy film 101 for heating weakens, the temperature of the shape memory alloy film 101 decreases, and the displacement returns to the original state.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop based on the amount of laser light applied to the shape memory alloy film 101, and the drive data applied to the setting circuit 112 and the displacement of the shape memory alloy film 101 are equal to 1. A one-to-one relationship holds.

Here, when the output from the optical modulator 110 changes, the amount of light reflected from the reflected light amount changing means 252 for displacement detection also changes, so the output from the optical modulator 110 is measured by the irradiation light amount detector 253. Then, by subtracting the value from the detection value of the photodiode 113 in the detection calculation circuit 254, the output of the detection calculation circuit 254 changes only by the displacement of the shape memory alloy film 101.

According to the above-mentioned fourth embodiment, there are the following effects. 1. The optical modulator can be miniaturized, and the manipulator can be miniaturized. 2. Since the energy sent to each joint is constant, proportional control is possible.

3. Compared with the first embodiment, the semiconductor laser is not required and the structure is simplified. Next, a fifth embodiment of the thermal displacement conversion element control device of the present invention will be described with reference to FIGS. 13 and 14. This embodiment relates to an articulated manipulator device. This multi-joint manipulator device has each joint (first and second joints are shown in the figure)
A shape memory alloy film 101 as an actuator, a bias spring (not shown), and a shape memory alloy film heating means 302.
And actuator displacement detection means 303.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount in the process of heating from the low temperature side to the high temperature side, and as shown in FIG.
Manipulator structure 1 fixed by crimping at 04
05 (Fig. 14 (a)). Further, the reflected light amount changing means 106 is applied to the shape memory alloy film 101 on the surface so that the concentration gradually changes from the end, and the black body paint 10 is applied to the back surface.
7 is applied. As shown in FIG. 3, the reflected light amount changing means 106 is provided with shading so that the reflected light of the semiconductor laser becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 302 has an Ar laser light source 308 at the base of the manipulator, an optical fiber 309 for transmitting the laser light to each joint, and a laser light from this optical fiber 309 to be branched at each joint. The shape memory alloy film 101 is composed of a directional coupling type optical modulator 310 which is optically connected to an optical fiber 309 whose branching ratio changes depending on an applied voltage. The directional coupling type optical modulator 310 is set so that the higher the voltage applied within the range of the voltage that the integrating circuit 316 can output, the larger the amount of light applied to the shape memory alloy film 101 for heating. The directional coupling type optical modulator 310 is a directional coupling type optical modulator utilizing the electric field effect of the waveguide.

The displacement detecting means 303 of the actuator is
A semiconductor laser 111, a voltage setting circuit 112 applied to this semiconductor laser 111, a photodiode 113 for detecting the reflected light from the reflected light amount changing means 106, and a detection circuit 11 for converting the output of this photodiode 113 into a voltage.
4 and an integrating circuit 316 that integrates the voltage.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. Further, the detection circuit 114 outputs a larger voltage as the input current is larger. 14
As shown in (c), the voltage setting circuit 112, the semiconductor laser 111, the detection circuit 114 for converting the output of the photodiode 113 into a voltage, the integrating circuit 316, and the directional coupling type optical modulator 310 are provided on the Si substrate 350. It is assembled.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 101 corresponding to that angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 applies the voltage given by the drive data to the semiconductor laser 111 of each joint. The laser light is applied to the reflected light amount changing means 106 coated on the shape memory alloy film 101, and the reflected light is converted into a current corresponding to the reflected light intensity by the photodiode 113. The current is converted into a voltage by the detection circuit 114. The voltage is integrated by the integrating circuit 316 and then applied to the directional coupling type optical modulator 310, whereby the branching ratio at each joint of the laser light for heating supplied from the Ar laser light source 308 through the optical fiber 309 is changed. However, the amount of laser light with which the shape memory alloy film 101 is irradiated is determined. The laser light is applied to the surface coated with the black body paint 107.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the semiconductor laser 111 changes and the shape memory alloy film 101 contracts, so that the intensity of the reflected light is weakened and the output current of the photodiode 113 is reduced. Drop,
Since the input voltage of the directional coupling type optical modulator 310 is lowered, the laser light applied to the shape memory alloy film 101 is weakened, the temperature of the shape memory alloy film 101 is lowered, and the displacement is restored.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop from the reflected light intensity of the semiconductor laser light, and the drive data applied to the semiconductor laser 111 and the displacement of the shape memory alloy film 101 have a one-to-one relationship. Holds.

According to the above-mentioned fifth embodiment, there are the following effects. 1. The branch and the optical modulator are one element, and the configuration is simple. 2. A single energy transfer path to a plurality of shape memory alloy films is sufficient, and the manipulator can be miniaturized. 3. Loss due to the Y-type branch waveguide is eliminated.

