JPH0877971A - Fluorescent lamp device and lighting system - Google Patents

Abstract

PURPOSE: To provide a fluorescent lamp device which can be efficiently lit up and a lighting system. CONSTITUTION: A cover 1 provided with a base 3 is closed by means of a partitioning plate 4, and on the base 3 side of the partitioning plate 4, a circuit substrate 13 for an inverter circuit 12 whose electric power consumption is 15W or less is provided, while on the opposite side, a fluorescent lamp 21 is arranged. In both end parts 26 of a glass bulb 25 of the fluorescent lamp 21, a thin tube 31, in which amalgam 32 controlling a mercury vapor pressure during lighting is stored, is projected. The amalgam 32 consists of bismuth(Bi)- indium(In)-lead(Pb)-mercury(Hg), and the optimum electric power consumption is provided when temperature of the amalgam 32 is 70 deg.C to 100 deg.C as the volume of an armor per electric power consumption 1W is set to 18cm<3> to 28cm<3> . For the volume of the armor per electric power consumption 1W is reduced, the rise of temperature is suppressed, and low grade parts can be used without damaging, the reliability of a circuit part, so that costs of the parts can be lowered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a fluorescent lamp device called a so-called light bulb type fluorescent lamp and an illuminating device equipped with the fluorescent lamp device.

[0002]

2. Description of the Related Art This fluorescent lamp device is disclosed, for example, in Japanese Patent Laid-Open No.
No. 0-208045. FIG.
It is a front view which has a partial notch of this fluorescent lamp apparatus. In this fluorescent lamp device, as shown in FIG. 11, a fluorescent lamp 71 having a saddle-shaped bend to form one meandering discharge path is provided with a ballast 74 in an envelope 73 having an E-shaped base 72. It is equipped with the structure accommodated together. FIG. 12 is a cross-sectional view showing an end portion of the fluorescent lamp 71. In the fluorescent lamp 71, a glass bulb 75 constitutes an airtight container. Mercury and a rare gas are enclosed inside the glass bulb 75, and a fluorescent light emitting layer 76 is formed on the inner surface. A thin tube 77 is continuously provided at both ends of the glass bulb 75, one of which functions as an exhaust pipe, and the other of which has an amalgam 78 inside thereof.

The amalgam 78 is enclosed so that the mercury vapor pressure in the fluorescent lamp 71 can show an optimum value even if the inside of the envelope 73 becomes hot. JP-A-60-20
In the case of the fluorescent lamp device described in Japanese Patent No. 8045, the amalgam 78 is composed of bismuth (Bi) -indium (In) -mercury (Hg). This amalgam 78 is
The ambient temperature of the fluorescent lamp 71, more accurately, the temperature of the amalgam is in the optimum state at a temperature of about 100 ° C to 120 ° C. Therefore, the efficiency of this bismuth (Bi) -indium (In) amalgam falls outside this temperature range.

On the other hand, bismuth (Bi) -indium (I
n) -An amalgam other than amalgam is also known.
For example, JP-A-1-197959 discloses that bismuth (B
i) -Indium (In) -Lead (Pb) -Mercury (Hg)
Of amalgams are described.

[0005]

Since the fluorescent lamp device has a high temperature inside, the parts used are highly reliable and therefore expensive. As a result, in order to reduce the manufacturing cost of the entire fluorescent lamp device, it is necessary to suppress the temperature rise inside the envelope.

On the other hand, the conventional fluorescent lamp device is
Although it was intended to be compatible with incandescent light bulbs, the compatibility with equipment for incandescent light bulbs was not sufficient and miniaturization was required. However, if the size is simply reduced, the temperature inside the envelope increases remarkably, and there is a problem that a product satisfying the reliability cannot be obtained.

Further, it is known to change the lighting circuit from a choke type ballast to a high frequency lighting circuit in order to improve the efficiency of such a fluorescent lamp device. However, the high-frequency lighting circuit has a higher component cost than the choke-type ballast, and there is a problem in that the component cost increases by simply replacing the high-frequency lighting circuit with the high-frequency lighting circuit. Furthermore, since the circuit efficiency is improved by changing the choke type ballast to a high frequency lighting circuit, the temperature inside the envelope will drop slightly if the other configurations are exactly the same, but the temperature will drop However, there is a problem that the compatibility of the amalgam used is impaired and the efficiency of the entire fluorescent lamp device is reduced.

Further, it is expected that the temperature inside the envelope will be lowered by changing the choke type ballast to a high frequency lighting circuit, and it is conceivable to change the amalgam used in accordance with this. At least the conventionally known bismuth (Bi) -indium (In) -lead (P
b) -For mercury (Hg) amalgams, the volume of the envelope,
Since the compatibility with the power consumption of the entire device is not good, there is a problem that high efficiency cannot be obtained.

The present invention has been made in view of the above problems, and can be miniaturized, the compatibility between the fluorescent lamp device and the amalgam can be improved, the efficiency can be further improved, and the reliability of the parts used can be improved. An object is to provide a fluorescent lamp device.

