JPH0859925A - Semiconductive rubber composition - Google Patents
Semiconductive rubber compositionInfo
- Publication number
- JPH0859925A JPH0859925A JP19958294A JP19958294A JPH0859925A JP H0859925 A JPH0859925 A JP H0859925A JP 19958294 A JP19958294 A JP 19958294A JP 19958294 A JP19958294 A JP 19958294A JP H0859925 A JPH0859925 A JP H0859925A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- rubber composition
- mooney viscosity
- semiconductive
- carbon black
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001971 elastomer Polymers 0.000 title claims abstract description 71
- 239000005060 rubber Substances 0.000 title claims abstract description 71
- 239000000203 mixture Substances 0.000 title claims abstract description 38
- 238000001179 sorption measurement Methods 0.000 claims abstract description 14
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052740 iodine Inorganic materials 0.000 claims abstract description 13
- 239000011630 iodine Substances 0.000 claims abstract description 13
- 238000010521 absorption reaction Methods 0.000 claims abstract description 12
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 5
- 238000013329 compounding Methods 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000006229 carbon black Substances 0.000 abstract description 16
- 238000002156 mixing Methods 0.000 abstract description 8
- 241001441571 Hiodontidae Species 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 239000004902 Softening Agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000006230 acetylene black Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 238000004073 vulcanization Methods 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000006232 furnace black Substances 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000010690 paraffinic oil Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000010734 process oil Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- -1 propylene, Ethylene Chemical group 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 239000006234 thermal black Substances 0.000 description 1
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導電性ゴム組成物に
係わり、特に電線、ケーブルの接続部や端末部のゴムモ
ールド接続体等に使用する半導電性ゴム組成物に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductive rubber composition, and more particularly to a semiconductive rubber composition used for a rubber mold connecting body of a connecting portion of electric wires or cables or a terminal portion.
【０００２】[0002]
【従来の技術】通常、中低圧または高圧の電力ケーブル
の接続部や端末部には、絶縁層と半導電層とを一体に成
形したゴムモールド接続体が使用されている。そして、
このゴムモールド接続体における半導電層には、エチレ
ンプロピレン系ゴム（以下、ＥＰ系ゴムと示す。）をベ
ースとし、これにアセチレンブラックのような導電性カ
ーボンブラックを多量に配合して導電性（半導電性）を
付与した半導電性ゴム組成物が使用されている。2. Description of the Related Art In general, a rubber mold connecting body in which an insulating layer and a semiconductive layer are integrally molded is used for a connecting portion and a terminal portion of a medium or low voltage power cable. And
The semiconductive layer in this rubber mold connector is based on ethylene propylene rubber (hereinafter referred to as EP rubber), and a large amount of conductive carbon black such as acetylene black is added to the semiconductive layer to improve the conductivity ( A semiconductive rubber composition imparted with (semiconductivity) is used.
【０００３】[0003]
【発明が解決しようとする課題】しかしカーボンブラッ
クを多量に配合すると、ゴム組成物のムーニー粘度が高
くなり、成形加工が困難になるという問題があった。そ
のため、ゴム組成物にプロセスオイルのような軟化剤を
添加し粘度を調整することが行われている。However, when a large amount of carbon black is blended, there is a problem that the Mooney viscosity of the rubber composition becomes high and the molding process becomes difficult. Therefore, a softener such as process oil is added to the rubber composition to adjust the viscosity.
【０００４】しかしながら、粘度を下げ成形を容易にす
るには、前記軟化剤を多量に添加する必要があり、軟化
剤を多量に添加した半導電性ゴム組成物においては、ベ
ース樹脂との相溶性が悪いばかりでなく、軟化剤の移行
によりモールド接続体の嵌合不良が生じるおそれがあっ
た。さらに、カーボンブラックの配合量を減少させるこ
とで、ゴム組成物の粘度を低下させることも一応考えら
れるが、その場合には組成物の導電性が不十分となり、
体積抵抗率が所定の値以下のゴム組成物を得ることがで
きない。However, in order to reduce the viscosity and facilitate the molding, it is necessary to add a large amount of the above-mentioned softening agent, and the semiconductive rubber composition containing a large amount of the softening agent is compatible with the base resin. Not only is there a problem, but there is a risk of defective fitting of the molded connector due to migration of the softening agent. Furthermore, by decreasing the blending amount of carbon black, it is conceivable that the viscosity of the rubber composition is lowered, but in that case, the conductivity of the composition becomes insufficient,
It is not possible to obtain a rubber composition having a volume resistivity of a predetermined value or less.
