JPH0855730A - Coil for mounting on board - Google Patents

Abstract

PURPOSE:To provide a coil for mounting on a board which can make the design, specification change, etc., of an electronic circuit board easier and can be automatically mounted on the circuit board. CONSTITUTION:The shapes of a coil section La formed by winding a conductive wire and connecting sections Lc between both ends of the coil section La and a pair of lead sections Lb for mounting on substrate are set in advance in a plurality of shapes. A coil having a fixed interval (e.g. 5mm) between the lead sections Lb is manufactured by selectively setting the shape of the coil from among the plurality of shapes in addition to the diameter of the conductive wire and the winding diameter and number of turns of the coil section La. As a result, in an electronic device using the coil, coil mounting holes which are bored into the circuit board of the electronic device can be made constant and the design, specification change, etc., of the circuit board can be easily made. In addition, the coil can be automatically mounted on the circuit board by using an automatic inserting device when the coil is taped at regular intervals.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board mounting coil mounted on an electronic circuit board to form a predetermined electronic circuit together with other electronic components.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 8, for example, a coil 50 of this type has a coil portion 52 in which a conductive wire is spirally wound by a predetermined number of turns at a predetermined winding diameter, and this coil portion. A pair of lead portions 54 (portions indicated by hatching in FIG. 8) formed in parallel to each other so as to be assembled to the electronic circuit board PK or the like by conductive wires extending from both ends of the coil portion 52, and both ends of the coil portion 52 and each lead. It is composed of a connecting portion 56 which connects the respective portions 54 with each other. The lead portion 54 is
The coil portion 5 is parallel to the winding center axis Xo of the coil portion 52 and
4 is formed so as to be perpendicular to the direction opposite to the coil portion with respect to one virtual plane (which is the surface of the electronic circuit board PK in FIG. 8) that is in contact with the outer peripheral surface of the sidewall 4.

In this type of coil 50, a lead portion 54 is subjected to a treatment such as solder plating, and the lead portion 54 after this treatment is passed through a hole formed in the electronic circuit board PK to make an electronic circuit board. The electronic circuit board PK is assembled by a procedure such as soldering to the circuit pattern formed on the back surface of the PK.

In FIG. 8, (a) shows a coil 50.
2B is a left side view of the coil 50, and FIG. 6C is a front view of the coil 50.

[0005]

However, in such a conventional coil 50, the electrical characteristic, that is, the inductance, is defined by the wire diameter of the conductive wire forming the coil 50, the winding diameter when winding the conductive wire, the number of turns, and the like. Connection part 5 for connecting both ends of the coil 50 and each lead part 54
6, the lead portion 54 is provided on the extension line thereof, as shown in FIG.
Is formed by pulling straight from both ends of the coil portion 52 perpendicularly to the virtual plane so that the overall shape of the coil 50 is the same regardless of its type. The intervals of the conductive wire, the winding diameter and the number of turns of the coil portion 52, in other words, the coil 5
It was determined by the inductance of 0, and was different for each type of coil.

Therefore, when the electronic circuit board PK on which the coil 50 is mounted is manufactured, the coil 50 required to form the electronic circuit is determined and the spacing between the lead portions 54 of the coil 50 is set. Accordingly, the holes for mounting the coil and the circuit pattern have to be determined, which causes a problem that the workability at the time of designing the electronic circuit board is poor.

Further, when the coil 50 to be used is changed in accordance with the specification change of the electronic device, the position of the coil mounting hole in the electronic circuit board PK must be changed. Had to change the circuit pattern of the electronic circuit board PK. For this purpose, it is necessary to change the mold used for manufacturing the electronic circuit board PK, and there is a problem that even a simple specification change requires a great deal of labor and cost. It was

In addition, since the conventional coil 50 does not have the same spacing between the lead portions 54 as described above, it should be used in an automatic insertion device for automatically inserting an electronic component having a lead portion into the electronic circuit board PK. Can not be, coil 5
The mounting work on the electronic circuit board PK of 0 has to be done by hand. In other words, for resistors and capacitors that have lead parts, the size of the main body is approximately the same even if the electrical characteristics are different, and the spacing between the lead parts is also approximately constant, so use an automatic insertion device. With the conventional coil 50, the size of the coil portion 52 is different depending on the inductance and the spacing of the lead portions 54 is also different, so that the electronic circuit board PK can be automatically mounted. It was not possible to perform automatic insertion into the electronic circuit board PK using the insertion device. Therefore, conventionally, there has been a problem that the manufacturing efficiency of the electronic device using the coil 50 is poor and the cost is increased.