[0010]

According to a first aspect of the present invention, there is provided a firefly lamp device having a base, at least a part of which is transparent, and a volume per watt of power consumption is 18 cm 3 or more and 28 cm 3.
Envelopes of 3 or less; curved tube-shaped glass bulbs, which are housed in the peripheral cavity and whose ends are located in the direction of the base and form an airtight discharge space, and a pair of glass bulbs sealed at both ends. Electrode, a fluorescent light emitting layer deposited inside the glass bulb, mercury and rare gas enclosed in the glass bulb, bismuth (Bi) -enclosed in the glass bulb.
It is composed of indium (In) -lead (Pb) -mercury (Hg), and the ratio of each metal is 47.0 wt% ≤ Bi ≤ 59.
0 wt%, 1.5 wt% ≤ In ≤ 4.5 wt%, 35.
0 wt% ≤ Pb ≤ 47.0 wt% and 2.5 wt% ≤
A fluorescent lamp having an amalgam with Hg ≤ 6.0 wt%; arranged in the envelope and having a total power consumption of 17
A high-frequency lighting circuit that lights the fluorescent lamp below W;
It is characterized by having.

Since at least a part is translucent, the other part may be non-translucent. Further, it may not be transparent as long as it is transparent. The envelope includes, for example, a glove and a cover, but is not limited to this. The volume is the outer volume of the envelope. In this case, the volume occupied by the base is also included. The electrodes are generally filament electrodes, but may be cold cathodes.

A fluorescent lamp device according to a second aspect is the fluorescent lamp device according to the first aspect, wherein bismuth (Bi)-
The ratio of indium (In) -lead (Pb) -mercury (Hg) is 51.6 wt% ≦ Bi ≦ 53.6 wt%, 2.6 w
t% ≦ In ≦ 3.2 wt%, 39.5 wt% ≦ Pb ≦ 4
1.5 wt% and 3.6 wt% ≤ Hg ≤ 4.4 wt%
Is characterized in that.

A fluorescent lamp device according to a third aspect of the present invention is the fluorescent lamp device according to the first or second aspect, in which the main component of the high-frequency lighting circuit has its component mounting surface directed between the base and the fluorescent lamp and toward the base. It is characterized in that it is mounted and arranged on a circuit board, and a main part of the fluorescent lamp is located on the opposite side of the circuit board.

A fluorescent lamp device according to a fourth aspect is the fluorescent lamp device according to any one of the first to third aspects,
The amalgam is housed in a thin tube protruding from the end of the glass bulb, and the thin tube is located closer to the base than the circuit board surface of the circuit board.

A fluorescent lamp device according to a fifth aspect is the fluorescent lamp device according to any one of the first to fourth aspects,
The power consumption of the circuit is 15% or less of the total power consumption.

A lighting device according to a sixth aspect of the present invention includes a fixture body;
The fluorescent lamp device according to any one of claims 1 to 5, which is mounted on a fixture body.

An illumination device according to a seventh aspect is the illumination device according to the fourth aspect, characterized in that the fixture body surrounds the fluorescent lamp device and is provided with a shade having an opening at one end.

[0018]

In the firefly lamp device according to the first aspect, the efficiency can be improved by using the high frequency lighting circuit, and the power consumption is less than 17 W, so that the temperature inside the envelope can be lowered.
However, the conventional bismuth (Bi) -indium (In) amalgam becomes unsuitable as an amalgam due to this temperature decrease, while the conventionally known bismuth (Bi) -indium (In) -lead (Pb) amalgam is used. However, because the temperature inside the envelope is so large that it is not possible to show the optimum efficiency, the internal volume of the envelope is 18 cm3 or more, which is smaller than the conventional volume per watt of power consumption.
Since the size is 8 cm3 or less, an efficient and compact fluorescent lamp device having a low temperature inside the envelope can be obtained.

The volume of the envelope per watt of power consumption is 2
When it exceeds 8 cm3, the temperature in the envelope is too low, and not only the conventional bismuth (Bi) -indium (In) amalgam but also bismuth (Bi) -indium (I
Even with n) -lead (Pb) amalgam, the mercury vapor pressure will be much lower than the optimum value. On the contrary, when the volume of the envelope per watt of power consumption is less than 18 cm3, the temperature inside the envelope is too high, and the optimum condition of bismuth (Bi) -indium (In) -lead (Pb) amalgam is obtained. Come off.

Further, if the power consumption is 17 W or more, it is difficult to reduce the size.

Further, the composition of amalgam is bismuth (B
i) -Indium (In) -Lead (Pb) -Mercury (Hg)
And the ratio of each metal is 47.0 wt% ≦ Bi ≦ 59.0.
wt%, 1.5 wt% ≦ In ≦ 4.5 wt%, 35.0
wt% ≦ Pb ≦ 47.0 wt% and 2.5 wt% ≦ H
The reason why g ≦ 6.0 wt% is that this amalgam composition is
This is because the mercury vapor pressure can be more appropriately maintained at 70 ° C. to 100 ° C., which is lower than in the past, and it is difficult to control the mercury vapor pressure outside this numerical range.

