JPH07240320A - Composite parts - Google Patents

Abstract

PURPOSE:To provide composite parts which do not require much time and labor at the time of assembling the parts and are free from characteristic fluctuation by arranging a plurality of inductors at prescribed positions on a substrate. CONSTITUTION:A conductor 12 is passed through the holes 13 of a plurality of cylindrical magnetic bodies 11 through which the holes 13 are formed in the axial direction and the magnetic bodies 11 are respectively put in the holes 15 of the substrate 14. Then the conductor 12 is connected to one end of each circuit pattern 16 formed between each hole 15 and one end of each circuit pattern 17 formed between the holes 15 on both sides and the edges of the substrate 14, with parts of the patterns 17 being formed to the edges. In addition, chip capacitors 19 connected to circuit patterns 18 on one side are respectively connected of the patterns 16 and 17. Therefore, a plurality of inductors can be simultaneously formed and the inductance values of the inductors can be changed by changing the length of the magnetic bodies 11, since the conductor 12 is passed through the holes 13 of the magnetic bodies 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite part which constitutes a filter circuit, a delay circuit and the like.

[0002]

2. Description of the Related Art Conventionally, a composite part of this type has a plurality of inductors and a plurality of capacitors arranged at predetermined positions on a substrate on which a circuit pattern is formed by a conductor.
Each electrode and the circuit pattern are fixed by soldering or the like. At this time, as the inductor, a chip type coil in which sheets having conductors formed on the surface are laminated, an air core coil in which a conductive wire is spirally wound, and a coil in which a conductive wire is wound around a drum core are used.

In such a composite component, it takes a lot of time to assemble it because a plurality of inductors and a plurality of capacitors are arranged at predetermined positions on the substrate. Further, since a plurality of inductors and capacitors are used, the respective characteristics are not constant, and the characteristics of the composite component itself are also not constant, causing variations.

[0004]

SUMMARY OF THE INVENTION Therefore, the present invention is to provide a composite part which does not require the labor of assembling by arranging a plurality of inductors and a plurality of capacitors at predetermined positions on a substrate and which has no characteristic variation. To aim.

[0005]

The composite part of the present invention is one in which a conductor is penetrated through a plurality of magnetic bodies having holes, or a plurality of magnetic bodies are formed around the conductor. The magnetic substance of (1) is arranged in a hole provided at a predetermined position on the substrate or at a predetermined position on the substrate and the conductor is connected to a circuit pattern to achieve the above object. Further, desired characteristics are obtained by making the axial lengths of the magnetic bodies different from each other.

[0006]

In the composite component of the present invention, a plurality of inductors are formed by passing a conductor through a plurality of holes of a magnetic body having holes and forming a magnetic body around the conductor.

[0007]

Embodiments of the present invention will be described below with reference to FIGS. 1, 2 and 3. 1 is a perspective view showing a composite component according to a first embodiment of the present invention, FIG. 2 is a sectional view of FIG. 1, and FIG. 3 is a circuit diagram for explaining the present invention. In FIGS. 1 and 2, 11 is a magnetic body, 12 is a conductor, 13 is a hole of a magnetic body, 1
Reference numeral 4 is a substrate, and 19 is a chip capacitor. The cylindrical magnetic body 11 has a hole 1 penetrating in the axial direction of the magnetic body.
3 is provided. The magnetic body 11 is formed in a columnar shape and is obtained by sintering a ferrite-based magnetic material having holes in the axial direction and cutting it to a predetermined length, or formed in a columnar shape.
It may be obtained by cutting a ferrite magnetic material having a hole in the axial direction into a predetermined length and sintering. The holes 13 of the plurality of magnetic bodies 11 thus obtained are made of copper.
The conductor 12 of the book is penetrated. The plurality of magnetic bodies 11 penetrating the conductors 12 have a plurality of holes 1 provided at predetermined positions on the substrate 14 and slightly larger than the size of the magnetic body 11.
5 are arranged and positioned respectively. Also, conductor 1
The portion between the magnetic bodies of 2 is connected to the surface of the substrate and to one end of the circuit pattern 16 formed of a conductive material between the holes 15 and 15 by soldering or the like. . Further, both ends of the conductor 12 are connected to one end of the circuit pattern 17 which is formed on the surface of the substrate and between the hole 15 and the edge of the substrate, and which is partially formed to the edge of the substrate, by soldering or the like. It Circuit pattern 16 to which conductor 12 is connected
A chip capacitor 19 is arranged between the other end of the circuit 17 and the circuit pattern 18, and the electrodes of the chip capacitor 19 and the circuit pattern 16, the electrodes of the chip capacitor 19 and the circuit pattern 17, the electrodes of the chip capacitor 19 and the circuit pattern 18, respectively. Connected to. External terminals such as surface connection terminals and pin terminals can be attached to the portion of the circuit pattern 17 formed up to the edge of the substrate and the circuit pattern 18. The circuit patterns 17 and 18 may be extended to the back surface of the substrate, or a through hole may be formed in a portion of the circuit pattern 17 formed up to the edge of the substrate and a part of the circuit pattern 18 to form the through hole. A pattern may be formed that extends to the back side of the substrate.

