JPH0870165A - Printed board - Google Patents

Abstract

PURPOSE: To enable any causes of defects to be easily checked even after parts are mounted by soldering on the printed substrate by providing test patterns for checking the characteristics of the board itself on a part of the board. CONSTITUTION: Pattern blocks 6 having the possibility of causing problems in designing are picked up, and test patterns 7, 8 which are the copy of the patterns 6 are printed on the blank spaces of printed boards 3, 4, 5. Next, electronic parts are mounted on a board 1 to complete multisurfaced board. After the completion of the board, respective characteristics are measured using the test patterns 7 or 8 so as to check the insulation characteristics of the board 1 itself. Through these procedures, when a defective board is found, it can be judged rapidly whether the cause is due to the insulating characteristic of the board itself or due to a defective circuit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which a circuit of an electronic device is constructed, and more particularly to a printed circuit board capable of checking the characteristics of the printed circuit board itself.

[0002]

2. Description of the Related Art Conventionally, in the case of forming a circuit on a printed circuit board, the number of parts is reduced by forming an air capacitor or the like in a pattern by utilizing the insulating property of the printed circuit board material itself, thereby reducing the size of the product. And manufacturing costs are being reduced.

[0003]

However, in the printed circuit board, there are subtle differences in the material of the material itself, the difference in the plate thickness, etc. depending on the lot, and there are variations in manufacturing. Due to these, the insulation characteristics are subtly different. different.

Therefore, when electronic components are mounted on a printed board and soldering is performed, and circuit characteristics, characteristics of air capacitors, etc. are measured, and if there are variations in characteristics or defects, these variations in characteristics or defects occur. There is a problem in that it is not possible to identify the cause of the variation in the insulation characteristics of the printed circuit board material itself, the variation in the component characteristics itself, or the variation in the manufacture of the printed circuit board, and it is not possible to pursue the cause.

In view of the above situation, the present invention makes it possible to easily pursue the cause even after the components are mounted and soldered on the printed circuit board.

[0006]

The present invention is characterized in that a test pattern capable of checking the characteristics of the substrate itself is provided on a part of the substrate.

[0007]

By measuring the characteristics of the test pattern, the insulation characteristics of the substrate itself can be known.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a multi-sided board 1 having the same circuit pattern 2 mounted on three sides. The board 1 is divided into printed boards 3, 4 and 5 having the pattern 2. A slit hole 9 is provided.

From the circuit pattern 2, a pattern block 6 which is likely to cause a design problem is extracted, and test patterns 7 and 8 obtained by copying the pattern block 6 are printed in the vacant spaces of the printed circuit boards 3, 4, and 5. To do.

Electronic components are mounted on the board 1 to complete a multi-sided circuit board.

After completion, the characteristics of the test pattern 7 or the test pattern 8 of each printed circuit board 3, 4, 5 can be measured to know the insulation characteristics of the board itself.

In this way, since the insulation characteristics of the board itself can be known, when a defective product occurs, it is possible to determine whether it is due to the insulation characteristics of the board itself or the cause of the circuit, and the cause of the failure is investigated. Can be done quickly.

When the check is performed on the entire substrate 1 by the test pattern, the characteristics may be measured by the test pattern 8 or the test pattern 7. After the printed boards 3, 4, 5 are divided from the board 1, the test patterns 7 on the printed boards 3, 4, 5 may be measured.

The test patterns 7 provided in the vacant spaces of the respective printed boards 3, 4, 5 do not necessarily have to be the same, and a plurality of pattern blocks which may cause a problem may be printed individually. Further, in the above-mentioned embodiment, the multi-sided board has been described, but it goes without saying that the board can be carried out in various modes.

[0016]

As described above, according to the present invention, since the insulating characteristics of the substrate itself can be controlled by the test pattern, the excellent effect that the pattern actually used is not damaged is exhibited.

[Brief description of drawings]

FIG. 1 is a schematic view showing an embodiment of the present invention.

[Explanation of symbols]

 1 circuit board 2 circuit pattern 3 printed circuit board 4 printed circuit board 5 printed circuit board 6 pattern block 7 test pattern 8 test pattern 9 slit hole

Claims (1)

[Claims] 1. A printed circuit board, wherein a test pattern capable of checking the characteristics of the board itself is provided on a part of the board.