JPH0878365A - Dicing apparatus - Google Patents

Abstract

PURPOSE: To provide a dicing apparatus which realizes a full automated system. CONSTITUTION: The apparatus comprises a blade 2 to cut a wafer 1, a rotary shaft 4 on which the blade 2 is mounted through a flange 3, a stage 5 provided with a wafer support face 5a movable at cutting of the wafer 1 and horizontal in its moving direction 14, and a dicing speed controller 6 which automatically changes the feed rate of the stage 5 according to an input data 7 corresponding to the number of cutting lines on the wafer 1. The data 7 is previously applied before dicing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing apparatus in semiconductor manufacturing technology, and more particularly to a technology for automatically controlling a feed speed of a stage on which a semiconductor wafer (hereinafter simply referred to as a wafer) is placed.

[0002]

2. Description of the Related Art The techniques described below are for studying the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

In the dicing apparatus, when the blade for cutting the wafer is replaced, precutting is performed in advance by using a dummy wafer or the like in order to make the surface of the blade uniform, or the feed speed of the stage for determining the dicing speed is slowed down. Then, the wafer is cut.

Regarding the dicing technology, for example, "Latest semiconductor factory automation system" issued by Science Forum Co., July 25, 1984, pages 134 to 1
The precut of the dicing machine is described on page 36, and is described, for example, on page C-23 of "Fully Automatic Dicing Saw DFD-2HSTI Instruction Manual" issued by Disco Co., Ltd. in July, 1985. .

[0005]

However, in the above-mentioned technique, when attempting to automate the dicing process,
Pre-cut and other incidental work after the blade replacement is an obstacle to full automation.

[0006] Therefore, an object of the present invention is to provide a dicing device which realizes complete automation.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, the dicing apparatus according to the present invention is provided with a blade for cutting a wafer, a rotary shaft to which the blade is attached, and a mounting surface for the wafer which is movable when the wafer is cut and is horizontal in the moving direction. It has a stage and a dicing speed control means for automatically changing the feed speed of the stage.

Further, a blade for cutting the wafer, a rotating shaft to which the blade is attached, a stage on which a mounting surface of the wafer which moves during cutting of the wafer and is horizontal in the moving direction is installed, and on the wafer And a dicing speed control means for automatically changing the feed speed of the stage based on the input data of the feed speed of the stage corresponding to the number of cutting lines.

Further, a blade for cutting the wafer, a rotary shaft to which the blade is attached, a stage on which a wafer mounting surface that moves during cutting of the wafer and is horizontal in the moving direction is installed, and the rotary shaft It has a tachometer that is installed and measures the number of revolutions of the blade, and a dicing speed control means that automatically changes the feed speed of the stage based on the measurement value measured by the tachometer.

Further, a blade for cutting the wafer, a rotary shaft to which the blade is attached, a stage on which a mounting surface of the wafer which is movable during the cutting of the wafer and is horizontal in the moving direction is installed, and immediately after the cutting of the wafer And a dicing speed control means for automatically changing the feed speed of the stage based on the measurement value measured by the monitoring means.

[0013]

According to the above means, by having the dicing speed control means for automatically changing the feed speed of the stage on which the wafer is placed and which moves when the wafer is cut,
The feed rate of the stage can be automatically changed according to the state of the blade at the time of cutting the wafer or the cutting result.

Here, by using a new blade by having a dicing speed control means for automatically changing the feed speed of the stage based on the input data of the feed speed of the stage corresponding to the number of cutting lines on the wafer. By inputting the data of the stage feed speed corresponding to the number of cutting lines from the start to the replacement of the blade, the dicing speed can be automatically changed according to the number of cutting lines.

As a result, the pre-cutting work after the blade replacement can be eliminated and the additional work can be reduced, and as a result, the dicing process can be fully automated.

Further, a tachometer installed on the rotating shaft of the blade and measuring the number of revolutions of the blade, and a dicing speed control means for automatically changing the stage feed speed based on the measurement value measured by the tachometer. By having, when the load applied to the blade during dicing becomes large (when the rotational speed of the blade becomes small),
The stage feed speed can be slowed down.

As a result, the load applied to the blade during dicing can be made constant at all times, so that the dicing state can be stabilized, and as a result,
High quality dicing can be performed.