Such a composite component can form a circuit as shown in FIG. 3, for example. A plurality of inductors 33 formed by a plurality of magnetic bodies 11 penetrating the conductor 12 are connected in series between the input / output ends 17. Each connection point 34 of the inductor 33 and the inductor 3
One end of a capacitor 19 is connected to each of the input side and the output side of the capacitor 3. The other end of the capacitor 19 has a common terminal 18
Connected to and grounded.

FIG. 4 is a front view showing a composite part of a second embodiment of the present invention, and FIG. 5 is a sectional view of FIG. In FIGS. 4 and 5, 41 is a magnetic material, 42 is a conductor, 43 is a hole of a magnetic material, 44 is a substrate, and 49 is a chip capacitor. The conductor 42 is penetrated through each of the holes 43 of the plurality of magnetic bodies 41, and the magnetic bodies 41 are bonded with an adhesive at a predetermined interval.
The conductor 42 penetrating the plurality of magnetic bodies 41 is cut so that a predetermined number of magnetic bodies 41 remain, and the portion between the magnetic bodies 41 is drawn out in the diameter direction of the magnetic body 41.
The magnetic body 41 and the magnetic body 41 are brought close to each other. Multiple magnetic bodies 4
1 is arranged in one hole 45 provided in the substrate 44,
Positioned. The short side of the hole 45 is smaller than the diameter of the magnetic body 41. The portions of the conductor 42 between the magnetic bodies 41 are connected to the circuit pattern 46 formed of a conductive material on the surface of the substrate 44 and in the vicinity of the holes 45, respectively. That is, the portion between the magnetic body 41 and the magnetic body 41 that are drawn out in the diametrical direction of the magnetic body 41 is
The circuit pattern 46 is slanted or parallel to the hole 43 of the magnetic material.
And is connected to the circuit pattern 46. In addition, both ends of the conductor 42 are previously formed,
It is connected to the circuit pattern 47 made of a conductive material so as to extend on the surface of the substrate 44 and near the edge of the substrate with solder or the like. Circuit pattern 46 or 4 to which the conductor 42 is connected
7 and a chip capacitor 49 disposed between the circuit pattern 48 formed of a conductive material and extending on the surface of the substrate 44 and near the edge of the substrate, and the electrodes and pattern of the chip capacitor are made of solder or the like. Connected. It should be noted that a plurality of magnetic bodies may be provided by molding a resin containing a magnetic material or the like around a single conductor using a mold or the like. Further, the conductor 42 may be directly connected to the electrode of the chip capacitor 49. Thus, the magnetic body 41 of the conductor 42
And the magnetic body 41 are pulled out in the diametrical direction of the magnetic body 41 to bring the magnetic bodies 41 close to each other to form the hole 45 of the substrate 44.
By arranging in, the mounting density can be increased and the composite component can be downsized.