The present invention has been made in view of the above problems, and provides a board mounting coil in which the intervals between the lead portions are all constant irrespective of the inductance of the coil, thereby providing an electronic circuit to which the coil is mounted. Board design,
It is an object of the present invention to make it possible to easily change the specifications and the like and to automate the mounting of the coil on the electronic circuit board.

[0010]

In order to achieve the above object, the invention according to claim 1 is a coil portion formed by spirally winding a conductive wire covered with an insulating material, and the coil. One imaginary plane that is in contact with the outer peripheral surface of the side wall of the coil portion, which is formed in a cylindrical shape by winding the conductive wire in parallel with the winding center axis of the coil portion, by the conductive wire extending from both ends of the portion, With respect to the anti-coil part, it is formed so as to extend perpendicularly to each other and parallel to each other, and it can be inserted into a hole formed in a predetermined electronic circuit board and soldered to a circuit pattern formed on the back surface of the board. A pair of lead portions from which the insulating material has been removed, and connecting portions for connecting both ends of the coil portion and the lead portions, respectively, the wire diameter of the conductive wire and the winding of the coil portion. The electrical characteristics are specified by the diameter and the number of turns. In the board-mounted coil, further,
By selectively setting the shape of the coil portion and the connecting portion from a plurality of preset shapes, the interval between the pair of lead portions is made constant regardless of the electrical characteristics. There is.

The invention described in claim 2 is the same as claim 1.
In the board mounting coil according to claim 1, as the shape of the coil portion and the connecting portion, both ends of the coil portion are formed on the virtual plane, and the connecting portion is provided with conductive wires at both ends of the coil portion. A first shape formed by straightly drawing out along the imaginary plane in the tangential direction of the coil part, and further bending at a position where the drawing out length becomes a predetermined length in the direction opposite to the coil part, and the coil part. Both ends of the coil are formed on the virtual plane, and the connecting portion is formed by immediately bending the conductive wires at both ends of the coil in the direction opposite to the coil, and A winding position on one axis which is parallel to the winding center axis of the coil portion and opposite to the imaginary plane is set as a reference position, and is a quarter or less of one turn of the coil portion from the reference position. Only length wound further winding the winding position,
Formed as both ends of the coil portion, the connecting portion, the conductive wire at both ends of the coil portion is drawn straight out from the both end positions in the tangential direction of the coil portion, and further in the anti-coil portion direction at a position intersecting with the virtual plane. It is characterized in that three kinds of shapes, that is, a third shape formed by connecting to the extending lead portion, are preset.

On the other hand, the invention according to claim 3 is the coil for mounting a substrate according to claim 1 or 2,
It is characterized in that the coils are continuously arranged at a predetermined interval, and a part of the lead portion of each coil is sequentially connected by a long adhesive tape.

[0013]

As described above, in the board mounting coil according to the first aspect, the shape of the coil portion and the connecting portion connecting the coil portion and the lead portion is set to a plurality of preset shapes. The distance between the pair of lead portions is set to be constant regardless of the electrical characteristics of the coil by selectively setting from among the above.

Therefore, according to the present invention, the intervals between the coil mounting holes formed in the electronic circuit board can be made constant at all times. As in the conventional case, the electronic circuit board can be used depending on the coil used. It is not necessary to determine the holes and circuit patterns for mounting the coil. Therefore, the design work of the electronic circuit board can be easily performed.

Further, since the distance between the coil mounting holes in the electronic circuit board is always constant, it is not necessary to change the electronic circuit board even if the electrical characteristics of the coil to be used are changed due to changes in specifications or the like. The specification of the electronic circuit can be easily changed. Furthermore, even if the electrical characteristics of the coils used are different, the same electronic circuit board can be used as long as the circuit configuration is the same. Therefore, electronic circuit boards of different specifications can be used. Can be shared.

Various shapes are conceivable as the shape of the coil portion and the connecting portion for keeping the interval between the lead portions constant. However, in order to firmly attach the coil to the electronic circuit board, the coil can be mounted. Has a pair of lead parts,
Parallel to the winding center axis of the coil portion, and extending in parallel to each other perpendicular to the direction of the coil portion with respect to one virtual plane that is in contact with the outer peripheral surface of the side wall of the coil portion formed in a cylindrical shape by winding the conductive wire. Need to be formed.

For this purpose, the shape of the coil portion and the connecting portion is set in advance according to the following (1) as described in claim 2.
It is desirable to set three types of shapes (3) to (3) and select from these three types of shapes. (1) Both ends of the coil portion are formed on the virtual plane, respectively, and the connecting portion is drawn out along the virtual plane in the tangential direction of the coil portion, respectively, and the conductive wire is further drawn out. A first shape formed by bending in a direction opposite to the coil portion at a position where the length becomes a predetermined length (see FIG. 4 described later).

(2) A second shape formed by forming both ends of the coil portion on the virtual plane, respectively, and forming the connecting portion by immediately bending the conductive wires at both ends of the coil portion in the direction opposite to the coil portion. (See FIG. 5 below). (3) A winding position on one axis, which is parallel to the winding center axis of the coil portion and opposite to the virtual plane in the coil portion, is set as a reference position, and four minutes of one turn of the coil portion from the reference position are set. The winding positions further wound by a predetermined length of 1 or less are formed as both ends of the coil portion, while the connecting portions are connected to the conductive wires at both ends of the coil portion from the both end positions in the tangential direction of the coil portion. A third shape that is formed by being drawn straight out and further connected to a lead portion that extends in the direction opposite to the coil portion at a position that intersects with the virtual plane (see FIG. 6 described later).

That is, the shapes of the coil portion and the connecting portion are
By setting as (1) to (3), by inserting the pair of lead portions into the holes formed in the electronic circuit board, the coil portion can be brought into close contact with the surface of the electronic circuit board. After the unadjusted coil is mounted on the electronic circuit board, it is possible to prevent the coil portion from vibrating due to an external force and changing its electrical characteristics.

Next, the board mounting coil of the present invention is
Since the spacing between the lead portions is constant regardless of the electrical characteristics, as described in claim 3, the coils are continuously arranged at a predetermined spacing, and a part of the lead portion is adhered in a long length. If they are connected sequentially with tape, they are mounted on an automatic insertion device for automatically inserting the electronic component having the lead portion into the electronic circuit board, and the desired coil is used to move the desired coil to the desired position on the electronic circuit board. Can be attached to. Therefore, according to the present invention, the work of mounting the coil on the electronic circuit board can be automated to improve the manufacturing efficiency of the electronic device.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. First, FIG. 1 is a block diagram showing a schematic configuration of a television signal amplifier (hereinafter, simply referred to as a booster) of an embodiment to which the present invention is applied.

The booster of this embodiment is a VHF band transmitted directly from a television broadcasting station or via a broadcasting satellite.
Received signals from receiving antennas (not shown) that receive UHF band and SHF band television broadcast signals respectively are input via input terminals TVIN, TUIN, and TBIN, respectively, and these amplified signals are amplified and output. It is a well-known signal which is output from the terminal TOUT at the same time, and as shown in FIG. 1, among the received signals from the VHF antenna which receives the television broadcast signal in the VHF band, the received signal VHF-L in the low band (television channels 1 to 3). And amplifier circuits 2 and 4 for respectively amplifying the reception signals VHF-H of the high band (TV channels 4 to 12), and UH for receiving the TV broadcasting signals of the UHF band.
Received signal UHF from the F antenna (TV channel 1
3 to 62) from an amplifier circuit 6 and a BS antenna that receives a television broadcast signal (BS signal) from a broadcast satellite, converts it to an intermediate frequency signal IF in a predetermined frequency band (1.2 GHz band), and outputs the intermediate frequency signal IF. Of the received signal BS-IF (BS channels 1 to 15).

Here, the VH input to the input terminal TVIN
Of the received signals in the F band, the received signal in the low band VHF-
L is a low-pass filter (hereinafter, referred to as LPF) 10 that passes a high-frequency signal in the VHF band or lower including a high band (specifically, a high-frequency signal of 222 MHz or lower) and a low-band reception signal VHF-L. The VHF input to the amplifier circuit 2 through a bandpass filter (hereinafter, referred to as BPF) 12 having a predetermined bandwidth (specifically, 90 to 108 MHz) and input to the input terminal TVIN.
Of the band reception signals, the high band reception signal VHF-H
Is the above-mentioned LPF 10 and high-band received signal VH
A predetermined bandwidth that passes only F-H (specifically 170
To 222 MHz) and is input to the amplifier circuit 4.

