JPH0878889A - Mounting head and parts mounting apparatus - Google Patents

Abstract

PURPOSE: To provide a mounting head wherein the illuminance can be improved, without increasing its size. CONSTITUTION: A mounting head 60 has nozzles 62, 73 for clamping an electronic part E, transferring it and placing it at a specified position, an irradiator (nozzle support part) to support one end of each nozzle from its circumferential direction and plural optical fiber cables 73 to irradiate the part E clamped by the nozzles with light. One end of each cable 73 lies in a plane facing the part E.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting head for picking up a component such as an electronic component and a component mounting apparatus for mounting a component on a substrate by using this mounting head, and more particularly, to recognize the posture of the component at high speed. Regarding what you can do.

[0002]

2. Description of the Related Art Conventionally, in manufacturing electronic products, an electronic component mounting apparatus has been used for performing a process of mounting a plurality of types of electronic components on a printed circuit board. 4A and 4B show an example of such an electronic component mounting apparatus. That is, the electronic component mounting apparatus includes an electronic component supply mechanism 10 for sequentially delivering a plurality of electronic components E to a supply position indicated by A in the figure, as shown in FIG.
Printed circuit board holding mechanism 20 for holding printed circuit board P
And a mounting head 30 and a component recognition unit 40.

The upper portion of the mounting head 30 is attached to an XY robot (not shown) and is driven in the direction X shown in the figure and in the direction Y perpendicular to the plane of the drawing. As shown in FIG. 4B, the mounting head 30 includes a support portion 31, a suction nozzle 32 provided at the tip of the support portion 31, and a disc-shaped illumination portion 33 provided around the support portion 31. ing. The illumination unit 33 is provided with a plurality of lamps 34.

The component recognizing section 40 includes a lens 41 for focusing the light from the illuminating section 33 on a line sensor 42, which will be described later, and a plurality of optical sensors for detecting the light focused by the lens 41 with respect to the moving direction of the mounting head 30. And the line sensor 42 arranged vertically, and the outer shape of the electronic component E is obtained based on the output from the line sensor 42, and the posture of the electronic component E
The image processing unit 43 for obtaining the position and the control unit 44 for controlling the mounting head 30 based on the attitude / position of the electronic component E obtained by the image processing unit 43 are provided.

In such an electronic component mounting apparatus, the electronic component E is mounted on the printed board P as follows. That is, as indicated by a chain double-dashed line Q in the figure, the electronic component E on the electronic component supply mechanism 10 is sucked, and the electronic component E is sucked and held and passes above the lens 41 of the component recognition unit 40 at a predetermined speed. Then, the printed circuit board P held on the printed circuit board holding mechanism 20 is mounted at a predetermined position.

When the electronic component E is sucked from the electronic component supply mechanism 10 by the suction nozzle 32, the suction nozzle 3
The position of the mounting head 30 is controlled so that the tip of 2 is on the center of the electronic component E. At this time, if the working accuracy of the electronic component supply mechanism 10 and the mounting head 30 is low, a portion other than the center of the electronic component E is sucked by the suction nozzle 32, or the electronic component E rotates in the axial direction of the suction nozzle 32. There was a case to do. Therefore, in order to accurately mount the electronic component E at a predetermined position on the printed circuit board P, the correction is performed as follows. That is, when the electronic component E held by the mounting head 30 passes above the lens 41 of the component recognition unit 40, the light from the illumination unit 33 is input to the line sensor 42 via the lens 41. Since the light does not enter the portion where the light is blocked by the electronic component E held by the suction nozzle 32, the moving speed of the mounting head 30 and the line sensor 42 at the minute time
The outer shape of the electronic component E is obtained from the input value of. Then, by comparing the outer shape of the electronic component E with the true shape of the electronic component E, the posture of the electronic component E attracted to the mounting head 30 and the position with respect to the mounting head 30 are recognized.
Based on the recognized posture and position, the control unit 44 corrects the mounting head 30 by rotating it and moving it in the XY directions so that the electronic component E can be accurately mounted at a predetermined position on the printed circuit board P. .