Further, by having a monitor means for measuring the cutting width immediately after the cutting of the wafer and a dicing speed control means for automatically changing the feed speed of the stage based on the measurement value measured by the monitor means, When the cutting width exceeds the allowable range, the stage feed speed can be slowed down.

As a result, similarly to the above, it becomes possible to stabilize the dicing state, and as a result, high quality dicing can be performed.

[0020]

Embodiments of the present invention will now be described in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a front view showing an embodiment of the structure of a dicing apparatus according to the present invention, and FIG. 2 is a plan view showing an embodiment of the structure of a wafer cut by the dicing apparatus of the present invention. FIG. 3 is a flowchart showing an embodiment of a dicing procedure of the dicing apparatus according to the present invention, and FIG. 4 is a dicing speed showing an embodiment of the stage feed speed with respect to the number of cutting lines on the wafer in the dicing apparatus of the present invention. It is an explanatory diagram.

First, the structure of the dicing apparatus according to the first embodiment will be described. A blade 2 for cutting the wafer 1
A rotary shaft 4 to which the blade 2 is attached via a flange 3, a stage 5 on which a mounting surface 5a of the wafer 1 that moves in the moving direction 14 when the wafer 1 is cut and is horizontal in the moving direction 14 And a dicing speed control means 6 for automatically changing the feeding speed of the stage 5 based on the input data 7 of the feeding speed (dicing speed) of the stage 5 corresponding to the number of cutting lines 8 on the wafer 1. The wafer 1 is cut by moving the stage 5 in the moving direction 14 with respect to the blade rotating direction 13 of 2.

The blade 2 is formed by solidifying grains such as diamond with an adhesive and has a thickness of about 30 to 100 μm.

The dicing apparatus according to the first embodiment inputs the feed speed of the stage 5 corresponding to the number of cutting lines 8 on the wafer 1 before dicing.

Here, as the input data 7, the data of the dicing speed shown in the dicing speed explanatory diagram of FIG. 4 and the like is used. For example, when the feed rate of the stage 5 when the blade state of the blade 2 is stable is 100, the feed rate of the stage 5 is about 10 when the number of cutting lines 8 to 1 to 1000 is 100 to 2000.
In the book, the feed speed of the stage 5 is about 20 and 1000
The feed speed of the stage 5 is set to 100 when the number is zero.

When the blade 2 having a thickness of about 30 μm is used, the life of the blade 2 is about 100,000.

Next, the dicing method of the dicing apparatus of the first embodiment will be described.

First, the blade exchange 9 for exchanging the blade 2 is performed, and then the dicing speed data input 10 for inputting the input data 7 is performed.

The input data 7 at this time is 1001 to 2000 when the cutting speed of the cutting line 8 is 1 to 1000 and the feed speed of the stage 5 is 10 mm / sec.
In this book, the feed rate of stage 5 is set to 20 mm / sec and 100
The feed speed of the stage 5 is 100 mm / sec when the number is 00.

Thereafter, the dicing 11 of the wafer 1 is started, and the dicing speed control means 6 automatically changes the feed speed of the stage 5 according to the number of cutting lines 8 on the wafer 1 according to the input data 7. The wafer 1 is cut.

According to the dicing apparatus of the first embodiment, the following effects can be obtained.

That is, by having the dicing speed control means 6 which automatically changes the feed speed of the stage 5 based on the input data 7 of the feed speed of the stage 5 corresponding to the number of cutting lines 8 on the wafer 1. From the start of using the new blade 2, the blade 2
By inputting the data of the feed speed of the stage 5 corresponding to the number of cutting lines 8 up to the replacement, the dicing speed can be automatically changed according to the number of cutting lines 8.

As a result, the pre-cutting work after the replacement of the blade 2 can be eliminated and the work involved can be reduced, and as a result, the dicing process can be fully automated.

Further, since the pre-cutting work can be eliminated, it is not necessary to use a dummy wafer, so that the manufacturing cost can be reduced.

(Embodiment 2) FIG. 5 is a partial perspective view showing an example of the structure of a dicing apparatus which is another embodiment of the present invention.

