JPH0877899A - Alloy type temperature fuse - Google Patents
Alloy type temperature fuseInfo
- Publication number
- JPH0877899A JPH0877899A JP23425194A JP23425194A JPH0877899A JP H0877899 A JPH0877899 A JP H0877899A JP 23425194 A JP23425194 A JP 23425194A JP 23425194 A JP23425194 A JP 23425194A JP H0877899 A JPH0877899 A JP H0877899A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- temperature fuse
- low melting
- flux
- metal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Fuses (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ヒュ−ズエレメントに
低融点金属片を用いた温度ヒュ−ズ、すなわち、合金型
温度ヒュ−ズに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature fuse using a low melting point metal piece for a fuse element, that is, an alloy type temperature fuse.
【０００２】[0002]
【従来の技術】合金型温度ヒュ−ズにおいては、フラッ
クスを塗布した低融点金属片をヒュ−ズエレメントに使
用している。この合金型温度ヒュ−ズは、各種のタイプ
で使用されている。例えば、筒型ケ−スタイプにおいて
は、図１に示すように、リ−ド線１，１間に低融点金属
片２を接続し、この低融点金属片上にフラックス３を塗
布し、その外部に筒型ケ−ス４を被せ、ケ−ス各端と各
リ−ド線との間をエポキシ樹脂等の接着剤５で封止して
いる。2. Description of the Related Art In an alloy type temperature fuse, a low melting point metal piece coated with a flux is used as a fuse element. This alloy type temperature fuse is used in various types. For example, in a cylindrical case type, as shown in FIG. 1, a low melting point metal piece 2 is connected between lead wires 1 and 1, a flux 3 is applied on the low melting point metal piece, and the outside thereof is applied. A cylindrical case 4 is covered, and each end of the case and each lead wire are sealed with an adhesive 5 such as an epoxy resin.
【０００３】合金型温度ヒュ−ズにおいては、保護しよ
うとする電気機器に取付けて使用される。而して、当該
機器が過電流により発熱すると、その発生熱により低融
点金属片が溶融され、溶融金属が表面張力によりリ−ド
線端を核として球状化され、この球状化の進行により分
断され、この分断後の球状化の更なる進行により分断間
距離がア−ク消滅距離に達し、ア−クの消滅により通電
遮断が確実に終結されて、通電遮断により機器の異常発
熱、ひいては火災の発生が未然に防止される。The alloy type temperature fuse is used by being attached to an electric device to be protected. When the equipment generates heat due to overcurrent, the generated heat melts the low-melting metal piece, and the molten metal is spheroidized with the lead wire end as the nucleus due to surface tension. Due to further progress of spheroidization after this division, the distance between divisions reaches the arc extinction distance, and the disappearance of the arc surely terminates the energization interruption. Is prevented from occurring.
【０００４】この場合、低融点金属片の表面に酸化皮膜
が存在すると、所定温度（融点）のもとでの低融点金属
片の溶断が生じ難くなって、誤作動の原因となり、ま
た、溶融金属のリ−ド線端に対する濡れ性が悪いと、溶
融金属の球状化分断が生じ難くなって、作動性の低下が
余儀なくされる。In this case, if an oxide film is present on the surface of the low-melting metal piece, the low-melting metal piece is less likely to melt at a predetermined temperature (melting point), causing malfunction and melting. If the wettability of the metal with respect to the lead wire end is poor, the spheroidization of the molten metal is less likely to occur and the operability is inevitably reduced.
【０００５】而るに、低融点金属片に塗布されたフラッ
クスにおいては、低融点金属片をケ−ス内空気から遮断
して低融点金属片の酸化を防止し、また、たとえ、低融
点金属片の表面に多少の酸化皮膜が存在しても、加熱溶
融フラックスがその酸化皮膜を溶解し、更に、溶融フラ
ックスが溶融金属のリ−ド線端への濡れを促進するか
ら、当該フラックスは、合金型温度ヒュ−ズの所定温度
のもとでの迅速な作動保証に不可欠な構成要素である。In the flux applied to the low melting point metal piece, however, the low melting point metal piece is shielded from the air in the case to prevent the low melting point metal piece from being oxidized. Even if some oxide film is present on the surface of the piece, the heating molten flux dissolves the oxide film, and the molten flux promotes the wetting of the lead wire end of the molten metal. It is an indispensable component for guaranteeing the quick operation of the alloy type temperature fuse at a predetermined temperature.
