JPH0836786A - Manufacture of optical recording medium - Google Patents

Manufacture of optical recording medium

Info

Publication number
JPH0836786A
JPH0836786A JP6169301A JP16930194A JPH0836786A JP H0836786 A JPH0836786 A JP H0836786A JP 6169301 A JP6169301 A JP 6169301A JP 16930194 A JP16930194 A JP 16930194A JP H0836786 A JPH0836786 A JP H0836786A
Authority
JP
Japan
Prior art keywords
adhesive
substrate
recording medium
optical recording
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6169301A
Other languages
Japanese (ja)
Inventor
Hiroshi Konishi
浩 小西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP6169301A priority Critical patent/JPH0836786A/en
Publication of JPH0836786A publication Critical patent/JPH0836786A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/342Preventing air-inclusions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406Ultraviolet [UV] radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1429Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface
    • B29C65/1435Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the way of heating the interface at least passing through one of the parts to be joined, i.e. transmission welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1477Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier
    • B29C65/1483Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation making use of an absorber or impact modifier coated on the article
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845Radiation curing adhesives, e.g. UV light curing adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/521Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by spin coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9161Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/91Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/90Measuring or controlling the joining process
    • B29C66/94Measuring or controlling the joining process by measuring or controlling the time
    • B29C66/949Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

Abstract

PURPOSE:To remove bubbles mixed in adhesive and reduce the cost by limiting an adhesive coating region and decreasing the pressure of either the inner or the outer periphery to extent the adhesive. CONSTITUTION:A substrate 2 is set on a turntable 4, and an adhesive 1 is discharged in a ring state from a dispenser 3 to the outer peripheral position on the substrate 2 while rotating. Then, an opposite substrate 2 is moved down, and the substrate 2 is brought into contact with the adhesive 1 at the entire periphery. A cover jig 5 for covering the inner peripheral hole is mounted on the surface of the inner periphery of the substrate 2 to seal the inner periphery, and pressure is reduced so that the adhesive 1 is uniformly spread up to the inner peripheral edge. Thereafter, ultraviolet rays are cast at the adhesive via the substrate 2, further left to stand for 1 hour in an atmosphere at 100 deg.C to cure the adhesive 1. Thus, the bubbles mixed with the adhesive 1 can be removed to improve its defective ratio.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は光記録媒体の製造方法
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical recording medium.

【0002】[0002]

【従来の技術】近年、光記録媒体が優れた特性を有する
情報記録媒体として注目されている。この光記録媒体の
記録層として種々の材料が用いられるが、このうち光磁
気記録媒体の記録層の材料としては、Tb,Gd,Dy等の希土
類とFe,Co 等の遷移金属の非晶質合金薄膜が用いられて
いる。この材料は非常に酸化、腐食され易いため、一般
に、記録層を保護する目的で誘電体層で記録層を挟み込
む構造が提案された。しかしながら、この誘電体層はそ
の性質上あるいは製法上、厚く形成することができない
のでその強度は小さく、これを補うために更にその上に
有機保護膜層を設けることが行われていた。そして、こ
のように加工されたもの同志を貼り合わせることで、両
面から情報を記録、再生できる光記録媒体を得ていた。
また、片面から情報を記録、再生するだけでよい場合に
は、片面には保護板を貼り合わせていた。
2. Description of the Related Art In recent years, an optical recording medium has attracted attention as an information recording medium having excellent characteristics. Various materials are used for the recording layer of this optical recording medium. Among them, as the material of the recording layer of the magneto-optical recording medium, rare earth elements such as Tb, Gd, Dy and amorphous transition metals such as Fe and Co are used. An alloy thin film is used. Since this material is very susceptible to oxidation and corrosion, a structure in which the recording layer is sandwiched between dielectric layers has been generally proposed for the purpose of protecting the recording layer. However, since this dielectric layer cannot be formed thick due to its nature or manufacturing method, its strength is small, and in order to compensate for this, an organic protective film layer has been further provided thereon. Then, the optical recording media capable of recording and reproducing information from both sides have been obtained by adhering the thus processed products.
Further, when it is sufficient to record and reproduce information from one side, a protective plate is attached to one side.