Next, a sixth embodiment of the thermal displacement conversion element control device of the present invention will be described with reference to FIGS. 15 and 16. This embodiment relates to an articulated manipulator device. This multi-joint manipulator device has a shape memory alloy film 1 as an actuator for each joint (first and second joints are shown in the figure).
01, a bias spring (not shown), a shape memory alloy film heating means 402, and an actuator displacement detection means 403.
Composed of and.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount in the process of heating from the low temperature side to the high temperature side, and as shown in FIG.
Manipulator structure 1 fixed by crimping at 04
05 (Fig. 16 (a)). Further, the reflected light amount changing means 106 is applied to the shape memory alloy film 101 on the surface so that the concentration gradually changes from the end, and the black body paint 10 is applied to the back surface.
7 is applied. As shown in FIG. 3, the reflected light amount changing means 106 is provided with shading so that the reflected light of the semiconductor laser becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 402 comprises an Ar laser light source 408 at the base of the manipulator, an optical fiber 409 for transmitting the laser light to each joint, and a laser light from the optical fiber 409 into a parallel light flux at each joint. A lens 418a, a piezoelectric bimorph type optical modulator (piezoelectric bimorph type mirror) 410 that reflects a part of the parallel light flux to irradiate the shape memory alloy film 101 with light, and a lens 418b that makes the parallel light flux enter an optical fiber. To be done. The piezoelectric bimorph type optical modulator 410 is set so that the higher the voltage applied within the voltage range that can be output by the booster circuit 417, the greater the amount of light reflected by the shape memory alloy film 101 for heating.

The displacement detecting means 403 of the actuator is
The semiconductor laser 111, a voltage setting circuit 112 applied to the semiconductor laser 111, a photodiode 113 that detects the reflected light from the reflected light amount changing means 106, a detection circuit 114 that converts the output of the photodiode 113 into a voltage, and the voltage is integrated. The integrating circuit 316 and the boosting circuit 417 that boosts the voltage are included.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. Further, the detection circuit 114 outputs a larger voltage as the input current is larger. FIG.
As shown in (c), the voltage setting circuit 112, the semiconductor laser 111, the photodiode 113, a detection circuit 114 for converting the output of the photodiode 113 into a voltage,
The integrating circuit 316, the boosting circuit 417, and the piezoelectric bimorph type optical modulator 410 are assembled on the Si substrate 450.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 401 corresponding to the angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 applies the voltage given by the drive data to the semiconductor laser 111 of each joint. The laser light is applied to the reflected light amount changing means 106 applied to the shape memory alloy film 101, and the reflected light is converted by the photodiode 113 into a current corresponding to the reflected light intensity. The current is converted into a voltage by the detection circuit 114.
The voltage is integrated by the integrating circuit 316, the integrated voltage value is boosted by the boosting circuit 417, and applied to the piezoelectric bimorph type optical modulator 410. Piezoelectric bimorph type optical modulator 41
0 is deformed by the voltage, reflects a part of the parallel light flux, and irradiates the shape memory alloy film.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the semiconductor laser 111 changes and the shape memory alloy film 401 contracts, so that the intensity of the reflected light is weakened and the output current of the photodiode 113 is reduced. Drop,
Since the input voltage of the piezoelectric bimorph type optical modulator 410 is lowered, the laser light applied to the shape memory alloy film 101 is weakened, the temperature of the shape memory alloy film 101 is lowered, and the displacement is restored.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop from the reflected light intensity of the semiconductor laser light, and the drive data applied to the semiconductor laser 111 and the displacement of the shape memory alloy film 101 have a one-to-one relationship. Holds.

The sixth embodiment described above has the following effects. 1. If the reflectance of the piezoelectric bimorph mirror is high enough,
There is no heat generation of the switching element due to light energy. 2. Loss due to the Y-type branch waveguide is eliminated. 3. It is not necessary to use laser light because it mechanically reflects light.

Next, a seventh embodiment of the thermal displacement conversion element controller according to the present invention will be described with reference to FIGS. 17, 18 and 19. This embodiment relates to an articulated manipulator device. The present multi-joint manipulator device has each joint (first joint in the figure
And a second joint portion), as a actuator, a shape memory alloy film 101, a bias spring (not shown), a shape memory alloy film heating means 502, and an actuator displacement detection means 503.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a predetermined amount in the process of heating from the low temperature side to the high temperature side, and as shown in FIG.
Manipulator structure 1 fixed by crimping at 04
05 (Fig. 18 (a)). Further, the reflected light amount changing means 106 is applied to the shape memory alloy film 101 on the surface so that the concentration gradually changes from the end, and the black body paint 10 is applied to the back surface.
7 is applied. As shown in FIG. 3, the reflected light amount changing means 106 is provided with shading so that the reflected light of the laser becomes weaker as the shape memory alloy film 101 is heated and displaced.

The shape memory alloy film heating means 502 is composed of the phase conjugate mirror 508 and the phase conjugate mirror 5 at the base of the manipulator.
08 is configured by optically connecting the optical fibers 509 and lenses for the number of joints. One optical fiber 509 is distributed to each joint, and the light emitted from the optical fiber 509 is configured to irradiate the shape memory alloy film 101 through the lens 510 and the half mirror 519. FIG.
As shown in FIG.
1, an optical isolator 512 arranged immediately after the output of the laser light source 511, a part of the laser light is transferred to the phase conjugate mirror 50.
The optical system includes a mirror 549, a half mirror 550, a lens 551, and an optical nonlinear medium 513, which are used for the pump light of 8 and the rest are input to an optical fiber for transmission to each joint for displacement detection. Optical isolator 512
Is located immediately after the laser light source 511 and has two polarizers and
It consists of two Faraday rotators, and the pass axis of the polarizer is set to form 45 degrees. Optical nonlinear medium 5
BaTiO3 crystal is used for 13, and phase conjugate light is generated by degenerate four-wave mixing. The angle formed by the forward pump light and the probe light in the crystal is 7 degrees, and the angle formed by the diffraction grating vector with the C axis of the crystal is 18 degrees.