【０００５】本発明はこのような現状に鑑みてなされた
もので、ムーニー粘度が低く成形加工性が良好であるた
め、軟化剤を多量に添加する必要がなく、かつ十分な半
導電性を有し、ケーブルの接続部等のモールド接続体用
として好適する半導電性ゴム組成物を提供することを目
的とする。The present invention has been made in view of the above circumstances. Since the Mooney viscosity is low and the molding processability is good, it is not necessary to add a large amount of a softening agent and it has sufficient semiconductivity. However, it is an object of the present invention to provide a semiconductive rubber composition suitable for a molded connector such as a cable connecting portion.
【０００６】[0006]
【課題を解決するための手段と作用】本発明の半導電性
ゴム組成物は、ムーニー粘度が20〜60のＥＰ系ゴムとム
ーニー粘度が 5〜15のＥＰ系ゴムとからなるベースゴム
100重量部に、ヨウ素吸着量および吸油量がともに低い
導電性カーボンブラック50〜80重量部を混合してなるこ
とを特徴とする。The semiconductive rubber composition of the present invention is a base rubber comprising an EP rubber having a Mooney viscosity of 20 to 60 and an EP rubber having a Mooney viscosity of 5 to 15.
It is characterized by mixing 100 parts by weight of 50 to 80 parts by weight of conductive carbon black having a low iodine adsorption amount and a low oil absorption amount.
【０００７】本発明に使用するＥＰ系ゴムは、エチレン
とプロピレンとをランダムに共重合させたものであり、
これら２成分の他に第３成分を導入して共重合させたエ
チレン・プロピレン・ジエン三元共重合体（ＥＰＤＭ）
も使用することができる。The EP rubber used in the present invention is obtained by randomly copolymerizing ethylene and propylene,
Ethylene / propylene / diene terpolymer (EPDM) copolymerized by introducing a third component in addition to these two components
Can also be used.
【０００８】本発明においては、ＥＰ系ゴムとして、ム
ーニー粘度（ＭＬ1+4 （ 100℃））が20〜60の高ムーニ
ーグレードのものと、ムーニー粘度が 5〜15の低ムーニ
ーグレードのものとを混合し、ベースゴムとして使用す
る。配合するＥＰ系ゴムの粘度を上記したように限定し
たのは、以下の理由による。すなわち、高ムーニーグレ
ードのＥＰ系ゴムのムーニー粘度が60を越えた場合に
は、ベースゴムの粘度が高くなりすぎて、軟化剤を多量
に添加しないと成形加工を行うことができず、反対に高
ムーニーグレードのＥＰ系ゴムとして粘度が20未満のも
のを使用した場合には、加硫後所望の物性が得られず加
工しにくい。また、低ムーニーグレードのＥＰ系ゴムの
粘度が15を越えた場合には、ベースゴムの粘度が高くな
りすぎて成形加工性が劣悪になり好ましくない。さら
に、このような高ムーニーグレードのＥＰ系ゴムと低ム
ーニーグレードのＥＰ系ゴムとの配合比率は、 1:1〜
1:9の範囲とすることが望ましい。配合比率が上記範囲
を外れ高ムーニーグレードのＥＰ系ゴムが多すぎた場合
には、ベースゴムの粘度が高くなりすぎて成形性が悪く
なり、反対に低ムーニーグレードのＥＰ系ゴムが多すぎ
た場合には、加硫後の物性が不十分になり好ましくな
い。In the present invention, as the EP rubber, there are a high Mooney grade having a Mooney viscosity (ML 1 + 4 (100 ° C.)) of 20 to 60 and a low Mooney grade having a Mooney viscosity of 5 to 15. Are mixed and used as a base rubber. The reason for limiting the viscosity of the EP rubber to be blended as described above is as follows. That is, when the Mooney viscosity of the high Mooney grade EP rubber exceeds 60, the viscosity of the base rubber becomes too high, and the molding process cannot be performed unless a large amount of the softening agent is added. When a high Mooney grade EP rubber having a viscosity of less than 20 is used, desired physical properties cannot be obtained after vulcanization and it is difficult to process. Further, when the viscosity of the low Mooney grade EP rubber exceeds 15, the viscosity of the base rubber becomes too high and the moldability becomes poor, which is not preferable. Further, the compounding ratio of such a high Mooney grade EP rubber and a low Mooney grade EP rubber is 1: 1 to
A range of 1: 9 is desirable. When the compounding ratio is out of the above range and the amount of the EP rubber of the high Mooney grade is too much, the viscosity of the base rubber becomes too high and the moldability is deteriorated. On the contrary, the amount of the EP rubber of the low Mooney grade is too much. In this case, the physical properties after vulcanization become insufficient, which is not preferable.
【０００９】本発明においては、流れ性が良好でモール
ド成形や押出しを容易に行うことができ、かつ十分な導
電性を有する半導電性ゴム組成物を得るために、前記し
たベースゴムに、ヨウ素吸着量と DBP吸油量がともに低
い導電性カーボンブラックを加えて混合する。すなわ
ち、ヨウ素吸着量の低いカーボンブラックは大きな粒径
を有しているので、このようなカーボンブラックの添加
混合により、ゴム組成物のムーニー粘度を下げ流れ性を
上げることができる。また、半導電性ゴム組成物として
は十分な導電性が要求されるが、導電性を上げるにはス
トラクチャーの小さなカーボンブラックの使用が望まし
く、その意味で DBP吸油量の小さなカーボンブラックを
添加混合することが望ましい。In the present invention, iodine is added to the above-mentioned base rubber in order to obtain a semiconductive rubber composition which has good flowability, can be easily molded and extruded, and has sufficient conductivity. Add and mix conductive carbon black with low adsorption and DBP oil absorption. That is, since carbon black having a low iodine adsorption amount has a large particle diameter, the Mooney viscosity of the rubber composition can be lowered and the flowability can be improved by adding and mixing such carbon black. In addition, although sufficient conductivity is required for the semi-conductive rubber composition, it is desirable to use carbon black having a small structure in order to increase the conductivity. In that sense, carbon black having a small DBP oil absorption is added and mixed. Is desirable.
【００１０】このようなカーボンブラックとして、具体
的にはヨウ素吸着量が80mg/g以下より好ましくは60mg/g
以下であり、かつ DBP吸油量が170ml/100g以下より好ま
しくは155ml/100g以下のものを使用することが望まし
い。使用するカーボンブラックのヨウ素吸着量が80mg/g
を越えると、適切なムーニー粘度を有し流れ性の良好な
ゴム組成物が得られず、また DBP吸油量が170ml/100gを
越えると、組成物の導電性を高めるために多量に配合し
なければならず、他の物性が劣悪となり好ましくない。
これら両方の条件を満足させるカーボンブラックを配合
することにより、流れ性が良好で十分な導電性を有する
半導電性ゴム組成物を得ることができる。なお、このよ
うなカーボンブラックとしては、サーマルブラック、ア
セチレンブラック、ファーネスブラック等の種類にかか
わらず、使用することができる。As such carbon black, specifically, the iodine adsorption amount is 80 mg / g or less, more preferably 60 mg / g.
It is desirable to use those having a DBP oil absorption of 170 ml / 100 g or less, more preferably 155 ml / 100 g or less. The carbon black used has an iodine adsorption of 80 mg / g
If it exceeds, a rubber composition having an appropriate Mooney viscosity and good flowability cannot be obtained, and if the DBP oil absorption exceeds 170 ml / 100 g, a large amount must be compounded to increase the conductivity of the composition. This is not preferable because other physical properties are poor.
By blending carbon black that satisfies both of these conditions, a semiconductive rubber composition having good flowability and sufficient conductivity can be obtained. As such carbon black, it is possible to use regardless of the type of thermal black, acetylene black, furnace black, or the like.
