JPH0868831A - Method and equipment for testing semiconductor - Google Patents

Abstract

PURPOSE: To obtain method and equipment for testing semiconductor in which a test program can be utilized effectively while shortening the test time to the minimum. CONSTITUTION: The semiconductor test equipment comprises a program controller 11 and a plurality of test execution units 12 wherein the program controller 11 is connected with the plurality of test execution units 12 through a communication line 13. The program control section 11 stores a source program corresponding to device being compiled in a compiler buffer 14 and a compiler 8 converts the source program to compile a object program. A test executing section 2 in the test execution unit 12 executes the object program stored in an object data base 9 thus testing the objective device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor testing apparatus and a semiconductor testing method for testing devices such as semiconductors.

[0002]

2. Description of the Related Art FIG. 15 is a block diagram showing a conventional semiconductor test apparatus for producing (converting) and executing a test program used for testing a device such as a semiconductor.

As shown in FIG. 1, the semiconductor test apparatus comprises a program control section 1 and a test execution section 2. The program control unit 1 creates a test program for a device such as a semiconductor and supplies the test execution unit 2 with an executable object and state test program. The test execution unit 2 executes the objectized test program obtained from the program control unit 1 to test the device to be tested.

The program control unit 1 comprises a source database 5, a product type table 6, a test control table 7 and a compiler 8.

A plurality of test programs 4 in a source state are registered in the source database 5, and each test program 4 is composed of sources of a plurality of test items (4a, 4b, 4c). Each test program 4 is manufactured for each type (product type) of a device such as a semiconductor to be tested by the test execution device.

The product type table 6 is a table showing the relationship between the product name and each test program 4 in the source database 5.

The test control table 7 is a table in which the execution order is described for each test item when the test program is executed.

The compiler 8 converts the test program (source format) into an object format that can be executed by the test execution section 2 to convert the object program into the test execution section 2
Output to.

On the other hand, the test execution unit 2 comprises an object database 9 and an execution control table 10. The object database 9 stores a test program that is made into an object for each test item to be executed. 4a ', 4b' in the object database 9
4c 'shows the test program of the objectized test items.

The execution control table 10 is a table showing the execution order of the test items in the object database 9.

FIG. 16 shows the contents of the source database 5 built in the program control unit 1, and the test program 4 (test program name: aaa) is the test item 4
a, 4b, 4c. Similarly, other test programs are also composed of a plurality of test items.

FIG. 17 shows the test items 4a and 4 which form the test program 4 (test program name: aaa).
The contents of b and 4c are shown. For each test item, the content of the target test item is described by a plurality of test instructions. Usage data used when executing the instruction is added to each test instruction. The test command and the data object to be used are executed by the test execution unit 2 to test the device.

FIG. 18 shows the contents of the product type table 6 incorporated in the program control unit 1. As shown in the figure, the device type name a100 is the test program aa.
It indicates that the device type name b200 corresponds to the test program bbb corresponding to a.

FIG. 19 shows the contents of the test control table 7 incorporated in the program control unit 1. As shown in the figure, the execution order of the test items of each test program is described.
Is executed in the order of the test items 4a, 4c, 4b.

FIG. 20 shows the contents of the object database 9 built in the test execution unit 2, and shows the test items 4
a, 4b, 4c object programs 4a ', 4
b'and 4c 'are stored respectively.

FIG. 21 shows the contents of the execution control table 10 incorporated in the test execution section 2. As shown in the figure, the execution order of the test items of the test program is described. From FIG. 21, the test program aaa is executed in the order of the test items 4a, 4c, 4b.

Next, an operation example of the conventional semiconductor test apparatus shown in FIG. 15 will be described.

From the product name assigning means (not shown), the product name a1
When the product name information DK that defines 00 is given to the program control unit 1 to test the device of the product name a100,
The program control unit 1 refers to the product type table 6 to search for a test program name used in the product name a100, and detects that the test program aaa is used. Then, the test programs aaa in the plurality of test programs 4 registered in the source database 5
The test items (source programs: 4a, 4b, 4c) forming the test program aaa are extracted from the above, and are sequentially supplied to the compiler 8.

The compiler 8 compiles the test items (source programs) 4a, 4b, 4c and converts them into object programs (4a, 4b, 4c). Each objectized test item (4a ', 4b', 4
c ′) is stored in the object database 9 in the test execution unit 2.

