JPH0880468A - Spinner device - Google Patents

Abstract

PURPOSE: To suppress an uneven intra-plane distribution of the thickness of a resin film to be formed and form the resin film having a uniform film thickness in a spinner device which forms a resin film on a substrate by a spin coating method. CONSTITUTION: A vessel consisting of a first bar 27 for sealing, the second bar 37 for sealing provided with notched parts and a cap 48 which is commonly used to the first and second bars 27 and 37 is provided on a spin table 41, and a spin stage 41a and the substrate 10 mounted on the spin stage 41a are surrounded with this vessel.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin coater for resin materials, and more particularly to a spin coater for forming a thin film.

In recent years, LCDs (Light Crystals)
2. Description of the Related Art With the improvement in quality of displays, high quality is demanded for color filters.

Especially when manufacturing a color filter,
The uniformity of the resin film in the step of applying the resin on the glass substrate is a problem that directly affects the transmittance distribution of the color filter. Therefore, development of a spinner device for applying and forming a resin film having a more uniform film thickness is effective in providing a high quality color filter.

[0004]

13 and 14 show a schematic structure of a conventional spinner device.

FIG. 13 is a block diagram of a conventional spinner device 1, FIG. 14 (a) is a top view of a film forming part 20a which is a main part of the spinner device, and FIG. 14 (b) is a similar film forming part 20a. FIG.

The spinner device 1 is roughly composed of a motor portion 20b for rotating the spin table 11 and a film forming portion 20a for spin coating a resin film on the film forming substrate 10 (hereinafter, simply referred to as a substrate).

The motor section 20b includes a mount 15 and a mount 15
And the motor 12 stored in the film forming unit 2
It consists of a shaft 14 connected to 0a. In addition, the film forming unit 2
Reference numeral 0a includes a spin table 11 and a spin stage 11a provided thereon.

A chamber 13 for covering the entire film forming section 20a and a resin dropping section 16 are attached to the pedestal 15.

The chamber 13 houses the spin table 11 and the entire spin stage 11a therein, and is configured to prevent the resin from scattering. The door 13a provided in the chamber 13 is an opening / closing type, and the substrate 10 is attached / detached.
And used when cleaning the inside of the chamber.

When the resin is applied by the above-mentioned conventional spinner device 1, the substrate 10 is set on the spin stage 11a, the resin is dropped on the substrate 10 from the dropping portion 16, and the motor 12 is operated. The motor 12 is connected to a spin stage 11a provided on the spin table 11 by a shaft 14, and the shaft 14 rotates the spin table 11a.
Then, the spin table 11 is rotated together with the spin stage 11a thereon for a predetermined time.

During the rotation, the dropped resin spreads on the substrate 10 due to the centrifugal force due to the rotation of the spin stage 11a, and gradually increases in viscosity as it dries, and eventually completely dries to form a resin film. A film is formed on the substrate 10. The thickness of the resin film depends on the speed of rotation and the temperature and viscosity of the resin film.

[0012]

By the way, the influence of high speed rotation on the resin is not uniform on the substrate.

That is, since the peripheral speed of rotation is proportional to the radius of rotation, the peripheral portion of the substrate 10 farther from the center of rotation is more affected by the drying by the atmosphere and the resin dries faster.
Since the viscosity of the resin is also increased by the drying, the thickness of the resin film to be formed becomes thicker in the peripheral portion of the substrate 10 than in the center of the substrate 10, resulting in a film thickness distribution within the substrate surface 10.

The above-mentioned problem becomes remarkable especially when the solvent of the resin is volatile, and causes the quality of the color filter to deteriorate.

That is, if the film thickness of the resin film is thick, the transmittance decreases, and if it is thin, the transmittance increases. Therefore, the distribution of resin film thickness is
As it is, it is reflected in the distribution of the transmittance of the color filter using the resin film.

On the other hand, the motor 12 that rotates the spin table 11 at high speed generates heat when it is driven. The generated heat is transmitted to the spin table 11 via the shaft. The heat conducted to the spin table 11 is transmitted to the spin table 11 around the shaft 14 that supports the spin table 11, and a temperature distribution is also generated on the spin stage 11a on the spin table 11 and finally on the substrate 10. Let

In this case, the resin in the center of the substrate 10 hardens faster than in the previous example, so that a resin film having a large thickness in the vicinity of the center is generated, but the resin film is distributed in the thickness of the resin film. Is the same in reducing the quality of the LCD color display.

FIG. 15 shows the transmittance distribution of the resin film formed by the conventional spinner device 1.

