JPH085663A - Prober for integrated circuit element - Google Patents

Abstract

PURPOSE:To bring each contact part into contact with all pad parts with high accuracy by a structure wherein the intermediate part of a contact element buffers contact between the contact part and the pad part. CONSTITUTION:A base board 10 is provided with openings corresponding in number with the pad parts of an object to be inspected, contact lands 12 formed on the periphery, electric connectors 30 fixed to the surface at one end part, add wiring conductors 13 formed in the center on the surface in order to connect the lands 12 and the connectors 30 electrically. A connecting element 20 inserted into the opening 11 comprises an intermediate part 22 for regulating the position of the pad part, a connecting part 21 extending from one end and connected with the land 12, and a contact part 23 extending from the other end and coming into contact with the pad part. When the connecting part 21 is welded to the land 12, the intermediate part 22 is pressed, at the upper outer side face, against the fringe part 11A of the opening 11 through its resiliency thus regulating the forward end part of the contact part 23 to be aligned with the pad part. Each contact part 23 can touch all pad part of the object to be inspected with high accuracy through buffering function of the intermediate part 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prober for integrated circuit devices.

[0002]

2. Description of the Related Art Conventionally, a wafer related to a semiconductor integrated circuit (IC) is cut into individual pellets, and the pellets are mounted on a lead frame and packaged by molding or the like. And aging, and there was also a device to measure the characteristics of pellets addressed to one piece. The measuring electrode used in such a case requires a small number of contact points, and there is no problem in the conventional technique in terms of design and work.

However, such inspection and aging methods take time and are not suitable for production. Also,
It takes a lot of time and effort to attach and detach the finished product IC, and when a defective product occurs, all the processes up to that point are wasted, which is a great pain especially for products with poor yield. Was there.

Therefore, in order to avoid waste of the process up to that time when defective products are detected and removed from the packaged ICs in the process near the final process, a plurality of integrated circuit devices and a plurality of integrated circuit devices grown on the wafer are omitted. It has been proposed that the pellets containing individual elements be measured at one time to prevent waste of subsequent steps and to significantly improve production efficiency.

[0005]

However, at present, in a pellet or an IC wafer having a plurality of semiconductor circuit parts mounted thereon, the distance between adjacent IC patterns is about 20 μm, and the electrode parts (pad parts) on the pattern are mutually separated. The distance between them is very small, about 30 μm, and in particular, in an 8-inch wafer, several hundreds to several thousands of IC patterns are grown, so that the number of pads is several tens per pattern. In terms of degree, the number of wafers per wafer is in the range of thousands to tens of thousands, and further tends to become finer with the trend toward higher integration.

When simultaneously measuring all of a large number of IC portions (subjects) formed on such an object to be measured, there are local and global irregularities on their surfaces, and therefore all It has been extremely difficult to achieve contact with the pad portion with high accuracy and high reliability. In addition, since the pins involved in probing are expensive and delicate, or the area of the contact block for one object is large, it is very possible to manufacture a prober that can simultaneously measure many objects. It was difficult.

In order to solve the above-mentioned problems of the prior art, an object of the present invention is to attach an inspection device for an IC and an aging device (hereinafter, both are collectively referred to as a main device) to A contact that allows highly accurate and reliable contact with the pad part on the pattern related to each IC part in the wafer state before cutting the IC into single or plural pellets or pellets. An object of the present invention is to provide a prober for an integrated circuit device having the prober (hereinafter referred to as a prober).

Another object of the present invention is to grow on a wafer in order to eliminate waste of the process up to that time when defective products are detected and removed from the packaged IC in the process near the final stage. By enabling measurement of multiple integrated circuit devices or those cut into pellets containing multiple devices at one time, it is possible to prevent waste of subsequent processes and improve production efficiency, and By extending the configuration, it is possible to determine the distribution state of defective portions on the wafer, and to retroactively determine process defects such as defective IC pattern masks. Providing a prober that can be expected to have a wide range of applications and can be applied to defect inspection devices other than IC wafers, such as liquid crystal display devices with electrodes. It is to be.