Then, each of these received signals VHF-L, V
HF-H is amplified to a predetermined level by the amplifier circuits 2 and 4, respectively, and then received signal VHF- as in the BPF 12.
The BPF 16 that passes only L and the BPF 18 that passes only the reception signal VHF-H are input to the BPF 18 as in the case of the BPF 14, and the LPF 10 is input from each of the BPFs 16 and 18.
LPF2 that passes high frequency signals below VHF band
Input to 0. As a result, the reception signals VHF-L and VHF-H amplified by the amplifier circuits 2 and 4 are combined in the LPF 20, and the LPF 20 outputs the reception signal in the VHF band including the low band and the high band. .

Also, the UHF input to the input terminal TUIN
The reception signal UHF of the band is input to the amplifier circuit 6 via a high-pass filter (hereinafter, referred to as HPF) 22 that passes a high-frequency signal in this frequency band or more (specifically, a high-frequency signal in 470 MHz or more) 22, and this amplification is performed. After being amplified to a predetermined level by the circuit 6, the received signal U is received in the same manner as the HPF 22.
HPF2 that passes high-frequency signals in the frequency band above HF
4 is input to the HPF 24, and the LPF 2
LPF2 that allows a high-frequency signal (specifically, a high-frequency signal of 770 MHz or less) in the frequency band of the reception signal UHF or less to pass along with the reception signal VHF in the VHF band output from 0
6 is input. As a result, the reception signal UHF amplified by the amplifier circuit 6 is combined with the reception signal VHF in the VHF band in the LPF 26, and the reception signal in the VHF band and the UHF band amplified to a predetermined level is output from the LPF 26. become.

Next, B input to the input terminal TBIN
The received signal BS-IF from the S antenna is a high-pass filter (hereinafter, referred to as a high-frequency signal that passes a high-frequency signal in this frequency band or higher (specifically, a high-frequency signal in 1.035 GHz or higher)).
It is called HPF. ) 28 to the amplifier circuit 8,
After being amplified to a predetermined level by this amplifier circuit 8, HP
Similar to F28, the received signal is input to the HPF 30 that passes a high frequency signal in the frequency band higher than BS-IF, and the H
The signal is input from the PF 30 to the output terminal TOUT together with the received signal output from the LPF 26. As a result, all the reception signals amplified to a predetermined level are output from the output terminal TOUT.

As described above, the various filter circuits 1 for inputting / outputting the reception signals of the frequency band to be amplified by the amplification circuits 2-8 are provided in the reception signal input / output paths of the amplification circuits 2-8.
0 to 30 are provided to prevent the received signal from being modulated by being mixed with signals in other frequency bands. A filter circuit including a capacitor and a coil is used.

Then, each of these filter circuits 10 to 30
Among them, in the HPFs 28 and 30 that pass the reception signal BS-IF from the BS antenna, the frequency of the reception signal BS-IF is 1.2 GHz band, and the inductance of the coil may be small. A spiral pattern coil is used as a part of the pattern, and in the other filter circuits 10 to 26, the lead portion is passed through a hole formed in the electronic circuit board, and the lead portion is attached to the back surface of the electronic circuit board. There is used a wire-wound coil that is assembled to an electronic circuit board by soldering to the circuit pattern formed on the.

For example, as shown in FIG. 2A, a BP that allows the reception signal VHF-L amplified by the amplifier circuit 2 to pass therethrough.
F16 is composed of three capacitors C1 to C3 and three coils L1 to L3, and the BPF 18 that passes the reception signal VHF-H amplified by the amplifier circuit 4 is also three capacitors C4 to C6. And an LPF 20 to which the received signals from the respective BPFs 16 and 18 are input, are composed of two capacitors C4 to L6.
7 and C8 and three coils L7 to L9, the winding circuits are used for the coils L1 to L9 that form the filter circuits 16, 18, and 20, respectively. As shown in FIG. 2B, the coils L1 to L9 have lead portions passed through holes previously formed in the electronic circuit board PK, and the lead portions are soldered to a circuit pattern formed on the back surface of the electronic circuit board PK. As a result, it is assembled to the electronic circuit board PK and constitutes a predetermined filter circuit together with the capacitors C1 to C8.