The transmittance was measured by using the "reduced transmittance method". The resin film was exposed to light and the incident light was measured.
The transmittance is evaluated by the ratio of reflected light.

It can be seen that the peripheral transmittance is lower than that in the central portion, and that the linearly low transmittance portion is in the center. As described above, this distribution is that the peripheral portion of the substrate 10 rotates faster than the central portion when the resin is spin-coated, and is strongly affected by the air flow. In addition, a part of the center is affected by heat generated by the motor 12.

In view of the above points, the present application aims to provide a high quality color filter by forming a resin film having a uniform film thickness by spin coating.

[0022]

According to another aspect of the present invention, there is provided a spinner device which is connected to a motor to rotate, a spin table which is provided on the spin table and rotates together with the spin table, and a film-forming material on the surface of the spin table. It is characterized by comprising a spin stage on which a substrate on which a film is formed by dropping is placed, and a container which is arranged on a spin table and surrounds the substrate placed on the spin stage. .

According to a second aspect of the present invention, in the spinner device, the container is composed of a frame-shaped sealing bar arranged so as to surround the spin stage, and a lid arranged above the sealing bar. It is characterized by having done.

The spinner device according to a third aspect of the present invention is characterized in that the sealing bar is provided with a cutout portion for discharging the scattered film forming material to the outside of the container.

In the spinner device according to the invention of claim 4, the container is arranged so as to surround the spin stage, and
A first sealing bar having a frame shape in which a notch is formed to discharge the film forming material scattered from the substrate to the outside, and a second sealing bar having a frame shape arranged so as to surround the first sealing bar.
It is characterized in that it is constituted by the sealing bar and the lid provided on the upper part of the first and second sealing bars.

According to the fifth aspect of the present invention, the spinner device stores the film forming material leaked to the outside of the first sealing bar through the notch, outside the sealing bar having the notch on the spin table. It is characterized in that a waste liquid tank is installed.

According to a sixth aspect of the present invention, the spinner device spins the film forming material leaked to the outside of the sealing bar having the cutout portion on the spin table to the outside of the first sealing bar via the cutout portion. The present invention is characterized in that a discharge mechanism for discharging to the outside of the table is provided.

According to a seventh aspect of the present invention, there is provided a spinner device, which is connected to a motor to rotate, a spin table, a spin stage on which a substrate is placed and which is provided on the spin table and rotates together with the spin table, and a spin table. And a spin connecting stage between the spin stage and a temperature equalizing means for equalizing the temperature on the spin stage.

According to the eighth aspect of the present invention, the spinner device is characterized in that the temperature equalizing means is constituted by a radiation fin. The spinner device according to the invention of claim 9 is
The heat radiation fin is provided on the shaft portion.

The spinner device according to a tenth aspect of the present invention is characterized in that the radiation fin is provided on the spin table.

According to the eleventh aspect of the present invention, the temperature equalizing means comprises a suction mechanism arranged on the spin stage for sucking the atmosphere, and the passage of the air flow generated by the suction mechanism is located on the back surface of the substrate. With such a setting, the substrate is cooled by the air flow.

According to the twelfth aspect of the present invention, the spinner device is characterized in that the temperature equalizing means is constituted by a hot plate arranged on the spin table and controlling the temperature of the surface of the spin stage.

[0033]

According to the first aspect of the present invention, since the container, which is composed of the sealing bar for enclosing the spin stage and the lid, for preventing the scattering of the resin is provided on the spin table, the film forming environment surrounded by the container is provided. Atmosphere rotates with the spin stage. Therefore, it is possible to prevent the resin from scattering and to prevent the air flow from being generated, and it is possible to perform a favorable film forming process.

According to the second aspect of the invention, since the sealing bar and the lid each have a simple structure, the container can be easily manufactured, and the cost can be reduced and the container can be mounted on the spin table. Ease of implementation facilitates the practice of the present invention. According to the invention of claim 3, during the rotation of the spin stage, the resin scattered from the substrate is discharged from the notch of the sealing bar to the outside of the container including the sealing bar and the lid, so that the resin is adhered to the inner wall of the container. Prevents adhesion. Therefore, it is possible to prevent the resin attached to the inner wall of the container from scattering and attaching again to the substrate.

According to the invention of claim 4, since the first sealing bar having the cutout portion is provided inside, the resin material scattered from the substrate mounted on the spin stage is discharged from the cutout portion. It does not stop near the resin film to be formed.
Further, since the second sealing bar is arranged so as to enclose the first sealing bar, the resin material scattered from the cutout portion of the first sealing bar is prevented from scattering outside the spinner device. The atmosphere of the film forming environment is enclosed to prevent the generation of air flow.