[0009]

A prober for an integrated circuit device according to one feature of the present invention is used for measuring an object in which an integrated circuit is formed and the pad portions thereof are arranged on one surface. A base substrate and a plurality of contact elements disposed on the base substrate, the base substrate being provided with an opening corresponding to the pad portion of the subject and around the opening. A contact land, an electrical connection portion to an external measuring device, and a wiring conductor electrically connecting between the contact land and the electrical connection portion, the contact element, An intermediate portion which is inserted into the opening portion and regulates the position of the pad portion; a connecting portion which extends from one end of the intermediate portion and is connected to the contact land around the opening portion; From the other end of the part and the pad part Contact has a contact portion that performs, the intermediate portion is characterized in that fulfill a cushioning function against contact between the contact portion and the pad portion.

A prober for an integrated circuit device according to another feature of the present invention is used for measuring an object in which a plurality of integrated circuits are arranged and their pad portions are arranged on one surface. The relay board, the contact block,
A conductive base and a cushioning member arranged between the relay board and the contact block, and a support base for positioning and holding the relay board, the contact block and the conductive cushioning member, The contact block includes a base substrate and a plurality of contact elements arranged on the base substrate. The base substrate has an opening corresponding to the pad portion of the subject and an opening of the opening. It has a contact land provided in the periphery, a base land for making an electrical connection to an external measuring device, and a wiring conductor for electrically connecting the contact land and the base land, The contact element is inserted into the opening and regulates a position with respect to the pad, and the contact element extends from one end of the intermediate part and is connected to the contact land around the opening. And a contact portion that extends from the other end of the intermediate portion to make contact with the pad portion, and the intermediate portion cushions contact between the contact portion and the pad portion. Is designed to function,
Opposing lands that are electrically drawn to an external measuring device are arranged corresponding to each contact element on the relay substrate, and the conductive and buffer members include the base lands and the opposing lands that correspond to each other. The contact block is electrically connected and is movable with respect to the relay board in the contact direction.

[0011]

Since the prober for integrated circuit device of the present invention has such a structure, the presence of the conductive member and the buffer member causes
It is possible to deal with global distortions and irregularities on the surface of the subject, and with the buffering function of each contact element, it is possible to deal with local strains and irregularities on the surface of the subject, and each contact part is all pad parts of the subject. The contact is made with high accuracy and high reliability.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail with reference to the accompanying drawings.

FIG. 1 is a schematic plan view showing a prober for an integrated circuit device as an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA 'in FIG. The integrated circuit device prober of this embodiment is configured so as to be able to perform probing on two subjects at the same time. As shown in FIGS. 1 and 2, the base substrate 10 and the base substrate 1 are provided.
And a plurality of contact elements 20 arranged at zero.

The base substrate 10 is made of ceramic or glass.
It may be made of an insulator such as plastic, a metal having an insulating film formed on the surface thereof, or a plate-like body of a semiconductor material. The base substrate 10 is formed with two rows of openings 11 corresponding to the pad portion of the subject, and contact lands 12 are provided around the openings 11. Furthermore, an electric connector 30 for electrically connecting to an external measuring device is attached to the upper surface of one end of the base substrate 10. A wiring conductor 13 is provided along the central portion of the upper surface of the base substrate 10 for electrically connecting each contact land 12 and each corresponding contact terminal of the electric connector 30. The contact land 12 and the wiring conductor 13 can be formed by a printed wiring manufacturing technique or the like.