【００１１】また本発明においては、ベースゴム 100重
量部に対して、前記したヨウ素吸着量および吸油量がと
もに低い導電性カーボンブラックを、50〜80重量部の割
合で配合する。カーボンブラックの配合量を上記範囲に
限定したのは、配合量が50重量部未満では、得られるゴ
ム組成物の導電性が不十分となり、例えばモールド接続
体の半導電層として必要とされる、体積抵抗率が１０4
Ω・cm以下のものを得ることができず、反対にカーボン
ブラックの配合量が80重量部を越えた場合には、得られ
るゴム組成物の粘度が高くなりすぎて、モールド成形等
が困難になるためである。In the present invention, 100 to 100 parts by weight of the base rubber is blended with 50 to 80 parts by weight of the conductive carbon black having a low iodine adsorption amount and a low oil absorption amount. The blending amount of carbon black is limited to the above range, when the blending amount is less than 50 parts by weight, the conductivity of the obtained rubber composition becomes insufficient, and for example, it is required as a semiconductive layer of a mold connector, Volume resistivity is 10 4
If the amount of Ω · cm or less cannot be obtained and, conversely, the amount of carbon black compounded exceeds 80 parts by weight, the viscosity of the obtained rubber composition becomes too high, which makes molding difficult. This is because
【００１２】さらに本発明の半導電性ゴム組成物には、
軟化剤としてパラフィン系油を、ベースゴム 100重量部
に対して 5〜20重量部の範囲で添加することができる。
また、老化防止剤、滑剤等の添加剤を配合しても良く、
架橋剤、架橋助剤等を配合することも可能である。な
お、本発明の半導電性ゴム組成物を架橋する場合には、
通常ジクミルパーオキサイド、3-ビス（t-ブチルパーオ
キシイソプロピル）ベンゼン等の有機過酸化物架橋剤に
より架橋する方法が採られるが、特にＥＰ系ゴムとして
ＥＰＤＭを使用した場合には、硫黄による加硫を行うこ
ともできる。Further, the semiconductive rubber composition of the present invention comprises
Paraffinic oil can be added as a softening agent in the range of 5 to 20 parts by weight with respect to 100 parts by weight of the base rubber.
Further, additives such as an antiaging agent and a lubricant may be blended,
It is also possible to add a crosslinking agent, a crosslinking aid, and the like. In the case of crosslinking the semiconductive rubber composition of the present invention,
Usually, a method of cross-linking with an organic peroxide cross-linking agent such as dicumyl peroxide or 3-bis (t-butylperoxyisopropyl) benzene is adopted. However, when EPDM is used as the EP rubber, it is likely that Vulcanization can also be performed.
【００１３】[0013]
【実施例】以下、本発明の実施例について説明する。Embodiments of the present invention will be described below.
【００１４】実施例１〜６ 表１の各成分を同表に示す割合で配合し、さらに適量の
架橋剤（ジクミルパーオキサイド）を添加したものをバ
ンバリーミキサーにより混練し、半導電性ゴム組成物を
得た。次いで、得られた半導電性ゴム組成物のムーニー
粘度をそれぞれ常法により測定した。また、実施例およ
び比較例のゴム組成物を、 160℃の温度で30分間プレス
加硫を行い厚さ 1mmおよび 2mmのゴムシートをそれぞれ
作製した。なお、表１に用いたＥＰＤＭ１、２、３およ
びＣＢ（カーボンブラック）１、２、３は、それぞれ以
下に示す特性を有するものである。Examples 1 to 6 The components shown in Table 1 were blended in the proportions shown in the table, and an appropriate amount of a cross-linking agent (dicumyl peroxide) was added and kneaded with a Banbury mixer to give a semiconductive rubber composition. I got a thing. Then, the Mooney viscosity of each of the obtained semiconductive rubber compositions was measured by an ordinary method. Further, the rubber compositions of Examples and Comparative Examples were press-vulcanized at a temperature of 160 ° C. for 30 minutes to produce rubber sheets having a thickness of 1 mm and 2 mm, respectively. The EPDMs 1, 2, and 3 and CB (carbon black) 1, 2, and 3 used in Table 1 have the following characteristics.