A fluorescent lamp device according to a second aspect is the fluorescent lamp device according to the first aspect, wherein the composition ratio of bismuth (Bi) -indium (In) -lead (Pb) -mercury (Hg) of amalgam is 51. .6 wt% ≦ Bi ≦ 53.
6 wt%, 12.6 wt% ≤ In ≤ 3.2 Wt%, 3
9.5 wt% ≤ Pb ≤ 41.5 Wt% and 3.6 wt
Since% ≦ Hg ≦ 4.4 wt%, the fluorescent lamp can be turned on in a more optimal state.

According to a third aspect of the present invention, there is provided the fluorescent lamp device according to the first or second aspect, wherein the main components of the high-frequency lighting circuit are between the base and the fluorescent lamp, and the component mounting surface is directed toward the base. Since it is mounted on the board and the main part of the fluorescent lamp is located on the opposite side of the circuit board, the volume of the envelope becomes smaller and the circuit becomes a high-frequency lighting circuit, reducing heat loss. Nevertheless, the operating temperature of the amalgam is controlled to a temperature range that shows even more optimum efficiency.

A fluorescent lamp device according to a fourth aspect is the fluorescent lamp device according to any one of the first to third aspects,
The amalgam is housed in a thin tube protruding from the end of the glass bulb, and the thin tube is positioned closer to the base than the circuit board surface of the circuit board, so that the operating temperature of the amalgam shows even more optimum efficiency. Controlled by temperature range.

In the fluorescent lamp device according to the fifth aspect, the power consumption of the circuit is 15% or less of the total power consumption, so that the heat loss is smaller than that of the conventional choke ballast, and the temperature inside the envelope is low. Can be reduced.

The power consumption of the circuit is 15% of the total power consumption.
If it exceeds, the heat generation of the circuit becomes too large, the temperature of the amalgam located closer to the base than the circuit board tends to be high, and it becomes difficult to maintain the mercury vapor pressure.

In the lighting device according to the sixth aspect, since the fluorescent lamp device according to the first to fifth aspects is mounted on the main body of the fixture, the fluorescent lamp can be turned on in an optimum state.

According to a seventh aspect of the present invention, there is provided an illumination device according to the sixth aspect, wherein the fixture body surrounds the fluorescent lamp device and includes a shade having an opening at one end. The temperature inside the enclosure rarely rises extremely.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A fluorescent lamp device according to an embodiment of the present invention and an illuminating device using this fluorescent lamp device will be described below with reference to the drawings.

FIG. 1 is a partially cutaway front view of the fluorescent lamp device BFL, and FIG. 2 is an exploded perspective view of the fluorescent lamp device BFL. Fluorescent lamp device BF shown in FIGS. 1 and 2.
In L, 1 is a cover, which is made of heat-resistant synthetic resin such as PBT resin, and a cylindrical portion 2 is integrally formed at one end of the cover 1.
A screw-type mouthpiece 3 such as an Edison type E26 type is attached to this, and after the mouthpiece 3 is screwed into a thread formed on the cylindrical portion 2, a punch is driven into the side surface of the mouthpiece 3. It is fixed to the cylindrical portion 2. You may fix with an adhesive agent.

The other end of the cover 1 is closed by a partition plate 4, which is made of a heat-resistant synthetic resin such as PBT resin and has a substantially circular dish shape. Further, as shown in FIG. 2, the partitioning board 4 has a flange portion 6 at the upper end closing edge of the side wall 5 having a rising shape.
Are formed on the flange portion 6. For example, four locking tongue pieces 7 are formed on the flange portion 6 so as to be spaced apart from each other in the circumferential direction. The locking tongues 7 are formed so as to divide the flange portion 6 in the circumferential direction by the slits 8 formed in the flange portion 6. Therefore, the locking tongues 7 can be elastically deformed in the radial direction.

Further, the inner surface of the cover 1 corresponds to these locking tongues 7 and locking projections 9 for locking these locking tongues 7.
Are integrally formed. That is, when the cover 1 and the partition board 4 are butted against each other, the locking tongue piece 7 is elastically deformed to get over the locking projection 9, and the cover 1 and the partition board 4 are locked to each other.
And the locking projection 9 are engaged with each other.

A fixed claw is attached to the flange portion 6 of the partition board 4.
11 is formed, and another fixed claw 11 is formed upright from the bottom wall at another position of the partition board 4. The fixed claw 11 has an inverter circuit as a high frequency lighting device.
Twelve printed circuit boards 13 are locked.

Further, the inverter circuit 12 is located in the space covered by the cover 1 and is attached to the partition board 4. The inverter circuit 12 is lit at a high frequency using a transistor inverter on the circuit board 13. It is configured by mounting a circuit component 14 for.

Also, at one end of the printed circuit board 13,
The connection terminals 15 are provided so as to project, and these connection terminals 15 are electrically connected to the circuit component 14, and the external lead wires 22 of the saddle-shaped fluorescent lamp 21 are wound and connected. The fluorescent lamp 21 may be U-shaped or W-shaped.

