JPH08336829A - Wire saw - Google Patents
Wire sawInfo
- Publication number
- JPH08336829A JPH08336829A JP14588795A JP14588795A JPH08336829A JP H08336829 A JPH08336829 A JP H08336829A JP 14588795 A JP14588795 A JP 14588795A JP 14588795 A JP14588795 A JP 14588795A JP H08336829 A JPH08336829 A JP H08336829A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- wafers
- cleaning liquid
- liq
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の利用分野】本発明はワイヤソーに係り、特に半
導体インゴット等の被加工物を走行するワイヤ列で多数
のウェーハに切断するワイヤソーに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw, and more particularly to a wire saw that cuts a large number of wafers by a wire row that travels a workpiece such as a semiconductor ingot.
【０００２】[0002]
【従来の技術】ワイヤソーは、一対のワイヤリール間を
往復走行するワイヤを複数の溝付ローラに巻きかけ、そ
の溝付ローラで形成されるワイヤ列に砥粒を含む加工液
を供給しながら被加工物を押し当てることにより、被加
工物を多数のウェーハに切断するものである。2. Description of the Related Art A wire saw winds a wire that reciprocates between a pair of wire reels around a plurality of grooved rollers, and supplies a working fluid containing abrasive grains to a wire row formed by the grooved rollers. By pressing the work piece, the work piece is cut into a large number of wafers.
【０００３】前記の如くワイヤソーは、被加工物を切断
する際に、ワイヤ列に加工液を供給しながら切断してい
る。このため、切断後のウェーハには砥粒を含む多量の
加工液が付着し、後にウェーハを洗浄する際に多大の労
力を要するという問題があった。この問題を解消するた
めに、特開平６−１１４８２８号広報には、ワイヤソー
で被加工物を切断終了後、走行するワイヤ列に洗浄液を
かけながらワイヤ列から被加工物を抜き取ることによ
り、ウェーハの予備的な洗浄を行ない、後に行なうウェ
ーハの洗浄の労力を削減することが開示されている。As described above, the wire saw cuts the workpiece while supplying the working liquid to the wire row. Therefore, there is a problem that a large amount of working liquid containing abrasive grains adheres to the cut wafer, which requires a great deal of labor when the wafer is washed later. In order to solve this problem, Japanese Laid-Open Patent Publication No. 6-114828 discloses that after cutting a workpiece with a wire saw, the workpiece is extracted from the wire row while applying a cleaning liquid to the traveling wire row. It is disclosed that a preliminary cleaning is performed to reduce the labor of cleaning the wafer to be performed later.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、前記ワ
イヤ列に洗浄液をかける洗浄方法では、ワイヤ列にかけ
た洗浄液の大部分が切断されたウェーハ間に供給されず
に下方へ落下してしまうため、洗浄液がウェーハ間の中
心部まで入り込まず、有効にウェーハの洗浄を行なうこ
とができないという欠点がある。However, in the cleaning method in which the cleaning solution is applied to the wire array, most of the cleaning solution applied to the wire array is not supplied between the cut wafers and drops downward, so that the cleaning solution is However, there is a drawback in that the wafer cannot be effectively cleaned because it does not enter the central portion between the wafers.
【０００５】本発明は、このような事情を鑑みてなされ
たもので、ウェーハの洗浄効果を高めることができるワ
イヤソーを提供することを目的とする。The present invention has been made in view of the above circumstances, and an object thereof is to provide a wire saw capable of enhancing the cleaning effect of a wafer.
