JPH0878444A - Resin material supplying method to resin sealing die - Google Patents

Abstract

PURPOSE: To prevent the increase of management loss or resin using efficiency loss when kinds of resin tablet sizes for resin sealing are increased according to the increase of kinds of semiconductor packages, and improve general-purpose properties of an equipment. CONSTITUTION: A resin amount of the greatest common measure is determined from resin amount of various kinds of packages from small size to large size, and a resin segment having the resin amount corresponding with the greatest common measure is made as a ball-shaped resin tablet 2. A necessary number of the resin tablets 2 are dropped into a pot 10 of a metal mold 8, according to the size of a package which is to be sealed, and resin material is supplied. Thereby one kind of resin tablet can correspond with various kinds of packages.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying a resin material to a resin encapsulating mold for supplying a resin material to a resin encapsulating mold forming an outer shell of a semiconductor device.

[0002]

2. Description of the Related Art Generally, semiconductor devices such as IC and LSI are
It is resin-sealed into a product by a transfer molding method using a thermosetting resin.

This type of resin encapsulation is carried out by tableting an epoxy type thermosetting resin containing an epoxy resin, a curing agent and a filler as main components to form a cylindrical tablet, and using this. Generally, one tablet seals a certain number of semiconductor devices. However, due to the recent expansion of multi-plunger type encapsulation devices, the number of resin supply packages per resin tablet is decreasing, and IC package Due to diversification, various types of packages have been developed, from ultra-thin package sizes of 1 mm or less to large packages of 300 leads or more. Therefore, in order to supply a resin amount that corresponds to the corresponding semiconductor device encapsulation amount, the variety of tablet sizes has rapidly expanded.

FIGS. 4A and 4B are views for explaining an example of a method of supplying a resin material to a conventional resin sealing mold. Conventionally, as shown in FIG. 4, a method for supplying a resin material to a resin-sealing mold of this type is as follows.
After being aligned and supplied by the parts feeder 18, they are set in the array section 19 by a pick and place mechanism (not shown) and inserted into the storage chamber 6 of the lead frame supply unit 5 by the pusher 20. Next, the lead frame supply unit 5 carrying the lead frame 7 moves and is inserted between the upper mold and the lower mold of the resin-sealed mold, and the cavity 1 is shuttered in the pot 10 connected through the runner. The cylindrical resin tablet 17 was dropped by opening 9 to complete the supply of the resin material.

Here, the size of the cylindrical resin tablet 17 must be set for each IC package size so as to correspond to the amount of resin supplied to 2 to 8 IC package bodies based on the mold design. In addition, since the tablet size needs to be changed according to the type change, the parts feeder 18, the pick-and-place mechanism, and the array unit 1 are required each time.
9, lead frame supply unit 5, pot inside mold 10
It was inevitable to change the handling system.

[0006]

However, when various types of resin tablets as described above are used, a great number of man-hours and waste are generated in the management thereof. For example, because of the nature of thermosetting resin, tablets are stored in a frozen state, and are thawed and used immediately before use for sealing. However, there is a marked change over time after thawing, and generally a storage period of about 100 hours is provided. Therefore, if there is a surplus due to production fluctuations of the target package, etc., the thawed resin tablet that has exceeded the storage deadline must be discarded because the size of each package is almost uniform.

Also, from the viewpoint of storage management, many tablet types corresponding to various packages must be managed and stored, and the management man-hour is a factor of cost increase including the manufacturing management cost at the resin maker. It was.

Further, in order to cope with the above-mentioned problems caused by the diversification of tablet sizes, the number of tablets is limited and the cull size is enlarged or dummy cavities are made to absorb the excess resin in the resin flow path in the sealing mold. Although the method of providing a tee is taken, it causes unnecessary waste of the resin and causes a cost increase. Moreover, it is not a good method from the viewpoint of reducing industrial waste.

On the other hand, regarding the resin encapsulation equipment, it is necessary to change the equipment such as the tablet feeder section and the tablet handling section and the mold side such as the pot and the plunger due to the type change accompanied by the tablet size change. There was a drawback that it deteriorated the flexibility of.

Therefore, an object of the present invention is to reduce the number of man-hours for managing the resin material, to reduce the amount of waste, to effectively use the resin material, and to enhance the versatility of the resin encapsulation equipment. A method of supplying a resin material to a mold is provided.

[0011]

A feature of the present invention is that a resin material is melted through a plurality of cavities for molding a resin encapsulant forming an outer shell of a semiconductor device and a runner which is a runner, and is melted in the cavities. In a method of supplying a resin material to a resin-sealing die, the resin material being supplied to the pot of a resin-sealing die having a cylindrical pot for pumping resin, various semiconductors having different outer shell sizes Obtain a minimum amount from the difference in the amount of resin to be filled in the cavity and the runner in a plurality of resin-sealing molds for resin-sealing the device, and make the resin piece into a single resin piece equal to this minimum amount. A method of supplying a resin material to a resin-sealing die, which comprises forming and inserting the number of resin pieces into the pot in accordance with the amount of resin to be filled in the cavity and the runner.