On the lower surface of the partition board 4, a lamp mounting cylinder portion 23 as a holding portion is integrally formed. A fluorescent lamp 21 is attached to the lamp mounting tube portion 23, and the fluorescent lamp 21 has a power consumption of about 13.5 W and a lamp current of about 280 mA. The brightness is 6
It is about 0 W incandescent bulb.

Further, the fluorescent lamp 21 has a fluorescent light emitting layer (not shown) formed on the inner surface thereof, and both ends 26 of a glass bulb 25 in which a rare gas such as mercury and argon is enclosed, are arranged in close proximity to each other, and a base is provided. It is located in three directions, and has a central bent portion 27 that is bent in a U shape between these both end portions 26, and this central bent portion 27 is bent so as to face the same direction as both end portions 26. Has been formed. Furthermore, electrodes 28 of a filament coil are sealed at both ends 26 of the glass bulb 25, and auxiliary amalgams 29 are attached to these electrodes 28, respectively. Then, the pair of external lead wires 22 connected to these electrodes 28 are guided to the outside from the ends 26 of the glass bulb 25, respectively, and are connected to the connection terminal 15 by being wound a plurality of times, for example.

The electrode 28 is composed of a triple coil. FIG. 3 is a partial front view of the primary coil for explaining the manufacturing process of the triple coil of the electrode 28, FIG. 4 is a partial front view of the secondary coil of the triple coil of the electrode 28, and FIG. 5 is configured as a triple coil. FIG. 8 is a front view of the electrode 28 that has been opened.

As shown in FIG. 3, this electrode 28 has a thickness of 6.3M.
9.0M parallel to the first molybdenum wire M1 of G
G main wire 28a is placed and
1.8 for molybdenum wire M1 and main wire 28a
The MG sub wire 28b is wound at a pitch of 0.08 mm. The first molybdenum wire M1 is later put into an acid and melted. The unit MG is m per length of 200 mm.
Indicates the weight expressed in g.

Next, as shown in FIG. 4, the coil formed in FIG. 3 is replaced with a second molybdenum wire of 100 MG.
Wind around M2 with 0.2mm pitch. This second molifden wire M2 will also be dissolved with acid later.

Next, the coil is wound around a piano wire having a diameter of 1.0 mm for several turns at a pitch of 0.7 mm. And pull out the piano wire, then the first molybdenum wire
Dissolve M1 and the second Molyfden wire M2 with acid, and as shown in Fig. 5, the number of turns per predetermined length is 3 and the diameter is 1.0.
Form the electrode 28 in mm.

Further, the cold resistance value of this electrode 28 at an ambient temperature of 25 ° C. is set to 2.6Ω.

Further, thin tubes 31 are projected at both ends 26 of the glass bulb 25, and at least one of these thin tubes 31 houses an amalgam 32 for controlling the mercury vapor pressure during lighting.

The amalgam 32 is composed of bismuth (Bi) -indium (In) -lead (Pb) -mercury (Hg), and the ratio of each metal is 47.0 wt% ≤Bi≤59.0w.
t%, 1.5 wt% ≦ In ≦ 4.5 wt%, 35.0 w
t% ≦ Pb ≦ 47.0 wt% and 2.5 wt% ≦ Hg
≦ 6.0 wt%, preferably 50.6 wt% ≦
Bi ≦ 52.6 wt%, 2.6 wt% ≦ In ≦ 3.2w
t%, 39.5 wt% ≤ Pb ≤ 41.5 wt% and 3.6 wt% ≤ Hg ≤ 4.4 wt%.

An auxiliary amalgam 29 is resistance-welded to the inner lead wire near the electrode 28. The auxiliary amalgam 29 is formed by depositing In metal on the surface of a nickel plate and installed in the fluorescent lamp 21, and the In metal absorbs mercury in the fluorescent lamp 21 to form an amalgam. The amalgam 32 is located closer to the base 3 than the circuit board 13.

The fluorescent lamp 21 is inserted from below the partition board 4 into a lamp mounting cylinder portion 23 having both ends 26 formed on the upper cutting board 4, and between the end portions 26 and the lamp mounting cylinder portion 23. It is fixed to the partition board 4 by a filled thermosetting adhesive 33 such as a silicone-based adhesive. Further, the central bent portion 27 of the fluorescent lamp 21 is joined to the lower surface of the partition board 4 by a thermosetting adhesive 34 such as a silicone type. For this reason, the fluorescent lamp 21 is fixed to the partition board 4 at a total of three places, that is, both ends 26 and the central bent portion 27.

The fluorescent lamp 21 is covered with, for example, a glass globe 35 forming a part of an envelope, and the glass globe 35 has a cup shape with an open upper end. The globe 35 is made of transparent or light-diffusing synthetic resin or glass, and the globe 35 may have a straight neck portion 36 with its upper end opening having a slightly smaller diameter. Furthermore, a meat reservoir 37 is formed continuously over the entire circumference at the opening end of the neck 36, and the meat reservoir 37 is melted by heating and softening the upper end closed portion of the globe 35. Meat is gathered together to form a meat puddle. The cover 1 and the globe 35 form an envelope.