By placing the first sealing bar and the second sealing bar together in the above-described structure, the resin film is affected by the redeposition of the scattered resin material and the difference in the drying speed within the plane of the substrate. Film is formed without any problem.

According to the fifth aspect of the present invention, the resin material scattered from the cutout portion of the first sealing bar adheres to the inner wall of the second sealing bar. The deposited resin material is accumulated according to the number of substrates to be processed by the spinner device, and limits the continuous processing amount of the spinner device. Therefore, the continuous processing capacity is increased by providing the waste liquid tank for storing the leaked film forming material.

According to the sixth aspect of the present invention, when the spinner device is provided with the waste liquid tank of the scattered resin film material, the continuous processing capacity of the spinner device is limited by the allowable amount of the waste liquid tank. By providing a waste liquid outflow mechanism outside the bar, further continuous processing is possible.

According to the seventh aspect of the present invention, the heat generated by the motor is lost by the temperature equalizing means, so that it is not transmitted to the substrate and no temperature distribution is generated on the substrate.

According to the invention of claim 8, the heat generated by the motor is efficiently exposed to the atmosphere and radiated by the temperature equalizing means constituted by the radiation fins, so that the temperature distribution on the substrate does not reach the substrate. Do not generate.

According to the ninth aspect of the present invention, the heat generated by the motor is transmitted to the radiating fins of the shaft portion, and is sufficiently exposed to the atmosphere by the large surface area of the radiating fins for cooling. Therefore, the film formation substrate is not affected by heat and does not have a temperature distribution.

According to the tenth aspect of the invention, the heat generated by the motor is transmitted to the heat radiation fins below the spin table,
The large surface area of the radiating fins allows it to be fully exposed to the atmosphere for cooling. Therefore, the film formation substrate is not affected by heat and does not have a temperature distribution.

According to the eleventh aspect of the present invention, the heat generated by the motor heats the atmosphere on the back surface of the substrate, but the passage of the air flow generated by the suction mechanism is set to be located on the back surface of the substrate. The low-temperature atmosphere, which is not affected by the heat of the motor, constantly flows into the back surface of the substrate to cool the substrate and prevent the temperature of the substrate from changing.

According to the spinner device of the invention of claim 12,
The temperature on the spin stage is uniform regardless of the heat generated by the motor by the hot plate that controls the temperature of the surface of the spin stage.

[0045]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to the drawings.

This embodiment corresponds to claim 2.

FIG. 3 is a schematic configuration diagram of the entire spinner device 2 of the first embodiment.

Like the spinner device 1 described in the conventional example, the spinner device 2 is roughly divided into a film forming section 30a and a motor section 30b. The feature of this embodiment as compared with the spinner device 1 is the film forming unit 30a.

The structure of the motor unit 30b and the structure of the chamber 23 attached to the mount 25 of the motor unit covering the entire film forming unit 30a are the same as those of the conventional spinner device 1. However, the feature of the present embodiment is the configuration of the film forming unit 30a, and therefore, the configuration of the film forming unit 30a, which is the main part of the present embodiment, is enlarged and shown in FIG.

FIG. 4A is a top view of the spin table 21 of the film forming section 30a and the spin stage 21a provided on the spin table 21, and FIG. 4B shows the spin table 21 and the spin stage 21a. It is a side view.

Hereinafter, a schematic configuration of the spinner device 2 and the film forming portion 30a thereof will be described with reference to FIGS.

The film forming section 30a includes a spin table 21,
A spin stage 21a placed on top of which a substrate is placed
And a sealing bar 27 and a lid 28.

The sealing bar 27 means the spin stage 21.
It is a rectangular frame that is installed so as to surround the periphery around a, and its height is higher than that of the spin stage 21a. When the lid 28 is placed on the sealing bar 27, the spin stage 21a is closed. It is in a state of being hermetically sealed in a container having 27 as a side surface and a lid 26 as an upper surface. (The sealing bar 27 is hereinafter referred to as a first sealing bar). The film forming unit 3
0a is installed in the chamber 23 of the spinner device 2.

When the resin film is formed by using the spinner device 2, first, the lid 28 is opened, and the substrate 10 is set and fixed on the spin stage 21a. On the fixed substrate 10, a colored resin, for example, CR-20 manufactured by Fuji Hunt Co., Ltd.
After 0 is dropped and the lid 28 is closed, the spinner part including the spin table and the 21 spin stage 21a is rotated at a desired rotation speed.

In the figure, reference numeral 10 denotes a resin film forming substrate, which is made of resin (eg, glass-epoxy resin).