【０００６】[0006]
【発明が解決しようとする課題】ところで、はんだ付け
が行われる機器、特にプリント回路基板においては、所
定のヒ−トサイクル試験のもとで、はんだ付け部が健全
であることが要求される。By the way, in a device to be soldered, especially in a printed circuit board, it is required that the soldered portion be sound under a predetermined heat cycle test.
【０００７】而るに、合金型温度ヒュ−ズをプリント回
路基板に装着する場合、当該プリント回路基板が合格し
なければならない上記ヒ−トサイクル試験に、合金型温
度ヒュ−ズも合格することが必要となる。When mounting the alloy type temperature fuse on the printed circuit board, the alloy type temperature fuse must also pass the heat cycle test which the printed circuit board must pass. Is required.
【０００８】しかしながら、本発明者の実験結果によれ
ば、プリント回路基板のはんだ付け部を検査するための
ヒ−トサイクル試験、すなわち、−２５℃３０分，＋７
０℃３０分を１サイクルとする１０００サイクルを合金
型温度ヒュ−ズに加えると、従来の合金型温度ヒュ−ズ
では、フラックス層にクラックが発生し易いことを知っ
た。However, according to the experimental results of the present inventor, a heat cycle test for inspecting a soldered portion of a printed circuit board, that is, -25 ° C. for 30 minutes, +7
It has been found that, when 1000 cycles of 0 ° C. for 30 minutes are added to the alloy type temperature fuse, cracks are easily generated in the flux layer in the conventional alloy type temperature fuse.
【０００９】かかるクラックを発生した温度ヒュ−ズで
は、ケ−ス内の空気がフラックス層のクラックの間隙を
経て低融点金属片表面に接触し、該表面が酸化し、温度
ヒュ−ズの作動特性の低下が懸念される。In the temperature fuse having such a crack, the air in the case comes into contact with the surface of the low melting point metal piece through the crack gap of the flux layer, the surface is oxidized, and the temperature fuse operates. There is concern about deterioration of characteristics.
【００１０】本発明の目的は、ヒ−トサイクルに曝され
ても、はんだ付け部が健全である以上、低融点金属片上
のフラックス層のクラック発生を確実に防止して当所の
作動特性を保証し得る合金型温度ヒュ−ズを提供するこ
とにある。The object of the present invention is to reliably prevent the occurrence of cracks in the flux layer on the low melting point metal piece by ensuring that the soldered portion is sound even when exposed to a heat cycle, thereby guaranteeing the operating characteristics of the present place. To provide a possible alloy type temperature fuse.
【００１１】[0011]
【課題を解決するための手段】本発明に係る合金型温度
ヒュ−ズは、低融点金属片をヒュ−ズエレメントとし、
該低融点金属片にフラックスを塗布した温度ヒュ−ズに
おいて、フラックスに、ヒ−トサイクルに対するクラッ
ク抑制剤を添加したことを特徴とする構成であり、クラ
ック抑制剤としては不飽和脂肪酸アミドが好適である。The alloy-type temperature fuse according to the present invention comprises a low melting point metal piece as a fuse element,
In a temperature fuse in which a flux is applied to the low melting point metal piece, a crack inhibitor for a heat cycle is added to the flux, and an unsaturated fatty acid amide is preferable as the crack inhibitor. Is.
