JPH087643Y2 - Circuit pattern structure - Google Patents
Circuit pattern structureInfo
- Publication number
- JPH087643Y2 JPH087643Y2 JP1990021471U JP2147190U JPH087643Y2 JP H087643 Y2 JPH087643 Y2 JP H087643Y2 JP 1990021471 U JP1990021471 U JP 1990021471U JP 2147190 U JP2147190 U JP 2147190U JP H087643 Y2 JPH087643 Y2 JP H087643Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- switch
- switch contact
- conductive
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Contacts (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、回路パターンの一部でスイッチ接片を一体
的に形成する構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a structure in which a switch contact piece is integrally formed with a part of a circuit pattern.
例えば電子発音装置は、メロディー等の電気信号を発
生する回路部分と、電気信号を音に変換する発音体とに
よって組み立てられており、スイッチからのトリガー信
号によって作動するようになっている。For example, an electronic sounding device is constructed by a circuit portion that generates an electric signal such as a melody and a sounding body that converts the electric signal into a sound, and is activated by a trigger signal from a switch.
この種の装置のスイッチとして、各種のものが利用さ
れているが、リーフ状のスイッチは、一対のスイッチ接
片によって構成されており、それらの間の電気的な開閉
によって、電気回路に対しトリガー信号を発生する。Various types of switches are used for this type of device, but the leaf-shaped switch is composed of a pair of switch contact pieces, and the electrical switching between them causes the electric circuit to trigger. Generate a signal.
従来のリーフ状のスイッチは、スイッチホルダの部分
でプリント基板に取り付けられ、一対のスイッチ接片
は、半田付けなどによって、プリント基板の導電パター
ンに接続される。このため、その組み立て過程で、別部
品としてスイッチが準備されなければならず、また、そ
の取り付けや半田付け作業が組み立て工数を多くする結
果となっている。また、スイッチのオンオフ電流が小さ
いため、スイッチの接点部分に貴金属メッキなどが必要
であり、必要な信頼性の確保のために、部品自体が高価
になる。A conventional leaf-shaped switch is attached to a printed circuit board at a switch holder, and a pair of switch contact pieces are connected to a conductive pattern on the printed circuit board by soldering or the like. For this reason, the switch must be prepared as a separate component in the assembly process, and the mounting and soldering operations increase the number of assembly steps. Further, since the on / off current of the switch is small, the contact portion of the switch needs to be plated with a precious metal, etc., and the parts themselves are expensive in order to secure the required reliability.
したがって、本考案の目的は、スイッチ自体を回路構
成用の部品で兼用するとともに、その信頼性を高めるこ
とである。Therefore, an object of the present invention is to use the switch itself as a component for circuit configuration and to improve its reliability.
そこで、本考案は、回路パターンを導電性金属板で構
成し、その一部でリーフ状のスイッチとしての一対のス
イッチ接片を一体的に形成している。Therefore, in the present invention, the circuit pattern is made of a conductive metal plate, and a part of the circuit pattern is integrally formed with a pair of switch contact pieces as leaf-shaped switches.
上記回路パターンは、導電性金属板を材料として、プ
レス打ち抜き加工によって成形される。このとき、回路
パターンの一部は、リーフ状のスイッチの一対のスイッ
チ接片を一体的に形成している。したがって、回路の組
み立て過程で、双方のスイッチ接片の半田付け箇所がな
くなる。また、スイッチ接片の接点がICチップなどのワ
イヤボンディング工程中にワイヤボンディング用の導電
ワイヤによって形成されるため、貴金属接点材料が必要
とされず、その信頼性が高められる。The circuit pattern is formed by press punching using a conductive metal plate as a material. At this time, a part of the circuit pattern integrally forms a pair of switch contact pieces of a leaf-shaped switch. Therefore, in the process of assembling the circuit, there are no soldering points for both switch contact pieces. Further, since the contact of the switch contact piece is formed by the conductive wire for wire bonding during the wire bonding process of the IC chip or the like, the precious metal contact material is not required and the reliability thereof is improved.