Since the container composed of the sealing bar 27 and the lid 26 is provided on the spin table 21, it rotates with the rotation of the spin table 21. Further, the substrate 10 placed on the spin stage 21a is in a state of being hermetically sealed in a container constituted by the sealing bar 27 and the lid 26.

Therefore, the substrate 1 on the spin stage 21a
0, and the resin being formed on the substrate 10 is not affected by the air flow of the atmosphere even when rotating at high speed. Therefore, in the container enclosed by the sealing bar 27 and the lid 26, the drying speed of the resin becomes uniform regardless of the central portion and the peripheral portion of the substrate.
A resin film having a uniform film thickness is formed within the surface of the substrate 10.

In order to verify the uniformity of the thickness of the resin film formed in this example, the in-plane distribution of the transmittance of the resin film was measured by using the reductive transmittance measuring method for the resin film.

FIG. 5 shows the transmittance distribution of the resin film formed by the spinner device 2 of the first embodiment. From FIG. 5, it can be considered that the transmittances at the peripheral portion and the central portion of the substrate are substantially uniform, so that the transmittance at the peripheral portion of the substrate is reduced in the resin film formed by the conventional spinner device 1. It was confirmed that there was not. (The decrease in transmittance that occurs in the central portion will be described later.) However, since the sealing bar 27 is provided on the spin table 21, it is installed relatively close to the spin stage 21a. Therefore, a part of the resin applied on the substrate 10 is scattered around when the spin stage 21a rotates at high speed. The scattered resin adheres to the sealing bar 27, but the adhered resin may drop onto the substrate 10 again.

In this embodiment, as described above, the problem that the peripheral portion of the substrate 10 is thickened due to the influence of the air flow can be solved, but on the other hand, the resin film falling on the substrate 10 is being formed. There is a problem that causes unevenness of the film quality.

Therefore, the invention for preventing the adhered resin from dropping onto the substrate 10 again will be described in the second embodiment.

The second embodiment corresponds to the invention described in claim 3 of the present invention.

The spinner device 3 of the second embodiment has a structure in which the film forming unit 30a of the spinner device 2 of the first embodiment is replaced with the film forming unit 40a of the spinner device 3. That is, in the present embodiment as well, a peculiar effect is produced by the configuration of the film forming unit 40a, and therefore the overall view of the spinner device 3 is omitted and the film forming unit 40a forming the main part is shown and described.

FIG. 6 is a schematic configuration diagram of the second embodiment.

FIG. 6A is a top view of the spin stage 31a constituting the film forming section and the spin table 31 provided with the spin stage 31a, and FIG. 6B is the spin table 31 and the spin table 31. It is a side view of stage 31a.

The film forming section 40a includes a spin table 31,
The spin stage 31a, which is provided thereon and on which the substrate 10 is placed, includes a sealing bar 37, and a lid 38.

The resin film forming substrate 10 has the same structure as that of the first embodiment.

The sealing bar 37 of the second embodiment has a structure in which the sealing bar 27 of the first embodiment is provided with a cutout portion 37a. As shown in FIG. 6, the processing for providing the notch portion 37a on the sealing bar 27 is performed by cutting the sealing bar 27 on a strip so that the sealing bar 27 has the same size and shape as the notch portion. And the lower half is removed by cutting in the height direction. However, the sealing bar 37 is attached to the spin table 3
Only a few points were left without removal in order to fix them on 1. This sealing bar 37 is replaced with the first sealing bar 27.
To the second sealing bar.

When the lid 36 is placed on the sealing bar 37, a part of the sealing bar 37 remaining without being removed is in a state of protruding downward from the lower surface of the lid 26.

The spinner device 3 was used to form a resin film with a colored resin in the same procedure as in the first embodiment. Even if a part of the resin applied to is scattered around the periphery when the spin stage 31a rotates at high speed,
The scattered resin is discharged to the outside of the sealing bar 37 through the notch provided in the sealing bar 37. Therefore, the resin does not fall onto the substrate 10 again.

In the present embodiment, however, the problem that the resin adhered to the sealing bar drops onto the substrate again and deteriorates the film quality, while the sealing bar 37 has the cutout portion 37a.
Therefore, the film forming unit 40a communicates with the outside air, and the atmosphere in the film forming environment is not enclosed, and the resin film is affected by the air flow. Therefore, in the configuration of the second embodiment, the influence of the air flow due to the rotation is the first.
The number is increased as compared with the spinner device 2 of the embodiment.