【００１２】以下、図面を参照しつつ本発明の実施例に
ついて説明する。図１は、本発明に係る筒型ケ−スタイ
プの合金型温度ヒュ−ズの実施例を示す断面図である。
図１において、１，１は一直線状に配設したリ−ド線、
２はリ−ド線１，１間に臘接または溶接により接続した
低融点金属片である。３は低融点金属片２に塗布したフ
ラックスであり、松脂等のロジンに活性剤〔有機アミン
のハロゲン化水素酸塩（例えば、シクロヘキシルアミン
ＨＢｒ、アニリン塩酸塩、ヒドラジン塩酸塩等）、有機
酸（例えば、パルミチン酸、セバシン酸等）、有機酸と
有機アミンとの塩（例えば、トリブチルアミンのアジピ
ン酸塩、ジエチルアミンのコハク酸塩等）〕並びにヒ−
トサイクルに対するクラック抑制剤を添加してある。４
はフラックス塗布低融点金属片上に被せたセラミックス
筒である。５，５はセラミックス筒両端の各端と各リ−
ド線（通常、裸銅線または絶縁被覆銅線が使用される）
との間を封止した接着剤、例えば、常温硬化性のエポキ
シ樹脂である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of an alloy type temperature fuse of a cylindrical case type according to the present invention.
In FIG. 1, 1 and 1 are lead wires arranged in a straight line,
Reference numeral 2 is a low melting point metal piece connected between the lead wires 1 and 1 by side contact or welding. 3 is a flux applied to the low melting point metal piece 2, which is an activator for rosin such as pine resin [organic amine hydrohalide salt (eg, cyclohexylamine HBr, aniline hydrochloride, hydrazine hydrochloride, etc.), organic acid ( For example, palmitic acid, sebacic acid, etc.), salts of organic acids and organic amines (eg, tributylamine adipate, diethylamine succinate, etc.)] and
A crack suppressant for tricycle is added. Four
Is a ceramic cylinder covered with a flux-coated low melting point metal piece. 5 and 5 are each end and both ends of the ceramic cylinder.
Wire (usually bare or insulated copper wire is used)
It is an adhesive agent that seals the space between and, for example, a room temperature curable epoxy resin.
【００１３】上記ヒ−トサイクルに対するクラック抑制
剤には、はんだ付けの検査に使用されるヒ−トサイクル
試験に対しフラックス層のクラック発生を防止し得る成
分が使用され、オレイン酸アミド、リノレン酸アミド、
ウンデシレン酸アミド、エライジン酸アミド、エルカ酸
アミド、ソルビン酸アミド、リノ−ル酸アミドの何れか
一種または二種以上の不飽和脂肪酸アミドが好適であ
り、添加量は、ロジン１００重量部に対し、１〜４重量
部が適切である。その理由は、１重量部以下では、ヒ−
トサイクルに対するフラックス層のクラック防止を満足
に達成し難く、４重量部以上ではフラックスの粘着性が
強くなり、温度ヒュ−ズ製作の作業性低下が生じるから
である。As the crack inhibitor for the above heat cycle, a component which can prevent the crack generation of the flux layer in the heat cycle test used for the inspection of soldering is used, and oleic acid amide and linolenic acid are used. Amide,
Undecylenic acid amide, elaidic acid amide, erucic acid amide, sorbic acid amide, or any one or more kinds of unsaturated fatty acid amides of linoleic acid amide are suitable, and the addition amount is 100 parts by weight of rosin. 1-4 parts by weight are suitable. The reason is that when the amount is 1 part by weight or less,
This is because it is difficult to satisfactorily achieve crack prevention of the flux layer against heat cycle, and if the amount is 4 parts by weight or more, the adhesiveness of the flux becomes strong, and the workability of the temperature fuse manufacturing deteriorates.