First, the structure of the dicing apparatus according to the second embodiment will be described. The blade 2 for cutting the wafer 1
A rotary shaft 4 to which the blade 2 is attached via a flange 3, a stage 5 on which a mounting surface 5a of the wafer 1 which moves in the moving direction 14 when the wafer 1 is cut and is horizontal in the moving direction 14 is installed, Installed on the rotary shaft 4 and the blade 2
The blade 2 comprises a tachometer 12 for measuring the number of revolutions of the blade 2 and a dicing speed control means 15 for automatically changing the feed speed (dicing speed) of the stage 5 based on the measurement value measured by the tachometer 12. The wafer 1 is cut by moving the stage 5 in the moving direction 14 with respect to the blade rotation direction 13.

That is, the dicing apparatus according to the second embodiment is
The number of revolutions of the blade 2 during dicing is measured by the tachometer 12, and the feed speed (dicing speed) of the stage 5 is automatically controlled by this measured value.

Here, the blade 2 is formed by solidifying grains of diamond or the like with an adhesive and has a thickness of about 30 to 100 μm.

The operation and effect of the dicing apparatus according to the second embodiment will be described. The rotating shaft 4 of the blade 2
Tachometer 1 installed in the and measuring the rotation speed of the blade 2
2 and the dicing speed control means 15 that automatically changes the feed speed of the stage 5 based on the measurement value measured by the tachometer 12, so that the load applied to the blade 2 during dicing becomes large. When the number of rotations of the blade 2 becomes small, the dicing speed control means 15 automatically slows down the feed speed of the stage 5.

This allows the blade 2 to be operated during dicing.
Since it is possible to keep the load applied to the constant, the dicing state can be stabilized.

As a result, since high quality dicing can be performed, the yield of products can be improved.

(Embodiment 3) FIG. 6 is a partial perspective view showing an example of the structure of a dicing apparatus which is another embodiment of the present invention.

First, the structure of the dicing apparatus according to the third embodiment will be described. The blade 2 for cutting the wafer 1
A rotary shaft 4 to which the blade 2 is attached via a flange 3, a stage 5 on which a mounting surface 5a of the wafer 1 which moves in the moving direction 14 when the wafer 1 is cut and is horizontal in the moving direction 14 is installed, Installed on the rotary shaft 4 and the blade 2
Tachometer 12 for measuring the number of rotations of the wafer 1, a camera 17 as a monitor means for measuring the cutting width 16 immediately after the cutting of the wafer 1, and a feed of the stage 5 based on the measurement value of the cutting width 16 measured by the camera 17. The blade rotation direction 1 of the blade 2 is composed of a dicing speed control means 18 for automatically changing the speed (dicing speed).
By moving the stage 5 in the moving direction 14 with respect to 3, the wafer 1 is cut.

That is, the dicing apparatus of the third embodiment is
The cutting width 16 immediately after the cutting of the wafer 1 is measured by a camera 17 which is a monitor means, and the feed speed (dicing speed) of the stage 5 is automatically controlled by this measured value.

For example, when a blade 2 having a thickness of 30 μm is used, the cutting width 1 when the normal cutting is performed
6 is about 40 to 50 μm. Therefore, the allowable limit value of the cutting width 16 is set to 65 μm as an example, and dicing is performed.

Here, the blade 2 is formed by solidifying grains such as diamond with an adhesive and has a thickness of about 30 to 100 μm.

The operation and effect of the dicing apparatus according to the third embodiment will be described. A camera 17 which is a monitor means for measuring the cutting width 16 immediately after the cutting of the wafer 1 and a cutting width 16 measured by the camera 17. By having the dicing speed control means 18 that automatically changes the feed speed of the stage 5 based on the measured value, when the cutting width 16 immediately after the cutting of the wafer 1 exceeds 65 μm which is an example of the allowable limit value, it is immediately The dicing speed control means 18 slows down the feed speed of the stage 5, and automatically controls the feed speed of the stage 5 so that the cutting width 16 becomes 65 μm or less.

As a result, similarly to the first and second embodiments, the dicing state can be stabilized, and as a result, high quality dicing can be performed.
Further, the yield of products can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the dicing apparatus according to the present invention may have the functions described in the first to third embodiments.

That is, the dicing apparatus is a combination of the first and second embodiments, the second and third embodiments, the first and third embodiments, or the first, second and third embodiments. Good.

In the dicing apparatus described in the third embodiment, the camera is used as the monitor means for measuring the cutting width immediately after cutting, but the monitor means is an optical distance measuring device or the like. Good.

[0053]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). Feed speed (dicing speed) of a stage on which a wafer is placed and which moves when the wafer is cut
By having a dicing speed control means for automatically changing the stage, the stage feed speed can be automatically changed according to the state of the blade at the time of cutting the wafer or the cutting result.