The displacement detecting means 503 of the actuator is
An optical fiber 514 that transmits light for displacement detection to each joint,
A Y-shaped branching waveguide 515 branched from the optical fiber 514 so as to have the same amount of light at each joint, and an optical modulator 5 for changing the intensity of the branched light irradiating the shape memory alloy film 501.
16, a voltage setting circuit 112 for setting the voltage applied to the optical modulator 516, the reflected light from the reflected light amount changing means 106 is a mirror 518, a half mirror 519, and a lens 510.
Through the optical fiber 509.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. As shown in FIG. 18C, these Y-type branch waveguide 515, optical modulator 516, voltage setting circuit 11
2, mirror 518, half mirror 519, lens 510
Are assembled on the Si substrate 520.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 501 corresponding to the angle is externally supplied to the voltage setting circuit 517 at the timing shown in FIG. The voltage setting circuit 517 applies the voltage given by the drive data to the optical modulator 516 of each joint. The laser light is applied to the reflected light amount changing means 506 applied to the shape memory alloy film 101, and the reflected light is reflected by the mirror 518, the half mirror 519, and the lens 51.
It is incident on the optical fiber 509 via 0, and it is incident on the phase conjugate mirror 508 as probe light. Phase conjugate mirror 50
The amplified phase conjugate light of the probe light is emitted from 8 and passes through the same path as the incident light and from the optical fiber 509 to the lens 5
The light is emitted via 10 and passes through the half mirror 519 to irradiate the shape memory alloy film 501. The light reflected by the half mirror 519 and returning from the optical fiber 514 is absorbed by the optical isolator 512.

If the displacement is too large, the positional relationship between the shape memory alloy film 101 and the optical modulator 516 changes, and the shape memory alloy film 101 contracts, so that the intensity of the reflected light weakens, and therefore the phase conjugate mirror 508 reflects the light. The laser light with which the shape memory alloy film 501 is irradiated due to the amplified heating is weakened, whereby the temperature of the shape memory alloy film 101 is lowered,
The displacement returns to the original.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop from the reflected light intensity of the laser beam for displacement detection, and the voltage applied to the optical modulator 516 and the displacement of the shape memory alloy film 101 are paired. The relationship of 1 is established.

The seventh embodiment described above has the following effects. 1. The electric circuit configuration of the joint is simplified. 2. There is no loss due to the splitting of light.

Next, an eighth embodiment of the thermal displacement conversion element controller of the present invention will be described with reference to FIGS. 20, 21 and 22. This embodiment relates to an articulated manipulator device. The present multi-joint manipulator device has each joint (first joint in the figure
And a second joint portion) as a shape memory alloy film 101 as an actuator, a bias spring (not shown), a shape memory alloy film heating means 602, and an actuator displacement detection means 5.
And 03.

The shape memory alloy film 101 is subjected to a memory treatment in which the length shrinks by a certain amount during the process of heating from the low temperature side to the high temperature side, and as shown in FIG.
Manipulator structure 1 fixed by crimping at 04
05 (Fig. 21 (a)). Further, the reflected light amount changing means 106 is applied to the surface of the shape memory alloy film 101 so that the concentration gradually changes from the end, and the black body paint 1 is applied to the back surface.
07 is applied. The reflected light amount changing means 106 is shown in FIG.
As shown in FIG. 6, the shape memory alloy film 101 is shaded so that the reflected light of the laser becomes weaker as it is heated and displaced.

The shape memory alloy film heating means 602 is composed of the phase conjugate mirror 608 and the phase conjugate mirror 6 at the base of the manipulator.
An optical fiber 609 is optically connected to the optical fiber 08, and the optical fiber 609 is connected to the Y-type branch / merging waveguide 621 at each joint. Further, the light emitted from the Y-type branch / merging waveguide 621 passes through the half mirror 619 and the shape memory alloy film 10 is formed.
It is configured to illuminate 1. As shown in FIG. 22,
The phase conjugate mirror 608 includes a laser light source 511 and a laser light source 5
Immediately after the output of 11, the optical isolator 512, a part of the laser light is used as the pump light of the phase conjugate mirror 608, and the rest is input to an optical fiber transmitted to each joint for displacement detection, and a half mirror 550. , An optical system including a lens 551 and an optical nonlinear medium 513.
The optical isolator 512 is located immediately after the laser light source and
It consists of one polarizer and one Faraday rotator,
The pass axis of the polarizer is set to form 45 degrees.
A BaTiO3 crystal is used for the optical nonlinear medium 513,
Phase conjugate light is generated by degenerate four-wave mixing. The angle between the forward pump light and the probe light in the crystal is 7 degrees,
The angle formed by the diffraction grating vector with the C axis of the crystal is 18 degrees.

The displacement detecting means 503 of the actuator is
An optical fiber 514 that transmits light for displacement detection to each joint,
A Y-shaped branching waveguide 515 that branches the optical fiber 514 so that the amount of light is the same at each joint, and an optical modulator 5 that changes the intensity with which the branched light is applied to the shape memory alloy film 101.
16, a voltage setting circuit 112 for setting the voltage applied to the optical modulator 516, and the reflected light from the reflected light amount changing means 106 is configured to enter the optical fiber through the mirror 518 and the half mirror 519.

