JPH0850062A - Temperature detector - Google Patents
Temperature detectorInfo
- Publication number
- JPH0850062A JPH0850062A JP21974795A JP21974795A JPH0850062A JP H0850062 A JPH0850062 A JP H0850062A JP 21974795 A JP21974795 A JP 21974795A JP 21974795 A JP21974795 A JP 21974795A JP H0850062 A JPH0850062 A JP H0850062A
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- tube
- substrate
- polyimide
- inverted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子レンジの排気温度
検出等、高温,多湿,腐食性ガス雰囲気中で用いられる
温度検知器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature detector used in a high temperature, high humidity, corrosive gas atmosphere such as exhaust temperature detection of a microwave oven.
【0002】[0002]
【従来の技術】加熱機器において温度検知が重要な要素
であり、温度検知器が多用されつつあるが、電子レンジ
の排気ダクト等に設けられる排気温度検知器は、高温,
多湿,腐食性ガス雰囲気中で使用されるため、その耐食
性,耐電圧性,絶縁物被覆の付着強度等については問題
が多い。従来、このような温度検知器は図4に示すよう
に絶縁性基板11に直立したピン端子10の先端にサー
ミスタ12が溶接され、更に前記ピン端子及びサーミス
タ全体が、テフロンやポリイミド等の耐熱絶縁性樹脂1
3で被覆されている。尚、このような温度検知器は排気
ダクトにあけられた穴の外側から設置され、悪環境に晒
されるのは、絶縁性基板の表面より先端(サーミスタ
側)のみである。2. Description of the Related Art Temperature detection is an important element in heating equipment, and temperature detectors are being widely used. However, exhaust temperature detectors installed in exhaust ducts of microwave ovens are
Since it is used in an atmosphere of high humidity and corrosive gas, there are many problems in its corrosion resistance, withstand voltage, adhesion strength of the insulation coating, etc. Conventionally, such a temperature detector has a thermistor 12 welded to the tip of a pin terminal 10 standing upright on an insulating substrate 11 as shown in FIG. 4, and the pin terminal and the thermistor as a whole are made of heat resistant insulation such as Teflon or polyimide. Resin 1
It is covered with 3. Incidentally, such a temperature detector is installed from the outside of the hole formed in the exhaust duct, and only the tip (thermistor side) from the surface of the insulating substrate is exposed to the bad environment.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、前記従
来の構成によると次のような問題があった。このような
構造の温度検知器は、テフロンやポリイミド等で厚く被
覆してもピンホールを皆無にすることは極めて難しく、
そのピンホールから湿気や腐食性ガスが浸入してしまう
ため、実用状態では数百時間程度でリーク電流が観測さ
れるようになる。又、厚い絶縁物被覆は被膜の多重塗布
によって得られるが、素地との接着が弱いため、はがれ
やすく、応答時間を遅らせ精密な温度検知ができないと
いう欠点があった。また、サーミスタ素子部が基板の近
傍に配置されているため、基板からの熱の影響を受け易
いことや、リード線が基板に直接接続されているため、
基板からの熱がリード線を介してサーミスタ素子部に伝
わってしまうことから、精密な温度検知ができないとい
う欠点もあった。本発明はこのような従来の欠点を解決
するためになされたものであり、その目的とするところ
は、耐食性,耐電圧性でありながら、熱応答性に優れた
温度検知器を提供することにある。However, the above-mentioned conventional structure has the following problems. The temperature sensor with such a structure is extremely difficult to eliminate pinholes even if it is thickly coated with Teflon or polyimide,
Moisture and corrosive gas will infiltrate through the pinholes, so that leakage current will be observed in a few hundred hours in a practical state. Further, a thick insulating coating can be obtained by multiple coating of coatings, but it has a drawback that it is easily peeled off due to weak adhesion to the base material, the response time is delayed and precise temperature detection cannot be performed. Further, since the thermistor element part is arranged in the vicinity of the substrate, it is easily affected by heat from the substrate and the lead wire is directly connected to the substrate,
Since the heat from the substrate is transmitted to the thermistor element section via the lead wire, there is also a drawback that precise temperature detection cannot be performed. The present invention has been made to solve such conventional drawbacks, and an object of the present invention is to provide a temperature detector excellent in thermal response while having corrosion resistance and withstand voltage. is there.