Furthermore, when the notch 37a rotates at a high speed, a new air flow of the atmosphere is generated, which makes the drying speed of the resin non-uniform within the surface of the substrate 10, thereby forming a film of the resin film. A new problem arises, where there is a thickness distribution.

Therefore, in order to solve the problems occurring in the first and second embodiments, a third embodiment corresponding to the invention of claim 4 was implemented.

FIG. 1 is a schematic configuration diagram of the third embodiment. Also in the spinner device 4 of the present embodiment, since the film forming section 50a produces the effect peculiar to the present embodiment, only the configuration of the film forming section 50a is shown as in the first and second embodiments. Will be explained.

FIG. 1A is a top view of the spin stage 41a of the film forming unit 50a and the spin table 41 provided with the spin stage 41a, and FIG. 1B is the spin table 41 and the spin stage. 41a is a side view of FIG.

The film forming section 50a, which is an essential part of this embodiment, is composed of a spin table 41 and a spin table 41a which is arranged on the spin table 41 and on which a substrate is placed.
In addition, the first sealing bar 27 and the second sealing bar 37 are arranged on the spin table 41.

Specifically, first, the second sealing bar 37 having the cutout portion described in the second embodiment is arranged on the outer periphery of the spin stage 41a on the spin table 41. Further, the first sealing bar 27 described in the first embodiment is installed on the outer periphery thereof.

When the lid 46 is further closed, the spin stage 4
The lid 1 and the spin table 41 provided with the sealing bar 37 surround the 1a and the substrate 10 placed thereon.

Using the spinner device 4 having the film forming section 50a described above, a colored resin film was formed by the procedure described in the first embodiment.

As a result, the colored resin scattered from the substrate 10 rotating with the rotation of the spin stage 41a comes out from the notch of the sealing bar 37 and adheres to the inner wall of the sealing bar 27. However, the sealing bar 27 and the spin stage 4
Since the sealing bar 37 is provided between 1a, the colored resin does not drop from the inner wall of the sealing bar 27 onto the substrate 10 again. Therefore, a resin film having a uniform film thickness is formed on the surface of the substrate.

Further, the uniformity of the film thickness of the resin film formed by the spinner device 4 was also measured by the transmittance as in the first embodiment, but the same uniformity as that of the resin film shown in FIG. 4 was obtained. It was possible to obtain a film having

The resin attached to the inner wall of the sealing bar 27 is accumulated in proportion to the number of substrates processed by the spinner device. Therefore, it is necessary to clean the sealing bar 27 after processing a certain number of substrates, but since the cleaning is a work performed by stopping the operation of the apparatus, it is desirable that the frequency is low in terms of throughput.

Therefore, in order to enable the continuous processing of the substrate without requiring frequent cleaning, in the fifth embodiment, a mechanism for accumulating the resin (waste liquid) scattered from the substrate is provided outside the sealing bar 27. The provided fourth embodiment will be described.

The fourth embodiment corresponds to the invention described in claim 5.

In the spinner device of this embodiment, the spinner device 4 described in the third embodiment is provided with a waste liquid tank 51 which functions as a waste liquid storage mechanism. Therefore, FIG. 7 shows only the schematic configuration of the waste liquid accumulation mechanism that constitutes the essential part of this embodiment. The same components as those of the spinner device 4 shown in the third embodiment are designated by the same reference numerals, and the description thereof will be omitted.

The waste liquid tank 51 is a groove provided between the sealing bar 47 and the sealing bar 37 on the spin table 41. The resin scattered from the substrate 10 comes out from the cutout portion of the sealing bar 47, and then the inner wall of the sealing bar 37 or the lid 46.
The sealing bar 47 attaches to the outside. After that, when it falls again, it falls on the waste liquid tank 51 and is accumulated.

As long as the resin is within the allowable amount of the waste liquid tank 51, the substrate can be continuously processed.

In this embodiment, the spinner device 4 of the fourth embodiment is used.
The continuous treatment amount can be increased, but the continuous treatment amount is limited by the allowable amount of the waste liquid tank 51.

Therefore, the fifth embodiment was carried out in order to continuously operate the spinner device regardless of the allowable accumulation amount of the waste liquid.

This embodiment corresponds to the invention described in claim 6, and is different from the spinner device 4 of the third embodiment in that
The waste liquid discharge mechanism 52 is provided inside the spin table 41 in a region between the sealing bar 47 and the sealing bar 37.

FIG. 8 is a schematic configuration diagram showing a main part of this embodiment regarding the configuration of the waste liquid discharge mechanism 52.