The volume of the envelope including the cover 1, the base 3 and the globe 35 is 18 per 1 watt of power consumption.
It is more than cm3 and less than 28 cm3. Particularly, in this embodiment, the total power consumption is about 15 W, while the volume is 330 cm @ 3. Therefore, the volume per watt of power consumption is 22 cm3. In this embodiment, the globe 35 has a cylindrical shape, whereas the spherical shape has a volume of 410 cm3.
(The volume per watt of power consumption is about 27 cm3). In the case of a fluorescent lamp device using a conventional bismuth (Bi) -indium (In) amalgam and having a cylindrical globe, the power consumption was 17 W and the volume was 500 cm3.

As shown in FIG. 1, the neck portion 36 of the glove 35 is adapted to be inserted into a ring-shaped gap formed between the inner surface of the cover 1 and the rising side wall 5 of the partition wall 4. The globe 35 is bonded to both the inner surface of the cover 1 and the rising side wall 5 of the partition board 4 by a thermosetting adhesive 41 such as a silicone type. The thermosetting adhesive 41 may be bonded to at least one of the inner surface of the cover 1 and the rising side wall 5 of the partition board 4.

The thermosetting adhesive 41 is made of silicone, for example, and has a hardness of 20 at the time of curing.
As described above, the hardness is 50 or less, and in the case of a silicone type, the hardness can be changed by adjusting the mixing ratio of the curing agent mixed with the silicone. When the hardness is less than 20, the fixing strength is weak, and when the hardness is more than 50, stress is applied to the glove 35 due to the distortion of the adhesive 41 at the time of curing, and the glove 35 is
May be damaged.

Next, the order of assembling the fluorescent lamp device will be described. First, the printed circuit board 13 on which the circuit component 14 for high-frequency lighting is mounted in advance is locked to the upper surface of the partition board 4 via the fixing claw 11. In addition, a fluorescent lamp 21 is provided on the lower surface of the partition board 4.
This fluorescent lamp 21 is inserted into the lamp mounting tube portion 23 having the end portion 26 formed on the partition board 4, and the end portion 26 of these glass bulbs 25 and the lamp mounting tube portion 23 are bonded by the thermosetting adhesive 33. Fix it. In addition, the central bent portion 27 of the glass bulb 25
Is bonded to the lower surface of the partition board 4 with a thermosetting adhesive 33. In this way, the fluorescent lamp 21 has a glass bulb 25.
The end 26 of the lamp is fixed with a thermosetting adhesive 33 in a state of being inserted into the lamp mounting cylinder 23, and the central bent portion 27 is joined to the lower surface of the partition board 4 with the thermosetting adhesive 34. Therefore, it is fixed to the partition board 4 at a total of three places.

In this state, the partition board 4 is attached to the cover 1. In this work, the locking tongue 7 formed on the flange portion 6 of the partitioning board 4 is passed over the locking projection 9 formed on the cover 1, and the locking tongue 7 is elastically deformed and locked to the locking projection 8. Then
The cover 1 and the partition board 4 are joined together.

Next, the inverter circuit 12 and the base 3 are electrically connected, and the base 3 is fixed to the cylindrical portion 2 of the force bar 1.

When such assembling is completed, the partition board 4
A thermosetting adhesive 41 is filled between the outer peripheral surface of the rising side wall 5 and the inside of the closed portion of the cover 1. Since the thermosetting adhesive 41 joins the partition board 4 and the cover 1, the partition board 4 is adhered to the cover 1 and prevented from coming out. Then, while the thermosetting adhesive 41 is not yet cured, the globe 35 is put on the fluorescent lamp 21, and the opening end of the globe 35 is covered with the outer peripheral surface of the rising side wall 5 of the partitioning board 4 and the inner surface of the opening of the cover 1. And is embedded in the thermosetting adhesive 41 filled therein. Then, the thermosetting adhesive 41 adheres to the inner surface and the outer surface of the neck portion 36 of the globe 35, and the thermosetting adhesive 41 is dried in this state.

When the thermosetting adhesive 41 dries,
The globe 35 is joined to the rising side wall 5 of the partition board 4 and the inner surface of the opening of the cover 1 via the thermosetting adhesive 41. In the fluorescent lamp device configured as described above, the volume of the envelope including the cover 1, the base 3 and the globe 35 is
Since the power consumption is 18 cm3 or more and 28 cm3 or less per watt, the temperature inside the envelope, especially Amalcum 32
The temperature of the tube wall of the thin tube 31 in which is installed is about 90 ° C. That is, conventional bismuth (Bi) -indium (I
n) It is lower than about 100 ° C to 120 ° C in the case of a fluorescent lamp device using amalgam and having a power consumption of 17 W and an envelope volume of 590 cm3. As a result, as the amalgam used, bismuth (Bi) -indium (In) -lead (Pb) amalgam is more suitable than the conventional bismuth (Bi) -indium (In) amalgam. Therefore, conventional bismuth (Bi)-
Bismuth (B) instead of indium (In) amalgam
i) -Indium (In) -Lead (Pb) amalgam can be used, and as a result, the present fluorescent lamp device can be efficiently turned on.