【0004】[0004]
【課題を解決するための手段】前記課題を解決するべく
本発明による温度検知器は、絶縁性基板にあけられた穴
に、温度検知素子が挿入されたポリイミド系又はポリア
ミド系チューブが逆U字状の状態で貫通され、逆U字状
の頂点に位置する温度検知素子の素子部が、少なくとも
この円弧の半径の2倍以上基板から離れているととも
に、前記穴の空隙部が絶縁樹脂により固定封止されてい
ることを特徴とするものである。In order to solve the above-mentioned problems, a temperature detector according to the present invention has a reverse U-shaped polyimide or polyamide tube having a temperature detecting element inserted in a hole formed in an insulating substrate. The temperature sensing element located at the apex of the inverted U-shape is separated from the substrate by at least twice the radius of this arc, and the void of the hole is fixed by insulating resin. It is characterized by being sealed.
【0005】前記ポリイミドとしては、ポリピロメリッ
ト酸イミド等の一般的なポリイミド、その他にポリエス
テルイミド,ポリアミドイミド,ポリエーテルイミド,
フッ素化ポリイミド等の他成分を含有するポリイミドも
有効である。前記ポリアミドとしては、耐熱性を有し非
熱可塑性の芳香族ポリエステルアミド,全芳香族ポリア
ミドが挙げられる。ポリイミド系又はポリアミド系チュ
ーブ以外の、例えばテフロンチューブでは、耐熱絶縁性
には優れているが熱可塑性であり、高温中では剛性が失
われ、温度検知素子のヘッディングリード線の弱い剛性
によってさえ変形を起こしたり、チューブへの食い込み
を起こす等、不安定要因を内包すると同時に基板との接
着が極めて困難である。Examples of the polyimide include general polyimides such as polypyromellitic imide, polyester imide, polyamide imide, polyether imide,
Polyimides containing other components such as fluorinated polyimides are also effective. Examples of the polyamide include heat-resistant non-thermoplastic aromatic polyesteramides and wholly aromatic polyamides. Teflon tubes other than polyimide-based or polyamide-based tubes, such as Teflon tubes, have excellent heat-resistant insulation, but are thermoplastic, and lose rigidity at high temperatures, and are deformed even by the weak rigidity of the heading lead wire of the temperature sensing element. It causes instability factors such as causing or biting into the tube, and at the same time, it is extremely difficult to adhere to the substrate.
【0006】前記温度検知素子が挿入された該チューブ
は、円弧を描くように逆U字状に曲げ、サーミスタの素
子部が少なくともこの円弧の半径の2倍以上基板から離
した状態で装着する。逆U字状にせず左右を直角に曲げ
ると、該チューブが裂け易くなり耐食性,耐電圧性が悪
くなってしまう。又、サーミスタの素子部と基板との距
離が円弧の半径の2倍より近いと、熱せられた基板から
の熱の影響を受け易く、正確な温度検知ができなくなっ
てしまう。The tube in which the temperature detecting element is inserted is bent in an inverted U shape so as to draw an arc, and the thermistor element is mounted in a state in which it is separated from the substrate by at least twice the radius of this arc. If the right and left sides are bent at a right angle without forming the inverted U-shape, the tube is likely to tear and corrosion resistance and voltage resistance deteriorate. Further, if the distance between the element portion of the thermistor and the substrate is shorter than twice the radius of the circular arc, it is easily affected by the heat from the heated substrate, and accurate temperature detection cannot be performed.
【0007】前記絶縁樹脂としては、ポリイミド樹脂の
ような、高温中でも剛性を失わない熱硬化性の樹脂がよ
い。The insulating resin is preferably a thermosetting resin that does not lose its rigidity even at high temperatures, such as polyimide resin.