The resin scattered from the substrate 10 comes out from the notch of the sealing bar 47 and adheres to the outside from the inner wall of the sealing bar 37 or the sealing bar 47 of the lid 46. Then, when it falls again, it falls onto the waste liquid outflow mechanism 52 and is discharged to the outside of the device through the line of the waste liquid passing through the inside of the spin table 41 and connected to the device.

In this embodiment, continuous processing by the spinner device 4 can be performed regardless of the allowable accumulation amount of waste liquid.

By the way, once again paying attention to the film thickness distribution chart shown in FIG. 4, the nonuniformity of the resin film thickness caused by the thickening of the peripheral portion with respect to the central portion of the substrate is solved. However, in the central area, where the transmittance decreases,
That is, it is confirmed that there is a region where the film thickness is thick.

The above results indicate that the heat generated by the motor 22 in FIG. 3 causes the shaft 2 connecting the film forming unit 30a and the motor 22 to rotate.
The temperature distribution is generated in the substrate 10 such that the temperature around the shaft 24 of the motor 22 becomes higher than that of the other parts, which is caused by the rapid drying of the resin in the high temperature portion and the thickening of the resin. .

Therefore, the examples carried out for solving the thickening of the central portion will be described below.

In order to increase the thickness of the central portion, the heat generated by operating the motor is transferred to the spin table, the spin stage, and the substrate surface placed on the spin table, so that the drying time of the resin is distributed. It happens by giving birth. Therefore, in order to solve this problem, it is possible to solve the problem by using a means such that the heat generated by the motor does not reach the substrate.

As one of the means, a sixth embodiment will be given and described below.

The present embodiment corresponds to the invention described in claim 9.

FIG. 9 is a schematic view of the essential parts of a spinner device according to the sixth embodiment.

FIG. 8A is a side view of the cooling means of this embodiment, and FIG. 8B is a view taken along the line AA in FIG. 8A. In each case, a shaft 114 supports a spin table 111 arranged below the spin stage 111a, and a motor is connected to the other end. The heat dissipation plate 61 has a shaft 11
4 and is heated by the heat transmitted from the shaft 114. However, since the heat radiation plate 61 has a large surface area exposed to the atmosphere, the heat transmitted is efficiently radiated.

Further, since a plurality of sheets are arranged, the heat generated by the motor does not reach the spin table 111 and is lost by being radiated, so that the substrate 10 is not affected by the heat. Since the temperature within the surface of the substrate 10 is uniform and the drying time of the resin is uniform, it is possible to form a resin film having a uniform film thickness.

In order to demonstrate the above effects, the same means as in the first embodiment is used by using the spinner device 5 in which the heat dissipation plate 61 of this embodiment is attached to the spinner device 4 described in the third embodiment in FIG. Then, a colored resin film was formed. The uniformity of the film thickness was evaluated by measuring the distribution of transmittance of the resin film formed by the spinner device 5.

The results are shown in FIG. Substrate 10
It was uniform both in the center and in the periphery.

This is to increase the thickness of the peripheral portion of the spinner device 4.
This is achieved by the prevention of the sealing bar having the above constitution and the prevention of the thickening of the central portion caused by the heat of the motor by the heat radiating plate according to the present embodiment.

That is, the spinner device of the present embodiment in which the spinner device 4 is provided with a heat dissipation mechanism solves both the non-uniformity of the film thickness caused by the difference in drying time and the non-uniformity of the film thickness caused by the temperature difference. It turns out that it is possible to do.

A seventh embodiment will be described in which a heat radiating plate is provided below the spin table to suppress thickening of the central portion.

The present embodiment corresponds to claim 10.

FIG. 10 is a schematic diagram of the essential parts of the spinner device 6 of the seventh embodiment.

FIG. 10A is a side view of the heat dissipation plate of this embodiment, and FIG. 10B is a view taken along the line BB in FIG. 10A.

A shaft 14 supports a spin table 111 arranged below the spin stage 111a, and a motor is connected to the other end.

The spinner device 6 is constructed by attaching the cooling mechanism 62 of this embodiment to the spinner device 4, and using this, the colored resin film is formed by the same means as in the first embodiment. .

The heat transmitted from the motor to the shaft 114 is transmitted to the heat dissipation plate 62 before being transmitted to the spin table 111. Since the heat radiating plate 62 is concentric in shape, it has a large surface area and a large portion in contact with the atmosphere.
Since the heat of 14 is efficiently radiated, the heat generated by the motor is lost before being transmitted to the spin table 111, and does not affect the film forming temperature.

Therefore, the uniformity of the resin film formed by the spinner device 6 was equivalent to that of the resin film formed by the spinner device 5 described in the sixth embodiment.