The volume of the envelope per watt of power consumption is 2
When it exceeds 8 cm3, the temperature inside the envelope is too low, and not only the conventional bismuth (Bi) -indium (In) amalgam but also bismuth (Bi) -indium (I
Even with n) -lead (Pb) amalgam, the mercury vapor pressure becomes lower than the optimum value. On the contrary, when the volume of the envelope per watt of power consumption is less than 18 cm3, the temperature rises, and bismuth (Bi) -indium (In)-
It comes out of the optimum condition of lead (Pb) amalgam.

FIG. 6 is a temperature characteristic diagram of mercury vapor pressure of amalgam. If the temperature is around 80 ° C to 90 ° C,
Regarding the mercury vapor pressure in the tube, the bismuth (Bi) -indium (In) -lead (Pb) amalgam shows a value closer to the optimum value than the conventional bismuth (Bi) -indium (In) amalgam.

Further, since the temperature inside the cover 1 also decreases in the same manner as the temperature of the tube wall of the thin tube 31 decreases, the reliability of the circuit parts does not deteriorate even if inexpensive low-grade parts are used. Therefore, the manufacturing cost can be reduced.

Further, in this fluorescent lamp device, the total power consumption is 15 W, whereas the power consumption of the circuit portion is about 1.5 W.
Is. As in this embodiment, the power consumption of the circuit is preferably 15% or less of the total power consumption. When the power consumption of the circuit exceeds 15% of the total power consumption, the heat generation of the circuit becomes too large and the temperature inside the cover rises too much. As a result, the temperature of the amalgam located closer to the base than the circuit board becomes high, and it becomes difficult to maintain the mercury vapor pressure.

When the fluorescent lamp 21 is turned on by using the inverter circuit 12, the amount of transmitted ultraviolet rays increases due to an increase in the tube wall load, which cannot be ignored as a cause of discoloration. For this reason, in this embodiment, an ultraviolet absorbing diffusion film (not shown) is formed on the inner surface of the globe 35. This diffusion film contains an ultraviolet absorbing fine particle metal oxide such as titanium oxide or zinc oxide which absorbs ultraviolet rays emitted from a fluorescent lamp. The UV absorbing fine particle metal oxide has an average particle size of less than 1 μm, and therefore the linear transmittance becomes high, the visible light diffusing effect becomes small, and the volatile component adheres to further increase the linear transmittance. Is transparent. Therefore, inorganic fine particles having an average particle size of 1 μm or more are mixed for visible light scattering. Further, simply increasing the average particle size causes deterioration of the film skin and creates a shadow. Therefore, 30% or more of particles having an average particle size of less than 1 μm and 30% of particles having an average particle size of 1 μm or more are included. % Or more, and the particle size distribution may be widely dispersed.

When coating the inside of the globe 35, the materials shown in Table 1 may be mixed.

[0062]

[Table 1] In this way, by mixing the ultraviolet absorber in the diffusion film of the globe 35, it is possible to absorb the ultraviolet light having a wavelength of about 365 nm, which is radiated to the outside. The spectra of ultraviolet rays emitted to the outside are shown in FIGS. 7 and 8. Here, FIG. 7 shows an ultraviolet spectrum distribution characteristic diagram that passes through a conventional globe,
FIG. 8 shows an ultraviolet spectrum distribution characteristic diagram that passes through the globe of the fluorescent lamp device in which the ultraviolet absorber is mixed in the diffusion film of the globe 35 of the present invention. Thus, the glove 35
The fluorescent lamp device in which an ultraviolet absorber is mixed in the diffusion film can reduce the amount of transmitted ultraviolet light and irradiate visible light mainly.

FIG. 9 is a perspective view of an illuminating device equipped with the above fluorescent lamp device. As shown in FIG. 9, the fluorescent lamp device BFL is attached to a lighting fixture 61 having an Edison socket to which an incandescent light bulb is attached. This lighting fixture
61 has a bottom open type shade 62. In the sealed type, the temperature inside the shade 62 becomes high, and the temperature inside the envelope of the fluorescent lamp device becomes too high, so that proper operation may not be obtained.

Since the fluorescent lamp device of the above-mentioned embodiment employs the high frequency lighting circuit, it uses parts weaker in temperature than the conventional choke ballast. Therefore, at the end of its life, a structure is provided so that abnormal discharge continues and an ignition accident does not occur. This will be described with reference to FIG.

FIG. 10 is a circuit diagram of the fluorescent lamp device of the above embodiment. In this circuit, a capacitor C1 is connected to both ends of a commercial AC power source E via a fuse F1, and a full-wave rectifier 51 is connected between both terminals of the capacitor C1 via an inductor L1.
Connect the input terminal of. Then, an electrolytic capacitor C2 is connected between the output terminals of this full-wave rectifier 5l, and the drain and source of the field effect transistor QI and the drain and source of the field effect transistor Q2 are connected between both terminals of this electrolytic capacitor C2. To do. Furthermore, field effect transistors
One end of the input winding CT1 of the saturable current transformer CT is connected between the source of Q1 and the drain of the field effect transistor Q2.