Further, it is preferable that the resin piece has a spherical shape having a diameter smaller than the diameter of the pot or a disk shape having a diameter capable of entering the pot.

Another feature of the present invention is that a resin material is melted through a plurality of cavities for molding a resin encapsulant forming an outer shell of a semiconductor device and a runner which is a runner, and the molten resin is pumped to the cavities. A method of supplying a resin material to a resin-sealing die, the resin material being supplied to the pot of a resin-sealing die having a cylindrical pot, including the cavity and the runner in the resin-sealing die. It is a method of supplying a resin material to a resin-sealing die, which supplies a granular resin material having a volume or weight depending on the volume to the pot.

[0014]

Next, the present invention will be described with reference to the drawings.

Usually, the package which is the outer shell of the semiconductor device is, for example, a TSOP package having a thickness of 1 mm.
The size extends to a large QFP package of 0 mm square and 3.7 mm thick, and the amount of resin per package used is widely distributed from 0.2 g to 12 g.

Therefore, according to the present invention, the minimum amount is obtained from the difference in the amount of resin to be filled in the cavity and runner in various resin-sealing molds having different package sizes, and the resin equal to this minimum amount is obtained. That is, resin pieces having a certain amount are used as resin tablets, and the number of resin tablets is supplied to the pot of the resin sealing mold according to the size of the package.

Here, for example, assuming a resin-sealed mold having two cavities and one pot and having a negligible runner volume, it is applied to the above-mentioned semiconductor device.
Further, assuming that a tablet, which is a standard resin piece of 0.2 g which is the minimum amount of resin, is prepared from the above-mentioned package, since there are two cavities in the mold, a fine resin supply of 0.1 g per package is possible. Is possible,
It can be said that a high resin usage efficiency can be achieved by being able to pressure feed to the cavity in units of 0.1 g. Also, from the point of view of storage and management of resin, it is only necessary to store only one type of standard tablet and to manage the amount of resin that is commensurate with the total production volume. Unnecessary management.

FIG. 1 is a diagram for explaining a first embodiment of a method for supplying a resin material to a resin-sealing mold according to the present invention. The first embodiment of the present invention is to make the resin tablet spherical. For example, as described above, assuming that this resin tablet is 0.2 g and the resin density is 1.7, the diameter is 6 mm.
Becomes a sphere. This size of sphere is suitable for handling.

Next, referring to FIG. 1, the operation of supplying a resin-sealed mold using a tablet standardized on a spherical resin piece having a diameter of 6 mm will be described. First, the resin tablets 2 aligned and supplied from a parts feeder (not shown) are dropped by the tablet separating section 4 driven by the air cylinder 3 through a chute as many as the number of strokes of the air cylinder 3. Then, the dropped resin tablet 2 is stored in the storage chamber 6 in the lead frame supply unit 5. Next, a lead frame supply unit 5 holding an appropriate number of resin tablets 2 and lead frames 7.
Moves to a fixed position of the mold 8 and places the lead frame 7 on the cavity 1 and at the same time drops the resin tablet 2 into the pot 10 of the mold 8 by the operation of the shutter 9 to supply the resin material. Complete. After that, mold clamping and molding operations are performed, and a resin-sealed semiconductor device is obtained.

By making the resin tablets spherical resin pieces, in the case of a plurality of resin tablets stacked in the pot 10, the thermal conductivity of the resin tablets is the same as that of a conventional cylindrical resin tablet alone. Good and has the advantage of being able to melt faster.

Since an appropriate amount of resin can be supplied to each package in this manner, it is not necessary to consider the means for retaining the surplus resin in the design of the functional part in the mold as in the conventional case, and the runner becomes a waste resin part after molding. It is possible to minimize the amount of waste resin such as the scallop and the like.

[0022] For example, as one example, 1
4mm wide and 20mm long rectangular shape with a thickness of 2.7mm Q
In the FP type package, the resin sealing mold with two cavities per pot used to have a resin efficiency of 60% in the past, but when this spherical resin tablet was used, the resin efficiency could be increased to 85%. It was As a result, the cost of the resin used could be reduced by 30%.

FIG. 2 is a diagram for explaining a second embodiment of the method for supplying the resin material to the resin sealing mold of the present invention. In this embodiment, a disk tablet 11 is used instead of the spherical tablet described above. When the amount of resin is 0.2 g, which is the same as that in the above-mentioned embodiment, the resin tablet is a disk having a diameter of 8 mm and a thickness of 2.2 mm.

The operation of supplying the resin material using the disk-shaped resin tablet 11 will be described with reference to FIG. By operating the tablet separating unit 4 provided at the bottom of the cylindrical stocker 12 in which the disk-shaped resin tablets 11 are stacked and stored, a desired number of disk tablets 11 can be easily stored in the lead frame supply unit 5. Storage room 6
You can enter That is, the required number is supplied by alternately opening and closing the shutter mechanisms provided in the upper and lower two stages of the tablet separating section 4 and dropping them one by one and counting them by the counter. The disk-shaped resin tablet 11 thus inserted into the storage chamber 6 of the lead frame supply unit 5 is stored in the pot 10 together with the transfer of the lead frame 7 to the mold 8.