As shown in FIG. 4, the voltage setting circuit 112 includes sample and hold circuits 42 and 42 ', flip-flops 41 and 41', and switching elements 40 and 40 '.
And a semiconductor laser or optical modulator 43, 43 '. As shown in FIG. 21C, these Y-type branch waveguide 515, optical modulator 516, voltage setting circuit 11
2, mirror 518, half mirror 519, lens 510
Are assembled on the Si substrate 620.

Next, the operation of this embodiment will be described. When it is desired to bend each joint to a certain angle, drive data corresponding to the amount of displacement of the shape memory alloy film 101 corresponding to that angle is externally supplied to the voltage setting circuit 112 at the timing shown in FIG. The voltage setting circuit 112 applies the voltage given by the drive data to the optical modulator 516 of each joint. The laser light is applied to the reflected light amount changing means 106 applied to the shape memory alloy film 101, and the reflected light is reflected by the mirror 518, the half mirror 519, and the lens 51.
From the Y-type branching / merging waveguide 621 to the optical fiber 6
09 is incident on the phase conjugate mirror 608 as probe light. The amplified phase conjugate light of the probe light is emitted from the phase conjugate mirror 608, is emitted from the optical fiber 609 via the lens 510 through the same path as the incident light, and is irradiated onto the shape memory alloy film 101 through the half mirror 519. To be done. The optical fiber 514 is reflected by the half mirror 519.
The light returning from the optical path is absorbed by the optical isolator 512.

If the displacement is too large, the positional relationship between the shape memory alloy film 501 and the optical modulator 516 is changed and the shape memory alloy film 101 contracts, so that the intensity of the reflected light is weakened. Therefore, the reflected light is reflected by the phase conjugate mirror 608. The laser light with which the shape memory alloy film 601 is irradiated is weakened due to the amplified heating, whereby the temperature of the shape memory alloy film 101 is lowered,
The displacement returns to the original.

Therefore, the displacement of the shape memory alloy film 101 forms a closed loop from the reflection intensity of the laser beam for displacement detection, and the voltage applied to the optical modulator 516 and the displacement of the shape memory alloy film 101 are 1: 1. The relationship is established.

