JPH0844964A - Resonance label and its manufacture - Google Patents
Resonance label and its manufactureInfo
- Publication number
- JPH0844964A JPH0844964A JP20589394A JP20589394A JPH0844964A JP H0844964 A JPH0844964 A JP H0844964A JP 20589394 A JP20589394 A JP 20589394A JP 20589394 A JP20589394 A JP 20589394A JP H0844964 A JPH0844964 A JP H0844964A
- Authority
- JP
- Japan
- Prior art keywords
- spiral
- pair
- dielectric
- resonance
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Control Of Conveyors (AREA)
- Burglar Alarm Systems (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
- Radar Systems Or Details Thereof (AREA)
- Credit Cards Or The Like (AREA)
- Geophysics And Detection Of Objects (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、人や物品の移動、識別
管理に使用される共振ラベル及びその製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resonance label used for movement and identification management of people and articles and a method for manufacturing the resonance label.
【０００２】[0002]
【従来の技術】特定の場所への入出者の管理や、物流工
程における物品の移動や識別管理のために、特定の周波
数の電波を送受信する送受信装置と、この送受信装置に
対して無線方式で応答する共振回路を有する識別カード
とを組合わせた識別システムは従来から種々開発されて
いる。例えば、特開平４−１６９９９５号公報には「共
振タグ及びその製造方法」として、誘電体フィルムの両
面に積層された金属箔（アルミ箔）にエッチング処理を
施し、コイル状の渦巻パターンを形成して共振回路を設
ける方法が開示されている。ところで、共振回路は電源
や能動素子を有しないため、その反射エネルギーは主と
して回路のＱやインダクタンスの開口面積によって左右
される。ここで、回路のＱは誘電体の材質やコイル形状
の他、特にインダクタンス素子の抵抗値によって大きく
影響される。この抵抗値は導体箔の断面積によるが、上
記のような識別カードにおいては寸法の点で制約がある
ため導体幅を増加させて抵抗を減少させることは困難で
あり、導体の厚みを増加させて対応することが望まし
い。2. Description of the Related Art A transmitter / receiver for transmitting and receiving radio waves of a specific frequency and a wireless system for transmitting and receiving radio waves of a specific frequency for the management of persons entering and leaving a specific place, and the movement and identification management of goods in a physical distribution process. Various identification systems have conventionally been developed in combination with an identification card having a responsive resonant circuit. For example, in Japanese Patent Laid-Open No. 4-169995, "Resonance Tag and Method for Manufacturing the Same", a metal foil (aluminum foil) laminated on both surfaces of a dielectric film is subjected to etching treatment to form a coiled spiral pattern. A method of providing a resonance circuit is disclosed. By the way, since the resonant circuit does not have a power source or an active element, its reflected energy is mainly influenced by the Q of the circuit and the opening area of the inductance. Here, the Q of the circuit is greatly influenced by the resistance value of the inductance element in addition to the material of the dielectric material and the coil shape. Although this resistance value depends on the cross-sectional area of the conductor foil, it is difficult to increase the conductor width and decrease the resistance because there are restrictions in terms of dimensions in the above identification card. It is desirable to respond.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、上述の
コイル状導体としてのアルミ箔は、その渦巻パターンを
エッチング処理によって形成しているので、加工に長時
間を要し、厚みのある材料は加工速度点で事実上量産加
工が困難であるという問題があった。また、キャパシタ
ンス素子とインダクタンス素子とを形成して共振回路と
するためには、少なくともどちらか一方の側にはコンデ
ンサ電極板を別途に設け、これをインダクタンス素子
（金属箔）の渦巻パターンと交叉するジャンパー線を介
してインダクタンス素子に接続して電気的導通状態を得
るようにしなければならない。これは共振回路の製作を
複雑なものとし、製造コストを嵩ませる一因となってい
た。本発明は、上記問題点に鑑み、応答感度の高い共振
ラベルを、低コストで、しかも容易に量産加工すること
ができる共振ラベル及びその製造方法を提供することを
目的とするものである。However, since the above-mentioned aluminum foil as the coil-shaped conductor has its spiral pattern formed by etching, it takes a long time to process, and a thick material can be processed at a high speed. In this respect, there is a problem that mass production processing is practically difficult. In order to form a capacitance element and an inductance element to form a resonance circuit, a capacitor electrode plate is separately provided on at least one side, and this is crossed with the spiral pattern of the inductance element (metal foil). It must be connected to the inductance element via a jumper wire so as to obtain an electrical conduction state. This complicates the production of the resonance circuit and is one of the factors that increase the manufacturing cost. In view of the above problems, it is an object of the present invention to provide a resonance label having high response sensitivity that can be easily mass-produced at low cost, and a method for manufacturing the resonance label.