The contact element 20 is formed by working in a plane direction from a thin plate material such as a conductive metal or a plastic plate plated with a conductor by a method such as punching by a fine press, chemical etching, or electroforming. The contact element 20 is structured to give a buffering function to the contact portion as described later by utilizing the elasticity and flexibility of the thin plate material. As best shown in FIG. 2, the contact element 20 is inserted into the circular opening 11 of the base substrate 10 to regulate the position of the subject with respect to the pad portion. A connecting portion 21 extending from one end of the intermediate portion 22 and connected to the contact land 12 around the opening portion 11, and a contact portion extending from the other end of the intermediate portion 22 to make contact with the pad portion of the subject. And 23.

The connecting portion 21 of each contact element 20 is connected and fixed to the corresponding contact land 12 by means of solder, silver brazing, conductive paint, welding or the like. in this case,
As best shown in FIG. 2, the intermediate portion 22 of the contact element 20.
The outer surface of the upper part of the opening by using its own elasticity
By pressing against the edge portion 11A of No. 1, it is possible to regulate so that the tip end portion of the contact portion 23 of the contact element 20 follows the position adapted to the pad portion of the subject. At this time, for the purpose of preventing generation of particles caused by friction between the outer surface of the intermediate portion 22 of the contact element 20 and the edge portion 11A of the opening 11 of the base substrate 10, as shown partially in FIG. The slippery material 2 is coated by a technique such as coating the outer surface corresponding to it with a suitable material such as Teflon.
4A should be added. FIG. 3 illustrates such another embodiment of a contact element 20A, which is shown in FIG.
0A has a connecting portion 21A, an intermediate portion 22A provided with a slippery material 24A, and a contact portion 23A.

The tip of the contact portion 23 of the contact element 20 is hardened or hardened in order to improve wear resistance.
Alternatively, it is preferable to perform a treatment such as forming a cured film. Further, by appropriately setting the angle formed between the tip portion of the contact portion 23 and the pad portion of the subject, a so-called self-cleaning action can be exerted.

As mentioned above, each contact element 20 is
It is fixed to the contact land 12 through the opening 11. In this case, the contact elements are three contact elements 20B on one side of the base substrate 10 as shown in FIG.
As shown in FIG. 5, the six contact elements 20C for both sides of the base substrate 10 are integrally formed and connected to each other, and the connecting portions of each contact element are connected to the corresponding contact lands 12.
After being fixed to, by chemical etching, current application, laser irradiation, etc., the connecting portion 25B or 25C is melted and individually electrically separated,
Positioning can be easily performed and productivity can be significantly improved.

When the contact element 20 is bent, the contact portion 23 of the contact element 20 is passed through the opening 11 and the connecting portion 2 is connected.
Although it may be bent at the time of fixing 1 to the contact land 12, the work is difficult to perform. Therefore, it is better to bend it in advance and pass it through the opening 11 while extending it within the elastic limit.

Further, in the contact element 20 in the embodiment shown in FIGS. 1 and 2, as well shown in FIG. 2, the connection portion 21 fixed to the contact land 12 and the opening portion 1 are provided.
The angle formed by the intermediate portion 22 inserted in 1 is set to an obtuse angle, but as in the contact element 20D illustrated in FIG. 6, the angle formed by the connecting portion 21D and the intermediate portion 22D is near a right angle or The same effect can be obtained even if the angle is set to an acute angle. However, since the degree of freedom increases, it is necessary to strictly control the bending angle and the like. Further, as in the contact element 20E illustrated in FIG. 7, unevenness is formed in the intermediate portion 22E between the connection portion 21E and the contact portion 23E to enhance rigidity, or as in the contact element 20F illustrated in FIG. Connection part 21
By forming a bent portion in the intermediate portion 22F between the contact portion F and the contact portion 23F, the contact portion 2 for the pad portion of the subject is formed.
The buffer function of 3F can be improved.

When simultaneously probing a large-area object such as a wafer composed of a large number of specimens,
To some extent, simply expanding the size of the probe configured as described with respect to FIGS. 1 and 2 over a wide range. However, when the influence of strain or unevenness of the prober itself or the subject is significant, it is often difficult to perform accurate probing only by the buffer function of the intermediate portion 22 of the contact element 20.