【０００６】[0006]
【課題を解決する為の手段】本発明は前記目的を達成す
る為に、一対のワイヤリール間を往復走行するワイヤを
複数個の溝付ローラに巻き掛けてワイヤ列を形成し、該
ワイヤ列に砥粒を含む加工液を供給しながら被加工物を
押し当ることにより該被加工物を多数のウェーハに切断
するワイヤソーにおいて、高圧洗浄液を噴射するノズル
を、前記被加工物の近傍で且つ切断されたウェーハ間の
溝内に高圧洗浄液を噴射可能な位置に設け、前記ワイヤ
列により前記被加工物を多数のウェーハに切断後、該ウ
ェーハを走行するワイヤ列から引き抜くときに、前記ノ
ズルから各ウェーハ間の溝内に向けて高圧洗浄液を噴射
することを特徴とする。In order to achieve the above-mentioned object, the present invention forms a wire row by winding a wire running between a pair of wire reels around a plurality of grooved rollers to form a wire row. In a wire saw that cuts the work piece into a large number of wafers by pressing the work piece while supplying a working liquid containing abrasive grains to the work piece, a nozzle for injecting a high-pressure cleaning liquid is cut in the vicinity of the work piece. Provided at a position where a high-pressure cleaning liquid can be sprayed in the groove between the wafers, after cutting the workpiece into a large number of wafers by the wire row, when pulling out from the wire row running the wafer, each from the nozzle It is characterized in that the high-pressure cleaning liquid is sprayed into the groove between the wafers.
【０００７】[0007]
【作用】本発明によれば、被加工物をワイヤ列により多
数のウェーハに切断後、走行するワイヤ列からウェーハ
を引き抜くときに、ノズルから各ウェーハ間の溝内に向
けて洗浄液を噴射する。この噴射された洗浄液は全てウ
ェーハに供給されるので、従来のワイヤ列に洗浄液を供
給する方式のものに比べ、効率的に洗浄液の供給をする
ことができ、短時間でウェーハを洗浄することができ
る。また、洗浄液を高圧で噴射供給すると、洗浄液をウ
ェーハの中心部まで入り込ませることができ、これによ
り、各ウェーハの中心部まで洗浄することが可能にな
る。According to the present invention, after the workpiece is cut into a large number of wafers by the wire row, and when the wafer is pulled out from the traveling wire row, the cleaning liquid is sprayed from the nozzle toward the groove between the wafers. Since all of the sprayed cleaning liquid is supplied to the wafer, the cleaning liquid can be supplied more efficiently and the wafer can be cleaned in a shorter time than the conventional method of supplying the cleaning liquid to the wire row. it can. In addition, when the cleaning liquid is jetted and supplied at a high pressure, the cleaning liquid can be made to enter the central portion of the wafer, which makes it possible to clean the central portion of each wafer.
【０００８】[0008]
【実施例】以下添付図面に従って本発明に係るワイヤソ
ーの加工液温度制御装置の好ましい実施例について詳説
する。図１は、本発明に係るワイヤソー１０の全体構成
図である。一方のワイヤリール１２に巻回されたワイヤ
１４は、ワイヤ案内装置１６、複数のガイドローラ１
８、１８、ダンサローラ２０を経由して３本の溝付きロ
ーラ２２、２２、２２に順次巻き掛けられてワイヤ列２
４を形成した後、複数のガイドローラ１８、１８、ダン
サローラ２０、ワイヤ案内装置１６を経て他方のワイヤ
リール２６に巻き取られる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a working fluid temperature control device for a wire saw according to the present invention will be described in detail below with reference to the accompanying drawings. FIG. 1 is an overall configuration diagram of a wire saw 10 according to the present invention. The wire 14 wound around one wire reel 12 includes a wire guide device 16 and a plurality of guide rollers 1.
The wire row 2 is wound around the three grooved rollers 22, 22, 22 in sequence via the 8, 18 and the dancer roller 20.
After forming No. 4, it is wound around the other wire reel 26 through the plurality of guide rollers 18, 18, the dancer roller 20, the wire guiding device 16.