According to the eighth embodiment described above, the following effects can be obtained. 1. The electric circuit configuration for the joints becomes simple. 2. Only one optical fiber for energy transmission is required. A. The technical idea of the following configuration is derived from the above-described specific embodiments. (1) A thermal displacement conversion element, light energy supply means for supplying light energy to the thermal displacement conversion element to heat and displace the thermal displacement conversion element, and illumination light for displacement measurement to the thermal displacement conversion element. Thermal displacement conversion by the optical energy supply means according to the light irradiation means for irradiating, the sensor for receiving the reflected light from the thermal displacement conversion element, and the received light intensity of the sensor changed by the displacement of the thermal displacement conversion element. A thermal displacement conversion element control device comprising: a supply light energy adjusting means for adjusting the supply amount of light energy to the element. (2) In the thermal displacement conversion element control device having the configuration (1), the amount of illumination light of the light irradiating means is variable according to a command from the outside. (3) In the thermal displacement conversion element control device having the configuration (2), the light irradiation unit includes a semiconductor laser and a voltage setting unit for the semiconductor laser. (4) In the thermal displacement conversion element control device having the configuration (1), supply light for adjusting the amount of light from the optical energy supply means for heating the thermal displacement conversion element by adding an external command value to the received light intensity. A thermal displacement conversion element control device having an energy adjusting means. (5) In the thermal displacement conversion element control device having the configuration (4), the conversion means for converting the reflected light into a voltage applies a photodiode and a voltage obtained by converting the output current of the photodiode and an arbitrary voltage from the outside. A thermal displacement conversion element control device comprising a conversion circuit that outputs a voltage. (6) In the thermal displacement conversion element control device having the configuration (1), the supply light for adjusting the light amount from the light energy supply means by using an amount obtained by adding the light reception intensity of the sensor in proportion, integration, or differentiation. A thermal displacement conversion element control device having an energy adjusting means. (7) In the thermal displacement conversion element control device having the configuration (1), the optical energy supply means for supplying optical energy is a thermal displacement conversion element control device including a laser light source and an optical fiber. (8) In the thermal displacement conversion element control device having the configuration (1), the thermal displacement conversion element control device has a reflected light amount changing means applied to the thermal displacement conversion element that changes the reflection intensity according to the displacement of the thermal displacement conversion element. (9) In the thermal displacement conversion element control device having the configuration (1), the light displacement means uses a part of the light supplied by the light energy supply means. (10) In the thermal displacement conversion element control device having the above configuration (9), the thermal displacement having an optical modulator for branching a part of the light supplied by the optical energy supply means by the light irradiation means and adjusting the irradiation light amount. Conversion element control device. (11) In the thermal displacement conversion element control device having the configuration (9), the thermal displacement conversion element control device in which the supply light energy adjusting means for adjusting the light quantity from the light energy supplying means comprises an optical modulator and an irradiation light quantity detecting means. (12) In the thermal displacement conversion element control device having the configuration (11), the conversion unit that converts the reflected light into a voltage changes the output voltage of the irradiation light amount detection unit from the photodiode and the voltage obtained by converting the output current of the photodiode. A thermal displacement conversion element control device comprising a conversion circuit that outputs a voltage to which an arbitrary voltage is applied from the outside. (13) In the thermal displacement conversion element control device having the configuration (1), the thermal displacement conversion element control device using a shape memory alloy for the thermal displacement conversion element. (14) A plurality of light branching means of light energy supplying means for supplying light energy are provided, and the thermal displacement conversion element heated by the light energy branched by the light branching means and the light irradiation means for illuminating the thermal displacement conversion element. And a sensor for receiving the reflected light thereof, and a supply light energy adjusting means for adjusting the amount of light from the light energy supply means for heating the thermal displacement conversion element according to the received light intensity changed by the displacement of the thermal displacement conversion element. A thermal displacement conversion element control device having: (15) The thermal displacement conversion element control device according to the above-mentioned configuration 14, wherein the thermal displacement conversion element control device has a plurality of light branching means for equalizing the light energy branched by the light branching means. (16) In the thermal displacement conversion element control device having the configuration (14), the thermal displacement conversion element control device using a shape memory alloy for the thermal displacement conversion element. (17) A thermal displacement conversion element control device in which the amount of light of a light irradiation unit that illuminates the thermal displacement conversion element is variable according to an external command. (18) In the thermal displacement conversion element control device having the configuration (17), the light irradiation means is a voltage setting means and a semiconductor laser. (19) In the thermal displacement conversion element control device having the configuration (14), supply light for adjusting the amount of light from the light energy supply means for heating the thermal displacement conversion element by adding an external command value to the received light intensity. A thermal displacement conversion element control device having an energy adjusting means. (20) In the thermal displacement conversion element control device having the configuration (19), the conversion means for converting the reflected light into a voltage applies a photodiode and a voltage obtained by converting the output current of the photodiode and an arbitrary voltage from the outside. A thermal displacement conversion element control device comprising a conversion circuit that outputs a voltage. (21) In the thermal displacement conversion element control device having the configuration (14), a supply light energy adjusting means for adjusting the light quantity from the light energy supplying means by using an amount obtained by adding proportionally and integral differentiating the received light intensity. A thermal displacement conversion element control device having. (22) In the thermal displacement conversion element control device having the configuration (14), the optical energy supply device for supplying optical energy is a thermal displacement conversion element control device including a laser light source and an optical fiber. (23) In the thermal displacement conversion element control device having the configuration (14), there is provided a thermal displacement conversion element control device having reflected light amount changing means applied to the thermal displacement conversion element for changing the reflection intensity depending on the displacement of the thermal displacement conversion element. (24) In the thermal displacement conversion element control device having the configuration (14), the light displacement means uses a part of the light supplied by the light energy supply means. (25) In the thermal displacement conversion element control device having the above configuration (24), the thermal displacement having an optical modulator for branching a part of the light supplied by the light energy supply means by the light irradiation means and adjusting the irradiation light amount. Conversion element control device. (26) In the thermal displacement conversion element control device having the configuration (24), the supplied light energy adjusting means for adjusting the amount of light from the optical energy supply means comprises an optical modulator and an irradiation light amount detection means. (27) In the thermal displacement conversion element control device having the configuration (26), the conversion unit that converts the reflected light into a voltage is the photodiode and the output voltage of the irradiation light amount detection unit is converted from the voltage obtained by converting the output current of the photodiode. A thermal displacement conversion element control device comprising a conversion circuit for pulling and applying an arbitrary voltage from the outside. (28) A plurality of branch type light modulation means is provided in the light energy supply means for transmitting light energy, and a thermal displacement conversion element heated by the light energy branched by the branch type light modulation means and a thermal displacement conversion element are provided. Light irradiation means to illuminate,