【００１４】図２の（イ）は、本発明に係る扁平ケ−ス
タイプの合金型温度ヒュ−ズの実施例を示す断面図、図
２の（ロ）は図２の（イ）におけるロ−ロ断面図であ
る。図２の（イ）並びに図２の（ロ）において、１，１
は互いに並設したリ−ド線、２はリ−ド線１，１間に臘
接または溶接により接続した低融点金属片である。３は
低融点金属片２に塗布したフラックスであり、上記と同
様、松脂等のロジンに活性剤並びにヒ−トサイクルに対
するクラック抑制剤を添加してある。４１はフラックス
塗布低融点金属片上に被せた、一端にのみ開口を有する
扁平な絶縁ケ−ス（アルミナセラミックス、フエノ−ル
樹脂等のプラスチック）である。５は絶縁ケ−スの開口
とリ−ド線１，１（通常、裸銅線または絶縁被覆銅線が
使用される）との間を封止した常温硬化性のエポキシ樹
脂である。FIG. 2A is a sectional view showing an embodiment of a flat case type alloy type temperature fuse according to the present invention, and FIG. 2B is a sectional view of FIG. FIG. In FIG. 2A and FIG. 2B, 1, 1
Is a lead wire arranged in parallel with each other, and 2 is a low melting point metal piece connected between the lead wires 1 and 1 by side contact or welding. Numeral 3 is a flux applied to the low melting point metal piece 2, and similarly to the above, rosin such as pine resin is added with an activator and a crack inhibitor against heat cycle. Reference numeral 41 denotes a flat insulating case (alumina ceramics, a plastic such as a phenol resin) having an opening only at one end, which is covered on the flux-coated low melting point metal piece. Reference numeral 5 is a room temperature curable epoxy resin that seals between the opening of the insulating case and the lead wires 1 and 1 (usually a bare copper wire or an insulating coated copper wire is used).
【００１５】図３の（イ）は本発明に係る基板タイプの
合金型温度ヒュ−ズの実施例を示す説明図、図３の
（ロ）は図３の（イ）におけるロ−ロ断面図である。図
３の（イ）並びに図３の（ロ）において、４０はセラミ
ックス基板（通常、アルミナセラミックスが使用され
る）である。１１，１１はセラミックス基板の片面に設
けた一対の膜電極であり、導電ペ−ストの印刷・焼付け
による厚膜法や金属蒸着や電着法等の薄膜法等により設
けることができる。２は膜電極１１，１１間に臘接また
は溶接により接続された低融点金属片である。FIG. 3 (a) is an explanatory view showing an embodiment of a substrate type alloy type temperature fuse according to the present invention, and FIG. 3 (b) is a cross-sectional view taken along the line of FIG. 3 (i). Is. In FIG. 3A and FIG. 3B, 40 is a ceramic substrate (usually alumina ceramics is used). Reference numerals 11 and 11 denote a pair of film electrodes provided on one surface of the ceramic substrate, and can be provided by a thick film method by printing / baking a conductive paste or a thin film method such as metal deposition or electrodeposition. Reference numeral 2 is a low melting point metal piece connected between the membrane electrodes 11 and 11 by contact or welding.
【００１６】３は低融点金属片に塗布したフラックスで
あり、上記と同様、松脂等のロジンに活性剤並びにヒ−
トサイクルに対するクラック抑制剤を添加してある。
１，１は各膜電極１１，１１に臘接または溶接により接
続されたリ−ド線（通常、絶縁被覆銅線または裸銅線が
使用される）である。５０はセラミックス基板４０の片
面上に被覆したエポキシ樹脂であり、上記と同様、常温
硬化性である。Numeral 3 is a flux applied to a low melting point metal piece, which is similar to the above, in addition to rosin such as pine resin, activator and heat agent.
A crack suppressant for tricycle is added.
Numerals 1 and 1 are lead wires (usually insulating coated copper wires or bare copper wires are used) connected to each of the membrane electrodes 11 and 11 by contact or welding. Reference numeral 50 denotes an epoxy resin coated on one surface of the ceramic substrate 40, which is curable at room temperature as described above.