[0007]

The electronic component mounting apparatus having the above-described conventional mounting head has the following problems. That is, the illumination unit 33 provided in the mounting head 30 for improving the accuracy of posture / position recognition and the like.
When the illuminance of the lamp 34 and the LED used in the above is attempted to be improved, there is a problem that the mounting head 30 becomes large. In addition, a large current is required to improve the illuminance, and the temperature of the mounting head rises accordingly. For this reason, the supporting portion 31 and the suction nozzle 32 may be thermally deformed to lower the mounting accuracy, or the electronic components sucked by the suction nozzle 32 may be adversely affected.

On the other hand, in order to correct the position of the electronic component E held by the mounting head 30, the lens 4 of the component recognition unit 40 is used.
In order to give the line sensor 42 a predetermined amount of light when passing over 1, the line sensor 42 needs to be moved at a slow speed of, for example, about 0.2 m / sec. Therefore, it is difficult to increase the operating speed of the entire electronic component mounting apparatus, and it is not possible to improve the operating efficiency.

Therefore, the present invention can improve the illuminance without increasing the size and the posture and position of the component can be recognized in a short time by using the mounting head, thereby improving the operating efficiency. An object of the present invention is to provide a component mounting device that can do the above.

[0010]

In order to solve the above problems and to achieve the object, the present invention provides a mounting head which picks up components by a nozzle, then conveys them, and mounts them at a predetermined position. A nozzle support that is supported from the circumferential direction and a plurality of lights for irradiating light to the component that is attracted to the nozzle, one end of which is provided on the surface of the nozzle support that faces the component that is attracted to the nozzle. And a fiber cable.

On the other hand, in a component mounting apparatus for mounting a component at a predetermined position on a board, a component supply mechanism for supplying the component, a board holding mechanism for holding a board on which the component is mounted, the component supply mechanism and the Image pickup means provided between the board holding mechanism, a mounting head provided movably between the component supply mechanism and the board holding mechanism, and a suction device provided on the mounting head for sucking and holding the component. A nozzle, a nozzle support that supports the suction nozzle from its circumferential direction, and one end provided on the surface of the nozzle support that faces the component to be sucked, and irradiates the component sucked by the nozzle with light. A plurality of optical fiber cables for, and arranged between one end of the plurality of optical fiber cables and the component suctioned to the suction nozzle, from the plurality of optical fiber cables And a posture recognition unit that recognizes the posture of the component based on the output of the imaging unit, and a control that controls the posture of the component based on the posture of the component recognized by the posture recognition unit. And means.

Further, it is preferable that the image pickup means is a line sensor in which optical sensors are arranged in a direction intersecting with a moving direction of the mounting head. Further, the means for homogenizing the light includes a lens arranged on one end side of the optical fiber cable, and a semitransparent diffusion plate provided between the lens and the component sucked by the suction nozzle. It is preferable.

[0013]

As a result of taking the above-mentioned means, the following effects occur. That is, in a mounting head that picks up a component by a nozzle and then conveys it and mounts it at a predetermined position, a nozzle support that supports one end side of the nozzle from its circumferential direction, and a side of the nozzle support that faces the component that is sucked by the nozzle. By arranging one end on the surface and providing a plurality of optical fiber cables for irradiating the component sucked by the nozzle with light, the component held by the nozzle is illuminated. For this reason, since the light source can be installed regardless of the size of the mounting head, the mounting head can be downsized, and even if the size of the light source is increased and the illuminance is increased, the heat of the light source causes heat deformation of the mounting head. Further, it is possible to prevent adverse effects on the parts held by the mounting head.

On the other hand, in the component mounting apparatus using such a mounting head, the amount of light entering the image pickup means can be increased, so that it is possible to shorten the time required to recognize the posture of the component. Therefore, it is possible to improve the operating efficiency of the component mounting apparatus. Furthermore, by homogenizing the light emitted from one end of the optical fiber cable,
The light entering the imaging means becomes parallel, and the posture of the component can be recognized with higher precision, and the component can be mounted with higher precision.