A sensor for receiving the reflected light and a branching ratio of the light of the branch type light modulation means for heating the thermal displacement conversion element according to the received light intensity which is changed by the displacement of the thermal displacement conversion element and is integrated by at least the integration means. Control device for adjusting thermal displacement conversion element. (29) The thermal displacement conversion element control device having the configuration (28), wherein a shape memory alloy is used for the thermal displacement conversion element. (30) In the thermal displacement conversion element control device having the configuration (28), the amount of light of the light irradiation means that illuminates the thermal displacement conversion element is variable according to an external command. (31) In the thermal displacement conversion element control device having the configuration (30), the light irradiation means is a voltage setting means and a semiconductor laser. (32) In the thermal displacement conversion element control device having the configuration (28), the thermal displacement conversion element control for adjusting the light splitting ratio of the split light modulating means according to an amount obtained by adding the received light intensity and a command value from the outside. apparatus. (33) In the thermal displacement conversion element control device having the configuration (32), the sensor that receives the reflected light converts the photodiode and the output current of the photodiode, which is integrated by the integration circuit and then an arbitrary voltage from the outside is applied. A thermal displacement conversion element control device comprising an additional conversion circuit. (34) In the thermal displacement conversion element control device having the configuration (28), the light branching ratio of the branching light modulator is adjusted by an amount obtained by adding the received light intensity and the received light intensity before integration in proportion and differentiation. Thermal displacement conversion element control device. (35) In the thermal displacement conversion element control device having the above configuration (28), the thermal displacement conversion element control device in which the light source for supplying optical energy and the optical transmission means are a laser light source and an optical fiber. (36) In the thermal displacement conversion element control device having the configuration (28), the thermal displacement conversion element control device having a reflected light amount changing means applied to the thermal displacement conversion element that changes the reflection intensity depending on the displacement of the thermal displacement conversion element. (37) In the thermal displacement conversion element control device having the configuration (28), the thermal displacement conversion element control device using part of the light supplied by the light energy supply means to the light irradiation means for illuminating the thermal displacement conversion element. (38) In the thermal displacement conversion element control device having the configuration (37), the light irradiation means splits a part of the light supplied by the light energy supply means, and the irradiation light amount sensor for measuring the irradiation light amount and the irradiation light amount are provided. A thermal displacement conversion element control device having an optical modulator that is adjusted by an external command. (39) In the thermal displacement conversion element control device having the configuration (37), the branch type optical modulation means for adjusting the amount of light from the optical energy supply means comprises an optical modulator and an irradiation light amount detection means. (40) In the thermal displacement conversion element control device having the configuration (39), the conversion means for converting the reflected light into a voltage changes the output voltage of the irradiation light amount detection means from the photodiode and the voltage obtained by converting the output current of the photodiode. A thermal displacement conversion element control device comprising a conversion circuit for applying an arbitrary voltage from the outside after drawing and integrating by an integrator. (41) In the thermal displacement conversion element control device having the configuration (28), the branch type optical modulation means reflects the air gap forming means for providing a space in the optical transmission line and a part of the light flux in the air gap to perform thermal displacement conversion. A thermal displacement conversion element control device comprising a mirror drive type optical modulator for irradiating an element. (42) In the thermal displacement conversion element control device having the above configuration (41), the thermal displacement conversion element control device using a pair of lenses for the gap forming means. (43) In the thermal displacement conversion element control device having the configuration (41), a thermal displacement conversion element control device using a piezoelectric bimorph for a mirror drive type optical modulator. (44) Thermal displacement conversion element control having a thermal displacement conversion element, a light irradiation unit that illuminates the thermal displacement conversion element, and a phase conjugate mirror that amplifies reflected light changed by the displacement of the thermal displacement conversion element and irradiates the thermal displacement conversion element apparatus. (45) In the thermal displacement conversion element control device having the configuration (44), the thermal displacement conversion element control device using a shape memory alloy for the thermal displacement conversion element. (46) In the thermal displacement conversion element control device having the configuration (44), the amount of light of the light irradiation means that illuminates the thermal displacement conversion element is variable according to a command from the outside. (47) In the thermal displacement conversion element control device having the configuration (44), the thermal displacement conversion element control device having reflected light amount changing means applied to the thermal displacement conversion element that changes the reflection intensity depending on the displacement of the thermal displacement conversion element. (48) In the thermal displacement conversion element control device having the configuration (44), the light irradiation means uses light from the same light source as the phase conjugate mirror. (49) In the thermal displacement conversion element control device having the configuration (44), the thermal displacement conversion element control device that configures a phase conjugate mirror by using degenerate four-wave mixing. (50) A plurality of thermal displacement conversion elements, a light irradiation means for illuminating each thermal displacement conversion element, an optical branching / merging means for converging a plurality of reflected lights changed by the displacement of the plurality of thermal displacement conversion elements, and their confluence. A thermal displacement conversion element control device having a phase conjugate mirror that amplifies the generated light and irradiates each thermal displacement conversion element through the reverse path. (51) In the thermal displacement conversion element control device having the configuration (50), the thermal displacement conversion element control device using a shape memory alloy for the thermal displacement conversion element. (52) In the thermal displacement conversion element control device having the configuration (50), the amount of light of the light irradiation unit that illuminates the thermal displacement conversion element is variable according to an external command. (53) In the thermal displacement conversion element control device having the configuration (50), the thermal displacement conversion element control device having a reflected light amount changing means applied to the thermal displacement conversion element that changes the reflection intensity depending on the displacement of the thermal displacement conversion element. (54) In the thermal displacement conversion element control device having the above configuration (50), a light irradiation means for irradiating each thermal displacement conversion element with an equal amount of light from the same light source as the phase conjugate mirror by using the light transmission means and the optical branching means. And a thermal displacement conversion element control device. (55) In the thermal displacement conversion element control device having the configuration (50), the thermal displacement conversion element control device that configures a phase conjugate mirror using degenerate four-wave mixing. B. The related art of each of the above-described configurations is as follows. Configurations (1) to (13) and (44) to (49) For position control of a thermal displacement conversion element such as a shape memory alloy, a displacement is measured using a potentiometer or a strain gauge as a position sensor, The position was controlled by feeding back the value. Configurations (14) to (43) and Configurations (50) to (55) For example, as disclosed in Japanese Patent Application Laid-Open No. 5-253172 by the present applicant, a shape memory alloy that changes shape by electric heating. In an actuator drive device that feeds and drives a plurality of actuators, an energization control element is inserted in series with respect to a plurality of actuators that are respectively connected to a power supply path, and the energization control element is selectively energized by a control means. In this way, a power supply path is not required for each actuator, and the power supply path can be shared and omitted. C. The problems to be solved by the invention having the above-described configuration are as follows. Configurations (1) to (13) and (44) to (49) In the related art, for example, when a thermal displacement conversion element is used for an actuator of each joint of a manipulator and displacement feedback control is performed at each joint, Since the potentiometer has a complicated configuration, it is difficult to miniaturize the manipulator,
A contact type sensor such as a strain gauge has a problem that an adhesive surface is deteriorated due to a temperature change when the thermal displacement conversion element is driven. Therefore, the present invention overcomes this problem,