The execution order of each test item constituting the test program aaa is described in the test control table 7 in the program control unit 1, and the contents are transferred to the test control table 7 in the test execution unit 2. Therefore, the test items (object programs: 4a ', 4c', 4b ') are executed in the order of the description contents of the test control table 7 for the device of the product name aaa.

Further, in the case of supplying only a specific item of the test program, it is possible to describe only the name of the test item to be executed in the test control table 7, and further, the execution order of the test items in the test program. Can also be changed by changing the order of the test item names of the corresponding test program in the test control table 7.

FIG. 22 shows a flow chart of a test program production and execution process in a conventional semiconductor test apparatus.

First, the product name is designated by the product name assigning means (not shown) providing the program control section 1 with the product name information DK defining the product name of the device to be tested (step ST41).

Then, the program control section 1 refers to the product type table 6 and inquires about the test program name corresponding to the specified product type name (step ST42).

Next, the program control unit 1 extracts the source file of each test item constituting the test program corresponding to the inquired test program name from the plurality of test programs 4 in the source database 5 (step ST43). ).

Then, the program control section 1 compiles the designated source files in order by the compiler 8 and converts them into objects and programs (step ST
44), the test item converted into the object format is registered in the object database 9 of the test execution section 2 (step ST45).

After that, the program control section 1 gives the information of the designated test program in the test control table 7 to the execution control table 11 of the test execution section 2 (step ST46).

Then, the test execution unit 2 follows the contents of the execution control table 11 and sets the object database 9
The test specified by the test items in the above is performed on the device to be tested (step ST47).

[0029]

Since the conventional semiconductor test apparatus is constructed and operates as described above, it is necessary to introduce a plurality of this apparatus in a factory for mass-producing a wide variety of small quantity of devices. In this case, since a database capable of storing test programs corresponding to all types is required in all semiconductor test devices, there is a problem in that a large-capacity storage device must be provided in each semiconductor test device. Furthermore, when the test program managed by each device is changed (revised) or the contents of the table are changed, there is a problem that it is necessary to change all the devices. That is, there was a problem that the test program could not be effectively used.

When executing a test program composed of many test items, the test execution unit 2
There is a problem that the number of accesses to the execution control table 9 and the object database increases, and the device testing time becomes long.

Further, when the program control unit 1 compiles (converts) the source format test items, duplicate test instructions having the same content are also converted between the test items. If duplicate test instructions are translated,
Since the test execution unit 2 executes the same processing many times, there is a problem that the device test time becomes longer than necessary.

The present invention has been made to solve the above problems, and provides a semiconductor test apparatus and a semiconductor test method capable of effectively using a test program and suppressing a test time for a device to a necessary minimum. With the goal.

[0033]

[Means for Solving the Problems] Claim 1 according to the present invention
The semiconductor test apparatus described is an apparatus that includes a program control device and a plurality of test execution devices, and performs a test on a device to be tested, and the program control device defines a product type name of a device to be compiled. Done first
And a first storage means for storing a plurality of test programs in a source format, each of which corresponds to a device type,
The plurality of test programs each include at least one test item, and a second storage unit that stores test item execution information that defines an execution order of the test items of each of the plurality of test programs and a test program to be compiled. A third storage means for storing the data; a compiler for executing a compile process on the test program stored in the third storage means, converting the test program into an object format to generate an object program; Of the test execution devices, fourth storage means for storing transfer required test execution device information for instructing a test execution device requiring object program transfer, and from the plurality of test programs based on the first product type name information. The test program corresponding to the device to be compiled RAM is extracted and stored in the third storage means in the order of test items based on the test item execution information, and then the compiler is caused to execute the compiling process, and the transfer required test among the plurality of test execution devices is performed. Program control means for outputting an object program corresponding to the device to be compiled to the test execution device indicated by the execution device information, wherein each of the plurality of test execution devices is obtained from the program control device. Fifth storage means for storing at least one object program, second type name assigning means for assigning second type name information defining the type name of the device under test, and the second type name Based on the information, based on the first product name information, from the at least one object program It extracts the corresponding object program to the test target device and execute the object program, and and a test executing means for testing for the test target device.

According to another aspect of the semiconductor test apparatus of the present invention, the test item comprises at least one test command, and the program control means of the program control device stores test commands of the same content continuously. Alternatively, the test program may be stored in the third storage unit so as not to be stored.

Further, as in the semiconductor test apparatus according to claim 3, the program control apparatus further comprises sixth storage means for storing the latest execution status of at least one test instruction as test instruction history information. The program control means may be configured to perform the storage operation with the duplicate instruction removing function by referring to the test instruction history information.