【0003】上記のように基板同志あるいは基板と保護
板を貼り合わせる際には、まず、貼り合わせに用いる接
着剤を隙間全体に拡げる必要があり、その方法として、
従来よりロールコート法、スプレー法、スクリーン印刷
法、スピンコート法、ディスペンス法等が知られてい
た。例えば、光磁気記録媒体の貼り合わせ方法として
は、そのための接着剤としてパラフィン系のホットメル
ト樹脂による固着型接着剤や、紫外線硬化性、熱硬化
性、湿気硬化性、嫌気硬化性樹脂等による反応性硬化型
接着剤がよく用いられている。
When the substrates are bonded together or the substrate and the protective plate are bonded together as described above, first, it is necessary to spread the adhesive used for bonding over the entire gap.
Conventionally, a roll coating method, a spraying method, a screen printing method, a spin coating method, a dispensing method and the like have been known. For example, as a method for laminating a magneto-optical recording medium, as an adhesive therefor, a fixing adhesive made of a paraffin-based hot melt resin or a reaction made by an ultraviolet curable resin, a thermosetting resin, a moisture curable resin, an anaerobic curable resin, or the like is used. A curable adhesive is often used.

【0004】ホットメルト樹脂で接着する方法は、接着
剤をロールコート法で塗布し、その後直ちに冷却しなが
らプレスして硬化させるというものであり非常に量産性
に優れた方法である。しかし、冷却しながらプレスを行
うので、樹脂の流動性低下に打ち勝って接着強度を得る
ためにはプレス圧力をかなり大きくする必要があり、こ
のため記録層にクラックが発生し易いという問題があっ
た。この問題を避けるためにプレス圧力が小さ過ぎると
十分な接着強度が得られず、経時劣化により接着層が剥
離するという別の問題が起きる傾向があった。更に、接
着剤自体が緻密性に劣るため、媒体の外部からの浸入し
ようとする水分に対するバリアーとしての機能は殆ど果
たさない。従って、この方法では信頼性の高い光記録媒
体を製造することはできなかった。
The method of adhering with a hot melt resin is a method of applying an adhesive by a roll coating method and then immediately pressing it while cooling to cure the adhesive, which is a very excellent method for mass production. However, since pressing is performed while cooling, it is necessary to increase the pressing pressure considerably in order to overcome the deterioration of the fluidity of the resin and obtain the adhesive strength, which causes a problem that cracks are likely to occur in the recording layer. . If the press pressure is too low to avoid this problem, sufficient adhesive strength cannot be obtained, and another problem that the adhesive layer peels due to deterioration over time tends to occur. Further, since the adhesive itself is inferior in the denseness, it hardly functions as a barrier against the moisture that tries to penetrate from the outside of the medium. Therefore, it was not possible to manufacture a highly reliable optical recording medium by this method.

【0005】これに対して、反応硬化型接着剤は、一般
的に固着型接着剤に比べて粘性が小さく、また、塗布後
直ちに硬化させて接着するという必要がないことから、
プレス時には室温で流動性を十分に確保できる。即ち、
プレス圧力が小さくて済むので記録層を損なうことなく
貼り合わせをすることができる。また、一般に反応硬化
型接着材料は、低吸湿性、低透湿性があるため、硬化
後、媒体外部から侵入しようとする水分に対するバリヤ
ーとして優れた能力を発揮し、このタイプの接着剤で貼
り合わせを行った光記録媒体は耐久性に優れるという利
点がある。反応硬化性接着剤のように低粘度の接着剤を
塗布する方法としては、スプレー法、スピンコート法、
スクリーン印刷法、ディスペンス法等が一般的である。
On the other hand, a reaction-curable adhesive generally has a lower viscosity than a fixed-type adhesive, and since it is not necessary to cure and bond immediately after application,
Sufficient fluidity can be secured at room temperature during pressing. That is,
Since the pressing pressure is small, it is possible to perform the bonding without damaging the recording layer. In addition, since the reaction-curable adhesive material generally has low hygroscopicity and low moisture permeability, it exhibits an excellent ability as a barrier against moisture that tries to enter from the outside of the medium after curing, and is bonded with this type of adhesive. The obtained optical recording medium has an advantage of excellent durability. As a method of applying a low-viscosity adhesive such as a reaction curable adhesive, a spray method, a spin coating method,
The screen printing method, the dispensing method and the like are common.