【００１７】本発明においては、基板タイプの合金型温
度ヒュ−ズの場合、セラミックス基板の裏面に抵抗取付
け用膜電極を設け、これらの電極間にまたがって膜抵抗
体を抵抗ペ−ストの印刷・焼付けにより設け、これらの
各電極にリ−ド線を接続し、上記エポキシ樹脂をセラミ
ックス基板の両面を含めた全体に被覆して、基板型抵抗
・温度ヒュ−ズとすることもできる。In the present invention, in the case of a substrate-type alloy type temperature fuse, a resistance-attaching film electrode is provided on the back surface of the ceramic substrate, and a film resistor is printed on the resistance paste across these electrodes. It is also possible to provide a substrate type resistance / temperature fuse by providing by baking, connecting lead wires to each of these electrodes, and covering the entire surface of the ceramic substrate including both sides with the epoxy resin.
【００１８】また、図４に示す基板型抵抗・温度ヒュ−
ズのように、セラミックス基板（通常、アルミナセラミ
ックスが使用される）４０の片面に、所定パタ−ンの膜
電極１２を導電ペ−ストの印刷・焼付け等により設け、
該膜電極の抵抗取付部１２１，１２１間にわたって膜抵
抗体６を抵抗ぺ−ストの印刷・焼付け等により設け、同
上膜電極１２の温度ヒュ−ズ取付部１２２，１２２間に
低融点金属片２を接続し、該低融点金属片２上にフラッ
クス３（上記と同様、松脂等のロジンに活性剤並びにヒ
−トサイクルに対するクラック抑制剤を添加してある）
を塗布し、同上膜電極１２の両端にリ−ド線１，１を接
続し、セラミックス基板片面に、上記と同様、常温硬化
性のエポキシ樹脂材５０を被覆することもできる。The substrate type resistance / temperature fuse shown in FIG.
, A film electrode 12 of a predetermined pattern is provided on one side of a ceramic substrate (usually made of alumina ceramics) 40 by printing or baking a conductive paste.
The film resistor 6 is provided between the resistance mounting portions 121, 121 of the membrane electrode by printing, baking, etc. of a resistance paste, and the low melting point metal piece 2 between the temperature fuse mounting portions 122, 122 of the same as above. And a flux 3 on the low melting point metal piece 2 (similar to the above, an activator and a crack inhibitor against heat cycle are added to rosin such as pine resin).
Alternatively, the lead wires 1 and 1 may be connected to both ends of the same film electrode 12, and one side of the ceramic substrate may be coated with the room temperature curable epoxy resin material 50 as described above.
【００１９】[0019]
【作用】はんだ付け部が耐え得るヒ−トサイクルに対
し、低融点金属片上のフラックス層が亀裂するのを排除
でき、はんだ付け部が健全である以上、合金型温度ヒュ
−ズのフラックス層も健全に保持でき、フラックス層の
低融点金属片に対する空気遮断作用を確保でき、合金型
温度ヒュ−ズの正常な作動性を確実に保証できる。[Function] It is possible to eliminate cracking of the flux layer on the low melting point metal piece against the heat cycle that the soldering part can withstand, and the flux layer of the alloy type temperature fuse is also as long as the soldering part is sound. It can be maintained soundly, the air blocking effect on the low melting point metal piece of the flux layer can be secured, and the normal operability of the alloy type temperature fuse can be surely guaranteed.
【００２０】[0020]
【実施例】以下の実施例並びに比較例の何れにおいて
も、合金型温度ヒュ−ズには、図１に示す筒型ケ−スタ
イプを使用し、リ−ド線１，１には、外径０．５ｍｍの
銅線を使用し、低融点金属片２には外径０．５ｍｍ、長
さ３．０ｍｍ、融点９８℃の低融点合金（Ｐｂ：３１重
量％、Ｓｎ：１９重量％、Ｂｉ：５０重量％の三元共晶
合金）を使用し、筒状ケ−ス４には内径１．４ｍｍ、長
さ１０ｍｍのセラミックス筒を使用し、筒状ケ−スの各
端と各リ−ド線との間を常温硬化エポキシ樹脂５で封止
した。EXAMPLES In each of the following examples and comparative examples, a cylindrical case type shown in FIG. 1 was used as the alloy type temperature fuse, and the lead wires 1 and 1 had an outer diameter. A 0.5 mm copper wire is used, and the low melting point metal piece 2 has an outer diameter of 0.5 mm, a length of 3.0 mm, and a melting point of 98 ° C. (Pb: 31% by weight, Sn: 19% by weight, Bi: 50% by weight ternary eutectic alloy), a cylindrical case 4 is a ceramic cylinder having an inner diameter of 1.4 mm and a length of 10 mm, and each end of the cylindrical case and each reel are used. It was sealed with a room temperature curing epoxy resin 5 between the lead wire and the lead wire.