FIG. 6 is a front view showing a composite part of a third embodiment of the present invention, and FIG. 7 is a sectional view of FIG. 6 and 7, 61 is a magnetic material, 62 is a conductor, 63 is a substrate, and 64 is
Is a chip capacitor. A plurality of cylindrical magnetic bodies 61 are formed around a single conductor 62 made of copper by molding with a resin containing a magnetic material at predetermined intervals. A conductor 62 around which a plurality of magnetic bodies 61 are formed is cut so that a predetermined number of magnetic bodies 61 remain, and the portion of the conductor 62 between the magnetic bodies 61 is referred to as the magnetic body 61. Magnetic material 61
Are pulled out in the diametrical direction of the magnetic body 61 so as to be close to each other. Then, the magnetic body 61 is arranged at a predetermined position on the substrate 63,
The portion of the conductor 62 between the magnetic body 61 and the magnetic body 61 is
The circuit pattern 65 formed of a conductive material on the surface of the substrate and in the vicinity of the arrangement position of the magnetic body 62 is connected with solder or the like. That is, in this case, the portion of the conductor 62 between the magnetic body 61 and the magnetic body 61 is arranged directly below, and the circuit pattern 6
Connected to 5. Further, both ends of the conductor 62 are formed in advance and connected to a circuit pattern 66 formed of a conductive material on the surface of the substrate and near the edge of the substrate with solder or the like. Between the circuit patterns 65 and 66 to which the conductor 62 is connected and the circuit pattern 67, the chip capacitor 64
The electrodes of the chip capacitors 64 and the circuit patterns 65, the electrodes of the chip capacitors 64 and the circuit patterns 67, and the electrodes of the chip capacitors 64 and the circuit patterns 67 are connected by soldering or the like. The conductor 62 is
It may be directly connected to the electrode of the chip capacitor 64. Further, the magnetic body may be provided with a hole penetrating in the axial direction, the conductor may be penetrated through the hole, and the magnetic body and the conductor may be bonded with an adhesive or the like.

FIG. 8 is a front view showing a composite part according to a fourth embodiment of the present invention. A plurality of columnar magnetic bodies 81
The conductor 82 of the book is formed at a predetermined interval. The conductor 82 around which the plurality of magnetic bodies 81 are formed is cut so that a predetermined number remains, and the magnetic bodies 81 are arranged between the magnetic bodies 81 of the conductors 82 in a zigzag manner. Bend a part. Then, a plurality of magnetic bodies 81 are arranged in holes having substantially the same size as the diameter of the magnetic bodies 81 provided in a zigzag shape on the substrate 83, and a portion of the conductor 82 between the magnetic bodies 81 is arranged. It is directly connected to one electrode of the chip capacitor 84. Further, both ends of the conductor 82 are bent and connected to the circuit pattern 85 formed of a conductive material on the surface of the substrate 83 and near the edge of the substrate 83 by soldering or the like. The other electrodes of the chip capacitors 84 are connected to the common pattern 86, respectively. External terminals such as surface connection terminals and pin terminals can be attached to the patterns 85 and 86. Further, the pattern 85 and the pattern 86 may be extended to the back surface of the substrate, or through holes may be provided in parts of the pattern 85 and the pattern 86, and a pattern may be formed to extend through the through hole to the back side of the substrate. May be. The portion of the conductor 82 between the magnetic body 81 and the magnetic body 81 is bent to form a staggered magnetic body 81.
Can also be arranged on the surface of the substrate 83. Further, it is also possible to form a portion of the conductor between the magnetic substance and form it, connect it to another circuit pattern provided on the surface of the substrate, and connect it to the electrode of the chip capacitor.
Further, the conductor 82 may be bent to arrange the magnetic body 81 on the substrate 83 in a straight line. In this case, the common pattern 86 may be formed in the center of the substrate 83, and the magnetic body 81 may be arranged on the common pattern 86. By bending the conductor 82 and disposing the magnetic body 81 on the substrate 83, it is possible to increase the mounting density and downsize the composite component.

Although the embodiment of the composite component of the present invention has been described above, the present invention is not limited to this. For example, the shape of the magnetic body may be a polygonal column. Further, the lengths of the magnetic bodies are not the same and may be changed. That is, assuming that the length of the magnetic body is 1, the inductance of the inductor is L, and the constant is k, L = kl, so that inductors having different inductance values can be formed at the same time. Further, the magnetic substance may be any nickel-based or manganese-ferrite-based material. Further, the conductor may be a copper-coated material. In that case,
It suffices to exclude the part connecting the magnetic material and the magnetic material and the coating on both ends. Further, the positions of the holes in the magnetic body and the substrate and the arrangement of the patterns can be freely changed, and the size of the holes in the substrate can be freely changed. In the embodiments, the example in which the present invention is applied to the filter circuit is given, but it goes without saying that the present invention can also be applied to a delay circuit and the like.

[0013]

As described above, in the composite component of the present invention, a plurality of magnetic bodies each having a hole penetrating in the axial direction are formed in the conductor, or a plurality of magnetic bodies are formed around the conductor. Therefore, it is not necessary to assemble the plurality of inductors on the substrate, and there is no variation in characteristics of the composite component. Also, since various inductance values can be obtained simply by changing the length of the magnetic body, it is possible to simultaneously obtain a plurality of inductors having different inductance values by penetrating the conductor with magnetic bodies of different lengths. . Furthermore, when the conductor is bent and a plurality of magnetic bodies are arranged on the substrate, the mounting density is increased and the composite component can be downsized.

[Brief description of drawings]

FIG. 1 is a perspective view showing a composite component according to a first embodiment of the present invention.

FIG. 2 is a sectional view of FIG.

FIG. 3 is a circuit diagram for explaining the present invention.

FIG. 4 is a front view showing a composite component according to a second embodiment of the present invention.

5 is a cross-sectional view of FIG.

FIG. 6 is a front view showing a composite component according to a third embodiment of the present invention.

7 is a cross-sectional view of FIG.

FIG. 8 is a front view showing a composite component according to a fourth embodiment of the present invention.

[Explanation of symbols]

 11 Magnetic Material 12 Conductor 13 Magnetic Material Hole 14 Substrate 19 Chip Capacitor

Claims (7)

[Claims] 1. In a composite component in which a plurality of inductors and a plurality of capacitors are arranged at predetermined positions on a substrate on which a circuit pattern is formed, and which are connected to the circuit pattern, the plurality of inductors have a plurality of conductors with holes. 7. A composite component, characterized in that the magnetic body is penetrated through, the plurality of magnetic bodies are arranged on a substrate, and the conductors are connected to a circuit pattern formed on the substrate. 2. In a composite component in which a plurality of inductors and a plurality of capacitors are arranged at predetermined positions on a substrate on which a circuit pattern is formed, and which are connected to the circuit pattern, the plurality of inductors are arranged around a conductor. 7. A composite component, comprising: forming a magnetic body of 1., arranging the plurality of magnetic bodies at predetermined positions on a substrate, and connecting the conductor to a circuit pattern formed on the substrate. 3. In a composite component in which a plurality of inductors and a plurality of capacitors are arranged at predetermined positions on a substrate on which a circuit pattern is formed, and which are connected to the circuit pattern, the plurality of inductors are conductors having holes. 7. A composite component, characterized in that the magnetic body is penetrated, the magnetic body is arranged in a hole provided at a predetermined position of a substrate, and the conductor is connected to the circuit pattern formed on the substrate. 4. In a composite component in which a plurality of inductors and a plurality of capacitors are arranged at predetermined positions on a substrate on which a circuit pattern is formed, and which are connected to the circuit pattern, the plurality of inductors are arranged around a conductor. 7. A composite component, comprising: forming a magnetic body of 1., arranging the magnetic body in a hole provided at a predetermined position of a substrate, and connecting the conductor to the circuit pattern formed on the substrate. 5. A plurality of holes are provided at predetermined positions on the substrate,
A plurality of magnetic bodies are arranged in the holes, respectively.
The described composite part. 6. A hole is provided at a predetermined position of the substrate,
The composite component according to claim 3, wherein a plurality of magnetic bodies are arranged in the holes. 7. The composite part according to claim 1, 2, 3, 4, 5, 6, wherein the lengths of the magnetic bodies in the axial direction are different from each other.