【0008】[0008]
【作用】上記構成による本発明の温度検知器は、排気ダ
クト中に設置される部分が、ピンホールのないポリイミ
ド系又はポリアミド系チューブで一体に被覆されてお
り、絶縁物被覆のピンホールと付着強度の問題がなくな
り悪環境においても極めて高い耐食性,耐電圧性を得る
ことが可能であるうえ、前記チューブの厚さが薄いので
応答時間も早く精密な温度検知が可能となる。さらに、
温度検知素子の素子部が円弧の半径の2倍以上基板から
離れているので、基板からの熱の影響を受けにくく、該
チューブが絶縁樹脂を介して基板に接続されているの
で、基板からの熱がリード線に伝わりにくく、正確な温
度検知が可能となる。In the temperature detector of the present invention having the above structure, the portion installed in the exhaust duct is integrally covered with a pinhole-free polyimide-based or polyamide-based tube, and adheres to the insulation-covered pinhole. The problem of strength is eliminated and extremely high corrosion resistance and withstand voltage can be obtained even in a bad environment, and since the tube is thin, the response time is fast and precise temperature detection is possible. further,
Since the element portion of the temperature detecting element is separated from the substrate by more than twice the radius of the arc, it is less susceptible to the heat from the substrate, and the tube is connected to the substrate through the insulating resin. It is difficult for heat to be transferred to the lead wires, which enables accurate temperature detection.
【0009】[0009]
【実施例】以下、図面を参照して本発明を更に詳しく説
明する。図1は、本発明による温度検知器の実施例を一
部破断して示した一部破断図である。図2は、図1の温
度検知器を構成するサーミスタを挿入したポリイミドチ
ューブの断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail below with reference to the drawings. FIG. 1 is a partially cutaway view showing an embodiment of a temperature detector according to the present invention, partially cut away. FIG. 2 is a cross-sectional view of a polyimide tube in which a thermistor that constitutes the temperature detector of FIG. 1 is inserted.
【0010】図2に示したように、サーミスタ1が、そ
のサーミスタ素子部6の周辺にシリコーングリース2を
塗布された状態で、内径1.2mm,厚さ0.05mm
のポリイミドチューブ3に挿入され、ポリイミドチュー
ブ3の両端からヘッディングリード線4が出た状態にし
ておく。As shown in FIG. 2, the thermistor 1 has an inner diameter of 1.2 mm and a thickness of 0.05 mm when the thermistor element portion 6 is coated with silicone grease 2.
The polyimide tube 3 is inserted into the polyimide tube 3, and the heading lead wires 4 are left on both ends of the polyimide tube 3.
【0011】ここで、シリコーングリースを用いる理由
は、サーミスタ素子部6の直径が約1mmと小さく、又
ポリイミドチューブの両端は解放されているので使用休
止中,保管中の湿気によりサーミスタ表面を通ってリー
ド線間を流れるリーク電流を阻止するためであり、ごく
一般的に行なわれている手段である。又、使用温度によ
ってはシリコーングリースのみならず、シリコーン樹脂
やシリコーンゴム等も有効である。更に前記のようにシ
リコーングリース塗布処理を施すことにより、サーミス
タ素子部6とポリイミドチューブ3の内壁との熱伝導が
増し、応答時間も早めることができる。The reason for using silicone grease is that the diameter of the thermistor element portion 6 is as small as about 1 mm, and both ends of the polyimide tube are open, so that moisture is passed through the thermistor surface during use and storage. This is to prevent a leak current flowing between the lead wires, and is a commonly used means. Depending on the operating temperature, not only silicone grease but also silicone resin or silicone rubber is effective. Further, by applying the silicone grease coating treatment as described above, the heat conduction between the thermistor element portion 6 and the inner wall of the polyimide tube 3 is increased, and the response time can be shortened.
【0012】又、本実施例で使用したサーミスタは図3
に示すごとく、両面に電極層が形成されたサーミスタチ
ップ5が一対のヘッディングリード線4で熱圧着される
と同時にガラス管が溶融されサーミスタ素子部6が形成
されてなるものであり、該サーミスタ素子部6の直径は
約1mm,リード線の直径は0.2mmである。The thermistor used in this embodiment is shown in FIG.
As shown in FIG. 3, the thermistor chip 5 having electrode layers formed on both sides is thermocompression bonded by a pair of heading lead wires 4 and, at the same time, the glass tube is melted to form a thermistor element part 6. The diameter of the portion 6 is about 1 mm and the diameter of the lead wire is 0.2 mm.