As a result, the pre-cutting work after the blade replacement can be eliminated and the additional work can be reduced. As a result, the dicing process can be fully automated.

(2). By having a dicing speed control means for automatically changing the feed rate of the stage based on the input data of the feed rate of the stage corresponding to the number of cutting lines on the wafer, the blade can be used from the start of use of a new blade. By inputting stage feed speed data corresponding to the number of cutting lines before the replacement, the dicing speed can be automatically changed according to the number of cutting lines. This makes it possible to eliminate the precut work after the blade replacement.

(3). By eliminating the pre-cutting work, it is not necessary to use a dummy wafer, so that the manufacturing cost can be reduced.

(4). By having a tachometer installed on the rotation axis of the blade and measuring the number of revolutions of the blade, and a dicing speed control means for automatically changing the feed speed of the stage based on the measurement value measured by the tachometer. When the load applied to the blade during dicing becomes large (when the rotational speed of the blade becomes small), the feed speed of the stage can be slowed down.

As a result, the load applied to the blade during dicing can be kept constant, and the dicing state can be stabilized. as a result,
High-quality dicing can be performed, and the yield of products can be improved.

(5). By having monitor means for measuring the cutting width immediately after cutting the wafer and dicing speed control means for automatically changing the stage feed speed based on the measurement value measured by the monitor means, the cutting width is allowed. When the range is exceeded, the stage feed speed can be reduced.

As a result, similarly to the above (4), it becomes possible to stabilize the dicing state, and as a result, it is possible to perform high-quality dicing and further improve the product yield. .

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the structure of a dicing apparatus according to the present invention.

FIG. 2 is a plan view showing an example of the structure of a wafer cut by the dicing apparatus of the present invention.

FIG. 3 is a flowchart showing an example of a dicing procedure of the dicing apparatus according to the present invention.

FIG. 4 is a dicing speed explanatory diagram showing an example of a stage feed speed with respect to the number of cutting lines on a wafer in the dicing apparatus of the present invention.

FIG. 5 is a partial perspective view showing an example of the structure of a dicing apparatus that is another embodiment of the present invention.

FIG. 6 is a partial perspective view showing an example of the structure of a dicing apparatus that is another embodiment of the present invention.

[Explanation of symbols]

 1 Wafer 2 Blade 3 Flange 4 Rotating Axis 5 Stage 5a Mounting Surface 6 Dicing Speed Control Means 7 Input Data 8 Cutting Line 9 Blade Replacement 10 Dicing Speed Data Input 11 Dicing 12 Rotation Meter 13 Blade Rotation Direction 14 Moving Direction 15 Dicing Speed Control Means 16 Cutting width 17 Camera (monitor means) 18 Dicing speed control means

Claims (4)

[Claims] 1. A blade for cutting a semiconductor wafer, a rotating shaft to which the blade is attached, a stage on which a mounting surface of the semiconductor wafer, which is movable when the semiconductor wafer is cut and is horizontal in the moving direction, is installed, A dicing speed control means for automatically changing the feed speed of the stage. 2. A blade for cutting a semiconductor wafer, a rotary shaft to which the blade is attached, a stage on which a mounting surface of the semiconductor wafer, which is moved when the semiconductor wafer is cut and is horizontal in the moving direction, is installed, And a dicing speed control means for automatically changing the feed speed of the stage based on input data of the feed speed of the stage corresponding to the number of cutting lines cut on the semiconductor wafer. 3. A blade for cutting a semiconductor wafer, a rotary shaft to which the blade is attached, a stage on which a mounting surface of the semiconductor wafer, which is movable when the semiconductor wafer is cut and is horizontal in the moving direction, is installed, It has a tachometer installed on the rotating shaft and for measuring the number of revolutions of the blade, and a dicing speed control means for automatically changing the feed speed of the stage based on the measurement value measured by the tachometer. Characteristic dicing equipment. 4. A blade for cutting a semiconductor wafer, a rotating shaft to which the blade is attached, a stage on which a mounting surface of the semiconductor wafer, which is movable when cutting the semiconductor wafer and is horizontal in the moving direction, is installed, Monitor means for measuring the cutting width immediately after cutting the semiconductor wafer,
A dicing speed control means for automatically changing the feed speed of the stage based on the measurement value measured by the monitor means.