It is an object of the present invention to provide a thermal displacement conversion element control device that can be easily downsized and has little deterioration of a displacement sensor. Configurations (14) to (43) and (50) to (55) When the conventional technique is used for a manipulator, for example, when the length of the manipulator becomes long, the power feeding line is increased as the actuator at the tip of the manipulator is driven. Has a problem that the efficiency of heating the shape memory alloy deteriorates. Therefore, an object of the present invention is to provide a thermal displacement conversion element control device that overcomes this problem and does not deteriorate the efficiency of heating the shape memory alloy even at the tip of the manipulator. D. The operation and effect of the above configuration are as follows. Configurations (1) to (13) This configuration corresponds to the first embodiment, and the thermal displacement conversion element described in the configuration is the shape memory alloy 101 in the embodiment, and the light energy supply means is the Ar laser light source 108 and the optical fiber. 1
The light irradiation means corresponds to the semiconductor laser 111 and the voltage setting circuit 112, the sensor for receiving the reflected light corresponds to the photodiode 113 and the detection circuit 114, and the supplied light energy adjusting means corresponds to the semiconductor optical modulator 110. (Operation) A certain amount of light set from the outside is applied to the thermal displacement conversion element from the light irradiation means, and the reflected light that changes depending on the displacement of the thermal displacement conversion element is converted by the sensor into a voltage corresponding to the received light intensity. By applying the voltage to the supplied light energy adjusting means, the light energy supplied to the thermal displacement conversion element for heating by the light transmitting means is adjusted. (Effect) The displacement of the thermal displacement conversion element is detected by irradiating the light from the light irradiating means to the thermal displacement conversion element, determining the displacement by the reflected light, and adjusting the optical energy supplied to the thermal displacement conversion element by the optical modulator. Can be performed without contact, and a displacement feedback loop can be realized with a simple configuration. Further, since the energy for heating the thermal displacement conversion element is transmitted by light, the energy loss can be reduced. Configurations (14) to (27) This configuration corresponds to the second embodiment, and the thermal displacement conversion element described in the configuration is the shape memory alloy 101 in the embodiment, and the light energy supply means is the Ar laser light source 208 and the optical fiber. Two
09, the optical branching means is the Y-type branching waveguide 216, and the light irradiating means is the semiconductor laser 111 and the voltage setting circuit 112.
In addition, the sensor that receives the reflected light is the photodiode 113.
In addition, the semiconductor light modulator 110 corresponds to the supply light energy adjusting means in the detection circuit 114. (Operation) A certain amount of light set from the outside is applied to the thermal displacement conversion element from the light irradiation means, and the reflected light that changes depending on the displacement of the thermal displacement conversion element is converted by the sensor into a voltage corresponding to the received light intensity. By applying the voltage to the supplied light energy adjusting means, the light energy supplied by the light transmitting means for irradiating the thermal displacement conversion element for heating is adjusted. This light is supplied to the plurality of thermal displacement conversion elements by the optical transmission means and the optical branching means. (Effect) The displacement of the thermal displacement conversion element is detected by irradiating the light from the light irradiating means to the thermal displacement conversion element, determining the displacement by the reflected light, and adjusting the optical energy supplied to the thermal displacement conversion element by the optical modulator. Can be performed without contact, and a displacement feedback loop can be realized with a simple configuration. Further, since the energy for heating the thermal displacement conversion element is transmitted by light, it is possible to reduce the loss of portions other than the light branching means. In addition, a single energy transfer path can be used to drive a plurality of thermal displacement conversion elements. Configurations (28) to (43) This configuration corresponds to the fifth embodiment, and the thermal displacement conversion element described in the configuration is the shape memory alloy 101 in the embodiment, and the light energy supply means is the Ar laser light source 308 and the optical fiber. Three
09, the optical branching type optical modulation means is a directional coupling type optical modulator 3
10, the light irradiation means corresponds to the semiconductor laser 111 and the voltage setting circuit 112, and the sensor for receiving the reflected light corresponds to the photodiode 113 and the detection circuit 114. (Operation) A certain amount of light set from the outside is applied to the thermal displacement conversion element from the light irradiation means, and the reflected light that changes depending on the displacement of the thermal displacement conversion element is converted by the sensor into a voltage corresponding to the received light intensity. By applying the voltage to the branch type light change adjusting means, the light energy supplied by the light transmitting means for irradiating the thermal displacement conversion element for heating is adjusted. This light is supplied to the plurality of thermal displacement conversion elements by the optical transmission means and the branch type optical change adjusting means. (Effect) The displacement of the thermal displacement conversion element is detected by irradiating the light from the light irradiating means to the thermal displacement conversion element, determining the displacement by the reflected light, and adjusting the optical energy supplied to the thermal displacement conversion element by the optical modulator. Can be performed without contact, and a displacement feedback loop can be realized with a simple configuration. Further, since the energy for heating the thermal displacement conversion element is transmitted by light, it is possible to reduce the loss of portions other than the light branching means. In addition, a single energy transfer path can be used to drive a plurality of thermal displacement conversion elements. Further, since the branch type switch is used, the branch and the optical modulator are integrated into one element, which simplifies the configuration. further,
The loss at the time of branching can be reduced. Configurations (44) to (49) This configuration corresponds to the seventh embodiment, and the thermal displacement conversion element described in the configuration is the shape memory alloy 101 in the embodiment, the light irradiation means is the Ar laser light source 511, and the optical fiber 514. , Y-shaped branch waveguide 515 and semiconductor optical modulator 516, and the phase conjugate mirror corresponds to the phase conjugate mirror 508. (Operation) A certain amount of light set from the outside is applied to the thermal displacement conversion element from the light irradiation means, and the reflected light that changes depending on the displacement of the thermal displacement conversion element is incident on the phase conjugate mirror. The light incident on the phase conjugate mirror is amplified and reflected, and is irradiated onto the thermal displacement conversion element through the same path to heat the thermal displacement conversion element. (Effect) A certain amount of light set from the outside is applied to the thermal displacement conversion element from the light irradiation means, the reflected light that changes due to the displacement of the thermal displacement conversion element is amplified by the phase conjugate mirror, and is converted into the thermal displacement conversion element. Since the supplied light energy is adjusted, the displacement can be detected in a non-contact manner, and the displacement feedback loop can be realized with a simple configuration. Further, since the energy for heating the thermal displacement conversion element is transmitted by light, the energy loss can be reduced. Configurations (50) to (55) This configuration corresponds to the eighth embodiment, and the thermal displacement conversion element described in the configuration is the shape memory alloy 101 in the embodiment, the light irradiation means is the Ar laser light source 511, and the optical fiber 514. , Y-type branch waveguide 515 and semiconductor optical modulator 516, the optical branching / merging means corresponds to Y-type branching / merging waveguide 621, and the phase conjugate mirror corresponds to phase conjugate mirror 608. (Function) A certain amount of light set from the outside is applied to each thermal displacement conversion element from a plurality of light irradiation means, and the reflected light that changes due to the displacement of the thermal displacement conversion element joins at the optical branching and joining means. It is incident on the phase conjugate mirror. The light incident on the phase conjugate mirror is amplified and reflected, and is irradiated onto the thermal displacement conversion element through the same path to heat the thermal displacement conversion element. (Effect) A certain amount of light set from the outside is applied to the thermal displacement conversion element from the light irradiation means, the reflected light that changes due to the displacement of the thermal displacement conversion element is amplified by the phase conjugate mirror, and is converted into the thermal displacement conversion element. Since the supplied light energy is adjusted, the displacement can be detected in a non-contact manner, and the displacement feedback loop can be realized with a simple configuration. Further, since the energy for heating the thermal displacement conversion element is transmitted by light, the energy loss can be reduced. Further, by using the branching and joining means, a plurality of thermal displacement conversion elements can be driven by a single energy transfer path.