Further, the gate of the field effect transistor Q1
The control winding CT2 of the saturable current transformer CT is connected between the sources, and the control winding CT3 of the saturable current transformer CT is connected between the gate and the source of the field effect transistor Q2. further,
A series circuit in which zener diode ZD1 and zener diode ZD2 are connected between the gate and source of field effect transistor Q2 with inverse characteristics and a series circuit of resistor R1 and capacitor C3 are connected in parallel.

Further, a series circuit of a resistor R2 and a trigger element Q3 is connected to the gate of the field effect transistor Q2,
The capacitor C4 is connected between the connection point of R2 and the trigger element Q3 and the negative electrode of the full-wave rectifier 5l. Also, fuse F2
A resistor R3 is connected between the sources of the field effect transistor QI and the diode D1 is connected between the resistors R2 and R3.

The saturable current transformer CT is 0.6
Terminal a is connected through a choke coil L2 for resonance of 4 mH and a capacitor C4 for DC cut of 333 μF, and terminal b is fed to the negative electrode of full-wave rectifier 5l.
One end of the electrode 28 is connected to each of the terminals and the terminal b. Terminals c and d are connected to both ends of the resonance capacitor C5 of 123 μF, and the other end of the electrode 28 is connected to these terminals c and d.

The cold resistance value of the electrode 28 between the terminals a and c and between the terminals b and d is set to 2Ω to 4Ω. Further, when the terminals a and c and the terminals b and d are short-circuited with a resistance value of 5Ω, a voltage of 260 V or more is generated between the terminals a and b.

Next, the lighting operation of the fluorescent lamp 21 will be described with reference to FIG.
This will be described with reference to 0. First, the AC voltage of the commercial AC power supply E is full-wave rectified by the full-wave rectifier 5l, and
By smoothing with Q2, charging the capacitor C4 and turning on the trigger element Q3 when the capacitor C4 becomes equal to or higher than a predetermined voltage value, the trigger element Q3 is turned on to charge the capacitor C3 and increase the voltage of the capacitor C3. A voltage is applied to the gate of the field effect transistor Q2 to turn on the field effect transistor Q2. Then, according to the saturation of the saturable current transformer CT, the gate of the field effect transistor QI and the field effect transistor Q2 are controlled by the control winding CT2 and the control winding CT3.
A voltage is alternately applied to the gate of the electrode to generate a high-frequency alternating current to start and light the fluorescent lamp 21, that is, arc discharge of about 40 V is performed between the electrodes 28, and
Always preheat.

Then, for example, at the end of the life, when the emitter of any of the electrodes 28 is consumed, there is a 1
One-sided glow discharge of about 00 V occurs, the impact of ions becomes large, and the electrode 28 on the side where the emitter is consumed heats up and burns off, causing a wire breakage, between the terminals a and c, or the terminal b.
And the terminal d are opened, the choke coil 2 and the resonance capacitor C5 are opened, and resonance stops,
The inverter circuit 12 stops oscillating.

With the end glow occurring on the electrode 28, the effective voltage value between the terminals a and b is about 270V.
Then, the effective voltage value of the electrode 28 is 12V and the effective current value is 2A.
Is. That is, when the electrodes 28 on both sides are coated with the emitter, the arc discharge can be reliably transferred.

Therefore, at the end of the life of the fluorescent lamp 21, the glow discharge does not continue between the electrodes 28, and
Since it is possible to prevent the temperature around the periphery 28 from unnecessarily rising, it is possible to prevent the lamp mounting cylinder portion 23 holding the end portion 26 of the glass bulb 25 of the fluorescent lamp 12 from burning.

Although it is conceivable to decrease the resistance value of the electrode 28 in order to increase the output of the inverter circuit 12, it is not preferable to shorten the total length of the electrode 28 because the holding amount of the emitter decreases. On the other hand, if MG is extremely small, the spot temperature rises abnormally to accelerate the evaporation of the emitter, resulting in a short life. On the contrary, if MG is extremely large, spots are less likely to be formed and the life becomes shorter due to sputtering.

Here, as shown in Table 2, according to the experiment, when the main wire 28a is 6 MG or less, the resistance of the electrode 28 increases and the voltage applied between the terminals a and b is decreased. Therefore, no glow discharge occurs and the two electrodes 28 continue to be electrically heated, and the lamp mounting tube portion 23 is thermally damaged. On the other hand, when the main wire 28a is 14 MG or more, the time until disconnection is too long and the lamp collecting tube portion 23 may be thermally damaged. Therefore, the main wire 28a is 8 MG
It is considered that 12 to 20 MG is preferable.

[0076]

[Table 2]

[0077]

According to the fire tip lamp device of the first and second aspects, the efficiency can be improved by using the high frequency lighting circuit, and the power consumption is less than 17 W and the inner volume of the envelope is consumed. The volume per watt is 18 cm3 or more and 28 cm3 or less, which is smaller than the conventional one, and suitable for this is bismuth (Bi) -indium (In) -lead (Pb)-
The combination of mercury (Hg) amalgam resulted in an efficient miniaturized fluorescent lamp device. Further, since the temperature inside the envelope is lowered, it is possible to reduce the grade of the used parts and manufacture at a low cost.