Further, the concentric circular shape of the heat dissipation plate 62 has an advantage that it is well balanced even when the spin table 111 is rotated at a high speed and can be smoothly rotated.

Next, using an air-cooling mechanism that cools the heat generated by the motor to the atmosphere below the substrate on the spin stage by a mechanism that sucks it, the eighth step of suppressing thickening of the film
Examples will be described. The present embodiment corresponds to claim 11.

FIG. 11 is a schematic configuration diagram of the eighth embodiment.

FIG. 11 (a) is a top view of the air-cooling mechanism of this embodiment, and FIG. 11 (b) is a side view thereof. A shaft 114 supports a spin table 111 arranged below the spin stage 111a, and a motor is connected to the other end. Reference numeral 63 denotes a large number of holes provided on the spin stage 111a, which are connected to the hollow portion 64 inside the shaft 114, and a vacuum device is connected to the other end of the hollow portion 64.

The heat generated by the motor is transmitted to the shaft 114, the spin table 111 and the spin stage 111a to heat the substrate from the back surface.

The air-cooling mechanism 63 of this embodiment is constructed so that when the substrate is placed on the spin stage 111a, the atmosphere constantly flows into the back surface of the substrate, and the heat of the back surface of the substrate is cooled by the low temperature atmosphere. However, the atmosphere warmed by cooling is sucked into the cavity 64 inside the shaft 114 by the vacuum device and does not return again.

Since the atmospheric air is constantly sucked during film formation, the low temperature atmosphere constantly cools the back surface of the substrate, and the temperature of the substrate surface is kept constant in the front region.

The air cooling mechanism 63 of this embodiment was combined with the spinner device 4 of the third embodiment to form a resin film, and the distribution of its transmittance was evaluated. As a result, a film equivalent to the uniformity of the resin films obtained in the sixth and sixth examples was formed.

As another method for keeping the temperature of the substrate surface constant, a ninth embodiment will be described in which a hot plate whose temperature can be controlled is provided under the spin table under the spin stage.

The present embodiment corresponds to claim 12.

FIG. 12 is a side view of the schematic construction of the ninth embodiment.

A shaft 114 supports a spin table 111 arranged below the spin stage 111a, and a motor is connected to the other end. 65 is the spin table 1
11 is a hot plate provided in the lower part, and it is possible to cancel the temperature distribution on the substrate by setting a desired temperature.

Also in the cooling mechanism 65 of this embodiment, a resin film is formed by the spinner device 8 combined with the spinner device 4 of the third embodiment, and the transmittance distribution is evaluated.
A film equivalent to the uniformity of the resin film obtained in each of Examples 8 to 8 was formed. Further, since the hot plate 65 has a function of controlling the temperature to a desired value, it is possible to control the film forming temperature of the resin in the present embodiment, so that a desirable temperature is set in terms of film quality or throughput. It also has the advantage of being able to do so.

The snner device as the main body to which the heat dissipation or cooling mechanism of the sixth to ninth embodiments is attached can be applied to any device as long as the spinner is connected to the motor by the shaft.

[0129]

According to the first and second aspects of the present invention, it is possible to provide a high-quality resin film having a uniform film thickness and a high transmittance while suppressing an increase in the film thickness in the peripheral portion of the substrate.

According to the third aspect of the present invention, it is possible to provide a high-quality resin film having a uniform film thickness and transmittance, without the resin film deposited being damaged by the resin falling from the inner wall of the container.

According to the fourth aspect of the present invention, the resin film to be formed is a high quality resin film having a uniform film thickness and transmittance without being damaged by the air flow or the resin adhering to the inner wall of the container. Can be provided.

According to the invention of claim 5, it is possible to increase the continuous processing amount of the spinner device.

According to the invention of claim 6, it is possible to further increase the continuous processing amount as compared with the invention of claim 5.

According to the seventh to the twelfth aspects of the present invention, it is possible to provide a resin film having a uniform film thickness and a uniform transmittance while suppressing an increase in the film thickness in the central portion of the substrate.

[Brief description of drawings]

1A and 1B are schematic configuration diagrams showing a film forming unit of a third embodiment of the present invention, in which FIG. 1A is a top view and FIG. 1B is a side view.

FIG. 2 is a distribution diagram of the transmittance of a resin film formed by the spinner device in which the spinner devices of the sixth to ninth embodiments are provided with the sealing bar of the spinner device of the third embodiment of the present invention.

FIG. 3 is a schematic configuration diagram of a first embodiment of the present invention.