【0006】しかしながら、従来、反応硬化型接着剤に
よって貼り合わせることにより製造した光記録媒体で
は、接着層に気泡が混入することが避けられなかった。
接着層に混入した気泡の近傍では、応力により記録層や
誘電体層にクラックが発生したり変形したりするため、
光ヘッドのフォーカシングやトラッキングに悪影響を与
える。その結果、バーストエラーやビットエラーのデー
タ誤りや、シーク(指定された番地にビームスポットを
移動させる動作)エラー等を発生させるという問題が生
じていた。また、この問題に付随して、製造歩留りが悪
くコスト高になるという問題も生じていた。
However, conventionally, in an optical recording medium manufactured by laminating with a reaction-curable adhesive, it is unavoidable that bubbles are mixed in the adhesive layer.
In the vicinity of the bubbles mixed in the adhesive layer, the recording layer and the dielectric layer may be cracked or deformed due to stress.
It adversely affects the focusing and tracking of the optical head. As a result, there has been a problem that a data error such as a burst error or a bit error, a seek (movement of a beam spot to a designated address) error, or the like occurs. In addition to this problem, there has been a problem that the manufacturing yield is poor and the cost is high.

【0007】そこで、次に説明するディスペンス法が提
案された。この方法を図2に沿って説明する。即ち、ま
ず、(a) に示すように、記録層を形成した基板2を一定
回転数で回転せながら、その上面の所定の半径位置に、
ディスペンサー3から所定量の接着剤1を吐出する。そ
の結果、接着剤1は基板上でリング状になる。次に、
(b) に示すように、リング状に接着剤が塗布された基板
上にもう一枚の基板2を静かに降下させて行く。そし
て、(c) に示すように、接着剤と降下している基板が接
触したならば、(d) を経て(e) に示すように、接着剤が
基板全域に拡がるまで放置またはプレスし、その後、硬
化させるというものである。
Therefore, the dispensing method described below has been proposed. This method will be described with reference to FIG. That is, first, as shown in (a), while rotating the substrate 2 on which the recording layer is formed at a constant rotation speed, the substrate 2 is moved to a predetermined radial position on the upper surface thereof.
A predetermined amount of the adhesive 1 is discharged from the dispenser 3. As a result, the adhesive 1 becomes a ring shape on the substrate. next,
As shown in (b), the other substrate 2 is gently lowered onto the substrate coated with the adhesive in a ring shape. Then, as shown in (c), if the adhesive and the descending substrate come into contact, as shown in (e) through (d), leave or press until the adhesive spreads over the entire substrate, After that, it is cured.

【0008】[0008]

【発明が解決しようとする課題】しかし、上記のディス
ペンス法により、接着層中に気泡が混入する度合いは大
幅に小さくなったものの、基板の反りや、温湿度等の変
動による接着剤の粘度や基板表面における接着剤に対す
る濡れ性の変動等により、接着層への気泡の混入を皆無
にすることができなかった。
However, although the degree of inclusion of air bubbles in the adhesive layer is greatly reduced by the above-mentioned dispensing method, the viscosity of the adhesive due to the warp of the substrate, the fluctuation of temperature and humidity, etc. It was not possible to completely eliminate the inclusion of air bubbles in the adhesive layer due to changes in the wettability with respect to the adhesive on the substrate surface.

【0009】本発明の目的はこのような問題の解決にあ
る。
An object of the present invention is to solve such a problem.

【0010】[0010]

【課題を解決するための手段】かかる問題の解決のため
に本発明者は鋭意研究の結果、基板上に接着剤を塗布す
る際、その塗布領域を限定することで、相手方の基板ま
たは保護板を接触させる際に仮に気泡が混入したとして
も、その影響が出ないかまたは少ない位置にすることが
でき、また、減圧して接着剤を拡げることで、接着剤の
流動速度を容易に調整できることを見出し、本発明をな
すに至った。
As a result of intensive research for solving the above problems, the present inventor has found that when an adhesive is applied onto a substrate, the application area of the adhesive is limited so that the other substrate or the protective plate. Even if air bubbles are mixed when they are brought into contact with each other, they can be located at a position where they are not affected or are small, and the flow rate of the adhesive can be easily adjusted by expanding the adhesive by reducing the pressure. The present invention has been completed and the present invention has been completed.

【0011】従って、本願発明は「少なくとも記録層を
形成した基板上に接着剤を塗布し、前記基板に、前記基
板と同一の基板または保護板を接近させることにより現
出した隙間に前記接着剤を拡げた後、前記接着剤を硬化
することにより貼り合わせを行う光記録媒体の製造方法
において、接着剤の塗布領域を限定し、かつ、内周また
は外周のどちらか一方向を減圧することで接着剤を拡げ
ることを特徴とする光記録媒体の製造方法」を提供する
ものである。
Therefore, according to the present invention, "the adhesive is applied to at least the substrate on which the recording layer is formed, and the same substrate or protective plate as the substrate is brought close to the substrate, and the adhesive is provided in the gap that appears. In the method for manufacturing an optical recording medium in which the adhesive is cured by spreading the adhesive, the application area of the adhesive is limited, and the inner circumference or the outer circumference is depressurized in one direction. A method for manufacturing an optical recording medium, which comprises spreading an adhesive.