【００２１】〔実施例１〕固形分が、ロジン１００重量
部、シクロヘキシルアミンＨＢｒ３重量部（活性剤）、
パルミチン酸１０重量部（活性剤）、セバシン酸５重量
部（活性剤）、オレイン酸アミド（不飽和脂肪酸アミ
ド）２重量部のフラックスを溶剤で溶解し、低融点金属
片上に塗布し、溶剤を飛散除去してフラックス層を設け
た。Example 1 Solid content was 100 parts by weight of rosin, 3 parts by weight of cyclohexylamine HBr (activator),
Flux of 10 parts by weight of palmitic acid (activator), 5 parts by weight of sebacic acid (activator), and 2 parts by weight of oleic acid amide (unsaturated fatty acid amide) was dissolved in a solvent and applied on a low-melting metal piece to remove the solvent. It was scattered and removed to provide a flux layer.
【００２２】〔実施例２〜７〕実施例１に対し、オレイ
ン酸アミド２重量部に代え、それぞれリノレン酸アミド
２重量部、ウンデシレン酸アミド２重量部、エライジン
酸アミド２重量部、エルカ酸アミド２重量部、ソルビン
酸アミド２重量部、リノ−ル酸アミド２重量部を使用し
た以外、実施例１に同じとした。Examples 2 to 7 In place of 2 parts by weight of oleic acid amide as compared with Example 1, 2 parts by weight of linolenic acid amide, 2 parts by weight of undecylenic acid amide, 2 parts by weight of elaidic acid amide, erucic acid amide, respectively Same as Example 1 except that 2 parts by weight, 2 parts by weight of sorbic acid amide and 2 parts by weight of linoleic acid amide were used.
【００２３】〔実施例８〕実施例１に対し、オレイン酸
アミド２重量部に代え、オレイン酸アミド１．４重量部
とリノレン酸アミド０．６重量部の二種の不飽和脂肪酸
アミドを使用した以外、実施例１に同じとした。[Example 8] Two unsaturated fatty acid amides, 1.4 parts by weight of oleic acid amide and 0.6 parts by weight of linolenic acid amide, were used instead of 2 parts by weight of oleic acid amide as in Example 1. Otherwise, the same as Example 1.
【００２４】〔比較例〕実施例１に対し、オレイン酸ア
ミド（不飽和脂肪酸アミド）の添加を省略した以外、実
施例１に同じとした。Comparative Example The same as Example 1 except that the addition of oleic acid amide (unsaturated fatty acid amide) was omitted.
【００２５】これらの実施例並びに比較例の各合金型温
度ヒュ−ズについて、−２５℃３０分間，＋７０℃３０
分間を１サイクルとするヒ−トサイクル試験を１０００
回行い、解体のうえフラックス層のクラックの発生の有
無を調査したところ、全ての実施例ともクラックの発生
が無かったのに対し、比較例においては、多数のクラッ
クの発生が観られた。For each alloy type temperature fuse of these examples and comparative examples, -25 ° C. for 30 minutes, + 70 ° C. for 30 minutes
1000 heat cycle tests with one minute cycle
After repeated dismantling and inspecting for the occurrence of cracks in the flux layer after dismantling, no cracks were found in all of the examples, whereas a large number of cracks were found in the comparative examples.