[0015]

1 is a side view showing an essential part of an electronic component mounting apparatus as a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of a mounting head, and FIG. 3 is an entire electronic component mounting apparatus. FIG. In these figures, the same functional parts as those in FIG. 4 are designated by the same reference numerals.

In FIG. 1, reference numeral 10 is a component supply mechanism for supplying an electronic component E as a component, 20 is a printed circuit board holding mechanism for holding a printed circuit board P as a substrate, 40 is a component recognition section as posture recognition means, and 50 is XY robot, 60 is X
The mounting head attached to the bottom of the Y robot is shown.

The electronic component supply mechanism 10 includes a tape 11 to which the electronic components E are attached at a predetermined interval, and a reel 12 for winding and accommodating the tape 11. The electronic component supply mechanism 10 feeds the tape 11 from the reel 12 and drives it intermittently to sequentially supply the electronic components E attached to the tape 11 to the supply position shown by A in the figure. To do. As shown in FIG. 3, a plurality of the supply devices 10 are provided for each type of electronic component E and are installed in parallel with each other.

The printed circuit board holding mechanism 20 is provided with a conveyor 21 that conveys the printed circuit board P from a printed circuit board supply unit (not shown) and stops it at a position facing the supply position A. Both end portions in the width direction of the printed circuit board P are held by the conveyor 21 and are conveyed in the Y direction perpendicular to the paper surface in FIG.

The component recognizing section 40 includes a lens 41 for focusing light from an illuminating section 71, which will be described later, on a line sensor 42, which will be described later, and a mounting head 60, which will be described later, for detecting a plurality of light sensors focused by the lens 41. Line sensor 42 as image pickup means arranged vertically to the moving direction of the
And an image processing unit 43 that obtains the outer shape of the electronic component E based on the output from the line sensor 42 to obtain the attitude and position of the electronic component E, and the electronic component E that is obtained by the image processing unit 43.
The control unit 44 is provided as control means for controlling the mounting head 60 based on the posture and position of the.

The XY robot 50 comprises a Y drive mechanism 51 and an X drive mechanism 55 held by the Y drive mechanism 51 so as to be movable in the Y direction. Y drive mechanism 51
Has a fixed portion 52, and the fixed portion 52 is provided with a Y guide rail 52a along the Y direction perpendicular to the paper surface, and a Y slider 53 is slidable on the Y guide rail 52a. It is provided. This Y slider 53
Positioning drive is performed in the Y direction by a ball screw indicated by 54 in the figure. On the other hand, the X drive mechanism 55
An X guide rail 56 attached to the Y slider 53 and provided along the X direction, and the X guide rail 56.
And an X slider 57 that is slidably provided on the rule 56. The X-slider 57 is used for the X-guide rail.
A ball screw (not shown) driven by an X motor 58 provided at one end of the ruler 56 is slid in the X direction.

The mounting head 60 is, as shown in FIG. 2, a head body 61 fixed to the lower portion of the X slider 24, a nozzle base portion 62 slidably attached to the head body 61 in the vertical direction, and a nozzle base portion. 62 a nozzle tip portion 63 provided at the tip of the nozzle 62, and an illuminating section 7 which will be described later and is arranged at a predetermined interval above the nozzle tip portion 63 in the figure.
The lens 74 and the semi-transparent diffusion plate 75, which form 0, are provided. Further, the mounting head 60 is connected to a vacuum device 64 that generates a suction force at the nozzle tip portion 63. In addition, inside the head body 61, a vertical drive mechanism (not shown) for driving the nozzle base portion 62 in the vertical direction shown by an arrow V in the drawing, and a central axis of the nozzle base portion 62 as a rotation axis are indicated by an arrow R in the drawing. A rotation drive mechanism (not shown) for rotating the motor is provided. Further, the nozzle base portion 62 and the nozzle tip portion 63 form a nozzle.