FIG. 9 is a schematic plan view showing one of the contact blocks of a prober for an integrated circuit device as another embodiment of the present invention which can cope with such a case. FIG. 10 is a schematic cross-sectional view showing a case where the prober for an integrated circuit element having a plurality of contact blocks of FIG. 9 is applied to a large-area subject. As shown in FIGS. 9 and 10, the prober for an integrated circuit device of this embodiment is used for measuring an object 1 in which a plurality of integrated circuits are arranged and their pad portions 2 are arranged on one surface. The relay board 60, the contact block 40A, the conductive and cushioning member 70 disposed between the relay board 60 and the contact block 40A, the relay board 60, and the contact block 4 are used.
OA and a support base 80 for holding the conductive and cushioning members 70 in position relative to each other.

The overall structure of each contact block 40A may be similar to that of the integrated circuit device prober as described above with reference to FIGS. 1 and 2, and the base substrate 40 may be used.
And a plurality of contact elements 50 arranged on the base substrate 40.
It has and. The base substrate 40 includes an opening 41 corresponding to the pad portion 2 of the subject 1, a contact land 42 provided around the opening 41, and a base land 44 for electrically connecting to an external measuring device. , Each contact land 42
And a wiring conductor 43 that electrically connects the respective base lands 44 with each other. The configuration itself of each contact element 50 is
It may be similar to the contact element as described with reference to FIGS. 1 to 8 and will not be repeated here.

On the relay board 60, opposed lands 61 are arranged corresponding to the respective contact elements 50 so as to be electrically drawn to an external measuring instrument. Each opposing land 61 is electrically connected to each corresponding contact terminal of the relay connector 90 which is attached to one end of the relay board 60 and electrically connects to an external measuring device. The arrangement of the opposing lands 61 arranged on the lower surface of the relay board 60 is arranged to be aligned with the arrangement of the base lands 44 arranged on the upper surface of the contact block 40A. The conductive and cushioning members 70 electrically connect the corresponding base lands 44 and the opposing lands 61 to each other, and each contact block 40A makes contact with the pad portion 2 of the subject 1 and the contact portion of each contact element 50. At the relay board 60. Thereby, basically, the conductive and cushioning member 70 has a function of coping with global unevenness of the subject 1.

In this embodiment, the conductive and cushioning member 70 is made of anisotropic conductive rubber as shown in detail in FIG. The anisotropic conductive rubber 70 is made of a conductive material 72, which is made of a polymer sheet 71 made of a metal wire or polymer material having conductivity resistance and metal or carbon mixed therein to make the sheet 71 conductive.
Are arranged side by side in the vertical direction at a minute interval so that conductivity, elasticity, and flexibility are combined only in the vertical direction. The example of FIG. 11 corresponds to the base land 44 and the opposing land 61. It has conductivity only in a necessary portion. Such an anisotropic conductive rubber 70 is added to the relay substrate 60.
Opposing land 6 having the same arrangement as the base land 44 of
By sandwiching between the two, electrical connection between them can be established.

The conductive and cushioning member 70 may be constituted by the following means instead of the anisotropic conductive rubber as described above. For example, a material such as a liquid conductive silicone rubber which becomes flexible and elastic after being hardened is applied to each of the lands forming the base land 44 or the opposing land 61 by coating or printing technique. Alternatively, the conductive and cushioning member 70 can be configured by means such as connecting both lands by soldering using a flexible printed board.

Further, the relay substrate 60 is adhered to the support base 80 in order to correct distortion, bending, thermal expansion, etc., but the support base 80 has a thermal property close to that of the semiconductor substrate 1 which is the subject. A material having a coefficient of expansion is used, and the material has sufficient rigidity for this purpose and has a small strain.

Further, the contact portion of each contact element 50 and the subject 1
Regarding the positional relationship with each pad portion 2 of the base board 40A, guides are provided on 2 to 4 sides of the base board 40 of the contact block 40A, and if necessary, the base board 40 is formed by a structure including a cylinder and a piston including a spring. In any case, it is possible to smoothly move only in the vertical direction, but it is necessary to have a structure that can precisely regulate in the plane direction. In this embodiment, as shown in FIG. 9 and FIG. The regulation is performed by fitting an alignment guide boss 81 provided on the support base 80 penetrating the relay substrate 60 and a semicircular portion 45 provided on the base substrate 40.

The contact block 40A shown in FIG.
This is an example in which one block can support four object units. However, depending on the situation, each contact block can be configured to support more object units, or there is a one-to-one relationship with the object unit. It goes without saying that it can also be configured as.

Further, the base substrate 40 and the relay substrate 60 can be formed of a semiconductor material. In this case,
At the same time as the formation of the wiring conductor 43, the base land 44, the contact land 42, the opposing land 61, etc. relating to the connection between the contact block and the relay board and the connection between the relay board and another external measuring device, the driver circuit, the interface circuit, etc. It is possible to form such a functional circuit, and there is a great advantage that it can cope with the case where the integration density of the test object is increased and the pitch and the size of the pad are further reduced in the future.

In the above description of the embodiments, the intermediate portion 22 of the contact element 20 or 50 penetrating the opening 11 or 41 of the base substrate 10 or the base substrate 40 is basically flat. If you want to make the positional relationship between the contact point of the contact element and the pad section of the subject more precise,
It is necessary to apply some means to the middle part. Some specific means for this purpose will be described below.

FIG. 12 is a perspective view showing an example of a contact element therefor. This contact element 20G has a connecting portion 21G.
The cross-sectional shape of the intermediate portion 22G between the contact portion 23G and the contact portion 23G is not a flat plate shape but a triangular shape. This contact element 2
In 0G, the contact portion 23G is bent in order to exert the self-cleaning action, but as in the contact element 20H illustrated in FIG. 13, the contact portion 23H is linear with respect to the intermediate portion 22H bent from the connecting portion 21H. You can leave it as it is.

FIG. 14 is a partial plan view of the prober in which the contact element 20G of FIG. 12 is arranged so as to be inserted into the opening 11 of the base substrate 10. As shown by the dotted line in FIG. By appropriately selecting the V-shaped angle and the cross-sectional dimension of the cross section of the intermediate portion 22G of the element 20G and the diameter of the opening 11, the position regulation effect can be set more strictly. Further, as shown in FIG. 12 and FIG. 13, what is formed in an inverted triangle can be easily regulated by pressing the apex against the edge of the opening 11 due to the elasticity of the material, and particles are less likely to drop. In these cases, the molding of the intermediate portion is not limited to the triangular shape as long as it is suitable for this purpose, and may be a U-shape or another shape.

FIG. 15 shows a contact element of a further embodiment in a sectional view, a contact element 20I of this embodiment.
Is an intermediate portion 22I between the connection portion 21I and the contact portion 23I.
In addition, an uneven portion similar to that of the contact element of the embodiment of FIG. 7 is formed. FIG. 16 shows a contact element of still another embodiment in a sectional view. The contact element 20J of this embodiment is shown.
Is an attachment member 22J having an appropriate shape added to a portion of the intermediate portion between the connection portion 21J and the contact portion 23J that fits into the opening 11 of the base substrate 10. FIG. 17 shows a contact element of still another embodiment in a sectional view, and the contact element 20K of this embodiment is a dedicated material to be fitted into the opening 11 forming the regulating portion of the base substrate 10. 22K is inserted at a right angle to the connecting portion 21K.
The lower end of the dedicated material 22K constitutes the contact portion 23K. If the dedicated material 22K is made of a conductor such as metal coated with plastic or the like, it is possible to prevent generation of particles.

As for the shape of the tip of the contact portion of these contact elements, for example, the tip portion of the contact element is made thin or thin, or a slit is formed in a fountain pen pen to self-align with the pad portion of the subject. A cleaning action, a subtle followability, and a twin contact effect can be provided, and the contact reliability can be further improved.

[0036]

According to the prober for an integrated circuit device of the present invention, the area for probing can be made equal to or less than the area per unit of object to be inspected. The contact element used for the prober can also be made inexpensive and easy to apply, and highly reliable, which can greatly reduce the number of assembly steps and time. As a result, it is possible to simultaneously measure or age an object such as a wafer on which a large number of analyte units are mounted from a pellet on which a plurality of analyte units are mounted, and it is possible to provide a very highly productive and economical prober.

Therefore, the inspection and aging performed in the latter stage of the semiconductor manufacturing process are performed in the initial process to eliminate defective products, thereby preventing the waste of the subsequent processes and probing the object units on the wafer at the same time. By doing so, it is possible to retroactively determine process defects such as finding the defect distribution state on the wafer and finding defects in the IC pattern mask, etc., and greatly improving the production efficiency of the semiconductor manufacturing line. Can be made.

The prober for an integrated circuit element of the present invention can cope with global distortion and unevenness of the surface of the subject due to the presence of the conductive and cushioning members, and the buffering function of each contact element allows the surface of the subject to be covered. It is possible to deal with local strain and unevenness, and each contact portion can contact all the pad portions of the subject with high accuracy and reliability.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a prober for an integrated circuit device as an embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA ′ of FIG.

FIG. 3 is a partial cross-sectional view illustrating a contact element according to another embodiment.

FIG. 4 is a plan view showing an example of a contact element assembly used for assembling the integrated circuit element prober of the present invention.

FIG. 5 is a plan view showing another example of a contact element assembly used for assembling the integrated circuit element prober of the present invention.

FIG. 6 is a cross-sectional view showing another embodiment of a contact element used in the prober of the present invention.

FIG. 7 is a sectional view showing still another embodiment of the contact element used in the prober of the present invention.

FIG. 8 is a sectional view showing still another embodiment of the contact element used in the prober of the present invention.

FIG. 9 is a schematic plan view showing one of the contact blocks of the integrated circuit element prober as another embodiment of the present invention.

FIG. 10 is a schematic cross-sectional view showing a case where the prober for an integrated circuit element having a plurality of contact blocks of FIG. 9 is applied to a large-area subject.

11 is a detailed view showing an example of a conductive member and a buffer member used in the integrated circuit device prober of FIG.

FIG. 12 is a perspective view showing an example of another contact element used in the prober of the present invention.

FIG. 13 is a perspective view showing an example of still another contact element used in the prober of the present invention.

14 is a partial plan view showing a prober using the contact element of FIG. 12. FIG.

FIG. 15 is a cross-sectional view showing still another example of the contact element used in the prober of the present invention.

FIG. 16 is a sectional view showing still another example of the contact element used in the prober of the present invention.

FIG. 17 is a sectional view showing still another example of the contact element used for the prober of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Subject 2 Pad part 10 Base substrate 11 Opening 12 Contact land 13 Wiring conductor 20 Contact element 21 Connection part 22 Intermediate part 23 Contact part 30 Electric connector 40 Contact block 40A Base substrate 41 Opening 42 Contact land 43 Wiring conductor 44 Base Land 45 Semi-circular portion 50 Contact element 60 Relay board 61 Opposing land 70 Conductive and cushioning member 80 Support base 81 Guide boss 90 Relay connector

Claims (15)

[Claims] 1. A prober for an integrated circuit element, which is used for measurement of a subject in which an integrated circuit is formed and whose pad portions are provided on one surface, is provided with a base substrate and a plurality of substrates provided on the base substrate. The base substrate is provided with an individual contact element, the base substrate has an opening corresponding to the pad portion of the subject, contact lands provided around the opening, and an electrical connection portion to an external measuring device. And a wiring conductor that electrically connects between the contact land and the electrical connection portion, and the contact element is inserted into the opening to regulate the position with respect to the pad portion. The intermediate portion, a connecting portion extending from one end of the intermediate portion to be connected to the contact land around the opening, and a contact portion extending from the other end of the intermediate portion to the pad portion. Has a contact point to perform, the intermediate portion Is a prober for an integrated circuit device, which functions as a buffer against contact between the contact portion and the pad portion. 2. The prober for an integrated circuit device according to claim 1, wherein at least some of the plurality of contact elements are integrally molded and processed, and after being disposed on the base substrate, they are individually separated. 3. The prober for an integrated circuit element according to claim 1, wherein a structure for promoting a position restriction effect by a corresponding opening of the base substrate is provided in an intermediate portion of the contact element. . 4. The prober for an integrated circuit element according to claim 1, 2 or 3, wherein a structure for promoting the buffering function is provided in an intermediate portion of the contact element. 5. The contact portion of the contact element is hardened or hard-coated.
Alternatively, the prober for an integrated circuit device as described in 4 above. 6. The shape of the tip of the contact portion of the contact element is
The prober for an integrated circuit element according to claim 1, wherein the pad portion has a self-cleaning action, a follow-up property, or a twin contact effect. 7. The integrated circuit device prober according to claim 1, wherein the electrical connection portion is an electrical connector attached to an end portion of the base substrate. 8. The integrated circuit device prober according to claim 1, wherein the electrical connection portion is a base land provided on an upper surface of the base substrate. 9. A prober for an integrated circuit device, which comprises a plurality of integrated circuits arranged and pad portions thereof arranged on one surface and is used for measuring an object, includes a relay substrate, a contact block, and the relay. A contact base provided between the substrate and the contact block; and a support base for positioning and holding the relay board, the contact block and the conductive and buffer member with respect to each other. The block includes a base substrate and a plurality of contact elements arranged on the base substrate, and the base substrate is
An opening corresponding to the pad portion of the subject, a contact land provided around the opening, a base land for electrically connecting to an external measuring device, the contact land and the base land A wiring conductor for electrically connecting between the contact element and the contact element, the contact element is inserted into the opening portion to regulate the position with respect to the pad portion, and one end of the intermediate portion. From the other end of the intermediate portion, the contact portion extending from the other end of the intermediate portion to make contact with the pad portion. The portion serves to buffer the contact between the contact portion and the pad portion, and the relay substrate is provided with an opposing land electrically drawn to an external measuring device corresponding to each contact element. Are arranged, and And a cushioning member electrically connects the base land and the opposing land corresponding to each other and enables the contact block to move with respect to the relay board in the contact direction. Prober for circuit elements. 10. The prober for an integrated circuit element according to claim 9, wherein the conductive and buffer members are formed of an anisotropic conductive material having elasticity in the thickness direction and conductivity only in the thickness direction. 11. The prober for an integrated circuit element according to claim 9, wherein the conductive and buffer members are conductive buffer pieces such as conductive rubber individually provided between the corresponding base lands and opposing lands. 12. A positioning engagement portion is formed on the relay board and the contact block, and the support base is engaged with the positioning engagement portion to form the relay board and the contact block. The prober for an integrated circuit element according to claim 9, 10 or 11, further comprising a position determining portion for determining a positional relationship. 13. The prober for an integrated circuit element according to claim 1, wherein the contact block is formed by an integrated circuit manufacturing technique including the base round. 14. The relay substrate is formed by a semiconductor integrated circuit manufacturing technique so as to have a circuit related to connection with an external measuring device and a functional circuit such as a driver circuit and an interface circuit at the same time, including a facing land. An integrated circuit device prober according to any one of claims 9 to 13. 15. The base of the contact block is formed of an insulator such as ceramic, glass, or plastic, or a metal whose surface is provided with an insulating film.
5. The prober for integrated circuit device according to any one of 4 above.