【0013】次に、図2に示すサーミスタを挿入したポ
リイミドチューブを、円弧の半径が12mmになるよう
に逆U字状に湾曲させ、サーミスタの素子部が前記円弧
の半径の2倍以上の26mm基板から離した状態で、図
1に示すように、耐熱絶縁性樹脂であるPPSから成る
基板7にあけられた穴8に貫通させ、この穴の空隙部を
絶縁樹脂9で充填し熱硬化させ固定封止する。ヘッディ
ングリード線4は、基板7に設けられたピン端子10に
溶接等で接続される。Next, the polyimide tube in which the thermistor shown in FIG. 2 is inserted is curved in an inverted U shape so that the radius of the arc is 12 mm, and the element portion of the thermistor is 26 mm which is twice or more the radius of the arc. In a state of being separated from the substrate, as shown in FIG. 1, it penetrates into a hole 8 formed in a substrate 7 made of PPS which is a heat resistant insulating resin, and the void portion of this hole is filled with an insulating resin 9 and thermoset. Fix and seal. The heading lead wire 4 is connected to the pin terminal 10 provided on the substrate 7 by welding or the like.
【0014】上述のように作成された本発明による温度
検知器の耐食,耐電圧等を調べるために、DC5Vの電
圧を印加したまま、JIS−C−7021「個別半導体
デバイスの環境試験方法及び耐久性試験方法」に規定さ
れた塩水噴霧試験を500hr行なった後、PPSから
成る基板7の表面より先端部分を水に浸漬し、水とサー
ミスタのヘッディングリード線4の間をDC5Vで絶縁
抵抗を測定したところ100MΩ以上であった。In order to examine the corrosion resistance and withstand voltage of the temperature detector according to the present invention prepared as described above, JIS-C-7021 "Environmental test method and durability of individual semiconductor device" is applied with a voltage of DC5V applied. After performing a salt spray test prescribed in "Surability test method" for 500 hours, the tip portion from the surface of the substrate 7 made of PPS is immersed in water, and the insulation resistance is measured at DC 5V between the water and the heading lead wire 4 of the thermistor. The result was 100 MΩ or more.
【0015】比較のために、ピン端子及びサーミスタ全
体に耐熱絶縁性樹脂であるポリイミド樹脂を3回塗布す
ることにより、厚さ0.3mmの被覆層を有する図4の
ような従来の温度検知器を用意した。この従来品を用い
て前記と同様の試験を実施するとショート状態であり、
ピンホールによるリークが発生している状態であること
は明らかである。又、25〜200℃の空気中における
応答時間を測定すると、本発明によるものは90%応答
で25秒,同じ条件で従来品のものを測定すると1分4
5秒であった。For comparison, a conventional temperature sensor as shown in FIG. 4 having a coating layer having a thickness of 0.3 mm is obtained by applying a polyimide resin, which is a heat-resistant insulating resin, three times to the entire pin terminal and the thermistor. Prepared. When a test similar to the above is performed using this conventional product, it is in a short state,
It is clear that there is a pinhole leak. Further, when the response time in air at 25 to 200 ° C. is measured, the one according to the present invention has a 90% response for 25 seconds, and the conventional one under the same conditions is 1 min 4
It was 5 seconds.
【0016】このように本発明によれば、絶縁性又は耐
食性,耐電圧性が著しく改善されると同時に応答時間も
極めて早く正確な温度検知をすることができる。尚、本
実施例では温度検知素子としてサーミスタを使用した
が、熱電対や超小型白金測温体を用いても同様である。As described above, according to the present invention, the insulation property, the corrosion resistance, and the withstand voltage properties are remarkably improved, and at the same time, the response time is extremely fast and accurate temperature detection can be performed. Although a thermistor is used as the temperature detecting element in the present embodiment, the same applies when a thermocouple or a micro platinum temperature measuring element is used.
【0017】[0017]
【発明の効果】以上詳述したように本発明によれば、高
温,多湿,腐食性ガス雰囲気となる電子レンジの排気ダ
クト等に挿入される部分は、ポリイミド系又はポリアミ
ド系チューブで被覆されており、絶縁物被覆のピンホー
ルと付着強度の問題がなくなるので極めて優れた絶縁性
又は耐食性,耐電圧性を得ることを可能にすると共に、
該チューブの厚さが薄いので応答時間を著しく早め精密
な温度検知を可能にすることができる。さらに、実際に
検知を行なう温度検知素子の素子部が、円弧の半径の2
倍以上基板から離れているので、基板からの熱の影響を
受けにくく、該チューブが絶縁樹脂を介して基板に接続
されているので、基板からの熱がリード線に伝わりにく
く、正確な温度検知が可能となる。As described above in detail, according to the present invention, the portion inserted into the exhaust duct of a microwave oven in a high temperature, high humidity and corrosive gas atmosphere is covered with a polyimide or polyamide tube. Since the problem of pinholes and adhesion strength of the insulation coating is eliminated, it is possible to obtain extremely excellent insulation, corrosion resistance, and withstand voltage.
Since the tube is thin, the response time can be remarkably shortened to enable precise temperature detection. Furthermore, the element portion of the temperature detecting element that actually performs detection has a radius of 2 arcs.
Since it is more than twice as far away from the board, it is less likely to be affected by heat from the board, and because the tube is connected to the board via an insulating resin, heat from the board is less likely to be transferred to the lead wires and accurate temperature detection is possible. Is possible.
【図1】本発明の一実施例を示す図で、一部破断図であ
る。FIG. 1 is a diagram showing an embodiment of the present invention and is a partially cutaway view.
【図2】本発明の一実施例を示す図で、サーミスタを挿
入した状態のチューブの断面図である。FIG. 2 is a view showing an embodiment of the present invention and is a cross-sectional view of a tube with a thermistor inserted.
【図3】本発明の実施例に使用したサーミスタの一部破
断図である。FIG. 3 is a partial cutaway view of a thermistor used in an example of the present invention.
【図4】従来例を示す図で、温度検知器を示す説明図で
ある。FIG. 4 is a diagram showing a conventional example and an explanatory diagram showing a temperature detector.
1…サーミスタ 2…シリコーングリース 3…ポリイミドチューブ 4…ヘッディングリード線 5…サーミスタチップ 6…サーミスタ素子部 7…基板 8…穴 9…絶縁樹脂 10…ピン端子 1 ... Thermistor 2 ... Silicone grease 3 ... Polyimide tube 4 ... Heading lead wire 5 ... Thermistor chip 6 ... Thermistor element part 7 ... Substrate 8 ... Hole 9 ... Insulating resin 10 ... Pin terminal
Claims (1)
素子が挿入されたポリイミド系又はポリアミド系チュー
ブが、逆U字状の状態で貫通され、逆U字状の頂点に位
置する温度検知素子の素子部が、少なくともこの円弧の
半径の2倍以上基板から離れているとともに、前記穴の
空隙部が絶縁樹脂により固定封止されていることを特徴
とする温度検知器。1. A temperature at which a polyimide-based or polyamide-based tube having a temperature sensing element inserted in a hole formed in an insulating substrate is penetrated in an inverted U-shaped state and located at an apex of the inverted U-shaped. A temperature detector characterized in that the element portion of the detection element is separated from the substrate by at least twice the radius of this arc and the void portion of the hole is fixed and sealed by an insulating resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21974795A JPH0850062A (en) | 1995-08-04 | 1995-08-04 | Temperature detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21974795A JPH0850062A (en) | 1995-08-04 | 1995-08-04 | Temperature detector |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0850062A true JPH0850062A (en) | 1996-02-20 |
Family
ID=16740366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21974795A Pending JPH0850062A (en) | 1995-08-04 | 1995-08-04 | Temperature detector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0850062A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010038616A (en) * | 2008-08-01 | 2010-02-18 | Ube Ind Ltd | Temperature sensor |
WO2010108961A1 (en) * | 2009-03-27 | 2010-09-30 | Epcos Ag | Sensor arrangement and method for production |
CN113607300A (en) * | 2020-04-20 | 2021-11-05 | 谢勇 | Sleeve type temperature sensor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61104234A (en) * | 1984-10-29 | 1986-05-22 | Toshiba Corp | Temperature measuring element |
-
1995
- 1995-08-04 JP JP21974795A patent/JPH0850062A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61104234A (en) * | 1984-10-29 | 1986-05-22 | Toshiba Corp | Temperature measuring element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010038616A (en) * | 2008-08-01 | 2010-02-18 | Ube Ind Ltd | Temperature sensor |
WO2010108961A1 (en) * | 2009-03-27 | 2010-09-30 | Epcos Ag | Sensor arrangement and method for production |
US9086329B2 (en) | 2009-03-27 | 2015-07-21 | Epcos Ag | Sensor arrangement and method for production |
CN113607300A (en) * | 2020-04-20 | 2021-11-05 | 谢勇 | Sleeve type temperature sensor |
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