The illumination unit 70 is a cylindrical irradiation unit (nozzle support) 71 arranged below the head body 61 of the mounting head 60 in the figure, a light source unit 72 provided inside the electronic component mounting apparatus, and irradiation. The optical fiber cable 73 connecting the section 71 and the light source section 72, the lens 74 provided on the nozzle base 62 below the irradiation section 71 and configured to convert the light emitted from the irradiation section 71 into substantially parallel light, and the lens 74. A semitransparent diffusion plate 75 that diffuses the transmitted light is provided. The lens 74 and the semi-transparent diffusion plate 74 constitute a means for making the light uniform. The light source unit 72 is provided with a lamp and a cooling fan, which are not shown in the figure and whose light amount can be varied. Also, 73a in the figure
Indicates an opening provided at one end of the optical fiber cable 73.

In FIG. 3, reference numeral 80 designates a base arranged on the floor surface, and 81 and 82 designate support frames provided on the base 80 for supporting the XY robot 50. In the electronic component mounting apparatus thus configured, the electronic component E is mounted on the printed circuit board P as follows. That is, the electronic component supply mechanism 10 operates to supply the electronic component E mounted on the printed board P to the supply position A.

When the electronic component E is supplied to the supply position A,
When the X drive mechanism 55 and the Y drive mechanism 51 are activated and the mounting head 60 is moved in the XY directions, the nozzle tip portion 6 is moved.
The lower end of 3 is made to face the electronic component E supplied to the supply position A. Next, by operating the vertical drive mechanism and the vacuum device 64 provided on the mounting head 60, the nozzle base 6
2 is lowered, and the electronic component E is suction-held on the lower end of the nozzle tip 63.

Mounting head 60 holding electronic component E by suction
Raises the nozzle base 62 and conveys the electronic component E along the two-dot chain line Q toward the printed circuit board holding mechanism 20 at a speed of 1 m / sec, for example. At this time, the component recognition unit 4
Pass 0 above.

The light emitted from the irradiating section 71 is reflected by the lens 41.
Is input to the line sensor 42 via. At this time, since light does not enter the portion shielded by the electronic component E, the moving speed of the mounting head 60 and the line sensor 4 at a minute time are not detected.
By adding the input values of 2, the outer shape of the electronic component E is obtained. The outer shape of the electronic component E and the electronic component E
The posture of the electronic component E sucked and held by the mounting head 60 and the position of the electronic component E with respect to the mounting head 60 are recognized by comparing the true shape of the electronic component E. A rotation correction amount and a correction amount in the XY directions are calculated based on the recognized posture / position.

Based on a command from the control unit 44, the mounting head 6
The nozzle base 62 is rotated by 0, and the XY robot 50 moves in the XY directions to make corrections.
The electronic component E is made to face a predetermined mounting portion of the printed circuit board P, and the electronic component E is accurately mounted on the printed circuit board P. It should be noted that a solder paste for holding the electronic component E is previously supplied onto the wiring pattern provided on the printed board P.

As described above, according to this embodiment, light can be introduced from the light source through the optical fiber cable, so that the temperature of the mounting head does not rise even if a large current is applied to the light source to increase the illuminance. It is possible to prevent deterioration of mounting accuracy and adverse effects on electronic components due to thermal deformation. Further, as the illuminance is increased, the amount of light entering the line sensor increases, so that the moving speed of the mounting head passing above the line sensor can be increased. Therefore, the operation speed of the XY robot can be increased, and the operation efficiency of the electronic component mounting apparatus can be increased. Further, since it is not necessary to provide the mounting head with a light source, the mounting head can be downsized.

The present invention is not limited to the above embodiments. That is, in the above embodiment, not only the XY robot type mounter but also the rotary type mounter can be used. Further, although the line sensor is used as the image pickup means, an area sensor may be used. At this time, it is necessary to pause above the area sensor,
This stop time can be shortened. Further, it may be used as a mounting device for components other than electronic components. Of course, various modifications can be made without departing from the scope of the present invention.