4A and 4B are schematic configuration diagrams showing a film forming unit of a first embodiment of the present invention, FIG. 4A is a top view and FIG. 4B is a side view.

FIG. 5 is a distribution diagram of transmittance of a resin film formed by the spinner device according to the first embodiment of the present invention.

6A and 6B are schematic configuration diagrams showing a film forming unit of a second embodiment of the present invention, FIG. 6A is a top view and FIG. 6B is a side view.

FIG. 7 is a side view showing a waste liquid tank of a spinner device according to a fourth embodiment of the present invention.

FIG. 8 is a side view showing a waste liquid outflow mechanism of a spinner device according to a fifth embodiment of the present invention.

FIG. 9 is a schematic configuration diagram of a heat dissipation mechanism of a spinner device according to a sixth embodiment of the present invention, (a) is a side view and (b) is a top view.

10A and 10B are schematic configuration diagrams of another heat dissipation mechanism of the spinner device according to the seventh embodiment of the present invention, FIG. 10A being a side view and FIG. 10B being a top view.

11A and 11B are schematic configuration diagrams of an air cooling mechanism of a spinner device according to an eighth embodiment of the present invention, in which FIG. 11A is a top view and FIG. 11B is a side view.

FIG. 12 is a schematic configuration diagram of a hot plate of a spinner device according to a ninth embodiment of the present invention.

FIG. 13 is a schematic configuration diagram of a conventional spinner device.

14A and 14B are schematic configuration diagrams showing a film forming unit of a conventional spinner device, in which FIG. 14A is a top view and FIG. 14B is a side view.

FIG. 15 is a transmittance distribution diagram of a resin film formed by a conventional spinner device.

[Explanation of symbols]

1 Conventional Spinner Device 2, 3, 4, 5, 6, 7, 8 Spinner Device According to the Present Invention 10 Substrate 11, 21, 31, 41, 111 Spin Table 11a, 21a, 31a, 41a, 111a Spin Stage 12 Motor 13 , 23, 33, 43 chambers 14, 114 shafts 17, 27, 37, 47 sealing bars 18, 28, 38, 48 lids 20a, 30a, 40a, 50a film forming section 61 heat sink 62 heat sink 63 air cooling hole 64 Air cooling cavity 65 Hot plate

Claims (12)

[Claims] 1. A spin table which is connected to a motor and rotates, and a substrate which is provided on the spin table and rotates together with the spin table and on which a film-forming material is dropped onto the surface to form a film is placed. A spinner device comprising: a spin stage; and a container disposed on the spin table and surrounding the substrate mounted on the spin stage. 2. The container is constituted by a sealing bar having a frame shape arranged so as to surround the spin stage, and a lid arranged above the sealing bar. Item 1. The spinner device according to item 1. 3. The spinner device according to claim 2, wherein the sealing bar is provided with a cutout portion for discharging the film forming material scattered from the substrate to the outside of the container. 4. A first hermetic seal having a frame shape in which the container is arranged so as to surround the spin stage, and a cutout portion for discharging the film forming material scattered from the substrate to the outside is formed. Bar, a second sealing bar having a frame shape arranged so as to surround the first sealing bar, and a lid arranged on top of the first and second sealing bars. The spinner device according to claim 1, wherein 5. A waste liquid tank for storing the film forming material leaked to the outside of the first sealing bar through the cutout, outside the sealing bar having the cutout on the spin table. The spinner device according to claim 4, wherein the spinner device is provided. 6. The film forming material leaked to the outside of the sealing bar having the cutout portion on the spin table and to the outside of the first sealing bar via the cutout portion, to the outside of the spin table. The spinner device according to claim 4, further comprising: 7. A spin table connected to a motor to rotate, a spin stage on which a substrate is placed, and which is provided on the spin table and rotates together with the spin table, and between the spin table and the spin stage. A spinner device comprising a connecting shaft and a temperature equalizing means for equalizing the temperature on the spin stage. 8. The spinner device according to claim 7, wherein the temperature equalizing means is constituted by a radiation fin. 9. The spinner device according to claim 8, wherein the radiating fin is provided on the shaft portion. 10. The spinner device according to claim 8, wherein the radiation fin is provided on the spin table. 11. The temperature equalizing means is composed of a suction mechanism arranged on the spin stage for sucking air, and the passage of the air flow generated by the suction mechanism is set to be located on the back surface of the substrate. 8. The spinner device according to claim 7, wherein the substrate is cooled by the air flow. 12. The temperature equalizing means is constituted by a hot plate disposed on the spin table for controlling the temperature of the surface of the spin stage.
Spinner device.