[0083]

According to the above-mentioned invention, it is possible to provide a thermal displacement conversion element control device which can be easily downsized and whose displacement sensor is less deteriorated.

[Brief description of drawings]

FIG. 1 is a block diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a structure of a manipulator joint portion according to the first embodiment.

FIG. 3 is a configuration diagram of a reflected light amount changing unit.

FIG. 4 is a voltage setting circuit diagram.

FIG. 5 is a diagram showing voltage setting timing.

FIG. 6 is a block diagram showing a second embodiment.

FIG. 7 is a diagram illustrating a structure of a manipulator joint portion according to a second embodiment.

FIG. 8 is a block diagram showing a third embodiment.

FIG. 9 is a diagram illustrating a structure of a manipulator joint portion according to a third embodiment.

FIG. 10 is a block diagram showing a fourth embodiment.

FIG. 11 is a diagram illustrating a structure of a manipulator joint portion according to a fourth embodiment.

FIG. 12 is a coating diagram of a reflected light amount changing unit and a black body paint.

FIG. 13 is a block diagram showing a fifth embodiment.

FIG. 14 is a diagram illustrating a structure of a manipulator joint portion according to a fifth embodiment.

FIG. 15 is a block diagram showing a sixth embodiment.

FIG. 16 is a diagram illustrating a structure of a manipulator joint portion according to a sixth embodiment.

FIG. 17 is a block diagram showing a seventh embodiment.

FIG. 18 is a diagram illustrating a structure of a manipulator joint portion according to a seventh embodiment.

FIG. 19 is a configuration diagram of a phase conjugate mirror of a seventh embodiment.

FIG. 20 is a block diagram showing an eighth embodiment.

FIG. 21 is a diagram illustrating a structure of a manipulator joint portion according to an eighth embodiment.

FIG. 22 is a configuration diagram of a phase conjugate mirror of an eighth embodiment.

[Explanation of symbols]

Reference numeral 101 ... Shape memory alloy film, 102 ... Shape memory alloy heating means, 103 ... Displacement detecting means, 106 ... Reflected light amount changing means, 107 ... Black body paint, 108 ... Laser light source, 109 ...
Optical fiber, 110 ... Optical modulator, 111 ... Semiconductor laser, 112 ... Voltage setting circuit, 113 ... Photodiode, 114 ... Detection circuit.

Claims (1)

[Claims] 1. A thermal displacement conversion element, an optical energy supply means for supplying optical energy to the thermal displacement conversion element to heat and displace the thermal displacement conversion element, and the thermal displacement conversion element for displacement measurement. Light irradiation means for irradiating illumination light, a sensor for receiving the reflected light from the thermal displacement conversion element, and the light energy supply means for receiving light intensity of the sensor changed by the displacement of the thermal displacement conversion element. A thermal displacement conversion element control device comprising: a supply light energy adjusting means for adjusting an amount of light energy supplied to the thermal displacement conversion element.