【００１５】ＥＰＤＭ１；ムーニー粘度ＭＬ1+4 （ 100
℃）40のＥＰ系ゴム ＥＰＤＭ２；ムーニー粘度ＭＬ1+4 （ 100℃） 8のＥＰ
系ゴム ＥＰＤＭ３；ムーニー粘度ＭＬ1+4 （ 100℃）70のＥＰ
系ゴム ＣＢ１；ヨウ素吸着量57mg/g、 DBP吸油量155ml/100gの
ファーネスブラック ＣＢ２；ヨウ素吸着量 100mg/g、 DBP吸油量178ml/100g
のアセチレンブラック ＣＢ３；ヨウ素吸着量 260mg/g、 DBP吸油量173ml/100g
のファーネスブラックEPDM1; Mooney viscosity ML 1 + 4 (100
40 ° C EP rubber EPDM2; Mooney viscosity ML 1 + 4 (100 ° C) 8 EP
System rubber EPDM3; Mooney viscosity ML 1 + 4 (100 ° C) 70 EP
System rubber CB1; Furnace Black CB2 with iodine adsorption amount 57mg / g, DBP oil absorption amount 155ml / 100g; Iodine adsorption amount 100mg / g, DBP oil absorption amount 178ml / 100g
Acetylene black CB3; iodine adsorption amount 260mg / g, DBP oil absorption amount 173ml / 100g
Furnace black
【表１】 さらに、実施例および比較例の半導電性ゴム組成物から
得られたゴムシートについて、体積抵抗率と引張り強度
とをそれぞれ測定した。なお、体積抵抗率の測定は厚さ
1mmのシートを使用し、引張り強度の測定は厚さ 2mmの
シートを使用してそれぞれ行った。これらの測定結果
を、シート成形の際の加工性の良否とともに、表２に示
す。[Table 1] Further, the volume resistivity and the tensile strength of the rubber sheets obtained from the semiconductive rubber compositions of Examples and Comparative Examples were measured. The volume resistivity is measured by the thickness.
A 1 mm sheet was used, and the tensile strength was measured using a 2 mm thick sheet. The results of these measurements are shown in Table 2 together with the quality of the workability during sheet formation.
【００１６】[0016]
【表２】 表２の結果から明らかなように、実施例の半導電性ゴム
組成物は、ムーニー粘度が低く成形加工性が良好である
うえに、適切な体積抵抗率値を有し、かつ十分大きな引
張り強度を有している。特にこのゴム組成物を、ケーブ
ル接続部等のモールド接続体の半導電層として使用する
場合には、ムーニー粘度ＭＬ1+4 （ 100℃）が45以下で
あることが望ましく、これ以上の粘度では、加工時の流
れ性が悪くバックライディングや外観不良を起こすおそ
れがあるが、実施例１乃至３で得られた半導電性ゴム組
成物は、粘度が25〜40と十分に低く成形加工が極めて容
易である。また体積抵抗率の値は、半導電層として長期
的に電界緩和の働きを果たすことができるように、１０
4 Ω・cm以下であることが望ましく、さらに引張り強度
は、放電や絶縁破壊あるいは異物、水分の侵入を防ぐた
め、 0.98MPa以上であることが望ましいが、実施例１乃
至３の半導電性ゴム組成物はこれらの要求を十分に満足
させることができ、モールド接続体の半導電層として好
適する。[Table 2] As is clear from the results in Table 2, the semiconductive rubber compositions of Examples have low Mooney viscosity, good moldability, and have an appropriate volume resistivity value and a sufficiently large tensile strength. have. In particular, when this rubber composition is used as a semiconductive layer of a molded connector such as a cable connector, it is desirable that the Mooney viscosity ML 1 + 4 (100 ° C.) be 45 or less, and if it is higher than this value. Although the flowability at the time of processing is poor and there is a risk of causing back riding and poor appearance, the semiconductive rubber compositions obtained in Examples 1 to 3 have sufficiently low viscosities of 25 to 40 and are extremely molded. It's easy. Further, the value of the volume resistivity is set to 10 so that it can function as an electric field relaxation in the long term as a semiconductive layer.
The tensile strength is preferably 4 Ω · cm or less, and the tensile strength is preferably 0.98 MPa or more in order to prevent electric discharge, dielectric breakdown, and invasion of foreign matter and moisture, but the semiconductive rubbers of Examples 1 to 3 are used. The composition can sufficiently satisfy these requirements, and is suitable as a semiconductive layer of a molded connector.
【００１７】[0017]
【発明の効果】以上説明したように、本発明の半導電性
ゴム組成物は、ムーニー粘度が低く成形加工が容易であ
るため、軟化剤を多量に添加する必要がなく、かつ寸法
安定性と強度に優れ良好な半導電性を有している。した
がって、電力ケーブルの接続部等におけるゴムモールド
接続体の半導電層を形成するための組成物として好適し
ている。As described above, since the semiconductive rubber composition of the present invention has a low Mooney viscosity and is easy to mold, it is not necessary to add a large amount of a softening agent and the dimensional stability is improved. It has excellent strength and good semiconductivity. Therefore, it is suitable as a composition for forming a semiconductive layer of a rubber mold connector in a connection portion of a power cable or the like.
【００１８】[0018]
Claims (3)
レン系ゴムとムーニー粘度が 5〜15のエチレンプロピレ
ン系ゴムとからなるベースゴム 100重量部に、ヨウ素吸
着量および吸油量がともに低い導電性カーボンブラック
50〜80重量部を混合してなることを特徴とする半導電性
ゴム組成物。1. A conductive carbon having a low iodine adsorption amount and a low oil absorption amount in 100 parts by weight of a base rubber composed of an ethylene propylene rubber having a Mooney viscosity of 20 to 60 and an ethylene propylene rubber having a Mooney viscosity of 5 to 15. black
A semiconductive rubber composition, characterized by being mixed in an amount of 50 to 80 parts by weight.
レン系ゴムとムーニー粘度が 5〜15のエチレンプロピレ
ン系ゴムとの配合比率が、 1:1〜 1:9の範囲にある請求
項１記載の半導電性ゴム組成物。2. The compounding ratio of the ethylene propylene rubber having a Mooney viscosity of 20 to 60 and the ethylene propylene rubber having a Mooney viscosity of 5 to 15 is in the range of 1: 1 to 1: 9. Semi-conductive rubber composition.
量が80mg/g以下で DBP吸油量が170ml/100g以下のもので
ある請求項１または２記載の半導電性ゴム組成物。3. The semiconductive rubber composition according to claim 1, wherein the conductive carbon black has an iodine adsorption amount of 80 mg / g or less and a DBP oil absorption amount of 170 ml / 100 g or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19958294A JP3442492B2 (en) | 1994-08-24 | 1994-08-24 | Semiconductive rubber composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19958294A JP3442492B2 (en) | 1994-08-24 | 1994-08-24 | Semiconductive rubber composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0859925A true JPH0859925A (en) | 1996-03-05 |
| JP3442492B2 JP3442492B2 (en) | 2003-09-02 |
Family
ID=16410251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19958294A Expired - Lifetime JP3442492B2 (en) | 1994-08-24 | 1994-08-24 | Semiconductive rubber composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3442492B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1028145A1 (en) * | 1999-02-10 | 2000-08-16 | Sumitomo Rubber Industries, Ltd. | Low modulus of elasticity-rubber composition |
| JP2011162745A (en) * | 2010-02-15 | 2011-08-25 | Hitachi Cable Ltd | Conductive rubber composition |
| JP2019517606A (en) * | 2016-05-30 | 2019-06-24 | ダウ グローバル テクノロジーズ エルエルシー | Ethylene / alpha-olefin / diene interpolymer composition |
-
1994
- 1994-08-24 JP JP19958294A patent/JP3442492B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1028145A1 (en) * | 1999-02-10 | 2000-08-16 | Sumitomo Rubber Industries, Ltd. | Low modulus of elasticity-rubber composition |
| JP2011162745A (en) * | 2010-02-15 | 2011-08-25 | Hitachi Cable Ltd | Conductive rubber composition |
| JP2019517606A (en) * | 2016-05-30 | 2019-06-24 | ダウ グローバル テクノロジーズ エルエルシー | Ethylene / alpha-olefin / diene interpolymer composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3442492B2 (en) | 2003-09-02 |
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