【０００４】[0004]
【課題を解決するための手段】このため本発明では、渦
巻状の導体箔からなるインダクタンス素子と、該インダ
クタンス素子の少なくとも一部に固着された誘電体から
なるキャパシタンス素子とからなり、特定の周波数の電
波に共振するＬＣ共振回路を備えた共振ラベルにおい
て、前記ＬＣ共振回路が、前記誘電体と、該誘電体の両
面に形成された一対の渦巻状導体箔からなる積層構造の
回路ユニットを有し、前記一対の渦巻状導体箔は、前記
誘電体を介して対向したときに同一の渦巻方向を示して
重合する一対の渦巻パターンが形成されており、一方側
の渦巻状導体箔の渦巻バターンの端部と、他方側の渦巻
状導体箔の渦巻パターンの端部が前記誘電体を介して結
合されていることを第１の特徴とし、その製造方法を、
（１）台紙に導体箔を再剥離可能に貼着する工程、
（２）台紙に貼着された導体箔に誘電体を積層する工
程、（３）誘電体を積層した導体箔をハーフダイカット
して一対の渦巻パターンを形成する工程、（４）一対の
渦巻パターンを形成した導体箔の不要部分を除去する工
程、（５）不要部分を除去した一対の導体箔を誘電体を
介して対向重合させる工程。（６）対向重合させた一対
の導体箔を結合する工程から構成したことを第２の特徴
とするものである。Therefore, according to the present invention, an inductance element made of a spiral conductor foil and a capacitance element made of a dielectric material fixed to at least a part of the inductance element are provided, and In the resonance label having an LC resonance circuit that resonates with radio waves, the LC resonance circuit has a laminated circuit unit including the dielectric and a pair of spiral conductor foils formed on both surfaces of the dielectric. However, the pair of spiral conductor foils is formed with a pair of spiral patterns that overlap with each other when facing each other with the dielectric interposed therebetween, and the spiral pattern of the spiral conductor foil on one side is formed. And the end of the spiral pattern of the spiral-shaped conductor foil on the other side are coupled via the dielectric, and the manufacturing method thereof is
(1) A step of removably attaching the conductive foil to the mount,
(2) A step of laminating a dielectric material on a conductor foil attached to a mount, (3) A step of half-die cutting the conductor foil laminated with a dielectric material to form a pair of spiral patterns, (4) A pair of spiral patterns. A step of removing unnecessary portions of the conductor foil formed with (5) a step of opposingly polymerizing a pair of conductor foils from which unnecessary portions have been removed via a dielectric. (6) A second feature is that the process is composed of a pair of oppositely polymerized conductive foils.
【０００５】[0005]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図１は本発明に係る共振ラベルの積層構成の概要
を示す断面図、図２は一対の渦巻パターンにハーフダイ
カットされた導体箔の平面図、図３は本実施例の製造工
程図、図４は本実施例に係る共振ラベルの平面図、図５
は本実施例に係る共振ラベルの電気的等価回路を示す回
路図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an outline of a laminated structure of a resonance label according to the present invention, FIG. 2 is a plan view of a conductor foil half-die cut into a pair of spiral patterns, and FIG. 3 is a manufacturing process diagram of this embodiment, FIG. 5 is a plan view of the resonance label according to the present embodiment, and FIG.
FIG. 4 is a circuit diagram showing an electrical equivalent circuit of the resonance label according to the present embodiment.