【０００９】前記ダンサローラ２０には所定重量の錘４
４が吊設され、走行するワイヤ１４に常に一定の張力を
付与している。前記ワイヤ走行路の途中にはワイヤ洗浄
装置４６が設けられ、このワイヤ洗浄装置４６によって
ワイヤ１４に付着した加工液４０が除去される。前記ワ
イヤリール１２、２６及び３本のうちの１本の溝付きロ
ーラ２２には、それぞれ正逆回転可能な駆動モータ２
８、３０が連結されており、これらの駆動モータ２８、
３０を同期させて駆動することにより、ワイヤ１４は一
対のワイヤリール１２、２６間を往復走行する。The dancer roller 20 has a weight 4 of a predetermined weight.
4 is suspended, and a constant tension is always applied to the traveling wire 14. A wire cleaning device 46 is provided in the middle of the wire traveling path, and the working liquid 40 attached to the wire 14 is removed by the wire cleaning device 46. Each of the wire reels 12, 26 and one grooved roller 22 out of the three reels has a drive motor 2 capable of rotating in the forward and reverse directions.
8 and 30 are connected to each other, and these drive motors 28,
By driving 30 synchronously, the wire 14 travels back and forth between the pair of wire reels 12 and 26.
【００１０】前記ワイヤリール１２、２６には、それぞ
れ正逆回転可能な駆動モータ２８、３０が連結されると
ともに、３本のうちの１本の溝付きローラ２２にも図示
しない駆動モータが連結されており、これらの駆動モー
タ２８、３０を同期させて駆動することにより、ワイヤ
１４は一対のワイヤリール１２、２６間を往復走行す
る。The wire reels 12 and 26 are respectively connected with drive motors 28 and 30 capable of rotating in the forward and reverse directions, and a drive motor (not shown) is also connected to one of the three grooved rollers 22. By driving these drive motors 28 and 30 in synchronization, the wire 14 travels back and forth between the pair of wire reels 12 and 26.
【００１１】前記ワイヤ列２４には、加工液貯留タンク
３８に貯留された砥粒（通常、ＧＣ♯６００〜♯１００
０程度のものが使用される）を含む加工液４０が加工液
供給ポンプ４１で送水されて加工液供給ノズル４２から
供給される。後述する半導体インゴット５４は、前記ワ
イヤ列２４に押し付けられて、この加工液４０によるラ
ッピング作用により多数のウェーハ５５、５５、…に切
断される。なお、ワイヤ列２４に供給された加工液４０
は、ワイヤ列２４の下方に設置された回収皿６０で回収
されて、再び加工液貯留タンク３８に戻される。すなわ
ち、前記加工液４０はワイヤ列２４に循環供給されてい
る。The wire row 24 has abrasive grains (generally GC # 600 to # 100) stored in the machining fluid storage tank 38.
A working fluid 40 containing a material of about 0 is supplied by a working fluid supply pump 41 and supplied from a working fluid supply nozzle 42. A semiconductor ingot 54, which will be described later, is pressed against the wire row 24 and is cut into a large number of wafers 55, 55, ... By the lapping action of the processing liquid 40. The machining liquid 40 supplied to the wire row 24
Is collected by a collecting dish 60 installed below the wire row 24 and returned to the working liquid storage tank 38 again. That is, the working fluid 40 is circulated and supplied to the wire row 24.
【００１２】前記ワイヤ列２４の上方には、被加工物で
ある半導体インゴット５４がスライスベース５８、ワー
ク接着ブロック５６を介してワーク送りテーブル４８に
支持されている。このワーク送りテーブル４８は、駆動
モータ５０で回動するボールネジ５２の作用により昇降
自在に設けられており、このワーク送りテーブル４８を
下方に移動させて前記半導体インゴット５４を高速走行
するワイヤ列２４に押し当てることにより、半導体イン
ゴット５４を多数のウェーハ５５、５５、…に切断す
る。Above the wire array 24, a semiconductor ingot 54, which is a workpiece, is supported by a work feed table 48 via a slice base 58 and a work adhesive block 56. The work feed table 48 is provided so as to be able to move up and down by the action of a ball screw 52 which is rotated by a drive motor 50. The work feed table 48 is moved downward so that the wire row 24 which travels the semiconductor ingot 54 at a high speed. By pressing, the semiconductor ingot 54 is cut into a large number of wafers 55, 55, ....
【００１３】また、図２及び図３に示すように、前記ス
ライスベース５８の両側部近傍には、洗浄液供給ノズル
６２、６２がスライスベース５８に沿って配設されてお
り、ブラケット６４、６４を介してワーク送りテーブル
４８に支持されている。この洗浄液供給ノズル６２は、
図４に示すように、円筒状に形成されるとともに、その
長手方向に沿ってスリット６２Ａが形成されており、内
部に洗浄液６６を圧入するとスリット６２Ａから前記半
導体インゴット５４に向かって高圧の洗浄液６６が噴射
される。このスリット６２Ａの方向は、ノズル６２内に
圧入された洗浄液６８が、切断された各ウェーハ５５、
５５、…間の溝内に噴射されるように形成されている。Further, as shown in FIGS. 2 and 3, cleaning liquid supply nozzles 62, 62 are arranged along the slice base 58 near both sides of the slice base 58, and brackets 64, 64 are provided. It is supported by the work feed table 48 via the. The cleaning liquid supply nozzle 62 is
As shown in FIG. 4, the cleaning liquid 66 is formed in a cylindrical shape and has a slit 62A formed along the longitudinal direction thereof. When the cleaning liquid 66 is pressed into the inside, a high-pressure cleaning liquid 66 is directed from the slit 62A toward the semiconductor ingot 54. Is jetted. The direction of this slit 62A is such that the cleaning liquid 68 press-fitted into the nozzle 62 is cut into each wafer 55,
It is formed so as to be injected into the groove between 55, ....
【００１４】また、図１に示すように、前記洗浄液供給
ノズル６２、６２に供給される洗浄液６８は、洗浄液貯
留タンク６６に貯留されており、洗浄液供給ポンプ７０
を駆動することにより、互いを連通する洗浄液供給パイ
プ７２を介して洗浄液供給ノズル６２、６２に洗浄液６
８が供給される。なお、前記ワイヤ列２４に供給する加
工液４０と同様に、半導体インゴット５４に供給された
洗浄液６８は、ワイヤ列２４の下方に設置された回収皿
６０で回収されて、再び洗浄液貯留タンク６６に戻され
る。すなわち、前記洗浄液６８も半導体インゴット５４
に循環供給されている。また、回収皿６０で回収した液
（加工液４０又は洗浄液６８）の排出先の切替えは、回
収皿６０に設けられた切替パイプ７４の排出口の位置を
移動させることにより切り替える。Further, as shown in FIG. 1, the cleaning liquid 68 supplied to the cleaning liquid supply nozzles 62, 62 is stored in a cleaning liquid storage tank 66, and a cleaning liquid supply pump 70 is provided.
By driving the cleaning liquid 6 to the cleaning liquid supply nozzles 62, 62 via the cleaning liquid supply pipe 72 communicating with each other.
8 is supplied. The cleaning liquid 68 supplied to the semiconductor ingot 54 is recovered by the recovery tray 60 installed below the wire array 24, and is again stored in the cleaning liquid storage tank 66, like the processing liquid 40 supplied to the wire array 24. Will be returned. That is, the cleaning liquid 68 is also used for the semiconductor ingot 54.
It is being circulated to. Further, the switching of the discharge destination of the liquid (processing liquid 40 or cleaning liquid 68) collected in the recovery tray 60 is switched by moving the position of the outlet of the switching pipe 74 provided in the recovery tray 60.
【００１５】前記の如く構成される本発明に係るワイヤ
ソーの実施例の作用は次の通りである。まず、ワーク送
りテーブル４８に半導体インゴット５４を位置決めして
セットし、ワイヤリール１２、２６の駆動モータ２８、
３０及び溝付ローラ２２の駆動モータを駆動してワイヤ
１４を走行させる。The operation of the embodiment of the wire saw according to the present invention constructed as described above is as follows. First, the semiconductor ingot 54 is positioned and set on the work feed table 48, and the drive motor 28 for the wire reels 12 and 26,
The wire 14 is run by driving the drive motors of the grooved roller 22 and the grooved roller 30.
【００１６】次に、走行するワイヤ列２４に加工液供給
ノズル４２、４２から加工液４０を供給しながら、半導
体インゴット５４を下降させて半導体インゴット５４を
ワイヤ列２４に押し付ける。これにより、半導体インゴ
ット５４は、加工液４０のラッピング作用により多数の
ウェーハ５５、５５、…に切断されていく。そして、ワ
イヤ列２４でスライスベース５８の所定位置まで切断し
たのち、駆動モータ２８、３０を一時停止させて加工液
４０の供給を停止するとともに、回収皿６０で回収する
回収液の排出先を加工液貯留タンク３８から洗浄液貯留
タンク６６に切り替える。Next, while supplying the working liquid 40 from the working liquid supply nozzles 42, 42 to the traveling wire array 24, the semiconductor ingot 54 is lowered to press the semiconductor ingot 54 against the wire array 24. As a result, the semiconductor ingot 54 is cut into a large number of wafers 55, 55, ... By the lapping action of the processing liquid 40. Then, after cutting to a predetermined position of the slice base 58 with the wire row 24, the driving motors 28 and 30 are temporarily stopped to stop the supply of the processing liquid 40, and the discharge destination of the recovery liquid to be recovered in the recovery tray 60 is processed. The liquid storage tank 38 is switched to the cleaning liquid storage tank 66.
【００１７】次に、再び駆動モータ２８、３０を駆動し
てワイヤ１４を走行させる。そして、洗浄液供給ポンプ
７０を駆動して洗浄液供給ノズル６２、６２のスリット
６２Ａ、６２Ａから各ウェーハ５５、５５、…間の溝内
に向けて洗浄液６８を高圧力で噴射する。これと同時
に、駆動モータ５０を駆動してウェーハ５５、５５、…
を上昇させ、ワイヤ列２４からウェーハ５５を抜き取
る。Next, the drive motors 28 and 30 are driven again to drive the wire 14. Then, the cleaning liquid supply pump 70 is driven to inject the cleaning liquid 68 at high pressure from the slits 62A, 62A of the cleaning liquid supply nozzles 62, 62 into the grooves between the wafers 55, 55, .... At the same time, the drive motor 50 is driven to drive the wafers 55, 55, ...
And the wafer 55 is removed from the wire row 24.
【００１８】この際、各ウェーハ５５、５５、…は、噴
射された洗浄液６８の吐出力、及び走行するワイヤ１４
の拭き落としの効果により、その表面に付着された加工
液４０等の汚れが除去される。このように、本実施例の
ワイヤソー１０によれば、洗浄液６８を直接各ウェーハ
５５、５５、…間の溝内に向けて高圧で噴射するように
したので、供給した洗浄液６８をウェーハ５５、５５、
…の中心部まで入り込ませることができる。これによ
り、ウェーハ５５、５５、…の中心部まで洗浄すること
が可能になり、洗浄効果を高めることができる。At this time, the wafers 55, 55, ...
Due to the effect of wiping off, the stain such as the working liquid 40 attached to the surface is removed. As described above, according to the wire saw 10 of the present embodiment, the cleaning liquid 68 is directly jetted at a high pressure toward the groove between the wafers 55, 55, ..., Therefore, the supplied cleaning liquid 68 is supplied to the wafers 55, 55. ,
You can enter the center of…. As a result, the central portions of the wafers 55, 55, ... Can be cleaned, and the cleaning effect can be enhanced.