【0012】[0012]

【作用】本発明の製造方法においては、まず、基板に接
着剤を塗布する。塗布する領域は、光記録媒体としの記
録領域外である外周縁または内周縁の領域に限定する。
次に、相手方の基板または保護板を、接着剤に接近させ
る。相手方の基板または保護板には接着剤が塗布されて
いてもいなくともよい。リング状の接着剤の全周が相手
方の基板または保護板光記録媒体と接した後、2枚の基
板同志あるいは基板と保護板を平行に保ちながら、この
隙間を接着剤を内周縁に塗布した場合には外周縁から、
また、外周縁に塗布した場合は内周縁から減圧する。減
圧することにより、塗布された接着剤は内周縁あるいは
外周縁まで到達し、隙間全域に拡がる。万一気泡が混入
しても気泡のその位置は記録領域外であるので、気泡に
よる問題は発生しない。減圧する程度と接着剤の拡がる
速度移動速度は相関関係があるので、使用する接着剤の
粘性に応じて、減圧する程度を加減することにより容易
に所望の速度が得られる。接着剤が隙間全域に拡がった
後に、その接着剤に応じた適当な硬化方法により硬化さ
せ、貼り合わせは終了する。
In the manufacturing method of the present invention, first, the substrate is coated with the adhesive. The area to be applied is limited to the outer edge area or the inner edge area that is outside the recording area of the optical recording medium.
Next, the other substrate or protective plate is brought close to the adhesive. The opposite substrate or protective plate may or may not be coated with an adhesive. After the entire circumference of the ring-shaped adhesive was in contact with the other substrate or protective plate optical recording medium, the adhesive was applied to the inner peripheral edge of this gap while keeping the two substrates or the substrate and the protective plate parallel to each other. In the case from the outer edge,
When applied to the outer peripheral edge, the pressure is reduced from the inner peripheral edge. By reducing the pressure, the applied adhesive reaches the inner peripheral edge or the outer peripheral edge and spreads over the entire gap. Even if air bubbles are mixed in, the position of the air bubbles is outside the recording area, so that the air bubbles do not cause a problem. Since there is a correlation between the degree of pressure reduction and the speed at which the adhesive spreads, the desired speed can be easily obtained by adjusting the degree of pressure reduction according to the viscosity of the adhesive used. After the adhesive has spread over the entire gap, it is cured by an appropriate curing method according to the adhesive, and the bonding is completed.

【0013】なお、減圧する程度を、接着剤が均一に拡
げられる最大限にすることにより、貼り合わせに要する
時間を短縮でき、更に、接着剤を隙間全体に拡げずに、
一部貼り合わせしない領域を設けることも可能である。
以下、実施例により本発明をより具体的に説明するが、
本発明はこれに限られるものではない。
By reducing the degree of pressure reduction to the maximum extent at which the adhesive can be evenly spread, the time required for bonding can be shortened, and further, without spreading the adhesive throughout the gap,
It is also possible to provide a region that is not partially bonded.
Hereinafter, the present invention will be described in more detail with reference to Examples.
The present invention is not limited to this.

【0014】[0014]

【実施例】まず、射出成形法によりトラッキング用グル
ーブを有する外径130mm 、内径10mm、厚さ1.2mm のポリ
カーボネート樹脂基板6を用意した。この基板上全面
に、スパッタリングにより、誘電体として窒化シリコン
の保護層7を70nmの厚さに形成し、その上に、同じくス
パッタリングにより、DyFeCoの記録層8を50nmの厚さに
形成し、更に、その上にスパッタリングにより誘電体と
して窒化シリコンの保護層7を70nmの厚さに形成した。
次に、窒化シリコン膜の上に、アクリレート系の紫外線
硬化型樹脂をスピンコート法により約8μm の厚さに形
成し有機保護層9とした。以上の工程を経た基板を図3
に示す。
EXAMPLE First, a polycarbonate resin substrate 6 having an outer diameter of 130 mm, an inner diameter of 10 mm and a thickness of 1.2 mm having a tracking groove was prepared by an injection molding method. A silicon nitride protective layer 7 having a thickness of 70 nm is formed as a dielectric on the entire surface of the substrate by sputtering, and a DyFeCo recording layer 8 having a thickness of 50 nm is also formed thereon by sputtering. Then, a protective layer 7 of silicon nitride was formed thereon as a dielectric to a thickness of 70 nm by sputtering.
Next, an acrylate-based UV curable resin was formed on the silicon nitride film by a spin coating method to a thickness of about 8 μm to form an organic protective layer 9. The substrate after the above steps is shown in FIG.
Shown in

【0015】次に、図1に沿って説明する。図1(a) に
示すように基板2をターンテーブル4にセットし、回転
数 10rpmで回転させながら、ディスペンサー3から基板
上の半径62mmの位置にリング状に接着剤1を3ccだけ吐
出させた。次に、相手方の基板を所定の速度で降下さ
せ、(c) に示すように基板2と、接着剤1を全周で接触
させた。次に、基板内周部の表面に内周孔を覆うカバー
冶具5を装着して内周部を密封状態にし、基板内周部の
下法から減圧して 200Torrの圧力とし、その状態を保ち
ながら接着剤を内周縁まで拡げた。その後、基板を通し
て紫外線を100mJ/cm2の強さで照射し、更に100 ℃の雰
囲気に1時間放置して接着剤を硬化させた。
Next, description will be made with reference to FIG. As shown in FIG. 1 (a), the substrate 2 was set on the turntable 4, and while rotating at a rotation speed of 10 rpm, 3 cc of the adhesive 1 was dispensed in a ring shape from the dispenser 3 to a position with a radius of 62 mm on the substrate. . Next, the other substrate was lowered at a predetermined speed, and the substrate 2 and the adhesive 1 were brought into contact with the entire periphery of the substrate 2 as shown in (c). Next, the cover jig 5 that covers the inner peripheral hole is attached to the surface of the inner peripheral portion of the substrate to seal the inner peripheral portion, and the pressure is reduced to 200 Torr from the lower method of the inner peripheral portion of the substrate, and the state is maintained. While spreading the adhesive to the inner peripheral edge. Then, the substrate was irradiated with ultraviolet rays at an intensity of 100 mJ / cm 2 and left in an atmosphere of 100 ° C. for 1 hour to cure the adhesive.

【0016】このようにして製造した光記録媒体に対し
て再生試験を行い、バーストエラーやビットエラーのデ
ータ誤り、及びシークエラーを測定したところ、不良率
は0%であった。なお、接着剤は(株)グレースジャパ
ン製の紫外線/熱硬化型樹脂で粘度 500cps のものを用
いた。
A reproduction test was conducted on the optical recording medium thus manufactured, and data errors such as burst error, bit error, and seek error were measured, and the defective rate was 0%. The adhesive used was an ultraviolet / thermosetting resin manufactured by Grace Japan Co., Ltd. and having a viscosity of 500 cps.

【0017】[0017]

【比較例】接着剤を基板上の半径40mmの位置に吐出させ
た以外は、実施例と全く同様の方法で光記録媒体を製造
し、同様の測定を行った。その結果は不良率は約60%で
あった。
[Comparative Example] An optical recording medium was manufactured in the same manner as in Example except that the adhesive was discharged onto a substrate at a position having a radius of 40 mm, and the same measurement was performed. As a result, the defective rate was about 60%.

【0018】[0018]

【発明の効果】以上説明した通り、本発明によれば、接
着層へ混入した気泡の影響を受けない品質の優れた光記
録媒体が低コストで製造できるようになった。
As described above, according to the present invention, an optical recording medium of excellent quality which is not affected by bubbles mixed in the adhesive layer can be manufactured at low cost.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の貼り合わせ方式を示す概念図であ
る。
FIG. 1 is a conceptual diagram showing a bonding method of the present invention.

【図2】 従来の貼り合わせ方法を示す概念図である。FIG. 2 is a conceptual diagram showing a conventional bonding method.

【図3】 光記録媒体の垂直断面図である。FIG. 3 is a vertical sectional view of an optical recording medium.

【符号の説明】[Explanation of symbols]

1・・・接着剤 2・・・基板 3・・・ディスペンサー 4・・・ターンテーブル 5・・・カバー冶具 6・・・基板 7・・・保護層 8・・・記録層 9・・・有機保護膜 以 上 1 ... Adhesive 2 ... Substrate 3 ... Dispenser 4 ... Turntable 5 ... Cover jig 6 ... Substrate 7 ... Protective layer 8 ... Recording layer 9 ... Organic Above protective film

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 少なくとも記録層を形成した基板上に接
着剤を塗布し、前記基板に、前記基板と同一の基板また
は保護板を接近させることにより現出した隙間に前記接
着剤を拡げた後、前記接着剤を硬化することにより貼り
合わせを行う光記録媒体の製造方法において、接着剤の
塗布領域を限定し、かつ、内周または外周のどちらか一
方向を減圧することで接着剤を拡げることを特徴とする
光記録媒体の製造方法。
1. After spreading an adhesive on a substrate on which at least a recording layer is formed, and by spreading the adhesive in a gap exposed by bringing the same substrate as the substrate or a protective plate close to the substrate. In the method for manufacturing an optical recording medium in which bonding is performed by curing the adhesive, the application area of the adhesive is limited, and the adhesive is expanded by depressurizing either the inner circumference or the outer circumference. A method of manufacturing an optical recording medium characterized by the above.
JP6169301A 1994-07-21 1994-07-21 Manufacture of optical recording medium Pending JPH0836786A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6169301A JPH0836786A (en) 1994-07-21 1994-07-21 Manufacture of optical recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6169301A JPH0836786A (en) 1994-07-21 1994-07-21 Manufacture of optical recording medium

Publications (1)

Publication Number Publication Date
JPH0836786A true JPH0836786A (en) 1996-02-06

Family

ID=15883995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6169301A Pending JPH0836786A (en) 1994-07-21 1994-07-21 Manufacture of optical recording medium

Country Status (1)

Country Link
JP (1) JPH0836786A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744739A1 (en) * 1995-05-20 1996-11-27 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
EP0790608A1 (en) * 1996-02-15 1997-08-20 Kitano Engineering Co., Ltd. Method of developing an adhesive and a rotary holding table for carrying out the same method
US5800670A (en) * 1995-05-20 1998-09-01 Kitano Engineering Co., Ltd. Spreader of an optical disc
US5954908A (en) * 1995-10-13 1999-09-21 Kitano Engineering Co., Ltd. Developing storage disc boss
EP0895234A4 (en) * 1996-04-19 1999-11-03 Matsushita Electric Ind Co Ltd Method and apparatus for manufacture of laminated optical disc
EP0833315A3 (en) * 1996-07-31 2000-02-16 Kitano Engineering Co., Ltd. Method of correcting nonalignment of a storage disc

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0744739A1 (en) * 1995-05-20 1996-11-27 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
US5744193A (en) * 1995-05-20 1998-04-28 Kitano Engineering Co., Ltd. Method of manufacturing an optical disc and a placing platform to be used by the same
US5800670A (en) * 1995-05-20 1998-09-01 Kitano Engineering Co., Ltd. Spreader of an optical disc
US5954908A (en) * 1995-10-13 1999-09-21 Kitano Engineering Co., Ltd. Developing storage disc boss
EP0790608A1 (en) * 1996-02-15 1997-08-20 Kitano Engineering Co., Ltd. Method of developing an adhesive and a rotary holding table for carrying out the same method
US5843257A (en) * 1996-02-15 1998-12-01 Kitano Engineering Co., Ltd. Method of developing an adhesive and a rotary holding table for carrying out the same method
EP0895234A4 (en) * 1996-04-19 1999-11-03 Matsushita Electric Ind Co Ltd Method and apparatus for manufacture of laminated optical disc
EP1120781A1 (en) * 1996-04-19 2001-08-01 Matsushita Electric Industrial Co., Ltd. Apparatus for manufacture of laminated optical discs
US6309485B1 (en) 1996-04-19 2001-10-30 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacture of laminated optical disc
US6733606B2 (en) 1996-04-19 2004-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacture of laminated optical disc including defoaming adhesive
US6733604B2 (en) 1996-04-19 2004-05-11 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacture of laminated optical disc
US6960269B2 (en) 1996-04-19 2005-11-01 Matsushita Electric Industrial Co., Ltd. Method and apparatus for manufacture of laminated optical disc including centerer
CN1306509C (en) * 1996-04-19 2007-03-21 松下电器产业株式会社 Method and apparatus for manufacture of laminated optical disc
EP0833315A3 (en) * 1996-07-31 2000-02-16 Kitano Engineering Co., Ltd. Method of correcting nonalignment of a storage disc

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