FIGS. 3 (a) to 3 (c) are views for explaining a third embodiment of the method of supplying the resin material to the resin-sealing mold of the present invention. In this embodiment, a small amount of resin pieces is supplied in order to further improve the resin usage efficiency.
That is, the granular resin has a size that is easy to handle as a minute resin piece and does not generate dust when being fed, for example, about 2 mm.

Next, the method of supplying the resin to the mold using this granular resin will be described. First, as shown in FIG.
The granular resin 13 is quantitatively supplied to the measuring pot 15 through the supply section 14 leading to the stocker. After that, as shown in FIG. 3 (b), the volume is accurately measured by the squeegee 16, and then, as shown in FIG. 3 (c), the lead frame 7 is already placed in the pot 10 of the mold 8. Heighing pot 15
The granular resin 13 is dropped by opening the shutter 9 of. When measuring the proper amount of resin for each package,
This is performed by changing the weighing pot 15 for each size. Further, it is also possible to measure the resin supply amount to the pot 15 by measuring the desired resin supply amount by a weight measuring device such as an electronic balance or a powder flow rate measuring feeder without using the measuring pot.

[0027]

As described above, according to the present invention, the resin amount which is the most common divisor of the amount of resin used per package of semiconductor devices of different sizes is defined as one resin tablet, and it is determined according to the size of the package. By supplying as the number or total volume of the resin tablets, the following effects can be obtained. (1) On the management side, there is now a single type of resin that has been conventionally managed in the factory, and as a result, there is no need to manage each type of product, and it is possible to distribute the resin by standardization, which causes production fluctuations. Loss due to the expiration of the resin for a specific product is eliminated. (2) When manufacturing resin pieces, it is not necessary to install a tablet tableting machine for each package, manufacturing control and storage of resin materials are rationalized, and the cost of resin pieces can be reduced accordingly. (3) Since it is possible to supply an appropriate amount of resin for each package, it is not necessary to consider the means for retaining the surplus resin in the design of the functional part in the mold as in the conventional case, and the runner or cull part becomes the waste resin part after molding. It is possible to minimize the waste resin part such as. As a result, the cost of resin used can be significantly reduced. (4) Regarding the resin encapsulation equipment side, conventionally, due to the change in product type accompanied by the change in tablet size, the equipment such as the tablet feeder section and the tablet handling section was changed and the mold side such as the pot and the plunger was changed. Although the flexibility of the encapsulation equipment was deteriorated, the adoption of this standard resin tablet enables the standardization of the handling part and the mold, and it is possible to reduce the replacement part cost and the replacement man-hours due to the change of the package type. became.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a first embodiment of a method of supplying a resin material to a resin-sealing die of the present invention.

FIG. 2 is a diagram for explaining a second embodiment of the method for supplying the resin material to the resin sealing mold of the present invention.

FIG. 3 is a diagram for explaining a third embodiment of the method for supplying the resin material to the resin sealing mold of the present invention.

FIG. 4 is a diagram for explaining an example of a method of supplying a resin material to a conventional resin sealing mold.

[Explanation of symbols]

 1 Cavity 2 Spherical Resin Tablet 3 Air Cylinder 4 Tablet Separation Section 5 Lead Frame Supply Unit 6 Storage Room 7 Lead Frame 8 Mold 9 Shutter 10 Pot 11 Disc Resin Tablet 12 Stocker 13 Granule Resin 14 Resin Supply Section 15 Weighing Pot 16 Squeegee 17 Cylindrical resin tablet 18 Parts feeder 19 Array part 20 Pusher

Claims (4)

[Claims] 1. A plurality of cavities for molding a resin encapsulant forming an outer shell of a semiconductor device and a cylindrical pot for melting a resin material through a runner which is a runner and forcing the molten resin into the cavities. In a method of supplying a resin material to a resin-sealing die, which supplies the resin material to the pot of a resin-sealing die, a plurality of resin encapsulations for resin-sealing various semiconductor devices having different outer shell sizes are provided. The minimum amount is obtained from the difference in the amount of resin to be filled in the cavity and the runner in the die, and the resin piece is formed into a single resin piece equal to this minimum amount, and the cavity and the runner are filled. A method of supplying a resin material to a resin-sealing die, characterized in that the number of the resin pieces is inserted into the pot according to the amount of resin to be injected. 2. The resin piece has a spherical shape whose diameter is smaller than the diameter of the pot.
A method for supplying a resin material to the resin-sealing die described. 3. The method of supplying a resin material to a resin-sealing mold according to claim 1, wherein the resin piece is in the shape of a disc having a diameter capable of entering the pot. 4. A plurality of cavities for molding a resin encapsulant forming an outer shell of a semiconductor device and a cylindrical pot for melting a resin material through a runner which is a runner and forcing the molten resin into the cavities. In a method of supplying a resin material to a resin-sealing mold for supplying the resin material to the pot of a resin-sealing mold, a volume amount corresponding to a volume including the cavity and the runner in the resin-sealing mold. Alternatively, a method for supplying a resin material to a resin-sealing mold, characterized in that a heavy granular resin material is supplied to the pot.