A semiconductor test method according to a fourth aspect of the present invention is a method for performing a test on a device to be tested by using a semiconductor test device including a program control device and a plurality of test execution devices. The program control device includes a first storage unit that stores a plurality of test programs corresponding to device types in a source format, each of the plurality of test programs including at least one test item. Second storage means for storing test item execution information that defines the execution order of test items of each of the plurality of test programs, third storage means for storing a test program to be compiled, and the third storage means. Compiles the test program stored in the And a fourth storage means for storing transfer required test execution device information for instructing a test execution device that requires object program transfer among the plurality of test execution devices. A fifth feature is that each of the plurality of test execution devices stores at least one object program obtained from the program control device.
The semiconductor test method comprises an object program generation process using the program control device and an object program execution process using each of the test execution devices, wherein the object program generation process is (a) A step of adding first type name information defining a type name of a device to be compiled,
(b) a step of extracting a test program corresponding to the device to be compiled from the plurality of test programs based on the first type name information, and (c) the test program stored in the step (b). Storing in the third storage means in a test item order based on test item execution information; (d) causing the compiler to execute the compiling process to generate an object program; and (e) performing the plurality of test executions. Storing the object program generated in step (d) in the fifth storage means for a test execution device designated by the transfer required test execution device information among the devices. The execution process is (f) a step of adding the second type name information that defines the type name of the device under test. And (g) extracting an object program corresponding to the device to be tested from the at least one object program based on the second type name information, and (h) the object program extracted in step (g). Run
Performing a test on the device under test.

Further, as in the semiconductor test method according to claim 5, the test item comprises at least one test instruction, and the step (c) performs a test so that test instructions having the same content are not stored continuously. You may perform the storage operation with a duplicate instruction removal function which stores a program in the said 3rd memory | storage means.

Further, as in the semiconductor test method according to claim 6, the program control device further comprises sixth storage means for storing the latest execution status of at least one test instruction as test instruction history information. Step (c)
May perform the storing operation with the duplicate instruction removing function for the test instruction stored in the test instruction history information.

[0039]

In the semiconductor test apparatus according to the first aspect of the present invention, a plurality of test control devices are provided for one program control device. Therefore, the test programs corresponding to all types can be stored in the first storage means of one program control device and shared by a plurality of test execution devices.

In addition, the program control means of the program control device causes the object program corresponding to the device to be compiled to be output, and the test execution means of the test execution device is at least 1 based on the second type name information.
Since the object program corresponding to the device under test is executed from one object program, the device program can be tested by executing the object program for each device under test.

Further, the program control means in the semiconductor test apparatus according to claim 2 stores the test program in the third storage means so that the test instructions of the same content are not stored continuously, and the storing operation with the duplicate instruction removing function. Therefore, useless instructions are not converted into an object program.

In addition, the program control means in the semiconductor test apparatus according to the third aspect refers to the test instruction history information and performs the storing operation with the duplicate instruction removal function, so that the test instruction frequently used as the test instruction history information. By storing the latest execution status of the above in the sixth storage means, it is possible to relatively easily and efficiently execute the storing operation with the duplicate instruction removing function.

The semiconductor test method according to claim 4 is:
The object program corresponding to the device to be compiled is output in step (c), and the second program is output in step (g).
Since the object program corresponding to the device to be tested is executed from at least one object program based on the product type name information, the device program can be tested by executing the object program for each device to be tested.

The semiconductor test method according to claim 5 is
In step (c), since the test instruction is stored in the third storage means so that the test instructions having the same contents are not stored successively, the storing operation with the duplicate instruction removing function is performed, so that the wasteful instructions are not converted into the object program. .

In addition, in the semiconductor test method according to the sixth aspect, in step (c), since the storing operation with the duplicate instruction removing function is performed by referring to the test instruction history information, it is frequently used as the test instruction history information. By storing the latest execution status of the test instruction in the sixth storage means, it is possible to relatively easily and efficiently execute the storage operation with the duplicate instruction removal function.

[0046]

【Example】

<First Embodiment> FIG. 1 is a block diagram showing the configuration of a semiconductor test apparatus for producing and executing a test program according to a first embodiment of the present invention.

As shown in FIG. 1, the semiconductor test apparatus of the first embodiment comprises one program control device 11 and a plurality of test execution devices 12, and the program control device 11 and a plurality of test execution devices 12 are different from each other. It is connected via the communication line 13.

The program control unit 11 has a program control unit 1. The program control unit 1 comprises a source database 5, a product type table 6, a test control table 7, a compiler 8, a compiler buffer 14, and a test execution unit table 16. Control each component.

In the source database 5, as in the conventional case, a plurality of source state test programs are registered.
Each test program 4 is composed of a plurality of test item sources. Each test program is a test execution device 12
It is manufactured according to the type of device to be tested.

The product type table 6 is a table showing the relationship between the product type name and each test program in the source database 5.

The test control table 7 is a table in which the execution order is described for each test item when the test program is executed.

The compiler buffer 14 accumulates a plurality of test items (consisting of one test program) given from the source database 5 in the order of execution and supplies them to the compiler 8 as one source program.

The compiler 8 uses the compiler buffer 14
The obtained test program (source format) is converted into an object format that can be executed by the test execution unit 2, and the object program is output to the test execution unit 2.

The test execution device table 16 is a test execution device that requires transfer of an object program generated from the program control device 11 among the test execution devices connected to the program control device 11 via the communication line 13. It is a table which shows an apparatus.

On the other hand, the test execution section 2 is composed of an object database 9 and an execution type table 15.
Control these components.

The object database 9 stores an object program obtained by the program control unit 1 and made into an object for each device type.

The execution type table 15 is a table in which the object program name (in the object database) to be executed is described for each type in the test execution device.

FIG. 2 shows the source database 4 in the program controller 11. As shown in FIG. 2, a plurality of test items (source programs) constituting each test program (aaa, bbb, ccc) are registered.

FIG. 3 shows the product type table 6 in the program control device 11. As shown in FIG. 3, the test program names corresponding to each of the plurality of types are described.

FIG. 4 shows the test control table 7 in the program control device 11. As shown in FIG. 7, the test item names used in each test program are described in the order of execution.

FIG. 5 is a schematic diagram showing the correspondence between the compiler buffer 14 and the compiler 8 in the program control device 11. The test program aaa consists of test items (4a, 4b, 4c), and the execution procedure is (4
a, 4c, 4b) are specified by the test control table 7, the test items (4a, 4c, 4b) are buffered in the compiler buffer 14 in that order.

Then, the compiler 8 compiles the source buffered in the compiler buffer 14 to generate the object program 40 of the test program aaa.

FIG. 6 shows the object database 9 in the test execution unit 2 of the test execution device 12, in which various object programs are registered. As shown in FIG. 6, each object program 40 is registered in a test program execution unit corresponding to each type of device.

FIG. 7 shows the execution product type table 15 in the test execution device 12. As shown in FIG. 7, the test program name (object program name) to be executed is described for each product type.

FIG. 8 shows the test execution device table 16 in the program control device 11. As shown in FIG. 8, the test execution device table 16 describes the test execution device names that currently require the object program transfer from the program control device 11.

Next, an operation example of the semiconductor test apparatus of the first embodiment will be described.

When the product name information DK1 defining the product name a100 is given from the first product name assigning means (not shown) to the program control unit 1 to generate the test program for the device of the product name a100, the program control unit 1 , The type table 6 is searched to search for the test program name used in the type name a100, and the test program aaa
To detect the use of. Then, from the test programs aaa in the plurality of test programs registered in the source database 5, the test items (source programs: 4a, 4b,
4c) is extracted.

Then, the program control unit 1 supplies the test items constituting the test program aaa to the compiler buffer 14 in the order of 4a, 4c, 4b according to the instruction of the test control table 7. Compiler buffer 11
Then, the test items 4a, 4c and 4b are combined and given to the compiler 8 as one source program (aaa). Further, the program control unit 1 causes the compiler 8 to convert the source program aaa to create one object program aaa corresponding to the device to be compiled. And the program control unit 1
Refers to the test execution device table 16 and transfers the object program to the object database 9 of the test execution unit 2 via the communication line 13 to the test execution device 12 that needs to transfer the object program, Register in the object database 9.

At this time, when a plurality of test execution devices 12 are connected, the object program is transferred only to the test execution devices registered in the test execution management table 16.

At the same time, the contents of the product type table 6 of the program control device 11 are transferred to the execution product type table 15 of all the connected test execution devices via the communication line 13.

After that, when the device of the product name a100 is tested by the test execution device 12, the second device (not shown) is used.
From the device name assigning means of the device name a1 of the device under test
The type name information DK2 defining 00 is not added to the test execution unit 2.

Then, the test execution unit 2 in the test execution device 12 specifies the corresponding object program name aaa from the execution type table 15 and executes the test on the device of the type name a100 by the object program aaa in the object database 9. To do.

9 and 10 are flow charts showing an object program generation process and an object program execution process in the semiconductor test apparatus according to the first embodiment.

With reference to FIGS. 9 and 10, first, the first product name assigning means (not shown) gives the program control unit 1 the product name information DK1 which specifies the product name of the device to be compiled. The type name of the device to be tested is designated (step ST1).

Next, the program control unit 1 in the program control device 13 refers to the product type table 6 to determine the test program name corresponding to the specified product name (step ST2).

Then, the program control section 1 extracts the source file of each test item constituting the test program corresponding to the determined test program name from the plurality of test programs in the source database 5 (step ST3).

After that, the program control unit 1 outputs the designated test items in the compile buffer 14 in the order of execution designated by the test control table 7 (step ST4).

Then, the program control unit 1 gives the plurality of test items in the compile buffer 14 to the compiler 8 as one test program (source format) (step ST5), and the compiler 8 causes one of the test items in the compiler buffer 14 to be stored. The test program of the book is converted from the source format to the object format, and a test program of one object format (object program) corresponding to the device to be compiled is created (step ST6).

Next, the program control unit 1 uses the communication line 1
The object program generated by the compiler 8 via 3 is transferred only to the test execution device specified in the test execution device table 16 (step ST
7).

At the same time, the contents of the test control table 7 of the program control unit 1 in the program control device 11 are transmitted only to the test execution device designated by the test execution device table 16 via the communication line 13 ( Step ST8).

The test execution unit 2 of the test execution device 12 that has received the object program registers the object program in the object database (step ST9) and also registers the contents of the test control table 7 in the execution product type table 15. (Step ST1
0).

Next, when the test program for the device under test is executed, the type name information DK2 defining the type name of the device under test is stored in the test execution device 12 by the second type name assigning means (not shown). By providing the test execution unit 2, the product type name is designated (step ST11).

Then, the test execution section 2 refers to the execution type table 15 to determine the object program name corresponding to the specified type name (step ST1).
2).

Next, the test execution section 2 specifies the object program having the determined test program name from the object database 9 (step ST1).
3).

Then, the test execution section 2 executes the step ST.
The device test is performed by executing the object program specified in 13 for the device to be tested (step ST14).

As described above, since the semiconductor test apparatus of the first embodiment is composed of one program control apparatus 11 and a plurality of test execution apparatuses 12, it is applicable to all types regardless of the number of test execution apparatuses 12. The source database 5 capable of storing the test program is provided only in one program control device 11, and the test program can be effectively used.

Also, change (revise) the test program
Also, even if the contents of the table are changed, it is sufficient to make a change to one program control device 11, and the test program can be effectively used.

When testing the device under test,
Even if the test program is composed of many test items, the test execution unit 2 of each test execution device 12 only needs to access the object database 9 and the execution type table 15 once. The test time for the device can be minimized.

<Second Embodiment> FIG. 11 shows a second embodiment of the present invention.
3 is a block diagram showing a configuration of a program control device of the semiconductor test device that is the embodiment of FIG.

As shown in the figure, the compiler table 1 is provided between the source database 5 and the compiler buffer 14.
7 is provided. The compiler table 17 is a compiler table that stores a test instruction and usage data used in the instruction as a set. The rest of the configuration including the test execution device 12 is similar to that of the semiconductor test device of the first embodiment.

Next, an operation example of the semiconductor test apparatus of the second embodiment will be described.

In FIG. 11, when compiling the test program corresponding to the device of the product name a100,
The program control unit 1 refers to the product type table 6 to specify the test program name aaa, and refers to the test control table 7 to determine each test item (source program name) forming the test program name aaa.

Then, the program control section 1 outputs the test items of the test program aaa obtained from the source database 4 in the order of the test items (4a, 4c, 4a) by referring to the test control table 7.

FIG. 12 is a diagram for explaining the operation of the compiler table. As shown in FIG. 12, the compiler table 17
Describes in advance test instructions that require a large amount of time to be executed by the test execution device (ABC,
AAB, ABA, ABB, BBB). First, each test instruction of the test item 4a is compared with the contents of the compiler table 17. Since the test item 4a is the first test item of the test program aaa, when there is a corresponding instruction, it is stored together with the usage data in the data entry column of the corresponding instruction column of the compiler table 17 (ABC → 100). , AAB → 200, ABB → 50
etc). The contents of the test item 4a for which the comparison process has been completed are stored in the compiler buffer 14 as they are.

Next, the contents of the test item 4c are compared with the compiler table 17. Test item 4c
The first instruction of the test instruction ABC is the used data 1
Since 00 matches the contents of the compiler table 17, it is regarded as a duplicate instruction. Therefore, the instruction AAA of the usage data 100 of the test item 4c is changed to the compiler buffer 14
Removed without being stored in. Also, test item 4
The test instruction ABC, which is the fourth instruction of c, corresponds to the comparison process, but since the used data 50 is different from 100, the used data is updated in the test instruction ABC column of the compiler table 17 (100 is described first). It was done, but 1
00 is changed to 50). After that, the comparison process with reference to the compiler table 17 is sequentially executed, and the test instructions that correspond to the same used data are removed without being stored in the compiler buffer 14 (test instructions that do not correspond to the compiler buffer 14). Stored in.).

When the comparison processing of the test item 4c is completed, the test instruction which does not correspond to the test instruction of the compiler table 17 (the same data is the same) is stored in the compiler buffer 14
Stored in. Next, the contents of the test item 4b are compared and the result is stored in the compiler buffer 14. At this time, the first test instruction AB of the test item 4b
Since the C and the usage data 50 match the test instruction ABC and the usage data 50 described in the compiler table 17, they are not stored in the compiler buffer 14 and are removed.

As a result of the comparison process based on the compiler table 17, the test instruction ABC of the test item 4c (use data 100) and the test instruction ABC of the test item 4b are obtained.
The (used data 50) is excluded from being stored in the compiler buffer 14.

Then, the contents of the compiler buffer 14 (test items 4a, 4c, 4b) are given to the compiler 8, and the compiler 8 generates one object program corresponding to the device to be compiled.

13 and 14 are flowcharts showing the object program creating process by the program control unit 1 of the semiconductor test apparatus of the second embodiment of the present invention.

Referring to the figure, first, the first object name assigning means (not shown) gives the program control unit 1 the object name information DK1 which specifies the object name of the device to be compiled, so that the test object is tested. The type name of the device is designated (step ST21).

Next, the program control unit 1 in the program control device 13 refers to the product type table 6 to determine the test program name corresponding to the specified product type name (step ST22).

Then, the program control section 1 extracts the source file of each test item constituting the test program corresponding to the determined test program name from the plurality of test programs in the source database 5 (step ST23).

After that, the program control unit 1 sets each instruction of the test item (source format) as a comparison target with the compiler table 17 in the order specified in the test control table 7 (step ST24).

Then, each test instruction of the test item to be compared with the compiler table 17) is compared with the test instruction described in the compiler table 7 (step ST25). If they do not match, the compiler buffer 1
The test instruction and its use data are stored in 4 (step ST26), and the process proceeds to step ST29.

If there is a corresponding instruction as a result of the comparison in step ST25, the used data of the instruction is further compared (step ST27).

In step ST27, if the usage data of the instruction to be compared does not match the usage data of the instruction described in the compiler table 17, the usage data number is entered in the area corresponding to the relevant instruction. Is changed (step ST28), the test instruction and the used data are stored in the compiler buffer 14 in step S26, and then the process proceeds to step ST29. On the other hand, if the used data also match, the instruction and the used data are removed without being transferred to the object buffer 17, and the process proceeds to step ST29.

In step ST29, the presence or absence of the next test instruction is confirmed, and if it is present, the process returns to step ST25, and thereafter, the processes of steps ST25 to ST28 are repeated until it is determined in step ST29 that it is not present.

When it is determined in step ST29 that the next test instruction does not exist and the comparison of all the test instructions of the designated test item is completed, the process proceeds to step ST30.

In step ST30, the presence or absence of the next test item is confirmed, and if it exists, the process returns to step ST24, and thereafter, the processes of steps S24 to S29 are repeated until it is determined in step ST30 that it does not exist.

When it is determined in step ST30 that the next test item does not exist and the comparison of all test items of the designated test program is completed, step ST3
Move to 1. At this time, the comparison process with reference to the compiler table 17 is completed, and the minimum necessary test instructions that compose the test program by storing the duplicate instructions are stored in the compile buffer 14.

Finally, in step S32, the contents stored in the compiler buffer 14 are transferred to the compiler 8, and the compiler 8 creates (converts) one object program corresponding to the device to be compiled.

As described above, in the semiconductor test apparatus of the second embodiment, in addition to the operation of the semiconductor test apparatus of the first embodiment, duplicate test instructions (use data are the same) between test items.
Has a duplicate instruction removing function for removing one test instruction without compiling.

As a result, in addition to the effects of the semiconductor test apparatus of the first embodiment, the semiconductor test apparatus of the second embodiment eliminates the object conversion of test instructions that are duplicated between test items. The test time can be further shortened.

[0114]

As described above, in the semiconductor test apparatus according to the first aspect, a plurality of test control devices are provided for one program control device. Therefore, the test programs corresponding to all types can be stored in the first storage means of one program control device and shared by a plurality of test execution devices.

As a result, the test program can be efficiently used even when many test execution apparatuses are installed.

In addition, the program control means of the program control device causes the object program corresponding to the device to be compiled to be output, and the test execution means of the test execution device is at least 1 based on the second type name information.
Since the object program corresponding to the device under test is executed from one object program, the device program can be tested by executing the object program for each device under test.

As a result, regardless of the complexity of the object program corresponding to the device under test, the fifth storage means can be accessed only once to obtain the object program corresponding to the device of the type name under test. Since the device can be tested, the device test time can be minimized.

Further, the program control means in the semiconductor test apparatus according to claim 2 stores the test program in the third storage means so as not to continuously store the test instructions having the same contents. Therefore, useless instructions are not converted into an object program.

As a result, since the execution time of the object program executed by the test execution means is also shortened, the device test time can be further shortened.

In addition, the program control means in the semiconductor test apparatus according to the third aspect refers to the test instruction history information and performs the storing operation with the duplicate instruction removal function, so that the test instruction frequently used as the test instruction history information. By storing the latest execution status of the above in the sixth storage means, it is possible to relatively easily and efficiently execute the storing operation with the duplicate instruction removing function.

The semiconductor test method according to claim 4 is
The object program corresponding to the device to be compiled is output in step (c), and the second program is output in step (g).
Since the object program corresponding to the device to be tested is executed from at least one object program based on the product type name information, the device program can be tested by executing the object program for each device to be tested.

As a result, regardless of the complexity of the object program corresponding to the device under test, the fifth storage means can be accessed only once to obtain the object program corresponding to the device of the type name under test. Since the device can be tested, the device test time can be minimized.

The semiconductor test method according to claim 5 is
In step (c), since the test instruction is stored in the third storage means so that the test instructions having the same contents are not stored successively, the storing operation with the duplicate instruction removing function is performed, so that the wasteful instructions are not converted into the object program. .

As a result, the execution time of the object program executed in step (h) is shortened, so that the device test time can be further shortened.

In addition, in the semiconductor test method according to the sixth aspect, since the storing operation with the duplicate instruction removing function is performed with reference to the test instruction history information in step (c), it is frequently used as the test instruction history information. By storing the latest execution status of the test instruction in the sixth storage means, it is possible to relatively easily and efficiently execute the storage operation with the duplicate instruction removal function.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a semiconductor test apparatus that is a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing the contents of a source database in the program control device.

FIG. 3 is an explanatory diagram showing the contents of a product type table in the program control device.

FIG. 4 is an explanatory diagram showing the contents of a test control table in the program control device.

FIG. 5 is an explanatory diagram for explaining the operation of a compiler buffer in the program control device.

FIG. 6 is an explanatory diagram showing the contents of an object database in the test execution device.

FIG. 7 is an explanatory diagram showing the contents of an execution product type table in the test execution device.

FIG. 8 is an explanatory diagram showing the contents of a test execution device table in the program control device.

FIG. 9 is a flowchart showing the operation of the semiconductor test apparatus of the first embodiment.

FIG. 10 is a flowchart showing the operation of the semiconductor test apparatus of the first embodiment.

FIG. 11 is a block diagram showing a configuration of a program control device in a semiconductor test device according to a second embodiment of the present invention.

FIG. 12 is an explanatory diagram for explaining the operation of the compiler table.

FIG. 13 is a flowchart showing the operation of the semiconductor test apparatus of the second embodiment.

FIG. 14 is a flowchart showing the operation of the semiconductor test apparatus of the second embodiment.

FIG. 15 is a block diagram showing a configuration of a conventional semiconductor test apparatus.

FIG. 16 is an explanatory diagram showing the contents of a source database built in a conventional program control unit.

FIG. 17: Test item 4 constituting the test program
It is explanatory drawing which shows the content of a, 4b, 4c.

FIG. 18 is an explanatory diagram showing the contents of a product type table built in the program control unit.

FIG. 19 is an explanatory diagram showing the contents of a test control table built in the program control unit.

FIG. 20 is an explanatory diagram showing the contents of an object database built in the test execution unit.

FIG. 21 is an explanatory diagram showing the contents of an execution control table built in the test execution unit.

FIG. 22 is a flowchart showing the operation of a conventional semiconductor test device.

[Explanation of symbols]

1 program control unit, 2 test execution unit, 4 test program, 5 source database, 6 type table, 8 compiler, 9 object database,
10 execution control table, 11 program control device,
12 test execution unit, 14 compiler buffer, 1
5 execution type table, 16 test execution device table, 17 compiler table.

Claims (6)

[Claims] 1. A semiconductor test apparatus comprising a program control device and a plurality of test execution devices, for testing a device to be tested, wherein the program control device defines a model name of a device to be compiled. A first storage means for storing a plurality of test programs in source format, each of which has a plurality of test programs corresponding to the device type. Each of the test programs consists of at least one test item, and stores a second storage means for storing test item execution information defining an execution order of the test items of each of the plurality of test programs, and a test program to be compiled. Compile processing is performed on the third storage means and the test program stored in the third storage means. And a compiler that converts the test program into an object format to generate an object program, and stores transfer-necessary test execution device information that indicates a test execution device that requires object program transfer among the plurality of test execution devices. Fourth storage means, and a test program corresponding to the device to be compiled is extracted from the plurality of test programs based on the first product type information, and the test programs are extracted in the test item order based on the test item execution information. After storing in the third storage means, the compiler is caused to execute the compilation processing,
A plurality of test execution apparatuses, further comprising: a program control unit for outputting an object program corresponding to the device to be compiled to a test execution apparatus designated by the transfer required test execution apparatus information, Each of the test execution devices has a fifth storage means for storing at least one object program obtained from the program control device and a second storage device for providing second product name information defining a product name of a device to be tested. A type name assigning means, and an object program corresponding to the device to be tested is extracted from the at least one object program based on the first type name information based on the second type name information and the object program To test the device under test. A semiconductor test device comprising a test execution means. 2. The test item comprises at least one test instruction, and the program control means of the program control device comprises:
2. The semiconductor test apparatus according to claim 1, wherein a storage operation with a duplicate instruction removing function is performed to store a test program in the third storage unit so that test instructions having the same content are not stored consecutively. 3. The program control device further comprises sixth storage means for storing the latest execution status of at least one test instruction as test instruction history information, and the program control means refers to the test instruction history information. 3. The semiconductor test apparatus according to claim 2, wherein the storage operation with the duplicate instruction removing function is performed. 4. A semiconductor test method for performing a test on a device to be tested using a semiconductor test apparatus comprising a program control device and a plurality of test execution devices, wherein each of the program control device is a device. A plurality of test programs corresponding to the product types are stored in a source format, each of the plurality of test programs comprises at least one test item. Second storage means for storing test item execution information defining an execution order, third storage means for storing a test program to be compiled, and compiling processing for the test program stored in the third storage means. To convert the test program into an object format and execute the object program. And a fourth storage unit that stores transfer-required test execution device information indicating a test execution device that requires an object program transfer among the plurality of test execution devices. Each of the test execution devices includes fifth storage means for storing at least one object program obtained from the program control device, and the semiconductor test method includes an object program generation process using the program control device and the test execution. Object program execution processing using each device, and the object program generation processing includes (a) a first type that defines the type name of the device to be compiled.
And (b) extracting a test program corresponding to the device to be compiled from the plurality of test programs based on the first product name information, (c) the step (c) storing the test program stored in b) in the third storage means in a test item order based on the test item execution information; and (d) causing the compiler to execute the compilation process to generate an object program. (E) Among the plurality of test execution devices, the object program generated in step (d) is stored in the fifth storage means for the test execution device designated by the transfer required test execution device information. In the object program execution processing, (f) the type name of the device under test is defined. And (g) extracting an object program corresponding to the device to be tested from the at least one object program based on the second product name information. (H) ) A step of executing the object program extracted in the step (g) to perform a test on the device under test, the semiconductor test method. 5. The test item comprises at least one test instruction, and the step (c) stores a test program in the third storage means so that test instructions having the same content are not stored consecutively. The semiconductor test method according to claim 4, wherein a storage operation with an instruction removal function is performed. 6. The program control device further comprises sixth storage means for storing the latest execution status of at least one test instruction in test instruction history information, wherein the step (c) is performed on the test instruction history information. 6. The semiconductor test method according to claim 5, wherein the stored operation with the duplicate instruction removing function is performed on the stored test instruction.