According to the fluorescent lamp device of the third and fourth aspects, the amalgam is installed at an appropriate place.
Alternatively, the effect of the invention according to claim 2 is surely obtained.

According to the fluorescent lamp device of the fifth aspect,
In addition to the effects of the first to fourth aspects of the present invention, since the power consumption of the circuit is 15% or less of the total power consumption, the temperature rise in the envelope can be suppressed.

According to the lighting device of the sixth aspect, the conventional lighting fixture for a light bulb can be used as it is.

According to the illumination device of the seventh aspect, in addition to the effect of the sixth aspect of the invention, since the main body of the fixture surrounds the fluorescent lamp device and is equipped with a shade having an opening at one end, the fluorescent device The temperature inside the envelope of the lamp device can be reduced, and the risk of impairing reliability can be reduced.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing an embodiment of a fluorescent lamp device of the present invention.

FIG. 2 is an exploded perspective view of the fluorescent lamp device of FIG. 1 excluding a globe.

3 is a partial front view of a process of manufacturing electrodes of a fluorescent lamp used in the fluorescent lamp device of FIG.

FIG. 4 is a partial front view of a fluorescent lamp electrode used in the fluorescent lamp device of FIG. 1 in a next manufacturing process.

5 is a front view of electrodes of a fluorescent lamp used in the fluorescent lamp device of FIG. 1. FIG.

6 is a vapor pressure characteristic diagram of an amalgam used in the fluorescent lamp device of FIG.

7 is a spectral characteristic diagram when the globe of the fluorescent lamp device of FIG. 1 does not include an ultraviolet absorber.

8 is a spectral characteristic diagram when the globe of the fluorescent lamp device of FIG. 1 contains an ultraviolet absorber.

9 is a perspective view of an illuminating device equipped with the fluorescent lamp device of FIG. 1. FIG.

10 is a circuit configuration diagram of an inverter circuit used in the fluorescent lamp device of FIG.

FIG. 11 is a partially cutaway front view of a conventional fluorescent lamp device.

12 is a cross-sectional view of an end portion of a fluorescent lamp housed in the fluorescent lamp device of FIG.

[Explanation of symbols]

3 ... Base, 12 ... Inverter circuit as high frequency lighting device 13 ... Circuit board, 14 ... Circuit parts, 21 ...
Fluorescent lamp 25 ... Glass bulb, 26 ... End portion, 28 ...
Electrode 31 ... Thin tube, 32 ... Amalgam, 35 ... Glove

Claims (7)

[Claims] 1. A base, at least a part of which is transparent,
Power consumption is 18 cm3 or more per watt, 28c
An envelope of m3 or less; a curved tube-shaped glass bulb that is housed in this envelope and has an end located in the direction of the base and forming an airtight discharge space; a pair of glass bulbs sealed at both ends. Electrode, a fluorescent light emitting layer deposited inside the glass bulb, mercury and a rare gas enclosed in the glass bulb, bismuth enclosed in the glass bulb (B
i) -Indium (In) -Lead (Pb) -Mercury (Hg)
The ratio of each metal is 47.0 wt% ≦ Bi ≦
59.0 wt%. 1.5 wt% ≤ In ≤ 4.5 wt%,
35.0 wt% ≤ Pb ≤ 47.0 wt% and 2.5 w
a fluorescent lamp having an amalgam satisfying t% ≤ Hg ≤ 6.0 wt%; a high frequency lighting circuit that is disposed in the envelope and that lights the fluorescent lamp when the total power consumption is less than 17W. A fluorescent lamp device characterized in that 2. Bismuth (Bi) -indium (In)-
The ratio of lead (Pb) -mercury (Hg) is 51.6 wt% ≦
Bi ≦ 53.6 wt%, 2.6 wt% ≦ In ≦ 3.2 w
The fluorescent lamp device according to claim 1, wherein t%, 39.5 wt% ≤ Pb ≤ 41.5 wt% and 3.6 wt% ≤ Hg ≤ 4.4 wt%. 3. A high-frequency lighting circuit is arranged such that its main components are mounted between a base and the fluorescent lamp and mounted on a circuit board with the component mounting surface facing the base, and the main part of the fluorescent lamp is the circuit board. The fluorescent lamp device according to claim 1, wherein the fluorescent lamp device is located on the opposite side. 4. The amalgam is housed in a thin tube projecting from the end of a glass bulb, and the thin tube is located closer to the base than the circuit board surface of the circuit board. 3. The fluorescent lamp device according to any one of 3 above. 5. The power consumption of the circuit is 15 of the total power consumption.
% Or less, the fluorescent lamp device according to claim 1. 6. A lighting device comprising: a fixture main body; and the fluorescent lamp device according to claim 1 mounted on the fixture main body. 7. The lighting device according to claim 6, wherein the fixture main body is provided with a shade that surrounds the fluorescent lamp device and has an opening at one end.