第１図ないし第６図は、電子発音装置１を例示してお
り、本考案は、その電子発音装置１に組み込まれてい
る。1 to 6 illustrate an electronic sounding device 1, and the present invention is incorporated in the electronic sounding device 1.
この電子発音装置１は、第１図に示すように、メロデ
ィー等の電気的な信号を出力するために、電子部品とし
て回路素子２、小型ボタン状の電池３、リーフ状のスイ
ッチ４が取り付けられた導電性金属板よりなる回路パタ
ーン５と、導電性薄金属板製の振動板９に電歪効果体６
が固定された発音体７とを備えている。As shown in FIG. 1, this electronic sounding device 1 is provided with a circuit element 2, a small button-shaped battery 3, and a leaf-shaped switch 4 as electronic parts in order to output an electric signal such as a melody. Circuit pattern 5 made of a conductive metal plate, a diaphragm 9 made of a conductive thin metal plate, and an electrostrictive effect member 6
And a fixed sounding body 7.
上記導電金属板製の回路パターン５は、本考案の要部
であり、第４図に示すように、帯状の導電製金属板から
プレス打ち抜き加工によって、両縁の連続部10を残して
打ち抜かれ、回路パターン５毎に回路素子２として後述
のICチップが装置された後、つなぎ部11の切断によっ
て、連続部10から切り離され、補強板８に固定される。
このようにして、回路パターン５は、回路素子２のリー
ド部分に取り付けられる位置で複数の導電部12、発音体
７の取付部13、電池ホルダ15の固定のための２つの固定
部14、スイッチ４の一対のスイッチ接片41、42およびリ
ード部16を一体的に形成している。The circuit pattern 5 made of a conductive metal plate is an essential part of the present invention, and as shown in FIG. 4, it is punched from a strip-shaped conductive metal plate by press punching, leaving a continuous portion 10 at both edges. After an IC chip, which will be described later, is mounted as the circuit element 2 for each circuit pattern 5, the connecting portion 11 is cut to be separated from the continuous portion 10 and fixed to the reinforcing plate 8.
In this way, the circuit pattern 5 has a plurality of conductive parts 12, mounting parts 13 of the sounding body 7, two fixing parts 14 for fixing the battery holder 15, and a switch at positions to be attached to the lead portions of the circuit element 2. The pair of switch contact pieces 41, 42 and the lead portion 16 are integrally formed.
上記回路素子２は、例えばICチップであり、回路パタ
ーン５の複数の導電部12に対し自動ワイヤボンディング
により電気的に接続されている。なお、回路素子２およ
びそのワイヤ接続部分は、被覆部19によって保護され
る。また、上記電池３は、半田付け17によって固定部14
に取り付けられた導電性の電池ホルダ15によって、回路
パターン５の所定の位置に着脱自在に保持され、電源入
力用の導電部12に対して電気的に接続されている。The circuit element 2 is, for example, an IC chip, and is electrically connected to the plurality of conductive portions 12 of the circuit pattern 5 by automatic wire bonding. The circuit element 2 and the wire connection portion thereof are protected by the covering portion 19. In addition, the battery 3 is fixed to the fixing portion 14 by soldering 17.
It is detachably held at a predetermined position of the circuit pattern 5 by a conductive battery holder 15 attached to the and is electrically connected to the conductive portion 12 for power input.
そして、スイッチ４は、本考案の特徴的な構成であ
り、既述のように回路パターン５の一部つまり導電性金
属板によって一体的に形成された一対のスイッチ接片4
1、42からなり、それぞれ固定片43、44および作動片4
5、46によって構成されている。一方の固定片43は、回
路パターン５の導電部12につながり、Ｌ字状に屈曲する
ことによって作動片45を形成している。また他方の固定
片44は、導電部12につながった状態で補強板８に取り付
けられていて、一端から延びる部分で逆Ｕ字状に屈曲す
ることによって、弾性部47となり、長い作動片46を形成
し、さらに、先端部分でＬ字状に屈曲して、操作片48を
一体的に形成している。The switch 4 has a characteristic structure of the present invention, and as described above, a pair of switch contact pieces 4 integrally formed by a part of the circuit pattern 5, that is, a conductive metal plate.