【００２６】[0026]
【発明の効果】本発明に係る合金型温度ヒュ−ズにおい
ては、上述した通り、はんだ付け部に課せられるヒ−ト
サイクル試験に対し、低融点金属片上のフラックス層を
亀裂させることなく健全に保持でき、はんだ付け部がヒ
−トサイクルに対し健全に保持されている以上、合金型
温度ヒュ−ズにも所定の作動特性を安定に保持させ得
る。従って、本発明によれば、はんだ付け部との調和の
もとで、所定の作動特性を確保できる合金型温度ヒュ−
ズを提供できる。As described above, in the alloy type temperature fuse according to the present invention, in the heat cycle test imposed on the soldered portion, the flux layer on the low melting point metal piece is sounded without cracking. As long as it can be held and the soldered portion is held soundly against the heat cycle, the alloy type temperature fuse can stably hold the predetermined operating characteristics. Therefore, according to the present invention, an alloy type temperature fuse capable of ensuring a predetermined operating characteristic in harmony with the soldered portion.
Can be provided.
【図１】本発明の実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】図２の（イ）は、本発明の上記とは別の実施例
を示す断面図、図２の（ロ）は図２の（イ）におけるロ
−ロ断面図である。2 (a) is a sectional view showing another embodiment of the present invention, and FIG. 2 (b) is a sectional view taken along line (b) of FIG.
【図３】図３の（イ）は本発明の上記とは別の実施例を
示す説明図、図３の（ロ）は図３の（イ）におけるロ−
ロ断面図である。3 (A) is an explanatory view showing an embodiment of the present invention different from the above, and FIG. 3 (B) is a flowchart in FIG. 3 (A).
FIG.
【図４】本発明の上記とは別の実施例を示す説明図であ
る。FIG. 4 is an explanatory diagram showing another embodiment of the present invention.
２ 低融点金属片 ３ フラックス 2 Low melting point metal piece 3 Flux
Claims (2)
該低融点金属片にフラックスを塗布した温度ヒュ−ズに
おいて、フラックスに、ヒ−トサイクルに対するクラッ
ク抑制剤を添加したことを特徴とする合金型温度ヒュ−
ズ。1. A low melting point metal piece as a fuse element,
In a temperature fuse in which a flux is applied to the low melting point metal piece, an alloy-type temperature fuse in which a crack suppressor against a heat cycle is added to the flux
Z.
る請求項１記載の合金型温度ヒュ−ズ。2. The alloy type temperature fuse according to claim 1, wherein the crack inhibitor is an unsaturated fatty acid amide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23425194A JP3594661B2 (en) | 1994-09-02 | 1994-09-02 | Alloy type temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23425194A JP3594661B2 (en) | 1994-09-02 | 1994-09-02 | Alloy type temperature fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0877899A true JPH0877899A (en) | 1996-03-22 |
| JP3594661B2 JP3594661B2 (en) | 2004-12-02 |
Family
ID=16968047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23425194A Expired - Fee Related JP3594661B2 (en) | 1994-09-02 | 1994-09-02 | Alloy type temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3594661B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982268A (en) * | 1998-03-31 | 1999-11-09 | Uchihashi Estec Co., Ltd | Thin type fuses |
| JP2000030586A (en) * | 1998-07-15 | 2000-01-28 | Uchihashi Estec Co Ltd | Manufacture of substrate type thermal fuse |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| JP2009070803A (en) * | 2007-08-20 | 2009-04-02 | Uchihashi Estec Co Ltd | Temperature fuse with resistor and battery protection circuit board |
-
1994
- 1994-09-02 JP JP23425194A patent/JP3594661B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5982268A (en) * | 1998-03-31 | 1999-11-09 | Uchihashi Estec Co., Ltd | Thin type fuses |
| JP2000030586A (en) * | 1998-07-15 | 2000-01-28 | Uchihashi Estec Co Ltd | Manufacture of substrate type thermal fuse |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| JP2009070803A (en) * | 2007-08-20 | 2009-04-02 | Uchihashi Estec Co Ltd | Temperature fuse with resistor and battery protection circuit board |
| JP4663758B2 (en) * | 2007-08-20 | 2011-04-06 | 内橋エステック株式会社 | Resistive thermal fuse and battery protection circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3594661B2 (en) | 2004-12-02 |
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