【００１９】また、噴射した洗浄液６８を全てウェーハ
５５、５５、…に供給することができるので、従来のワ
イヤ列２４に洗浄液６８を供給する方式のものに比べ、
効率的に洗浄液６８の供給をすることができ、短時間で
ウェーハ５５、５５、…の洗浄を行なうことができる。Further, since all of the sprayed cleaning liquid 68 can be supplied to the wafers 55, 55, ..., Compared with the conventional system in which the cleaning liquid 68 is supplied to the wire row 24,
The cleaning liquid 68 can be efficiently supplied, and the wafers 55, 55, ... Can be cleaned in a short time.
【００２０】[0020]
【発明の効果】以上説明したように、本発明によれば、
洗浄液を直接各ウェーハ間の溝内に向けて噴射するよう
にしたので、供給した洗浄液をウェーハの中心部まで入
り込ませることができる。これにより、ウェーハの中心
部まで洗浄することが可能になり、洗浄効果を高めさせ
ることができる。As described above, according to the present invention,
Since the cleaning liquid is sprayed directly into the groove between the wafers, the supplied cleaning liquid can be introduced into the central portion of the wafer. As a result, the central portion of the wafer can be cleaned and the cleaning effect can be enhanced.
【００２１】また、噴射した洗浄液を全てウェーハに供
給することができるので、従来のワイヤ列に洗浄液を供
給する方式のものに比べ、効率的に洗浄液の供給をする
ことができ、短時間で洗浄を行なうことができる。Further, since all of the sprayed cleaning liquid can be supplied to the wafer, the cleaning liquid can be supplied more efficiently and cleaning can be performed in a shorter time as compared with the conventional method of supplying the cleaning liquid to the wire row. Can be done.
【図１】本発明に係るワイヤソーの実施例の全体構成図FIG. 1 is an overall configuration diagram of an embodiment of a wire saw according to the present invention.
【図２】図１の要部拡大図FIG. 2 is an enlarged view of a main part of FIG.
【図３】図２の斜視図FIG. 3 is a perspective view of FIG.
【図４】洗浄液供給ノズルの説明図FIG. 4 is an explanatory diagram of a cleaning liquid supply nozzle.
１０…ワイヤソー １２、２６…ワイヤリール １４…ワイヤ １８…ガイドローラ ２２…溝付ローラ ２４…ワイヤ列 ４０…加工液 ６０…回収皿 ６２…洗浄液供給ノズル ６６…洗浄液貯留タンク ６８…洗浄液 ７０…洗浄液供給ポンプ 10 ... Wire saw 12, 26 ... Wire reel 14 ... Wire 18 ... Guide roller 22 ... Grooved roller 24 ... Wire row 40 ... Machining liquid 60 ... Recovery dish 62 ... Cleaning liquid supply nozzle 66 ... Cleaning liquid storage tank 68 ... Cleaning liquid 70 ... Cleaning liquid supply pump
Claims (1)
イヤを複数個の溝付ローラに巻き掛けてワイヤ列を形成
し、該ワイヤ列に砥粒を含む加工液を供給しながら被加
工物を押し当ることにより該被加工物を多数のウェーハ
に切断するワイヤソーにおいて、 洗浄液を噴射するノズルを、前記被加工物の近傍で且つ
切断されたウェーハ間の溝内に洗浄液を噴射可能な位置
に設け、前記ワイヤ列により前記被加工物を多数のウェ
ーハに切断後、該ウェーハを走行するワイヤ列から引き
抜くときに、前記ノズルから各ウェーハ間の溝内に向け
て洗浄液を噴射することを特徴とするワイヤソー。1. A wire row is formed by winding a wire that reciprocates between a pair of wire reels around a plurality of grooved rollers, and a workpiece is fed while a working liquid containing abrasive grains is supplied to the wire row. In a wire saw that cuts the workpiece into a large number of wafers by pressing, a nozzle for spraying the cleaning liquid is provided near the workpiece and in a position where the cleaning liquid can be sprayed into the groove between the cut wafers. After the workpiece is cut into a large number of wafers by the wire row, and when the wafer is pulled out from the traveling wire row, a cleaning liquid is sprayed from the nozzle toward the groove between the wafers. Wire saw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14588795A JP3075143B2 (en) | 1995-06-13 | 1995-06-13 | Wire saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14588795A JP3075143B2 (en) | 1995-06-13 | 1995-06-13 | Wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08336829A true JPH08336829A (en) | 1996-12-24 |
| JP3075143B2 JP3075143B2 (en) | 2000-08-07 |
Family
ID=15395354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14588795A Expired - Fee Related JP3075143B2 (en) | 1995-06-13 | 1995-06-13 | Wire saw |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3075143B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011183503A (en) * | 2010-03-08 | 2011-09-22 | Takatori Corp | Wire saw |
| EP2955745A1 (en) * | 2014-06-11 | 2015-12-16 | Applied Materials Switzerland Sàrl | Wafer cleaning system |
| CN105216127A (en) * | 2015-08-28 | 2016-01-06 | 厦门钨业股份有限公司 | Multi-line cutting method and multi-line cutting machine |
| CN105479610A (en) * | 2016-01-07 | 2016-04-13 | 金建华 | Multi-wire sawing machine with take-up and pay-off cylinders vertically arranged |
| CN107030907A (en) * | 2017-03-17 | 2017-08-11 | 浙江好亚能源股份有限公司 | The processing method of polysilicon chip |
| CN109622478A (en) * | 2019-01-31 | 2019-04-16 | 宁夏银和半导体科技有限公司 | Cleaning device after crystal bar slice |
| CN112372862A (en) * | 2020-11-12 | 2021-02-19 | 上海新昇半导体科技有限公司 | Crystal bar workpiece plate and crystal bar cutting method |
| CN115534151A (en) * | 2022-11-03 | 2022-12-30 | 浙江矽盛电子有限公司 | Monocrystalline silicon rod manufacturing and cutting device for solar cell |
-
1995
- 1995-06-13 JP JP14588795A patent/JP3075143B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011183503A (en) * | 2010-03-08 | 2011-09-22 | Takatori Corp | Wire saw |
| EP2955745A1 (en) * | 2014-06-11 | 2015-12-16 | Applied Materials Switzerland Sàrl | Wafer cleaning system |
| CN105216131A (en) * | 2014-06-11 | 2016-01-06 | 应用材料瑞士有限责任公司 | Chip cleaning system, silk saw and the method for the wafer in clean silk saw |
| JP2016015481A (en) * | 2014-06-11 | 2016-01-28 | アプライド マテリアルズ スウィッツァーランド エス アー エール エル | Wafer washing system |
| CN105216127A (en) * | 2015-08-28 | 2016-01-06 | 厦门钨业股份有限公司 | Multi-line cutting method and multi-line cutting machine |
| CN105479610A (en) * | 2016-01-07 | 2016-04-13 | 金建华 | Multi-wire sawing machine with take-up and pay-off cylinders vertically arranged |
| CN107030907A (en) * | 2017-03-17 | 2017-08-11 | 浙江好亚能源股份有限公司 | The processing method of polysilicon chip |
| CN109622478A (en) * | 2019-01-31 | 2019-04-16 | 宁夏银和半导体科技有限公司 | Cleaning device after crystal bar slice |
| CN112372862A (en) * | 2020-11-12 | 2021-02-19 | 上海新昇半导体科技有限公司 | Crystal bar workpiece plate and crystal bar cutting method |
| CN115534151A (en) * | 2022-11-03 | 2022-12-30 | 浙江矽盛电子有限公司 | Monocrystalline silicon rod manufacturing and cutting device for solar cell |
| CN115534151B (en) * | 2022-11-03 | 2023-08-22 | 浙江矽盛电子有限公司 | Cutting device for manufacturing monocrystalline silicon rod for solar cell |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3075143B2 (en) | 2000-08-07 |
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