JPH085203Y2 - Weak heat conduction outer wall base - Google Patents
Weak heat conduction outer wall baseInfo
- Publication number
- JPH085203Y2 JPH085203Y2 JP11544790U JP11544790U JPH085203Y2 JP H085203 Y2 JPH085203 Y2 JP H085203Y2 JP 11544790 U JP11544790 U JP 11544790U JP 11544790 U JP11544790 U JP 11544790U JP H085203 Y2 JPH085203 Y2 JP H085203Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- wall
- weak heat
- wall base
- weak
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Load-Bearing And Curtain Walls (AREA)
- Building Environments (AREA)
Description
【考案の詳細な説明】 （Ａ）産業上の利用分野 この考案は、住宅等の外壁内側に取り付ける，弱熱伝
導外壁下地に関したものである。[Detailed Description of the Invention] (A) Industrial Application Field The present invention relates to a weak heat-conducting outer wall base to be mounted inside the outer wall of a house or the like.
（Ｂ）従来の技術 従来の外壁の下地は木材そのものであった。(B) Conventional Technology Conventionally, the base material of the outer wall was wood itself.
（Ｃ）考案が解決しようとする問題点 木材は鉄やコンクリートと対比すれば、極めて熱伝導
率の低い構造体であるが、ガラス繊維断熱材、樹脂系断
熱材と比較すれば数倍熱伝導率が高く、断熱性が劣る。
弱熱伝導外壁下地を使用することによって住宅等からの
熱損失を抑え、省エネルギー効果が期待できる。(C) Problems to be solved by the invention Although wood has a structure with extremely low thermal conductivity in comparison with iron and concrete, it has several times the heat conduction compared with glass fiber heat insulating material and resin heat insulating material. High rate, poor heat insulation.
By using a weak heat conduction outer wall base, it is possible to suppress heat loss from homes, etc., and to expect an energy saving effect.
（Ｄ）問題を解決するための手段 本考案の弱熱伝導外壁下地を柱、間柱に釘又はビスに
よって取り付ける。外壁は弱熱伝導外壁下地を構成する
下地木材に、又は、弱熱伝導外壁下地を貫通して、釘又
はビスによって柱又は間柱に取り付ける。(D) Means for solving the problem The weak heat conducting outer wall base of the present invention is attached to the pillar or stud by nails or screws. The outer wall is attached to the base wood constituting the low heat conductive outer wall base or to the pillar or stud by penetrating the low heat conductive outer wall base with nails or screws.
（Ｅ）作用 1.この考案によって柱、間柱部分からの熱伝導による熱
損失量を小さく抑えることができる。(E) Action 1. With this invention, the amount of heat loss due to heat conduction from the pillars and studs can be kept small.
2.本考案の弱熱伝導外壁下地の厚みを変えることによっ
て、現場発泡断熱層の施工厚さを調整することができ
る。2. By changing the thickness of the low heat conductive outer wall substrate of the present invention, it is possible to adjust the construction thickness of the foam insulation layer on site.
（Ｆ）考案の効果 住宅等の外断熱工法は柱、間柱等構造体の外側に、本
考案の弱熱伝導外壁下地及び現場発泡断熱層を形成する
ことで、内断熱工法に対して構造体が外気の影響を受け
難い。又、構造体が断熱層の内側に位置するため、暖・
冷房時に構造体への蓄熱・蓄冷効果を発揮して、省エネ
ルギーに貢献する。(F) Effect of the invention The external heat insulation method of the house, etc. is a structure against the internal heat insulation method by forming the weak heat conductive outer wall foundation and the in-situ foam insulation layer on the outside of the structure such as columns and studs. Is not easily affected by outside air. In addition, since the structure is located inside the heat insulation layer,
It contributes to energy saving by exerting heat and cold storage effect on the structure during cooling.
（Ｇ）実施例 以下本発明の一実施例におけるに弱熱伝導外壁下地に
ついて、図面とともに説明する。(G) Example A weak heat conducting outer wall substrate in one example of the present invention will be described below with reference to the drawings.
1.図１、図２及び図３において３と４で構成された弱熱
伝導外壁下地を釘又はビスによって柱又は間柱に取り付
け、次に外壁を弱熱伝導外壁下地を構成する下地木材
に、釘又はビスによって取り付ける。1. Attach the weak heat conducting outer wall foundations 3 and 4 in FIGS. 1, 2 and 3 to a pillar or stud with nails or screws, and then attach the outer wall to the foundation wood constituting the weak heat conducting outer wall foundation, Attach with nails or screws.