[0030]

According to the present invention, since the light source can be installed regardless of the size of the mounting head, the mounting head can be downsized, and the light source can be increased by increasing the size of the light source. It is possible to prevent thermal deformation of the mounting head and adverse effects on the components held by the mounting head due to the heat generation of.

On the other hand, in the component mounting apparatus using such a mounting head, the amount of light entering the image pickup means can be increased, so that the time required for recognizing the posture of the component can be shortened. Therefore, it is possible to improve the operating efficiency of the component mounting apparatus. Furthermore, by homogenizing the light emitted from one end of the optical fiber cable,
The light entering the imaging means becomes parallel, and the posture of the component can be recognized with higher precision, and the component can be mounted with higher precision.

[Brief description of drawings]

FIG. 1 is a side view showing a main part of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view showing a mounting head incorporated in the apparatus with a part thereof cut away.

FIG. 3 is a perspective view showing an entire electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 4 is a diagram showing a conventional electronic component mounting apparatus,
(A) is the schematic which shows the whole structure, (b) is sectional drawing of a mounting head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Component supply mechanism 11 ... Tape 12 ... Reel 20 ... Printed circuit board holding mechanism 21 ... Conveyor 40 ... Component recognition part 41 ... Lens 42 ... Line sensor 43 ... Image processing part 44 ... Control part 50 ... XY robot 51 ... Y drive mechanism 52 ... Fixed part 52a ... Y guide rail 53 ... Y slider 54 ... Ball screw 55 ... X drive mechanism 56 ... X guide rail 57 ... X slider 58 ... X motor 60 ... Mounting head 61 ... head main body 62 ... nozzle base 63 ... nozzle tip 64 ... vacuum device 70 ... illumination section 71 ... irradiation section 72 ... light source section 73 ... optical fiber cable 74 ... lens 75 ... semitransparent diffusion plate 80 ... bases 81, 82 ... support frame

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshifumi Yamada 2121 Nagao, Asahi-cho, Mie-gun, Mie Incorporated company Toshiba Mie Factory (72) Inventor Toshimasa Hirate 2121 Nao, Asahi-cho, Mie-gun, Mie Prefecture (72) Inventor, Kaji Ogawa 1-1-1, Shibaura, Minato-ku, Tokyo Inside Toshiba Head Office

Claims (4)

[Claims] 1. A mounting head for picking up a component by a nozzle and then transporting the component and mounting it at a predetermined position. A nozzle support that supports one end side of the nozzle from its circumferential direction and a nozzle of the nozzle support. A mounting head having one end provided on a surface facing a component, and a plurality of optical fiber cables for irradiating the component adsorbed by the nozzle with light. 2. A component mounting apparatus for mounting a component at a predetermined position on a board, a component supply mechanism for supplying the component, a board holding mechanism for holding a board on which the component is mounted, the component supply mechanism, and the component supply mechanism. An image pickup unit provided between the substrate holding mechanism, a mounting head movably provided between the component supply mechanism and the substrate holding mechanism, and a suction device provided on the mounting head for sucking and holding the component. A nozzle, a nozzle supporter that supports the suction nozzle from its circumferential direction, and one end is provided on the surface of the nozzle support body facing the component to be sucked, and the component sucked by the nozzle is irradiated with light. A plurality of optical fiber cables for, and arranged between one end of the plurality of optical fiber cables and the component sucked to the suction nozzle, from the plurality of optical fiber cables And a posture recognition unit that recognizes the posture of the component based on the output of the imaging unit, and a control that controls the posture of the component based on the posture of the component recognized by the posture recognition unit. And a means for mounting parts. 3. The component mounting apparatus according to claim 2, wherein the image pickup means is a line sensor in which optical sensors are arranged in a direction intersecting a moving direction of the mounting head. 4. The means for homogenizing the light is a semi-transparent diffusion plate provided between a lens arranged at one end of the optical fiber cable and the lens and a component sucked by the suction nozzle. The component mounting apparatus according to claim 2 or 3, further comprising: