JPH0862046A - Method and apparatus for calibrating temperature of board - Google Patents

Abstract

PURPOSE: To calibrate the temperature without stopping an apparatus for a long time by shifting a calibration board, i.e., a heat resistant board having thermal conduction equivalent to that of a board to be processed and fixed with a thermocouple, to a temperature measuring position in a heat treatment chamber. CONSTITUTION: A processing chamber 2 is coupled with a gate valve 4 which is coupled with a telescopic vacuum bellows 5. An arm 7 penetrates the bellows 5 and secured in place with a calibration board 3 being bonded to the forward end of the arm 7. A plurality of thermocouples, having one ends secured to a thermocouple terminal block 8, are embedded in the board 3. The arm 7 is coupled, at the rear end thereof, with means 6 for advancing or retracting the arm 7 horizontally. The arm 7 is advanced by turning the screw rod 20 and the bellows 5 is compressed to advance the board 3 to a temperature measuring position. The temperature in a radiation temperature measuring region is then measured by means of a radiation thermometer and compared with a temperature measured by means of the thermocouple.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature calibrating method and a method for calibrating the temperature of a substrate to be processed easily in a heat treatment apparatus for single-wafer processing without stopping the apparatus for a long time. The present invention relates to a temperature calibration device used.

[0002]

2. Description of the Related Art Conventionally, in a heat treatment apparatus for single-wafer processing, reproducibility when measuring the temperature of a substrate to be processed with a radiation thermometer, a deviation of measured values, and a defect of a heat source are regularly checked. For this purpose, the temperature of the substrate to be processed is calibrated. Conventionally, such temperature calibration is performed by the heating plate (susceptor) 13 that indirectly heats the substrate to be processed 1 as shown in FIGS. 9 to 10 and the substrate to be processed 13 as shown in FIGS. 11 and 12. Then, the thermocouple 9 having one end fixed to the thermocouple terminal block 8 is fixed, and the temperature measured by the thermocouple 9 is compared with the temperature actually measured by the radiation thermometer of the substrate or the heating plate. It was

However, in this method, since the thermocouple 9 has to be fixed to the substrate 1 to be processed or the heating plate 13, the apparatus has to be temporarily stopped, which requires a large-scale preparation. There was a problem that work efficiency was very poor. Not only that, but because the impurities or impurities are inevitably brought into the heat treatment chamber due to the work or tools for measuring in this way, it is not possible to continue production after the measurement, and the production work for cleaning is not possible. There was a problem that had to be suspended. Therefore, the conventional calibration method has a problem that the productivity of the substrate cannot be increased because it requires extremely troublesome work.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the conventional temperature calibration method, and the temperature calibration of the substrate to be processed can be performed without stopping the apparatus for a long time. Can be done, and after temperature calibration,
An object of the present invention is to provide a temperature calibration method that can start the operation of the apparatus as it is, and an apparatus used for the method.

[0005]

In order to achieve the above object, the present inventor has conducted extensive studies and as a result, as a result, a thermocouple was formed on a heat-resistant material substrate having the same material or the same thermal conductivity and emissivity as the substrate to be processed. The above-mentioned object is achieved by forming a calibration substrate by attaching the calibration substrate, introducing the calibration substrate into the heat treatment chamber through the gate valve, and after the temperature measurement, pulling it out of the heat treatment chamber through the gate valve. That is why the present invention has been reached. However, heretofore, a method of calibrating using such a calibration substrate has not been known at all, and such an idea has not been known at all.

The present invention provides a temperature measured by a radiation thermometer,
In the temperature calibration method, such as comparing the temperature measured by the thermocouple, the accurate temperature measurement of the substrate to be processed in the single-wafer processing apparatus, the correction for the control of the heating output or the detection of the failure of the radiation thermometer, A calibration substrate is formed by attaching a thermocouple to a heat-resistant material substrate having the same material or the same thermal conductivity and emissivity as the substrate to be processed, and the calibration substrate is mounted on the substrate with a radiation thermometer in a heat treatment chamber. It is characterized in that the temperature is moved to a position where the temperature is measured, and after the temperature is measured, the temperature is moved to the outside of the heat treatment chamber.

Further, the apparatus of the present invention comprises a calibration substrate formed by attaching a thermocouple to a heat-resistant material substrate having the same material or the same thermal conductivity and emissivity as the substrate to be processed, and the calibration substrate. An arm for moving the calibration substrate horizontally or horizontally and vertically, a gate valve serving as a gate to the heat treatment chamber of the calibration substrate, and a bellows joint connected to the gate valve. When the gate valve is opened and introduced into the heat treatment chamber, the bellows joint is compressed, and when the calibration substrate is separated from the heat treatment chamber, the bellows joint is extended. And

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view showing an embodiment of the present invention, in which a substrate 1 to be processed is processed at a position shown in the drawing in a processing chamber 2 and, after processing, is transferred from a gate valve 4'as indicated by an arrow. It is transferred into the chamber 17. The calibration method according to the present invention is performed without the substrate 1 to be processed. A gate valve 4 is connected to the processing chamber 2, and a stretchable vacuum bellows 5 is connected to the gate valve 4. In this embodiment, since the substrate is produced in vacuum, the vacuum bellows 5 is used. However, when producing at normal pressure, a bellows joint for normal pressure may be used.

An arm 7 is fixed through the vacuum bellows 5, and at the tip of the arm 7, as shown in FIGS.
The calibration substrate 3 is adhesively connected with the heat resistant adhesive 11 via the holding pins 10 and 10 'formed of two elastic materials. A plurality of thermocouples 9 each having one end fixed to a thermocouple terminal block 8 are embedded in the calibration substrate 3. In this embodiment, four thermocouples 9 are embedded in the calibration substrate 3 at equal intervals, and a radiation temperature measurement temperature region 12 is formed in the center of the calibration substrate 3 inside the thermocouple 9. ing. The calibration substrate 3 is formed of the same material as the substrate to be processed or a heat-resistant material having the same thermal conductivity and emissivity.

At the rear end of the arm 7, means 6 for advancing and retracting the arm 7 in the horizontal direction is connected. The means 6 for moving forward and backward in the horizontal direction is, as shown in FIG.
A rod 18 connected to the arm 7 in the horizontal direction, and a cylindrical body 19 threaded on the inner peripheral surface of the rod 18 connected to the tip of the rod 18.
It is composed of a spiral rod 20 screwed into the cylindrical body 19. By rotating the spiral rod 20 in both directions by the motor 21, the arm 7 is moved forward and backward in the horizontal direction. The means 6 for moving the arm 7 forward and backward may of course be any other means.
May be manually moved forward and backward in the horizontal direction, not automatically.

The screw rod 20 is rotated, the arm 7 is moved forward, the vacuum bellows 5 is compressed, and the calibration substrate 3 is moved forward to the temperature measuring position as shown in FIG. In this state, the temperature of the radiation temperature measurement temperature region 12 is measured by a radiation thermometer, and compared with the temperature measured by the thermocouple 9, as in the conventional case, long-term temperature deviation and correction for control of the heating output are corrected. Or, detect a malfunction of the radiation thermometer.

When the substrate 1 to be processed is indirectly heated by heat conduction from the heating plate (susceptor) 13, as shown in FIG. 6, means 6 for horizontally advancing and retreating, and means for vertically driving it. 16 are connected and the arm 7 is moved up and down to bring the calibration substrate 3 into close contact with the heating plate 13 without any gap. The vacuum bellows 5 can be freely transformed,
Since the holding pins 10 and 10 'are made of a material having elasticity, the calibration substrate 3 is brought into close contact with the heating plate 13 without a gap by moving the arm 7 up and down to bend the holding pins. The rear end of the arm 7 and the cylindrical body 19 may be directly connected without interposing the rod 18 as shown in FIG.

In this embodiment, as shown in FIG. 6, the means 16 for vertically moving is constituted by a cylinder, and the means 6 for horizontally advancing and moving backward in the cylinder is moved up and down to move the arm 7 up and down. Let's calibrate board 3
Is closely attached to the heating plate 13.
Of course, other means for moving up and down may be used, and it may be moved up and down manually instead of automatically. In the above-described embodiment, the heating of the calibration substrate 3 and the heating plate 13 is performed as shown in FIG.
As shown in FIG. 5, the infrared lamp 14 is operated through the quartz window 15, but the heating means is not particularly limited in the present invention.

[0014]

According to the present invention, since the calibration substrate having the thermocouple fixed thereto is used, it is possible to save the trouble of fixing the thermocouple to the substrate or the heating plate each time the measurement is performed. Further, since the calibration substrate is configured to be taken in and out of the heat treatment chamber, the calibration substrate is isolated from the heat treatment chamber after the temperature calibration so that the apparatus can be processed without stopping the apparatus for a long time. The temperature of the substrate can be calibrated, and there is no risk of impurities being brought into the heat treatment chamber during the temperature calibration.

[0015]

[Effect] As described above, according to the present invention, since the calibration substrate having the thermocouple fixed therein can be put in and taken out from the heat treatment chamber, the labor for fixing the thermocouple in the measurement can be saved. The temperature of the substrate to be processed can be calibrated without stopping the equipment for a long time, and there is no risk of impurities being brought into the heat treatment chamber during temperature calibration. Since the production can be continued after the measurement as it is, it greatly contributes to the reduction of the productivity and the manufacturing cost of the substrate. Further, according to the present invention, since the temperature calibration work is extremely simplified, it is possible to regularly and frequently perform temperature calibration, so that it is possible to produce a substrate of stable quality.

[0016]

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention (in order to clarify the internal state, a substrate to be processed and a calibration substrate are shown by solid lines).

FIG. 2 is a plan view showing a state in which calibration is performed by the method of the present invention (displayed with the lid of the heat treatment chamber removed to clarify the internal state).

FIG. 3 is an enlarged side view of the calibration substrate of the present invention.

FIG. 4 is a plan view of FIG. 3;

FIG. 5 is a plan view showing another embodiment of the present invention (shown with the lid of the heat treatment chamber removed to clarify the internal state).

FIG. 6 is a vertical sectional view of FIG.

FIG. 7 is a side view showing a state before the calibration substrate is brought into close contact with the heating plate.

FIG. 8 is a side view showing a state where the calibration substrate is brought into close contact with a heating plate.

FIG. 9 is a plan view showing a conventional calibration method.

10 is a vertical cross-sectional view of FIG.

FIG. 11 is a plan view showing another example of a conventional calibration method.

FIG. 12 is a vertical cross-sectional view of FIG.

[Explanation of symbols]

1 substrate to be processed 2 processing chamber 3 substrate for calibration 4 gate valve 5 vacuum bellows 6 means for moving forward and backward in a horizontal direction 7 arm 9 thermocouple 10, 10 'holding pin 12 radiation temperature measurement temperature region 13 heating plate 16 driving up and down Means to make

Claims (6)

[Claims] 1. A temperature measured by a radiation thermometer and a temperature measured by a thermocouple are compared to accurately measure temperature of a substrate to be processed in a single-wafer processing apparatus, correction for control of heating output, or a radiation thermometer. In the temperature calibration method such as detecting a failure of, a calibration substrate is formed by attaching a thermocouple to a heat-resistant material substrate having the same material or the same thermal conductivity and emissivity as the substrate to be processed, A method of calibrating a temperature of a substrate, which comprises moving a calibration substrate to a position where the temperature is measured by a radiation thermometer in a heat treatment chamber, measuring the temperature, and then moving the temperature outside the heat treatment chamber. 2. The calibration substrate passes through a gate valve and is introduced into the heat treatment chamber, and when not in use, passes through the gate valve to be isolated from the heat treatment chamber. The calibration method according to Item 1. 3. A plurality of thermocouples are attached to the calibration substrate,
The calibration method according to claim 1, wherein the in-plane temperature distribution of the constituent substrate is regularly measured to detect a defect of the heat source. 4. The calibration substrate is constructed so as to be movable in the horizontal direction or in the horizontal and vertical directions.
Calibration method described in. 5. A calibration substrate formed by attaching a thermocouple to a heat-resistant material substrate having the same material or the same thermal conductivity and emissivity as the substrate to be processed, and the calibration substrate in the horizontal or horizontal direction. It comprises an arm for moving in the vertical direction, a gate valve serving as a gate to the heat treatment chamber of the calibration substrate, and a bellows joint connected to the valve, and the calibration substrate is opened by opening the gate valve. The temperature calibrating device is configured so that the bellows joint is compressed when being introduced into the heat treatment chamber, and that the bellows joint is elongated when the calibration substrate is separated from the heat treatment chamber. 6. The temperature calibrating device according to claim 5, wherein the calibration substrate is connected to the arm via a holding pin having elasticity.