2.図１、図２及び図３において３と４で構成された弱熱
伝導外壁下地を、接着剤を用いて予め張り合わせた後、
実施例１と同様に取り付ける。2. After pre-bonding the weak heat-conducting outer wall underlayers composed of 3 and 4 in FIGS. 1, 2 and 3 with an adhesive,
Attach as in Example 1.
3.図４及び図５において，樹脂系断熱材を用いて単一材
料で作った一体構造の弱熱伝導外壁下地10を，釘又はビ
スによって柱又は間柱に取り付け、次に外壁を弱熱伝導
外壁下地を貫通して，柱又は間柱に、釘又はビスによっ
て取り付ける。3. In Fig. 4 and Fig. 5, the weak heat conducting outer wall foundation 10 made of a single material using a resin heat insulating material is attached to the pillar or stud with nails or screws, and then the outer wall is weakly conducting heat. Attach to the pillar or stud with nails or screws through the outer wall foundation.
図１は、この考案の請求の範囲１項．の使用斜視図 図２は、この考案の請求の範囲１項．の使用平面図 図３は、この考案の請求の範囲１項．の弱熱伝導外壁下
地斜視図 図４は、この考案の請求の範囲２項．の使用平面図． 図５は、この考案の請求の範囲２項．の弱熱伝導外壁下
地斜視図 図中の数字は各々次の材料を表す。 １柱、２間柱、３樹脂系断熱芯材、４下地木材、５外
壁、６現場発泡断熱層、７釘又はビス、８内壁、９土
台、10請求の範囲2.の弱熱伝導外壁下地FIG. 1 shows the scope of claims 1. Fig. 2 is a perspective view of the use of the invention. FIG. 3 is a plan view of the use of the invention. FIG. 4 is a perspective view of the underlayer of the weak heat conducting outer wall of FIG. Use plan view of. FIG. 5 shows claims 2 and 3 of the present invention. Figure 3 is a perspective view of the underlayer of the weak heat conduction outer wall. The numbers in the figure represent the following materials, respectively. 1 pillar, 2 studs, 3 resin-based heat insulating core material, 4 foundation wood, 5 outer wall, 6 in-situ foam insulation layer, 7 nails or screws, 8 inner wall, 9 base, 10 Claims 2. Weak heat conduction outer wall foundation
Claims (2)
体をなしている構造、又は樹脂系断熱芯材と下地木材を
予め張り合わせて一体にした構造を，弱熱伝導外壁下地
と称する。柱、間柱に対して釘又はビス等によって打ち
込まれる弱熱伝導外壁下地。1. A structure in which a resin-based heat-insulating core material and base wood are overlapped and integrated with each other, or a structure in which a resin-based heat-insulating core material and base wood are pre-bonded to form an integral body is referred to as a weak heat-conducting outer wall base material. . A weak heat conducting outer wall base that is driven into a pillar or stud with nails or screws.
えて、樹脂系断熱材単一の材料で作った1.項の弱熱伝導
外壁下地。2. A weak heat conducting outer wall base material according to claim 1, which is made of a single material of a resin heat insulating material instead of a composite material of a resin heat insulating core material and a base wood.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11544790U JPH085203Y2 (en) | 1990-11-03 | 1990-11-03 | Weak heat conduction outer wall base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11544790U JPH085203Y2 (en) | 1990-11-03 | 1990-11-03 | Weak heat conduction outer wall base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0473115U JPH0473115U (en) | 1992-06-26 |
| JPH085203Y2 true JPH085203Y2 (en) | 1996-02-14 |
Family
ID=31863220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11544790U Expired - Fee Related JPH085203Y2 (en) | 1990-11-03 | 1990-11-03 | Weak heat conduction outer wall base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085203Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3479807B2 (en) * | 1993-02-03 | 2003-12-15 | 株式会社福地建装 | External insulation method for wooden houses |
| JP4668405B2 (en) * | 2000-11-22 | 2011-04-13 | 積水化学工業株式会社 | Thermal insulation structure of building |
-
1990
- 1990-11-03 JP JP11544790U patent/JPH085203Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0473115U (en) | 1992-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |