JPH0837205A - Tab package - Google Patents

Abstract

PURPOSE:To provide a TAB package capable of transmitting a signal at a high speed and also reducing electric noise. CONSTITUTION:As shown in Fig. 1(a), a wiring 101 having an area to which a plurality of integrated circuit chips 103, 104 are mounted and a wiring 105 connecting therewith are repeatedly formed on a tape film 102. The integrated circuit chips 103, 104 are continuously connected, and thereafter the tape film is cut off by a cutoff part 106, and as shown in Fig. 1(b), the wiring 101 is connected with a package 107. At this time, it is unnecessary to transmit the signal between the chips 103 and 104 via pins of a package or the wiring of a substrate, and it is possible to connect via the wiring 105 on the film, and it is possible to transmit the signal with a short delay period and reduce electric noise.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB (Tape Automated Bond) for connecting an integrated circuit chip to a package by a tape film having wiring formed thereon.
ing) packages.

[0002]

2. Description of the Related Art In an electronic circuit device such as an electronic computer composed of a plurality of integrated circuits, in order to increase the operating speed, individual integrated circuits are mounted at a high density, and wiring between them is minimized. It is required to be short. At the same time, in order to reduce electrical noise caused by high-speed operation, it is required to connect components such as capacitors as close as possible. For this purpose, various packaging technologies have been devised, and one of them is the TAB packaging technology in which an integrated circuit chip is connected to a package by a tape film on which wiring is formed.

As a conventional technique of the TAB package, for example, there is a technique described in Japanese Patent Laid-Open No. 4-322438. FIG. 6 is an example of this conventional TAB package. In the conventional technique, as shown in FIG. 6A, the wiring 601 is repeatedly formed in advance on the tape film 602, and the integrated circuit chips 603 are continuously connected. After that, the tape film is cut at the cutting section 604, and
The wiring 601 and the package 605 are connected as shown in FIG. The distance D4 between the chips when they are connected to the tape is determined by the area occupied by the wiring 601 and the cut portion 604. In this conventional example, the tape film is cut by the cutting unit 604 for each integrated circuit chip and connected to the package. Therefore, when they are mounted on a substrate and used, even if the packages are arranged so as to contact each other, the distance between the center of the chip and the center of the adjacent chip cannot be reduced to the size of the package or less, and The wiring route becomes long. For example, when a plurality of integrated circuit chips 701 and 702 are mounted on a substrate 703 and connected as shown in FIG. 7A, the distance is D5 even if they are arranged closest to each other, which is generally larger than D4. turn into. As a result, the signal wiring connecting the chips 701 and 702 is the wiring 704 on the film (the wiring is actually on the film surface, but the wiring is drawn in the drawing for easy understanding in the drawing), the package Pins 705, board wiring 70
6, package pins 707, film wiring 708
Must be routed through, resulting in a large delay time.

Further, in this conventional example, even when a noise reducing capacitor is mounted, the mounting distance is separated by the package. For example, as shown in FIG. 7B, an integrated circuit chip 711 is mounted on a substrate 712 and a capacitor 7
In the case of connecting with 13, the distance is D6 even if they are arranged closest to each other. As a result, the wiring connecting them has to pass through the wiring 714 on the film, the pin 715 of the package, the wiring 716 of the substrate, and the through hole 717 of the substrate, and the noise reduction effect becomes small.

[0005]

In the prior art, when the integrated circuit chip is mounted on the package, its size becomes large and the wiring route becomes long, so that not only the signal transmission becomes slow, but also noise is reduced. Also had a problem that it had an adverse effect. An object of the present invention is to solve the problems of the prior art and to provide a TAB package capable of high-speed signal transmission and less electrical noise.

[0006]

In order to achieve the above-mentioned object, the present invention forms conductive wirings on an insulating tape film and connects the wirings to an integrated circuit chip and a package in which the wirings are mounted, respectively. In the TAB package for electrically connecting the plurality of conductive wires to each other, the plurality of conductive wirings are formed on the same insulating tape film, and the connection wirings connecting the integrated circuit chips connected to the conductive wirings are connected to the insulating same tape film It is formed on the upper surface, the conductive wirings and the connection wirings are connected to the integrated circuit chips, and the conductive wirings are connected to the package. In the TAB package, conductive wiring having an integrated circuit chip mounting area and a component mounting area is formed on the same insulating tape film, and the integrated circuit chip is connected to the integrated circuit chip mounting area of the conductive wiring.
A single passive element or an active element is connected to the component mounting area of the conductive wiring, and each conductive wiring is connected to the package. Further, in the TAB package having a connection wiring for connecting the respective integrated circuit chips, the conductive wiring is a conductive wiring having an integrated circuit chip mounting area and a component mounting area, and is integrated in the integrated circuit chip mounting area of the conductive wiring. A circuit chip is connected, and a single passive element or active element is connected to the component mounting area of the conductive wiring. Further, in the TAB package, conductive wiring having an integrated circuit chip mounting area and a wiring component connection area is formed on the same insulating tape film, and the integrated circuit chip is connected to the integrated circuit chip mounting area of the conductive wiring. A wiring component is connected to the wiring component connection area, and each of the conductive wires is connected to the package, and the wiring component has a predetermined connection area corresponding to the wiring component connection area on the insulating tape film. It is designed to be a component in which wiring for connecting the connection areas is formed. Further, in the TAB package having a connection wiring for connecting the respective integrated circuit chips, the conductive wiring is a conductive wiring having an integrated circuit chip mounting area and a wiring component connection area, and the conductive wiring is provided in the integrated circuit chip mounting area. An integrated circuit chip is connected, a wiring component is connected to a wiring component connection area of the conductive wiring, and each of the conductive wirings is connected to the package, and the wiring component is on the insulating tape film. And a wiring for connecting the predetermined connection areas to each other are formed.
Further, a TAB package having an integrated circuit chip mounting area and a component mounting area in the conductive wiring, or a connection wiring having an integrated circuit chip mounting area and a component mounting area in the conductive wiring and connecting the integrated circuit chips In a TAB package having, a wiring component connection area is provided in the conductive wiring, and a wiring component is connected to the wiring component connection area of the conductive wiring, the wiring component corresponding to the wiring component connection area on an insulating tape film. And a wiring for connecting between the predetermined connection areas. Further, the wiring for connecting the predetermined connection areas on the wiring component is made to be a wiring for connecting the connection areas via a single passive element or active element or an integrated circuit chip.

[0007]

According to the present invention, integrated circuit chips which are known to be connected in advance are connected to a tape film adjacent to each other, and the tape film is mounted on one package without cutting so that the integrated circuit chips It is possible to prevent an increase in the delay time due to the long wiring. In addition, parts such as capacitors that are known to be connected in advance are mounted on a tape film on which an integrated circuit chip is mounted, connected, and then mounted on a single package without cutting the tape film. This prevents the wiring between the components and the mounted parts from becoming long and adversely affecting the electrical characteristics. In addition, by using wiring components having wiring formed on a tape film for wiring components that connect the mounted integrated circuits and components, it is possible to connect with short wiring without passing through the outside of the package. It becomes possible to shorten the delay time and improve the electrical characteristics. Furthermore, by mounting a passive element, an active element, and an integrated circuit chip on the wiring components that connect the integrated circuits and the components that are mounted as described above, a tape film can be formed without passing even more complicated circuits outside the package. It becomes possible to form the above, and it becomes possible to shorten the delay time and improve the electric characteristics.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a TAB which is a first embodiment of the present invention.
The structure of the package is shown, and it has a multi-chip structure having a plurality of chips (two chips in the figure). FIG.
As in (a), in this embodiment, the wiring 101 having a plurality of integrated circuit mounting areas is repeatedly formed on the tape film 102, and the integrated circuit chips 103 and 104 are formed.
Are connected continuously. And chips 103, 10
When it is necessary to connect the wiring 4, the wiring 105 is formed on the tape film and connected. After that, the tape film is cut at the cutting portion 106, and the wiring 101 and the package 107 are connected as shown in FIG. For this reason,
The distance D1 between the chips is determined only by the area occupied by the wirings 101 and 105, and is determined by the cutting portion 106 and the package 1.
There is no increase by 07. 108 is a pin. In this embodiment, as shown in FIG. 2, integrated circuit chips 201 and 202 are provided.
7 is mounted on the substrate 203 and is connected, the chip interval is D2 (which is almost the same as D1).
It can be made much smaller than the chip spacing D5 of the conventional example of (a). In addition, the signal between the chips 201 and 202 can be connected by the wiring 204 on the film, and it is not necessary to pass through the pin 205 of the package or the wiring 206 of the substrate. It enables signal transmission in time. Even when the number of integrated circuit chips on the TAB package is three or more, if it is necessary to connect each chip, the wiring 105 may be formed on the tape film as in the case of two chips. .

FIG. 3 shows a TA which is a second embodiment of the present invention.
The structure of a B package is shown. As shown in FIG. 3A, in this embodiment, the wiring 301 having the integrated circuit mounting area and the capacitor mounting area is repeatedly formed on the tape film 302, and the integrated circuit chip 303 and the capacitor 3 are formed.
04 are connected continuously. After that, the tape film is cut at the cutting portion 305, and the wiring 30 is cut as shown in FIG.
1 and the package 306 are connected. Therefore, the position of the capacitor 304 can be arbitrarily determined within the range of the wiring 301, and the wiring distance between the integrated circuit chip 303 and the capacitor 304 is not increased by the cutting portion 305 or the package 306.

In this embodiment, even when the integrated circuit chip 401 is mounted on the substrate 402 and connected to the capacitor 403 as shown in FIG. 4, it is possible to connect only by the wiring 404 on the film, and the pin of the package is connected. It is not necessary to go through the wiring 405 and the wiring 406 of the substrate. Therefore, in the configuration of the conventional example of FIG. 7B, the distance to the capacitor is D6, whereas in this embodiment, the position D3 much closer to the chip is provided.
It is possible to mount a capacitor on, and it is possible to effectively reduce electrical noise.

In this embodiment, the TAB package mounted with one integrated circuit chip is shown, but it goes without saying that a TAB package mounted with a plurality of integrated circuit chips may be used. In addition, although a capacitor is mounted as a component in this embodiment, it goes without saying that another passive element or active element may be mounted.

FIG. 5 shows a TA which is a third embodiment of the present invention.
The structure of a B package is shown. As shown in FIG. 5A, in this embodiment, the wiring 502 having the integrated circuit mounting area and the connection area 501 for connecting the wiring components is repeatedly formed on the tape film 503, and the integrated circuit chip 5 is formed.
04 are connected continuously. After that, the tape film is cut at the cutting portion 505, and as shown in FIG. 5B, the wiring component 506 as shown in FIG. 5C is connected to the wiring 502 in the overlapping connection area 501, and further connected to the wiring 502. The package 507 is connected. As a result, a complicated wiring that cannot be achieved by the wiring 502 alone can be realized in the package. As the wiring component 506, a connection area 50 corresponding to the connection area 501 is formed on the tape film.
It is conceivable that there is a component in which wiring for connecting 1'and the connection area 501 'is formed. Further, a passive element or an active element or an integrated circuit chip may be connected between the connection areas 501 '. Further, it is possible to use wiring formed on the surface of the package instead of the above components, or to use a metal wire or the like. It is also possible to use these in multiple layers, to use in combination. Although the TAB package having one integrated circuit chip mounted therein is shown in this embodiment, the TAB package having a plurality of integrated circuit chips mounted thereon is used.
It goes without saying that an AB package may be used.

[0013]

According to the present invention, it is possible to realize an integrated circuit package that is compact, has a fast signal transmission, and suppresses electrical noise. Further, this makes it possible to further improve the performance of a computer or other device using a high-speed integrated circuit.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a TAB package according to a first embodiment of the present invention.

FIG. 2 is a diagram for explaining a wiring route in the TAB package of FIG.

FIG. 3 is a diagram showing a configuration of a TAB package according to a second embodiment of the present invention.

FIG. 4 is a diagram for explaining a wiring route in the TAB package of FIG.

FIG. 5 is a diagram showing a configuration of a TAB package according to a third embodiment of the present invention.

FIG. 6 is a diagram showing a conventional example of a TAB package.

FIG. 7 is a diagram for explaining a wiring route in the TAB package of FIG. 6;

[Explanation of symbols]

101, 204, 301, 404, 502, 601, 7
04, 708, 714 Wiring conductors on tape film 102, 302, 503, 602 Tape film 103, 104, 201, 202, 303, 401, 5
04, 603, 701, 702, 711 Integrated circuit chips 106, 305, 505, 604 Tape film cutting portions 107, 207, 306, 407, 507, 605, 7
08,718 packages 205,307,405,508,606,705,7
07, 715 Package pins 203, 402, 703, 712 Substrate 206, 406, 706, 716 Substrate wiring 304, 403, 713 Capacitor element 717 Substrate through hole 105 Wiring for connecting integrated circuits on a tape film 501, 501 'area for connecting wiring parts 506 wiring parts

Front page continued (72) Inventor Yoshinobu Nakagome 1-280, Higashi Koikekubo, Kokubunji City, Tokyo Central Research Laboratory, Hitachi, Ltd. (72) Inventor, 1-280 Higashi Koikekubo, Kokubunji City, Tokyo Metropolitan Hitachi, Ltd. In-house (72) Yoichi Shintani 4, 6 Kanda Surugadai, Chiyoda-ku, Tokyo Hitachi, Ltd. (72) Inventor Naoki Hamanaka 1-280, Higashi Koikeku, Kokubunji, Tokyo Hitachi Central Research Laboratory (72) Invention Masato Ito 1-280, Higashi Koigokubo, Kokubunji City, Tokyo Inside Hitachi Central Research Laboratory

Claims (7)

[Claims] 1. A TAB package in which conductive wiring is formed on an insulating tape film, and the wiring is electrically connected to an integrated circuit chip and a package on which the integrated circuit chip is mounted by electrically connecting the wiring to the same insulating tape film. And forming a plurality of the conductive wirings on the insulating same tape film and connecting the integrated circuit chips connected to each conductive wiring on the insulating same tape film. A TAB package connected to a circuit chip and each of the conductive wires connected to the package. 2. A TAB package in which conductive wiring is formed on an insulating tape film, and the wiring is electrically connected to an integrated circuit chip and a package in which the wiring is mounted, respectively, in the same insulating tape film. A conductive wiring having an integrated circuit chip mounting area and a component mounting area is formed on the conductive wiring, the integrated circuit chip is connected to the integrated circuit chip mounting area of the conductive wiring, and a single passive element or active element is mounted in the conductive wiring component mounting area. A TAB package, characterized in that each of the conductive wires is connected to the package. 3. The TAB package according to claim 1, wherein the conductive wiring is a conductive wiring having an integrated circuit chip mounting area and a component mounting area, and the integrated circuit chip is connected to the integrated circuit chip mounting area of the conductive wiring. A TAB package, wherein a single passive element or active element is connected to a component mounting area of the conductive wiring. 4. A TAB package in which conductive wiring is formed on an insulating tape film, and the wiring is electrically connected to an integrated circuit chip and a package on which the wiring is mounted, respectively, in the same insulating tape film. Forming a conductive wiring having an integrated circuit chip mounting area and a wiring component connection area, connecting an integrated circuit chip to the integrated circuit chip mounting area of the conductive wiring, and connecting a wiring component to the wiring component connecting area of the conductive wiring And each of the conductive wirings is connected to the package, and the wiring component is formed on an insulating tape film with a connection area corresponding to the wiring component connection area and a predetermined wiring connecting between the respective connection areas. A TAB package that is a component. 5. The TAB package according to claim 1, wherein the conductive wiring is a conductive wiring having an integrated circuit chip mounting area and a wiring component connection area, and the integrated circuit chip is connected to the integrated circuit chip mounting area of the conductive wiring. A wiring component is connected to the wiring component connection area of the conductive wiring, and each of the conductive wirings is connected to the package, and the wiring component is a connection area corresponding to the wiring component connection area on the insulating tape film. TA, which is a component formed with a predetermined wiring for connecting between the respective connection areas
B package. 6. The TAB package according to claim 2, wherein the conductive wiring is provided with a wiring component connection area, and the wiring component is connected to the wiring component connection area of the conductive wiring. A TAB package, which is a component in which a connection area corresponding to the wiring component connection area and a predetermined wiring for connecting between the respective connection areas are formed on an insulating tape film. 7. The TAB package according to any one of claims 4 to 6, wherein a wiring that connects between the predetermined connection areas on the wiring component is a single passive element between the connection areas. Alternatively, the TAB package is characterized in that the wiring is connected through an active element or an integrated circuit chip.