Incidentally, FIG. 2B shows the above-mentioned filter circuits 16, 18, 20 of the electronic circuit board PK to which various electronic components constituting the electronic circuit shown in FIG. 1 are actually assembled when the electronic circuit shown in FIG. 1 is actually constructed. FIG. 6 is an explanatory view showing a state in which a portion is viewed from the back surface on which a circuit pattern is formed. The coils L1 to L9 are arranged on the front surface side of the substrate at positions shown by dotted lines in the drawing, and their lead portions are arranged. It is inserted into the holes at both ends of each dotted line and soldered to the circuit pattern around each hole. Further, in this embodiment, so-called chip parts are used for the capacitors C1 to C8 and are directly soldered onto the circuit pattern on the back surface of the electronic circuit board PK.

By the way, when the conventional coil shown in FIG. 7 is used for assembling such a wire-wound coil to the electronic circuit board PK, the coil may have different electrical characteristics (inductance). Since the spacing between the lead portions (hereinafter, also referred to as the lead pitch) is different, the spacing between the coil mounting holes formed in the electronic circuit board PK must be set according to the lead pitch of the coil used. Moreover, it is not possible to automatically insert the electronic circuit board PK using the automatic insertion device.

Therefore, in the booster of this embodiment, as shown in FIG. 3, three types of preset coil shapes (R type, M type, L type) shown in FIGS. 4 to 6 are set.
The lead pitch ΔL of the coil is all constant regardless of the inductance by selecting from among the above, and by defining the wire diameter of the conductive wire forming the coil, the winding diameter (inner diameter) and the number of windings of the coil portion. Each of the filter circuits 10 to 10 is selected from among the substrate mounting coils which are (5 mm in this embodiment).
By selecting the coil to be used for 26, the interval between the coil mounting holes formed in the electronic circuit board PK is fixed (5
In addition, the coil can be automatically mounted on the electronic circuit board PK by using an automatic insertion device.

The substrate mounting coil used in the booster of this embodiment will be described below. First, the board mounting coil is R type, L type, or M depending on the coil shape.
Classified into types. Among these three types of board mounting coils, the R type coil LR has a pair of lead portions Lb for mounting an electronic circuit board in parallel with the winding center axis Xo of the coil portion La as shown in FIG. And to be formed so as to extend perpendicular to the direction of the anti-coil part and parallel to one virtual plane Yo which is in contact with the outer peripheral surface of the side wall of the coil part formed into a cylindrical shape by winding the conductive wire. Both ends of the coil portion La in which the conductive wire is spirally wound are
Each of the connecting portions Lc, which is formed on a virtual plane Yo serving as the substrate surface and connects both ends of the coil portion La and the lead portion Lb, connects the conductive wires at both ends of the coil portion La to the tangential direction of the coil portion La. Formed by straightly drawing out along the virtual plane Yo in the S1 and S2 directions shown in the drawing, and bending in the anti-coil direction (S3 direction shown in the drawing) at the position where the drawing length becomes a predetermined length. (First shape).

Of the above three types of board mounting coils, the M type coil LM is the R type coil as shown in FIG.
Like the type coil LR, a pair of lead parts Lb
With respect to the virtual plane Yo, it is perpendicular to the anti-coil direction,
Moreover, since the coil portions La are formed so as to extend in parallel to each other, both ends of the coil portion La are formed on the virtual plane Yo, respectively, and further, the connecting portions Lc connecting the both ends of the coil portion La and the lead portion Lb are connected to each other. It is formed by immediately bending the conductive wires at both ends in the anti-coil direction (S3 direction shown in the figure) (second shape).

Of the three types of substrate mounting coils, the L type coil LL has a pair of lead portions Lb, as shown in FIG. 6, similar to the R and M type coils LR and LM. The coil portion La is parallel to the winding center axis of the coil portion La and is opposite to the virtual plane Yo in order to be formed so as to extend perpendicular to the virtual plane Yo and in parallel to each other. The winding position on one axis at the position of is the reference position Zo, and the reference position Zo
The winding positions P1 and P2 further wound by a predetermined length equal to or less than a quarter of the circumference of the coil portion La are formed as both ends of the coil portion La, and both ends of the coil portion La and the lead portion Lb. A connecting portion Lc connecting with each other draws the conductive wires at both ends of the coil portion La straightly from both end positions P1 and P2 of the coil portion La in the tangential direction of the coil portion La (in the SP1 and SP2 directions shown in the drawing), and further on a virtual plane. Lead portion L extending in the direction opposite to the coil portion (S3 direction in the figure) at the position intersecting with Yo
It is formed by connecting with b (3rd shape).

Each of the board mounting coils is provided for each type of coil, in other words, for each required inductance.
Coil shape, diameter of conductive wire used, coil part La
By defining the winding diameter (inner diameter) and the number of windings respectively, the lead pitch ΔL is kept constant (5 mm) regardless of the inductance.

That is, in the board mounting coil of the present embodiment, in order to keep the lead pitch ΔL constant, the coil shape is selected from among the three types described above, and the coil having the higher inductance has a smaller wire diameter. The wire diameter, the winding diameter (inner diameter), and the number of windings are set so that the diameter is thin, the winding diameter is large, and the number of windings is small.

4 to 6, (a) respectively.
Is a plan view of the coils LR to LL, (b) is a left side view of the coils LR to LL, and (c) is a front view of the coils LR to LL. On the other hand, in the substrate mounting coil of this embodiment, the coil shape, wire diameter, winding diameter (inner diameter) and number of windings are set in accordance with the inductance as described above. Among the coils, a urethane wire coated with polyurethane as an insulating material is used for a coil having a wire diameter of 0.5 mm or more (0.5 mm and 0.6 mm in the figure), and a wire diameter of less than 0.5 mm (in the figure, 0.4mm) coil,
As the insulating material, a fusion-bonded wire coated with nylon, bratil, or the like that is fused to each other by heating or a solvent is used.

That is, when the wire diameter of the conductive wire forming the coil is small, the coil is apt to be deformed by an external force received at the time of carrying the coil or assembling the board, and the inductance thereof may not be secured. In the example, a fusion wire is used for a coil having a small wire diameter (less than 0.5 mm), and not only the lead portion Lb is solder-plated after the coil is manufactured,
The coating material of the coil portion La is melted and fused by heating or a solvent so that the windings are joined together.

In this case, if a covering material (nylon) that is fused by heating is used as the fusion wire, the windings can be joined when the lead portion Lb is solder-plated. The treatment process is similar to that of a normal coil using urethane wire, and no special treatment is required.

That is, in the solder plating of the lead portion Lb, the lead portion Lb is applied to the solder bath in which the solder is melted to form the solder layer on the surface while separating the coating material from the conductive wire in the solder bath. Therefore, the coil portion La is also heated during solder plating. Therefore,
In the case of a coil formed of a fusion wire using a coating material that is fused by heating, the coating material of each winding of the coil portion La is fused by solder plating, and the windings of the coil portion La are No special treatment is required for joining, and the joining can be performed easily.

In the substrate mounting coil of this embodiment, the surface of the coil (specifically, the covering material) is colored according to the winding diameter (inner diameter) of the coil portion La. That is, in the case of a coil having a wire diameter of 0.5 mm or more using a urethane wire as a conductive wire, the inner diameter is 1 mm, 2 mm, ..., and the dimension below the decimal point (that is, 1 mm or less) is “0.00 mm”. If so, a urethane wire colored blue (B) is used, and the inner diameter is 1.5 mm, 2.5 m
m, ..., the decimal point is “.50m
m ", a urethane wire colored red (R) is used, and the inner diameter is 1.25 mm, 2.25 mm, ... If a transparent (W) urethane wire not used is used and the inside diameter is 1.75 mm, 2.75 mm, etc., and the dimension after the decimal point is ".75 mm", it is colored green (G). Urethane wire is used.

Further, a wire diameter of 0.
If the coil is less than 5 mm, the inner diameter is 1 mm, 1.5
mm, 2 mm, ..., If the dimension after the decimal point is “0.00 mm” or “.50 mm”, the fusion wire colored in red (R) is used and the inner diameter is 1.2.
5 mm, 1.75 mm, 2.25 mm, etc., the dimension after the decimal point is ".25 mm" or ".75 m"
If it is "m", a transparent (W) fused wire which is not colored is used.

Furthermore, the board mounting coil of this embodiment is manufactured as an automatic insertion coil so that it can be automatically mounted on the electronic circuit board PK using an automatic insertion device. That is, as shown in FIG. 7, the board mounting coil of the present embodiment manufactured as described above is
By sequentially connecting the tip ends of the solder-plated lead portions Lb with an adhesive tape, it is possible to mount them on the automatic insertion device as an electronic component for automatic insertion having a lead portion. As a result, the automatic insertion device cuts the lead portion Lb, removes the desired coil from the adhesive tape TP, and inserts the lead portion Lb into a predetermined hole formed in the electronic circuit board PK. Can be automatically mounted on the electronic circuit board PK.

As described above, in the booster of this embodiment, as the coils forming the filter circuits 10 to 26 for processing the received signals in the VHF band and the UHF band,
In addition to defining the wire diameter, winding diameter, and number of turns as in the past, in addition to wire diameter, winding diameter, and number of turns, three types of coil shapes that have been preset (R type, M type, L type) A coil manufactured so that the lead pitch ΔL is constant (5 mm) regardless of its inductance is used by selectively setting it from the inside.

Therefore, in the booster of the present embodiment, the intervals between the coil mounting holes formed in the electronic circuit board PK can be made constant at all times. It is not necessary to determine the coil mounting holes and the circuit pattern of the electronic circuit board PK. Therefore, the design work of the electronic circuit board PK can be easily performed.

That is, for example, the BPF 1 shown in FIG.
In the filter circuit composed of 6, 18 and LPF 20, a coil of 56.6 nH is used as the coil L1.
2 has a 200 nH coil and coil L3 has 39.2
nH coil, coil L4 has 120 nH coil, coil L5 has 102 nH coil, and coil L6
Has 11.1 nH coil, coils L7 and L8 have 67.7 nH coil, and coil L9 has 40.2 nH coil.
However, since the lead pitch is different for each coil in the related art, it is necessary to set the interval between the coil mounting holes formed in the electronic circuit board PK for each coil. However, according to this embodiment, each coil is
Since the lead pitch ΔL is all constant regardless of the inductance, the intervals of the coil mounting holes formed in the electronic circuit board PK may all be the same, as shown in FIG. 2B. The design work of the circuit board PK can be easily performed.

Further, since the intervals between the coil mounting holes in the electronic circuit board PK are always constant, even when the inductance of the coil to be used is changed by changing the specifications, the electronic circuit board PK is correspondingly changed. Need not be changed, and the specification of the device can be easily changed. Furthermore, even if the inductances of the coils used are different, the same electronic circuit board PK can be used if the circuit configuration is the same.
The electronic circuit board PK can be shared between devices having different specifications.

As described above, the board mounting coil is
By taping the lead portion Lb in order, it is produced as an automatic insertion coil, and can be automatically attached to the electronic circuit board PK using an automatic insertion device. Therefore, like a conventional coil, Electronic circuit board PK
It is not necessary to manually attach the coil to the electronic circuit board PK, and the coil can be efficiently assembled to the electronic circuit board PK. As a result, the process of assembling the electronic component on the electronic circuit board PK can be completely automated, and the production efficiency thereof can be improved.

Next, the shape of the board mounting coil is R
Since the coil shape is selectively set from among three types of coil shapes of type, M type and L type, when various coils are mounted on the electronic circuit board PK, the coil portion La is firmly fixed on the board PK. it can. That is, each of the above-described types of board mounting coils has its lead portion Lb for board mounting.
Is not only drawn out in parallel from both ends of the coil portion La, but also the lead portion Lb is in a direction opposite to the coil portion La with respect to one virtual plane contacting the outer peripheral surface of the side wall of the coil portion La. Since they are formed vertically, the coil portion La can be brought into close contact with the surface of the electronic circuit board PK simply by inserting the pair of lead portions Lb into the holes formed in the electronic circuit board PK. Therefore, after the coil is mounted on the electronic circuit board PK, it is possible to prevent the coil portion from vibrating due to an external force and changing its inductance.

Further, for the board mounting coil in which the conductive wire having the small wire diameter is used, the fused wire is used as the conductive wire, and after the manufacturing, the respective windings of the coil portion La are joined together. There is. Therefore, it is possible to prevent the inductance of the coil from being largely deviated from the initial value due to the deformation of the coil portion when the coil is transported or when the substrate is mounted. Further, since the urethane wire or the fused wire of the color set according to the winding diameter (inner diameter) of the coil portion La is used as the conductive wire forming the board mounting coil, the coil having the same winding diameter is used. Even if it is, the coil can be identified from its color, and workability is improved when, for example, a desired coil is selectively taken out from a large number of coils of different types. it can. In addition, even if another coil is mixed in the box containing the specific coil, it can be easily found, so that it is possible to prevent another coil such as an electronic circuit board from being accidentally attached, It is also possible to prevent the occurrence of product defects that occur when the device is manufactured.

Although one embodiment of the present invention has been described above, the present invention is not limited to this embodiment and can take various forms. For example, in the present embodiment, three types of R-type, M-type, and L-type are set as the coil shape of the board mounting coil. With such coil shapes, the coil is firmly fixed to the electronic circuit board PK. Any shape is possible as long as the lead pitch ΔL can be made constant. Further, in the present embodiment, as the electronic device using the board mounting coil, the booster for amplifying the television signal has been described as an example, but the device including the circuit for processing the high frequency signal such as the receiving device or the oscillating device is used. If so, the present invention can be applied to obtain the same effects as the above.

[Brief description of drawings]

FIG. 1 is a block diagram showing a schematic configuration of a television signal amplifier according to an embodiment.

FIG. 2 is an explanatory diagram showing an example of an LC filter circuit used in a television signal amplifier and a part of an electronic circuit board on which the circuit is assembled.

FIG. 3 is an explanatory diagram showing a part of a substrate mounting coil in which a coil shape and the like are defined in order to keep a lead pitch constant.

FIG. 4 is an explanatory diagram illustrating the shape of an R type coil.

FIG. 5 is an explanatory diagram illustrating a shape of an M type coil.

FIG. 6 is an explanatory diagram illustrating the shape of an L type coil.

FIG. 7 is an explanatory diagram showing a coil for automatic insertion.

FIG. 8 is an explanatory diagram illustrating a shape of a conventional coil.

[Explanation of symbols]

2, 4, 6, 8 ... Amplifying circuit 10, 20, 26 ... LPF (low pass filter) 12, 14, 16, 18 ... BPF (band pass filter) 22, 24, 28, 30 ... HPF (high pass filter) L1 L9 ... Coil LR ... Coil (R type) LM ... Coil (M type) LL ... Coil (L type) La ... Coil part Lb ... Lead part Lc ... Connection part

Claims (3)

[Claims] 1. A coil portion formed by spirally winding a conductive wire covered with an insulating material, and a conductive wire extending from both ends of the coil portion so as to be parallel to a winding center axis of the coil portion. Further, it is formed so as to extend perpendicularly to the direction opposite to the coil portion with respect to one virtual plane which is in contact with the outer peripheral surface of the coil portion side wall formed in a cylindrical shape by winding the conductive wire, and has a predetermined shape. A pair of lead parts from which the insulating material coating is removed so that they can be inserted into holes formed in an electronic circuit board and soldered to a circuit pattern formed on the back surface of the board, and both ends of the coil part. A board mounting coil having electrical characteristics defined by a wire diameter of the conductive wire, a winding diameter of the coil portion, and a number of turns, the connecting portion connecting each of the lead portions to each other. And the shape of the connection part beforehand By selectively setting out of the constant is a plurality of shapes, substrates mounting coils, characterized in that it has a constant spacing of the pair of lead portions Notwithstanding the above electrical characteristics. 2. As the shape of the coil portion and the connecting portion, both ends of the coil portion are respectively formed on the virtual plane, and the connecting portion is provided with conductive wires at both ends of the coil portion, respectively. In the direction of the virtual plane, and further, the first shape is formed by bending in the direction opposite to the coil portion at the position where the drawn length becomes a predetermined length, and both ends of the coil portion are A second shape which is formed on each of the virtual planes, and the connecting portion is formed by immediately bending the conductive wires at both ends of the coil portion in the direction opposite to the coil portion; and, in the coil portion, the second shape. A winding position on one axis which is parallel to the winding center axis and opposite to the virtual plane is set as a reference position, and the winding position is further wound by a predetermined length equal to or less than a quarter of one circumference of the coil portion from the reference position. Turning The winding position is formed as both ends of the coil portion, and the connecting portion is
Thirdly formed by drawing out the conductive wires at both ends of the coil portion in a straight line in the tangential direction of the coil portion from the both end positions and further connecting to the lead portion extending in the direction opposite to the coil portion at a position intersecting with the virtual plane. The substrate mounting coil according to claim 1, wherein three types of shapes are previously set. 3. The board mounting coil according to claim 1 or 2, wherein the coils are continuously arranged at a predetermined interval, and a part of the lead portion of each coil is formed into a long adhesive tape. A coil for mounting a substrate, characterized in that it is sequentially connected.