【０００６】図１、図２及び図３に示すように、先ず、
インダクタンス素子を形成するための導体箔である厚さ
３０μｍのアルミ箔１を、台紙（工程紙）としての厚さ
５０μｍのポリエステルテープ２に再剥離型接着剤３に
より貼着する（Ａ）。As shown in FIGS. 1, 2 and 3, first,
An aluminum foil 1 having a thickness of 30 μm, which is a conductor foil for forming an inductance element, is attached to a polyester tape 2 having a thickness of 50 μm as a mount (process paper) with a removable adhesive 3 (A).
【０００７】台紙のポリエステルテープ２は後の打ち抜
き加工の際の緩衝体としての機能、また、カス取りの際
に打ち抜かれたアルミ箔１を補強して安定させる機能を
有する。このポリエステルテープ２は５０μｍ以上の厚
みのものが好ましい。The polyester tape 2 on the mount has a function as a buffer in the subsequent punching process, and a function to reinforce and stabilize the punched aluminum foil 1 in removing dust. The polyester tape 2 preferably has a thickness of 50 μm or more.
【０００８】次いで、このポリエステルテープ２に貼着
されたアルミ箔１面上に液状のポリエチレンを塗布して
乾燥させ、誘導体となる厚さ１０μｍのポリエチレン薄
膜４を積層する（Ｂ）。Then, liquid polyethylene is applied to the surface of the aluminum foil 1 adhered to the polyester tape 2 and dried to laminate a polyethylene thin film 4 having a thickness of 10 μm as a derivative (B).
【０００９】次いで、この積層された誘導体であるポリ
エチレン薄膜４側から、ポリエステルテープ２の上面に
到るハーフダイカット（打ち抜き加工）を施してポリエ
チレン薄膜４及びアルミ箔１をカットし、図２に示すよ
うな一対の渦巻パターン５Ａ及び５Ｂを形成し（Ｃ）、
アルミ箔１の不要部分の除去、所謂カス取りを行う
（Ｄ）。その際、一対の渦巻パターン５Ａ及び５Ｂの境
界部分にミシン目Ｔを同時に入れ、折り線とする。ここ
で、一対の渦巻パターン５Ａ及び５Ｂは、ミシン目Ｔを
中心として左右に配置されており、折り合せたときに左
側の渦巻パターン５Ａの端部６Ａが、右側の渦巻パター
ン５Ｂの端部６Ｂと重合するように形成されている。ま
た、渦巻パターン５Ａ及び５Ｂの他端部には、キャパシ
タンス素子を形成するために面積を広くした電極板７Ａ
及び７Ｂが形成されている。Next, from the side of the polyethylene thin film 4 which is the laminated derivative, half die cutting (punching) up to the upper surface of the polyester tape 2 is performed to cut the polyethylene thin film 4 and the aluminum foil 1 and shown in FIG. Forming a pair of spiral patterns 5A and 5B (C),
The unnecessary portion of the aluminum foil 1 is removed, that is, so-called scrap removal is performed (D). At that time, perforations T are simultaneously inserted in the boundary portion between the pair of spiral patterns 5A and 5B to form a folding line. Here, the pair of spiral patterns 5A and 5B are arranged on the left and right around the perforation T, and when folded, the end portion 6A of the spiral pattern 5A on the left side is the end portion 6B of the spiral pattern 5B on the right side. Is formed to polymerize with. Further, at the other end of the spiral patterns 5A and 5B, an electrode plate 7A having a large area for forming a capacitance element is formed.
And 7B are formed.
【００１０】次いで、図４の如くポリエステルテープ２
をミシン目Ｔよりポリエチレン薄膜４側を内側にして折
り曲げて対向重合させ（Ｅ）、気泡や間隙を残さないよ
うにヒートプレスで加熱圧着し、左右一対の渦巻パター
ン５Ａ及び５Ｂをポリエチレン薄膜４を介して結合させ
る（Ｆ）。これにより誘電体としてのポリエチレン薄膜
４の誘電率が一定となり、対向重合された両渦巻パター
ン５Ａ及び５Ｂからなる分布容量により、電気的導通を
要しない回路が形成される。これは図５に示すような電
気的等価回路になる。Next, as shown in FIG. 4, polyester tape 2
Is folded with the polyethylene thin film 4 side inward from the perforation T to be opposed and polymerized (E), and thermocompression-bonded by a heat press without leaving bubbles or gaps, and the left and right spiral patterns 5A and 5B are attached to the polyethylene thin film 4. (F). As a result, the dielectric constant of the polyethylene thin film 4 serving as a dielectric becomes constant, and a distributed capacitance composed of the spiral patterns 5A and 5B oppositely polymerized forms a circuit that does not require electrical conduction. This becomes an electrical equivalent circuit as shown in FIG.
【００１１】以上の工程により、アルミ箔１の渦巻パタ
ーン５Ａ及び５Ｂによって形成されたインダクタンス素
子及び両渦巻パターン５Ａ及び５Ｂの電極板７Ａ及び７
Ｂ間に挟着された誘電体であるポリエチレン薄膜４によ
って形成されるキャパシタンス素子とからなるＬＣ共振
回路ユニットを有する共振ラベル８を得た。Through the above steps, the inductance element formed by the spiral patterns 5A and 5B of the aluminum foil 1 and the electrode plates 7A and 7 of both spiral patterns 5A and 5B.
A resonance label 8 having an LC resonance circuit unit including a capacitance element formed of a polyethylene thin film 4 which is a dielectric material sandwiched between B was obtained.
【００１２】上述のハーフダイカットによる金属箔の加
工はエッチングに比較して加工時間を著しく短縮するこ
とができる。すなわち、エッチングでは加工速度の点で
生産性が低く量産が困難な５０μｍ程度の箔厚のものも
容易に加工することができる。The processing of the metal foil by the above-mentioned half die cutting can significantly shorten the processing time as compared with etching. That is, etching can easily process a foil having a foil thickness of about 50 μm, which has low productivity in terms of processing speed and is difficult to mass produce.
【００１３】本実施例では、誘電体となるポリエチレン
薄膜４を介して対面重合された両渦巻パターンの端部６
Ａ及び６Ｂがコンデンサ電極板として利用でき、且つ渦
巻パターン５Ａ及び５Ｂもポリエチレン薄膜４を介して
分布容量的にキャパシタンス要素を構成するため、従来
のように別途設けられていたキャパシタンス素子の電極
が不要になる。In this embodiment, the end portions 6 of both spiral patterns face-to-face polymerized via the polyethylene thin film 4 serving as a dielectric.
Since A and 6B can be used as a capacitor electrode plate, and the spiral patterns 5A and 5B also constitute capacitance elements in a distributed capacitance manner through the polyethylene thin film 4, there is no need for a separately provided capacitance element electrode. become.
【００１４】また、本実施例における導体箔の分布容量
的結合は、従来技術のようにキャパシタンス素子とイン
ダクタンス素子を接続させるために渦巻パターンに交差
してジャンパーラインを付加したり、回路の電気的結合
を要しないため、これらに係る繁雑な工程を大幅に省略
することができる。Further, in the distributed capacitive coupling of the conductor foil in this embodiment, jumper lines are added to cross the spiral pattern to connect the capacitance element and the inductance element as in the prior art, or the electrical of the circuit is electrically connected. Since no coupling is required, complicated steps associated therewith can be largely omitted.
【００１５】尚、本実施例では、ポリエステルテープ２
を折り曲げ加工することにより左右一対の渦巻パターン
５Ａ及び５Ｂを重合させているが、これに限定されるも
のではなく、渦巻パターン５Ａ及び５Ｂを別々の台紙
（工程紙）に形成して張り合わせるようにしたものでも
よい。また、共振ラベルを構成する材料のうち、導体
箔、台紙、誘導体の厚さは本実施例のものに限定される
ものではなく、所望の共振回路に適した任意のものとす
ればよい。In this embodiment, the polyester tape 2 is used.
The pair of left and right spiral patterns 5A and 5B are polymerized by bending the same, but the present invention is not limited to this, and the spiral patterns 5A and 5B may be formed on separate mounts (process paper) and pasted together. You can use the one Further, among the materials forming the resonance label, the thicknesses of the conductor foil, the mount, and the dielectric are not limited to those of this embodiment, and may be any thickness suitable for a desired resonance circuit.
【００１６】次に本実施例に係る共振ラベルの作用につ
いて説明する。ＬＣ共振回路ユニットの共振周波数はイ
ンダクタンス素子としての渦巻状の導体箔の総渦巻回数
と一対の導体箔の間に挟着されるキャパシタンス素子と
しての誘電体の誘電率及び厚さによって決定される。Next, the operation of the resonance label according to this embodiment will be described. The resonance frequency of the LC resonance circuit unit is determined by the total number of spirals of a spiral conductor foil as an inductance element and the dielectric constant and thickness of a dielectric material as a capacitance element sandwiched between a pair of conductor foils.
【００１７】送受信装置から送信される電磁波の周波数
が共振ラベル８の持つ固有の共振周波数に合致すると、
共振ラベル８は受信した電磁波に共振してエコー波を発
信する。このエコー波は送受信装置で受信され、共振ラ
ベル８の存在が認識される。When the frequency of the electromagnetic wave transmitted from the transmitter / receiver matches the unique resonance frequency of the resonance label 8,
The resonance label 8 resonates with the received electromagnetic wave and emits an echo wave. This echo wave is received by the transmission / reception device, and the existence of the resonance label 8 is recognized.
【００１８】実際の共振ラベルを用いた識別カードにお
いては、共振周波数を異ならせた複数のＬＣ共振回路が
一枚のカード基板（誘電体フィルム）上に互いに干渉し
ないような間隔で配置されており、一枚の識別カードを
多目的に使用できる。例えば、共振周波数がｆ１，
ｆ２，ｆ３の３通りの共振回路ユニットを設けた識別カ
ードでは、共振周波数がｆ１，ｆ２，ｆ３，（ｆ１＋ｆ
２），（ｆ１＋ｆ３），（ｆ２＋ｆ３）および（ｆ１＋
ｆ２＋ｆ３）の７通りの組み合わせに係る送信周波数を
利用できるので、特定のカード携帯者の入場チェック装
置に使用する場合には一枚のカードで７ヵ所、一般式で
は２ｎ−１ヵ所（ｎ＝共振周波数のチャンネル数）のチ
ェックを受けることが可能になる。また、共振周波数が
互いに異なる２つのＬＣ共振回路ユニットを上下に重ね
合せると、両ユニットのそれぞれの共振周波数に加え
て、これらの中間の共振周波数についてもエコー波が得
られることが確認されており、これにより更に多くの送
信周波のチャンネル数を使用することができる。In an identification card using an actual resonance label, a plurality of LC resonance circuits having different resonance frequencies are arranged on one card substrate (dielectric film) at intervals so as not to interfere with each other. , One identification card can be used for multiple purposes. For example, if the resonance frequency is f 1 ,
f 2, the identification card provided with a resonant circuit unit of three different f 3, the resonance frequency f 1, f 2, f 3 , (f 1 + f
2 ), (f 1 + f 3 ), (f 2 + f 3 ) and (f 1 +
Since the transmission frequencies related to the 7 combinations of f 2 + f 3 ) can be used, one card can be used for 7 places, and 2 n -1 places can be used for the general formula when used for the entrance check device of a specific card carrier. (N = number of channels at resonance frequency) can be checked. Moreover, it has been confirmed that when two LC resonance circuit units having different resonance frequencies are superposed on each other, echo waves can be obtained not only at the resonance frequencies of both units but also at an intermediate resonance frequency between them. Therefore, it is possible to use a larger number of transmission frequency channels.
【００１９】尚、本願発明の要旨は、導体箔の一対の渦
巻パターンを、対向重合したときに同一の巻方向を示し
て重合し、且つ一方の渦巻パターンの端部と他方の渦巻
パターンの端部が重合するように打ち抜き加工した点に
あり、基本的には前記実施例に記載した方法によって製
造することができるが、その製造過程は工程の効率化及
び簡略化のため、その他種々の方法に置換できることは
言うまでもない。It is to be noted that the gist of the present invention is that a pair of spiral patterns of a conductor foil are overlapped with each other in the same winding direction when facing each other, and one end of one spiral pattern and the end of the other spiral pattern are overlapped. The parts are punched so as to be polymerized, and can be basically manufactured by the method described in the above example, but the manufacturing process is performed by various other methods in order to streamline and simplify the process. Needless to say, can be replaced with.
【００２０】[0020]
【発明の効果】本発明は以上のように構成したので、応
答感度の高い識別カードを、極めて短時間に、しかも容
易に量産加工することができる。このため製造コストを
大幅に削減でき（エッチング処理方法の約３分の１のコ
スト）、従来方法では高価格となるためできなかった消
耗品として使用が可能になるという優れた効果がある。
また、エッチング処理の際に発生する廃液が出ないの
で、廃液処理上の問題も解消できるという優れた効果が
ある。Since the present invention is configured as described above, an identification card having high response sensitivity can be mass-produced easily in an extremely short time. For this reason, the manufacturing cost can be significantly reduced (about one-third the cost of the etching method), and there is an excellent effect that it can be used as a consumable item that could not be obtained due to the high cost of the conventional method.
Further, since the waste liquid generated during the etching treatment does not come out, there is an excellent effect that the problem in the waste liquid treatment can be solved.
【００２１】[0021]
【図１】本発明に係る識別カードの積層構成の概要を示
す断面図である。FIG. 1 is a cross-sectional view showing an outline of a laminated structure of an identification card according to the present invention.
【図２】一対の渦巻パターンにハーフダイカットされた
導体箔の平面図である。FIG. 2 is a plan view of a conductor foil half-die cut into a pair of spiral patterns.
【図３】本実施例の製造工程図である。FIG. 3 is a manufacturing process diagram of the present embodiment.
【図４】本実施例に係る共振ラベルの平面図である。FIG. 4 is a plan view of a resonance label according to this embodiment.
【図５】本実施例に係る共振ラベルの電気的等価回路を
示す回路図である。FIG. 5 is a circuit diagram showing an electrically equivalent circuit of the resonance label according to the present embodiment.
１ アルミ箔（導体箔） ２ ポリエステルテープ（台紙） ３ 再剥離型接着剤 ４ ポリエチレン薄膜（誘電体） ５Ａ 渦巻パターン（インダクタンス素子） ５Ｂ 渦巻パターン（インダクタンス素子） ６Ａ 渦巻パターンの端部 ６Ｂ 渦巻パターンの端部 ７Ａ 電極板（キャパシタンス素子） ７Ｂ 電極板（キャパシタンス素子） ８ 共振ラベル Ｔ ミシン目（折り線） 1 Aluminum foil (conductor foil) 2 Polyester tape (mounting board) 3 Removable adhesive 4 Polyethylene thin film (dielectric) 5A Swirl pattern (inductance element) 5B Swirl pattern (inductance element) 6A End of swirl pattern 6B Swirl pattern Edge 7A Electrode plate (capacitance element) 7B Electrode plate (capacitance element) 8 Resonance label T Perforation (fold line)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０１Ｖ 15/00 Ｈ０１Ｆ 17/00 Ａ 4230−5Ｅ 41/04 Ａ // Ｂ６５Ｇ 43/08 Ｆ Ｇ０７Ｃ 11/00 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical display location G01V 15/00 H01F 17/00 A 4230-5E 41/04 A // B65G 43/08 F G07C 11 / 00
Claims (2)
子と、該インダクタンス素子の少なくとも一部に固着さ
れた誘電体からなるキャパシタンス素子とからなり、特
定の周波数の電波に共振するＬＣ共振回路を備えた共振
ラベルにおいて、 前記ＬＣ共振回路が、前記誘電体と、該誘電体の両面に
形成された一対の渦巻状導体箔からなる積層構造の回路
ユニットを有し、 前記一対の渦巻状導体箔には、前記誘電体を介して対向
したときに同一の渦巻方向を示して重合する一対の渦巻
パターンが形成されており、 一方側の渦巻状導体箔の渦巻パターンの端部と、他方側
の渦巻状導体箔の渦巻パターンの端部が前記誘電体を介
して結合されていることを特徴とする共振ラベル。1. An LC resonance circuit comprising an inductance element made of a spiral conductor foil and a capacitance element made of a dielectric material fixed to at least a part of the inductance element, the LC resonance circuit resonating with a radio wave of a specific frequency. In the resonance label described above, the LC resonance circuit has a circuit unit having a laminated structure composed of the dielectric and a pair of spiral conductor foils formed on both surfaces of the dielectric, and the pair of spiral conductor foils includes: Form a pair of spiral patterns that overlap with each other when facing each other through the dielectric, and the spiral pattern of the spiral conductor foil on one side and the spiral pattern on the other side are formed. A resonance label, wherein the ends of the spiral pattern of the strip-shaped conductor foil are coupled via the dielectric.
ベルの製造方法、（１）台紙に導体箔を再剥離可能に貼
着する工程、（２）台紙に貼着された導体箔に誘電体を
積層する工程、（３）誘電体を積層した導体箔をハーフ
ダイカットして一対の渦巻パターンを形成する工程、
（４）一対の渦巻パターンを形成した導体箔の不要部分
を除去する工程、（５）不要部分を除去した一対の導体
箔を誘電体を介して対向重合させる工程、（６）対向重
合させた一対の導体箔を結合する工程。2. A method of manufacturing a resonance label, which comprises the following steps: (1) a step of removably attaching a conductive foil to a mount, (2) a conductive foil attached to the mount A step of stacking dielectrics, (3) a step of half-die cutting a conductor foil having dielectrics stacked thereon to form a pair of spiral patterns,
(4) A step of removing unnecessary portions of the conductor foil having a pair of spiral patterns formed thereon, (5) A step of counter-polymerizing the pair of conductor foils from which unnecessary portions are removed through a dielectric, (6) Counter-polymerization The process of joining a pair of conductor foils.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20589394A JP2969426B2 (en) | 1994-07-26 | 1994-07-26 | Resonant label and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20589394A JP2969426B2 (en) | 1994-07-26 | 1994-07-26 | Resonant label and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0844964A true JPH0844964A (en) | 1996-02-16 |
| JP2969426B2 JP2969426B2 (en) | 1999-11-02 |
Family
ID=16514490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20589394A Expired - Fee Related JP2969426B2 (en) | 1994-07-26 | 1994-07-26 | Resonant label and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2969426B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11175677A (en) * | 1997-10-29 | 1999-07-02 | Esselte Meto Internatl Gmbh | Identification element and method for manufacturing the same |
| ES2158775A1 (en) * | 1999-04-13 | 2001-09-01 | Checkpoint Systems Espana S A | Manufacturing procedure for a body formed from two sheets of cardboard folded and superimposed. |
| US6407669B1 (en) | 2001-02-02 | 2002-06-18 | 3M Innovative Properties Company | RFID tag device and method of manufacturing |
| US6693541B2 (en) | 2001-07-19 | 2004-02-17 | 3M Innovative Properties Co | RFID tag with bridge circuit assembly and methods of use |
| KR100603014B1 (en) * | 2004-07-21 | 2006-07-24 | 황호연 | Method for producing package film for label, the package film for label thereby, and the using method thereof |
| CN100433077C (en) * | 2003-07-29 | 2008-11-12 | 琳得科株式会社 | Label mfg device and mfg method |
| WO2012040885A1 (en) * | 2010-09-28 | 2012-04-05 | Huang Jiajia | Processing method and processing device of die cutting type tag |
| CN103235966A (en) * | 2013-04-16 | 2013-08-07 | 凤宝珍 | Production process and machining equipment for environment-friendly tags |
| JP2019120972A (en) * | 2017-12-28 | 2019-07-22 | 大阪シーリング印刷株式会社 | Method for manufacturing antenna for rfid, and method for manufacturing rfid inlet |
| CN111950682A (en) * | 2020-07-29 | 2020-11-17 | 上海优比科电子科技有限公司 | Coil type die-cut label and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58501843A (en) * | 1981-10-30 | 1983-10-27 | リ−ブ マツクス エ− | Identification device in the form of a bill-like strip that can be fixed to an article |
| JPS63133289A (en) * | 1986-09-29 | 1988-06-06 | センサマティック エレクトロニクス コーポレイション | Tag and manufacture thereof |
-
1994
- 1994-07-26 JP JP20589394A patent/JP2969426B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58501843A (en) * | 1981-10-30 | 1983-10-27 | リ−ブ マツクス エ− | Identification device in the form of a bill-like strip that can be fixed to an article |
| JPS63133289A (en) * | 1986-09-29 | 1988-06-06 | センサマティック エレクトロニクス コーポレイション | Tag and manufacture thereof |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11175677A (en) * | 1997-10-29 | 1999-07-02 | Esselte Meto Internatl Gmbh | Identification element and method for manufacturing the same |
| ES2158775A1 (en) * | 1999-04-13 | 2001-09-01 | Checkpoint Systems Espana S A | Manufacturing procedure for a body formed from two sheets of cardboard folded and superimposed. |
| US6407669B1 (en) | 2001-02-02 | 2002-06-18 | 3M Innovative Properties Company | RFID tag device and method of manufacturing |
| US6693541B2 (en) | 2001-07-19 | 2004-02-17 | 3M Innovative Properties Co | RFID tag with bridge circuit assembly and methods of use |
| CN100433077C (en) * | 2003-07-29 | 2008-11-12 | 琳得科株式会社 | Label mfg device and mfg method |
| KR100603014B1 (en) * | 2004-07-21 | 2006-07-24 | 황호연 | Method for producing package film for label, the package film for label thereby, and the using method thereof |
| WO2012040885A1 (en) * | 2010-09-28 | 2012-04-05 | Huang Jiajia | Processing method and processing device of die cutting type tag |
| CN103235966A (en) * | 2013-04-16 | 2013-08-07 | 凤宝珍 | Production process and machining equipment for environment-friendly tags |
| JP2019120972A (en) * | 2017-12-28 | 2019-07-22 | 大阪シーリング印刷株式会社 | Method for manufacturing antenna for rfid, and method for manufacturing rfid inlet |
| CN111950682A (en) * | 2020-07-29 | 2020-11-17 | 上海优比科电子科技有限公司 | Coil type die-cut label and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2969426B2 (en) | 1999-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0203083B1 (en) | Folded rf marker for electronic article surveillance systems | |
| JP6414614B2 (en) | Article | |
| JP4884477B2 (en) | Capacitor strap | |
| JP3979178B2 (en) | Non-contact IC medium module and non-contact IC medium | |
| JP4688396B2 (en) | Non-contact data carrier device | |
| EP0704816B1 (en) | RF transponder with resonant crossover antenna coil | |
| JP2001076115A (en) | Ic card | |
| JP2001084463A (en) | Resonance circuit | |
| JPH0844964A (en) | Resonance label and its manufacture | |
| JP2002245432A (en) | Method of manufacturing resonant circuit device | |
| JP4184716B2 (en) | Bag with built-in auxiliary antenna member for non-contact type data carrier device and auxiliary antenna member for non-contact type data carrier device | |
| WO1998026939A1 (en) | Semiconductor device and method for manufacturing the same | |
| JP2002109492A (en) | Contactless data carrying device and wiring member for booster antenna section | |
| JPH1013313A (en) | Radio wave identifying sheet | |
| JP2002157560A (en) | Resonance tag | |
| JP4641095B2 (en) | Non-contact data carrier device and wiring member for booster antenna | |
| JP3512140B2 (en) | Manufacturing method of identification label | |
| JPH0745441A (en) | Resonance circuit unit and its manufacture | |
| JP4139488B2 (en) | Non-contact IC card | |
| JP2002245429A (en) | Resonance tag and manufacture of the same | |
| EP0698870A1 (en) | Resonant sensor | |
| JP2003157420A (en) | Ic tag | |
| JPH09198580A (en) | Identification label | |
| NL9001180A (en) | Identity card with in-built integrated circuits - provides data signal link via contactless embedded induction coil | |
| JPS62266700A (en) | Self-break-down type resonance circuit tag and breaking method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070827 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080827 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090827 Year of fee payment: 10 |
|
| LAPS | Cancellation because of no payment of annual fees |