1 and 42, fixed piece 43 and 44 and actuating piece 4 respectively
It is composed of 5 and 46. One fixing piece 43 is connected to the conductive portion 12 of the circuit pattern 5 and is bent in an L shape to form an operating piece 45. The other fixing piece 44 is attached to the reinforcing plate 8 in a state of being connected to the conductive portion 12, and is bent in an inverted U-shape at a portion extending from one end to become an elastic portion 47 and a long operating piece 46. Further, the operation piece 48 is integrally formed by bending the tip end portion into an L-shape.
なお、作動片46は、第５図および第６図に示すよう
に、作動片45と対向する位置に１または２以上のワイヤ
ボンディング用の導電ワイヤによるスイッチ接点40を有
している。このスイッチ接点40は、ICチップなどの回路
素子２を回路パターン５に対して自動ワイヤボンディン
グ機によって導電ワイヤにより電気的に接続するさいに
導電ワイヤにより形成される。As shown in FIGS. 5 and 6, the actuating piece 46 has one or more switch contacts 40 made of a conductive wire for wire bonding at a position facing the actuating piece 45. The switch contact 40 is formed by a conductive wire when the circuit element 2 such as an IC chip is electrically connected to the circuit pattern 5 by the automatic wire bonding machine by the conductive wire.
さらに、発音体７の振動板９は、薄金属板であり、一
方の面の中央部分で電歪効果体６と接着などの手段によ
って一体化しており、回路パターン５の取付部13に対し
半田付け18などによって固定され、かつ導電部12により
回路素子２に対し電気的に接続されている。そして、こ
の電歪効果体６は、回路パターン５と一体に形成された
リード部16の先端に常時接しており、回路パターン５の
所定の部分に導電部12により電気的に接続されている。
このとき、リード部16は、それ自体の弾性により、先端
部分で電歪効果体６に対する接触状態を維持する。Further, the vibrating plate 9 of the sounding body 7 is a thin metal plate, and is integrated with the electrostrictive body 6 at the central portion of one surface by means such as bonding, and is soldered to the mounting portion 13 of the circuit pattern 5. It is fixed by attachments 18 and the like, and is electrically connected to the circuit element 2 by the conductive portion 12. The electrostrictive effect body 6 is always in contact with the tip of the lead portion 16 formed integrally with the circuit pattern 5, and is electrically connected to a predetermined portion of the circuit pattern 5 by the conductive portion 12.
At this time, the lead portion 16 maintains the contact state with the electrostrictive effect body 6 at the tip portion due to its elasticity.
本考案では、リーフ状のスイッチを構成する一対のス
イッチ接片が回路パターンの一部で一体的にプレス打ち
抜き加工によって形成されるため、リーフスイッチにつ
いて回路パターンに対する半田付け作業が必要とされ
ず、回路パターンとスイッチ接片との接続の信頼性が向
上し、かつ回路パターン付設用の別部品としてのスイッ
チも不要となるので、組み立て過程が簡単になって、製
品が安価に提供できる。In the present invention, since a pair of switch contact pieces constituting a leaf-shaped switch are integrally formed by press punching on a part of the circuit pattern, the leaf switch does not need to be soldered to the circuit pattern. Since the reliability of the connection between the circuit pattern and the switch contact piece is improved, and the switch as a separate component for attaching the circuit pattern is not necessary, the assembly process is simplified and the product can be provided at a low cost.
また、実施例のように、スイッチ接点がICチップをワ
イヤボンディングするための導電ワイヤで形成される
と、ICチップなどの電子部品のワイヤボンディング加工
過程で形成できるため、工程が省略でき、信頼性の高い
接点部分が簡単に形成でき、貴金属接点材料など用意す
る必要がなく、スイッチ部分や回路構成が安価に構成で
きる。When the switch contact is formed of a conductive wire for wire-bonding the IC chip as in the embodiment, it can be formed during the wire-bonding process of electronic parts such as the IC chip, so that the process can be omitted and the reliability can be improved. The high contact point portion can be easily formed, and it is not necessary to prepare a precious metal contact point material, and the switch portion and the circuit configuration can be inexpensively constructed.
第１図は電子発音装置の平面図、第２図は電気接続部分
の断面図、第３図はスイッチ部分の側面図、第４図は回
路パターンの展開図、第５図はスイッチ接点部分の拡大
平面図、第６図はスイッチ接点部分の拡大側面図であ
る。 １……電子発音装置、２……回路素子、３……電池、４
……スイッチ、５……回路パターン、６電歪効果体、７
……発音体、８……補強板、９……振動板、16……リー
ド部、13……取付部、40……スイッチ接点、43、44……
固定片、45、46……作動片。FIG. 1 is a plan view of an electronic sounding device, FIG. 2 is a sectional view of an electric connection portion, FIG. 3 is a side view of a switch portion, FIG. 4 is a developed view of a circuit pattern, and FIG. 5 is a switch contact portion. An enlarged plan view and FIG. 6 are enlarged side views of the switch contact portion. 1 ... electronic sounding device, 2 ... circuit element, 3 ... battery, 4
...... Switch, 5 …… Circuit pattern, 6 Electrostrictive effect element, 7
…… Sound generator, 8 …… Reinforcement plate, 9 …… Vibration plate, 16 …… Lead part, 13 …… Mounting part, 40 …… Switch contact, 43,44 ……
Fixed piece, 45, 46 ... Actuating piece.
Claims (2)
形成した回路パターンにおいて、この回路パターンに取
り付けられるスイッチを一対のスイッチ接片により構成
し、この一対のスイッチ接片を上記回路パターンの導電
性金属板により一体的に形成することを特徴とする回路
パターンの構造。1. In a circuit pattern formed of a conductive metal plate to which electronic parts are attached, a switch attached to the circuit pattern is composed of a pair of switch contact pieces, and the pair of switch contact pieces are electrically connected to the circuit pattern. A circuit pattern structure characterized by being integrally formed of a flexible metal plate.
金属板に対してワイヤボンディングする導電ワイヤによ
り電気的に接続するとともに、上記一対のスイッチ接片
の対向する部分の少なくとも一方にスイッチ接点を設
け、このスイッチ接点を上記電子部品をワイヤボンディ
ングする導電ワイヤにより形成したことを特徴とする実
用新案登録請求の範囲第１項記載の回路パターンの構
造。2. The electronic component is electrically connected to a conductive metal plate of the circuit pattern by a conductive wire for wire bonding, and a switch contact is provided on at least one of opposing portions of the pair of switch contact pieces. The circuit pattern structure according to claim 1, wherein the switch contact is provided by a conductive wire for wire-bonding the electronic component.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990021471U JPH087643Y2 (en) | 1990-03-05 | 1990-03-05 | Circuit pattern structure |
| KR1019910002989A KR0165544B1 (en) | 1990-03-05 | 1991-02-25 | Electronic sound producing device |
| US07/662,522 US5264656A (en) | 1990-03-05 | 1991-02-28 | Electronic sound generating device |
| GB9104356A GB2243479B (en) | 1990-03-05 | 1991-03-01 | Electronic sound generating device |
| DE4106824A DE4106824A1 (en) | 1990-03-05 | 1991-03-04 | ELECTRONIC SOUND GENERATOR DEVICE AND METHOD FOR THEIR PRODUCTION |
| FR9102621A FR2659164B1 (en) | 1990-03-05 | 1991-03-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990021471U JPH087643Y2 (en) | 1990-03-05 | 1990-03-05 | Circuit pattern structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03112950U JPH03112950U (en) | 1991-11-19 |
| JPH087643Y2 true JPH087643Y2 (en) | 1996-03-04 |
Family
ID=12055893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990021471U Expired - Fee Related JPH087643Y2 (en) | 1990-03-05 | 1990-03-05 | Circuit pattern structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087643Y2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5116962A (en) * | 1974-08-01 | 1976-02-10 | Suwa Seikosha Kk | Denshidokeiniokeru suitsuchikiko |
| JPS6142037U (en) * | 1984-08-22 | 1986-03-18 | 株式会社東芝 | multiple switch |
-
1990
- 1990-03-05 JP JP1990021471U patent/JPH087643Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03112950U (en) | 1991-11-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |