JPH08335335A - Electroforming device of stamper for optical disk - Google Patents

Electroforming device of stamper for optical disk

Info

Publication number
JPH08335335A
JPH08335335A JP14016895A JP14016895A JPH08335335A JP H08335335 A JPH08335335 A JP H08335335A JP 14016895 A JP14016895 A JP 14016895A JP 14016895 A JP14016895 A JP 14016895A JP H08335335 A JPH08335335 A JP H08335335A
Authority
JP
Japan
Prior art keywords
electroforming
master
opening
optical disk
stamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14016895A
Other languages
Japanese (ja)
Inventor
Nobuhiro Tanaka
伸洋 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP14016895A priority Critical patent/JPH08335335A/en
Publication of JPH08335335A publication Critical patent/JPH08335335A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To stably form a stamper for optical disks having high accuracy. CONSTITUTION: This electroforming device has a nozzle 4 opened with plural injection ports 4-1 (i=1, 2,...n) for injecting an electroforming liquid in a direction perpendicular to a master disk 6 formed with a conductive metallic film between an anode 3 of an electroforming metal and a cathode 2 set with the master disk 6 within an electroforming main vessel 1 in which the electroforming liquid 7 is housed. The opening areas of these injection ports 4-1 are set successively larger from the center of the master disk 6 toward the outside end. The electroforming liquid injected to the master disk 6 is so injected as to be made uniform when the cathode 2 rotates around a shaft 2a, by which the electric lines of force are made uniform and the thickness of the electroforming film is made uniform.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光ディスク用スタンパ
の電鋳装置に関し、より詳細には、光情報記録媒体をレ
プリカ製造するためのスタンパの電鋳層を高精度な厚さ
にする電鋳装置に関し、精密電鋳表面処理等の工業分野
に利用される。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroforming apparatus for stampers for optical discs, and more particularly to an electroforming apparatus for making a replica of an optical information recording medium with a highly precise thickness. The apparatus is used in the industrial field such as precision electroforming surface treatment.

【0002】[0002]

【従来の技術】微小スポットを形成可能なレーザ光を活
用した製品としての光ディスクは、技術仕様が全世界的
に統一され、使用者と生産者何れにとっても利便性が高
いので、急速に用途が拡大している。更に、ニーズの多
様化により、光ディスクに収納される情報密度は、急速
に高くなっている。情報の高密度化は、光技術だけでな
く、光ディスクそのものの精度が要求され、これに伴っ
て、光ディスクをレプリカ製造するためのスタンパの精
度および加工の合理化が求められている。
2. Description of the Related Art Optical discs, which are products utilizing laser light capable of forming minute spots, have uniform technical specifications worldwide and are highly convenient for both users and producers. It is expanding. Further, due to the diversification of needs, the information density stored in the optical disc is rapidly increasing. In order to increase the information density, not only the optical technology but also the precision of the optical disc itself is required, and accordingly, the precision and processing of the stamper for replica manufacturing the optical disc are required to be rationalized.

【0003】スタンパは、ガラス原盤を精密研磨し、平
坦で高い面粗度に仕上げられ、研磨完了したガラス基板
上にスピンコートによりフォトレジストを、厚さ一定に
なるようにコーティングしたあと、ベーキングを行い、
これに情報に対応して変調されたレーザビームによる露
光が行われたあと、現像を行い、フォトレジスト層によ
る情報に応じた微細凹凸形状を形成する。微細凹凸形状
の上面には、スパッタリング法,真空蒸着法などの成膜
法により、導電性Ni被膜が施され、更に導電性Ni被
膜上にNi電鋳層が形成され、形成後、ガラス原盤から
剥離することによりスタンパが得られる。このように、
形成された電鋳層の厚さは、スタンパの精度を規定する
重要な要素となっている。
The stamper is obtained by precisely polishing a glass master plate, finishing it to a flat and high surface roughness, and coating a photoresist on the polished glass substrate by spin coating so that the photoresist has a constant thickness, and then baking it. Done,
After this is exposed by a laser beam modulated corresponding to information, development is carried out to form a fine concavo-convex shape according to information by the photoresist layer. A conductive Ni film is formed on the upper surface of the fine concavo-convex shape by a film forming method such as a sputtering method or a vacuum evaporation method, and a Ni electroformed layer is further formed on the conductive Ni film. A stamper is obtained by peeling. in this way,
The thickness of the formed electroformed layer is an important factor that defines the accuracy of the stamper.

【0004】Ni電鋳層は、導電性Ni被膜が施された
基板を陰極とし、電鋳のためのNiを陽極にした電鋳槽
の電鋳液内で生じたNiイオンを陰極で還元することに
より形成されるが、電鋳時の電気力線の密度が一定でな
い場合、電鋳層の厚さが不均一となることが知られてい
る。これを解決するための手段として、特開平7−64
13号公報による光記録媒体製造用スタンパの電鋳装置
および電鋳方法が開示された。
The Ni electroformed layer uses a substrate coated with a conductive Ni film as a cathode and reduces Ni ions produced in an electroforming solution in an electroforming bath in which Ni for electroforming is used as an anode. It is known that the thickness of the electroformed layer becomes non-uniform when the density of the lines of electric force during electroforming is not constant. As means for solving this, Japanese Patent Laid-Open No. 7-64
No. 13 discloses an electroforming apparatus and an electroforming method for a stamper for manufacturing an optical recording medium.

【0005】特開平7−6413号公報のスタンパの電
鋳方法は、電鋳装置の陽極と陰極との間隙に、原盤の有
効部より直径の小さい円形開口部と、その開口部周辺に
その開口部より直径の小さい小穴を有するバッフル板を
設けるか、開口部直径が可変のバッフル板を設け、その
開口部の直径を変えながら、スタンパの電鋳を行うもの
である。
In the stamper electroforming method disclosed in Japanese Patent Laid-Open No. 7-6413, a circular opening having a diameter smaller than the effective portion of the master is provided in the gap between the anode and the cathode of the electroforming apparatus, and the opening is formed around the opening. A baffle plate having small holes with a diameter smaller than that of the portion or a baffle plate having a variable opening diameter is provided, and the stamper is electroformed while the diameter of the opening is changed.

【0006】一般に、電鋳時の電気力線が中心部より周
端部に集中し易く、これに伴って膜厚が周端部の方が厚
くなるが、前記従来技術は、バッフル板に原盤の有効部
より直径の小さい円形開口部を設けることにより、外端
部の電気力線を遮閉し、原盤上の電気力線を一定にし、
電鋳層の厚さを均一にしようとするものである。
Generally, electric lines of force at the time of electroforming are more likely to be concentrated on the peripheral end portion than the central portion, and the film thickness at the peripheral end portion is thicker accordingly. By providing a circular opening whose diameter is smaller than the effective part of, the electric force lines at the outer end are blocked, and the electric force lines on the master are made constant,
This is intended to make the thickness of the electroformed layer uniform.

【0007】[0007]

【発明が解決しようとする課題】しかし、上記従来技術
の方法で用いられているバッフル板は、膜厚制御するた
めに開口部を設け、開口部の形状を選んで膜厚制御をし
ていたが、この方法によっても開口部の中央から周辺部
にかけて電鋳膜の膜厚が厚くなる傾向は防ぐことはでき
ず、均一な電鋳膜厚分布とするためには、開口部の開口
分布を変えたり、電鋳の時間経過に従って開口面積や電
流を調整する必要があるなど、膜厚分布を管理する上で
行われる微調整は、現実的には困難である。
However, the baffle plate used in the above-mentioned method of the prior art is provided with an opening for controlling the film thickness, and the shape of the opening is selected to control the film thickness. However, even with this method, the tendency of the thickness of the electroformed film to increase from the center of the opening to the peripheral portion cannot be prevented, and in order to obtain a uniform electroformed film thickness distribution, the opening distribution of the opening is It is practically difficult to make fine adjustments for managing the film thickness distribution, such as changing the opening area and adjusting the electric current with the lapse of electroforming.

【0008】本発明は、上述した従来技術の課題を解決
し、スタンパの電鋳膜厚が内外周において差のない均一
であり、更には、電鋳膜厚分条件の設定が容易にコント
ロールでき、更には、安定した電鋳膜厚が得られるとと
もに表面粗さが改善される安定して高精度なスタンパが
得られる電鋳装置を提供することを目的とする
The present invention solves the above-mentioned problems of the prior art, the electroformed film thickness of the stamper is uniform with no difference between the inner and outer circumferences, and the condition of the electroformed film thickness can be easily controlled. Furthermore, it is an object of the present invention to provide an electroforming apparatus that can obtain a stable electroformed film thickness and a stable and highly accurate stamper with improved surface roughness.

【0009】[0009]

【課題を解決するための手段】[Means for Solving the Problems]

(1)ガラス基板上のフォトレジスト層に設けられたト
ラック溝の微細凹凸形状上面に導電性Ni被膜を形成
し、該導電性Ni被膜上にNi電鋳を行う電鋳装置にお
いて、前記導電性Ni被膜に対し、略直角方向に電鋳液
を吐出する複数の噴射口を有する筒状のノズルを前記ガ
ラス基板の半径方向に配置し、前記噴射口は、前記基板
の中心部から周端部に向け順次開口面積を大きくしたこ
と、更には、(2)前記(1)において、前記複数の噴
射口を設けたノズルは、前記噴射口の開口面積を変更可
能な開閉機構を有すること、更には、前記(1)又は
(2)において(3)前記複数の噴射口を設けたノズル
を2本以上組合わせたことを特徴とするものである。
(1) In an electroforming apparatus for forming a conductive Ni coating on the upper surface of a fine uneven shape of a track groove provided in a photoresist layer on a glass substrate and performing Ni electroforming on the conductive Ni coating, A cylindrical nozzle having a plurality of injection ports for ejecting an electroforming liquid in a direction substantially perpendicular to the Ni coating film is arranged in the radial direction of the glass substrate, and the injection ports are provided from the central portion to the peripheral end portion of the substrate. And (2) in (1) above, the nozzle provided with the plurality of injection ports has an opening / closing mechanism capable of changing the opening area of the injection ports. In (1) or (2) above, (3) two or more nozzles provided with the plurality of injection ports are combined.

【0010】[0010]

【作用】回転する陰極側の導電性Ni被膜した原盤に対
して半後方向に開口した噴射口から面と直角に電鋳液を
噴射したとき、噴射された電鋳液が原盤の面に均一に噴
射されるように噴射口の開口面積を中心から周端側に順
次大きくし、電力線の密度を一定として電鋳膜厚を均一
にする。
When the electroforming liquid is jetted perpendicularly to the surface from the semi-rearwardly-opened master onto the rotating cathode-side electroconductive Ni-coated master, the sprayed electroforming liquid is evenly distributed on the master surface. The opening area of the injection port is gradually increased from the center to the peripheral end side so that the electric power line density is kept constant and the electroformed film thickness is made uniform.

【0011】[0011]

【実施例】【Example】

〔実施例1〕(請求項1に対応) 図1は、本発明による光ディスク用スタンパの電鋳装置
を説明するための図で、図1(A)は電鋳装置の側断面
図、図1(B)は、図1(A)の矢視A−A線断面図で
あり、図中、1は電鋳本槽、2は陰極、3は陽極、4は
ノズル、5はバッフル板、6は原盤、7は電鋳液であ
る。
[Embodiment 1] (corresponding to claim 1) FIG. 1 is a view for explaining an electroforming apparatus for an optical disk stamper according to the present invention. FIG. 1A is a side sectional view of the electroforming apparatus. 1B is a cross-sectional view taken along the line AA of FIG. 1A, in which 1 is an electroforming main tank, 2 is a cathode, 3 is an anode, 4 is a nozzle, 5 is a baffle plate, and 6 Is a master, and 7 is an electroforming liquid.

【0012】図1(A)に示した電鋳装置は、電鋳液7
を収容する電鋳本槽1に、電鋳金属のNi電極材とした
板状の陽極3が取り付けられ、陽極3には、周端部の電
気力線を制御する円環状の絶縁材からなるバックル板5
が接合されている。また、陽極3と平行に対向して板状
の陰極2が軸2aまわりに回動可能に取り付けられてお
り、陽極3と対向した陰極2の面にNi導電膜を形成し
た原盤6がセットされている。陽極3と陰極2との間に
は各々の面と略平行し、先端が閉止された円筒状のノズ
ル4が電鋳本槽1の底部を貫通して設けられている。ノ
ズル4は原盤6に向けて直角方向に電鋳液を吐出させる
もので、原盤6の中心から外周に向けた半径方向に複数
の噴射口4-1,〜4-i,〜4-nが等間隔に開口してい
る。
The electroforming apparatus shown in FIG. 1 (A) has an electroforming liquid 7
A plate-shaped anode 3 made of an electroformed metal Ni electrode material is attached to an electrocasting main tank 1 for accommodating an electroformed metal, and the anode 3 is made of an annular insulating material for controlling electric lines of force at a peripheral end portion. Buckle plate 5
Are joined. Further, a plate-shaped cathode 2 is attached in parallel with the anode 3 so as to be rotatable around an axis 2a, and a master 6 having a Ni conductive film formed on the surface of the cathode 2 facing the anode 3 is set. ing. Between the anode 3 and the cathode 2, a cylindrical nozzle 4 which is substantially parallel to each surface and has a closed tip is provided penetrating the bottom of the electroforming main tank 1. The nozzle 4 discharges the electroforming liquid in a direction perpendicular to the master 6, and has a plurality of injection ports 4 -1 , -4- i , -4- n in the radial direction from the center of the master 6 to the outer periphery. Open at equal intervals.

【0013】噴射口4-1,〜4-i,〜4-nの開口面積
は、図1(B)に示すように原盤6の中心から外周に向
けて順次大きくなっており、この大きさの関係は、陰極
2とともに回転する原盤6に対して噴射される電鋳液の
量が原盤6の全面積に亘って均等となるように選ばれて
いる。もし、噴射口の各々の面積が等しい場合は、回転
した原盤6に噴射される電鋳液の吐出量は、中心から周
端に向けて小さくなる。
As shown in FIG. 1 (B), the opening areas of the injection ports 4 -1 , 〜 4 -i , 〜 4 -n gradually increase from the center of the master 6 to the outer periphery, and this size is the same. The relationship is selected so that the amount of electroforming liquid sprayed onto the master 6 rotating with the cathode 2 is uniform over the entire area of the master 6. If the areas of the injection ports are equal, the discharge amount of the electroforming liquid injected onto the rotated master 6 decreases from the center toward the peripheral edge.

【0014】これを原盤6が回転したとき噴射口4が1
個が走査する円転原盤6の面積を、中心部半径r1から
1´までの面積S1と、周端部の半径r2からr2´とを
比較すると、 S1=π(r1´2−r1 2) S2=π(r2´2−r1 2) となり、S2>S1であるから中心部と外周部の噴射口の
面積が同一であれば各々の単位面積当りの電鋳液の吐出
量は外周側が少なくなる。これに対し、周端側の噴出口
の開口面積を中心側の開口面積よりも大きくし、例えば
1,5S2>S1に対応する比率で開口面積を選ぶことに
より、中心部より周端部の電鋳液の吐出量が多くなり原
盤6の全面積に亘って均一に電鋳液が吐出される。
When the master 6 is rotated, the injection port 4 becomes 1
Comparing the area of the rotary master 6 scanned by the individual pieces with the area S 1 from the center radius r 1 to r 1 ′ and the radius r 2 to r 2 ′ of the peripheral edge, S 1 = π (r 12 −r 1 2 ) S 2 = π (r 22 −r 1 2 ), and since S 2 > S 1 , if the area of the injection port in the central portion is the same as that in the outer peripheral portion, each unit The discharge amount of the electroforming liquid per area decreases on the outer peripheral side. On the other hand, by making the opening area of the jet port on the peripheral end side larger than the opening area on the central side and selecting the opening area at a ratio corresponding to, for example, 1,5S 2 > S 1 , The discharge amount of the electroforming liquid is increased and the electroforming liquid is uniformly discharged over the entire area of the master 6.

【0015】実施例1によると原盤6の中心部と周端部
との吐出面に均等に電鋳液が当たるので、電気力線が均
一化して電鋳膜厚の精度をあげることができる。
According to the first embodiment, since the electroforming liquid is evenly applied to the discharge surfaces of the central portion and the peripheral end portion of the master 6, the lines of electric force can be made uniform and the precision of the electroformed film thickness can be improved.

【0016】〔実施例2〕(請求項2に対応) 図2は、本発明による光ディスク用スタンパの電鋳装置
の第2実施例を説明するための図で、図2(A)はノズ
ル先端部斜視図、図2(B)は噴射口側からみたノズル
正面図であり、図中、10はノズル、11,12は開閉
板である。
[Second Embodiment] (Corresponding to Claim 2) FIG. 2 is a view for explaining a second embodiment of the electroforming apparatus for an optical disk stamper according to the present invention, and FIG. 2B is a front view of the nozzle as seen from the injection port side, in which 10 is a nozzle and 11 and 12 are opening and closing plates.

【0017】図2(A)において閉止されたノズル10
の先端側、すなわち、原盤6の中心側の噴射口10
-1は、ノズル10の壁面を四角形に開口した例で、開口
10-1内には、壁面に沿って周方向に回動して開口10
-1の開口面積を調整する開閉板11,12が設けられて
いる。図2(B)に示すように、開閉板11,12を回
動することにより、原盤6の周端部に向けて順次開口面
積が大きくなるように調整される。なお、開口形状は四
角形に限るものではなく、開閉板11,12は、噴射口
個別に又は複数連動して開閉できるものでもよい。
The nozzle 10 which is closed in FIG.
Of the injection port 10 on the tip side of
-1 is an example having an open wall of the nozzle 10 to a square, the opening 10 in -1, opening rotates in the circumferential direction along the wall surface 10
The opening / closing plates 11 and 12 for adjusting the opening area of -1 are provided. As shown in FIG. 2B, by rotating the opening / closing plates 11 and 12, the opening area is adjusted so as to be gradually increased toward the peripheral end portion of the master 6. The opening shape is not limited to the quadrangular shape, and the opening / closing plates 11 and 12 may be opened or closed individually or in combination with a plurality of injection ports.

【0018】実施例2によれば、噴射口の面積を任意に
調整できるので、電鋳液の噴射量を自由に調整でき、容
易に電鋳膜の膜厚の管理が可能となる。
According to the second embodiment, since the area of the injection port can be arbitrarily adjusted, the injection amount of the electroforming liquid can be freely adjusted, and the thickness of the electroformed film can be easily controlled.

【0019】図3は、本発明による光ディスク用スタン
パの電鋳装置の第3実施例を説明するための図で、図3
(A)は電鋳装置の側断面図、図3(B)はノズルの平
面図で、図中、8は電鋳液流管、20,21,22,2
3はノズルであり、図1と同様な作用をする部分には、
図1と同じ参照番号が付してある。
FIG. 3 is a view for explaining a third embodiment of the electroforming apparatus for optical disk stampers according to the present invention.
3A is a side sectional view of an electroforming apparatus, FIG. 3B is a plan view of a nozzle, in which 8 is an electroforming liquid flow tube, 20, 21, 22, 2
Reference numeral 3 is a nozzle, and a portion having the same function as in FIG.
The same reference numerals as in FIG. 1 are attached.

【0020】実施例3によるノズルは2以上のノズルを
設けた例であり、図3(B)では、ノズル20,21,
22,23の4本のノズルが設けられた場合で、各々同
一平面上に十字状に配置されている。各々の噴射口20
-i,21-i,22-i,23-i(i=1,2…,n)は、
面積が図1(B)にしめしたノズル4の場合と同様に中
心部から外端部に向けて順次大きくなっており、ノズル
が交叉した中央部には各々のノズルに共通した電鋳液を
供給する電鋳液流管8が設けられている。電鋳流管8
は、図3(A)に示すように陽極3の中央部を直角に貫
通して、噴射口20-i,21-i,22-i,23-iから原
盤6に向けて矢印で示すように直角に噴射される。
The nozzle according to the third embodiment is an example in which two or more nozzles are provided. In FIG. 3 (B), the nozzles 20, 21,
In the case where four nozzles 22 and 23 are provided, they are arranged in a cross shape on the same plane. Each injection port 20
-i , 21 -i , 22 -i , 23 -i (i = 1, 2, ..., n) is
As in the case of the nozzle 4 shown in FIG. 1 (B), the area gradually increases from the central portion toward the outer end portion, and the electroforming liquid common to each nozzle is provided in the central portion where the nozzles intersect. An electroforming liquid flow pipe 8 for supplying is provided. Electroformed flow tube 8
3A penetrates through the central portion of the anode 3 at a right angle as shown in FIG. 3A, and is indicated by an arrow from the injection ports 20 -i , 21 -i , 22 -i , 23 -i toward the master 6. Is sprayed at a right angle.

【0021】実施例3では電鋳液の噴出量がノズル本数
に比例して増加し、しかも、均等に噴出されるので、原
盤に付着した気体、例えば陰極に発生した水素ガスを効
果的に除去するので電鋳膜の面粗さが小さくなり平坦な
面が得られる。
In the third embodiment, the amount of electroforming liquid ejected increases in proportion to the number of nozzles and is evenly ejected, so that the gas adhering to the master, for example, hydrogen gas generated at the cathode is effectively removed. As a result, the surface roughness of the electroformed film is reduced and a flat surface is obtained.

【0022】[0022]

【発明の効果】以上の説明から明らかなように、本発明
によれば、以下の効果がある。 (1)請求項1に対応する効果:電鋳液を噴出する噴射
口を有するノズルを設け噴射口の開口面積を原盤の中心
部より周端部に向かって大きくしたので陰極(原盤)が
回転したとき中心部と周端部の噴射面に均等に電鋳液が
当り、電気力線を均一化して膜厚の精度を上げることが
できる。 (2)請求項2に対応する効果:請求項1の噴射口付き
ノズルの噴射口に開閉できる機能を設けたので、噴射口
を開閉することにより、自由に電鋳液の噴射量を調整で
きるから、容易に膜厚の管理が可能となり、色々な膜厚
条件に対応できる。 (3)請求項3に対応する効果:請求項1又は2の機構
をもったノズルを2本以上にしたので、噴射口が増えこ
れに比例して電鋳液の噴射量が増え、しかも、均等に原
盤に噴射できる。この結果、原盤に付着した気体を効果
良く除去し、電鋳膜における突起や凹みの発生を防ぐこ
とができ、表面粗さをより改善した電鋳を形成すること
が可能になるので、スタンパ裏面研磨に要する時間を短
縮でき、製造コストを低減できるという効果を奏する。
As is apparent from the above description, the present invention has the following effects. (1) Effect corresponding to claim 1: Since the nozzle having an injection port for ejecting the electroforming liquid is provided and the opening area of the injection port is increased from the central portion of the master toward the peripheral end, the cathode (master) rotates. At this time, the electroforming liquid is evenly applied to the injection surfaces of the central portion and the peripheral edge portion, and the lines of electric force can be made uniform to improve the accuracy of the film thickness. (2) Effect corresponding to claim 2: Since the injection port of the nozzle with an injection port of claim 1 is provided with a function that can be opened and closed, the injection amount of the electroforming liquid can be freely adjusted by opening and closing the injection port. Therefore, the film thickness can be easily controlled and various film thickness conditions can be dealt with. (3) Effect corresponding to claim 3: Since the number of nozzles having the mechanism of claim 1 or 2 is two or more, the number of injection ports is increased and the injection amount of electroforming liquid is increased in proportion thereto, and further, Can be sprayed evenly on the master. As a result, it is possible to effectively remove the gas adhering to the master and prevent the formation of protrusions and dents in the electroformed film, and it is possible to form electroformed with more improved surface roughness. The effect that the time required for polishing can be shortened and the manufacturing cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明による光ディスク用スタンパの電鋳装
置を説明するための図である。
FIG. 1 is a diagram for explaining an electroforming apparatus for an optical disk stamper according to the present invention.

【図2】 本発明による光ディスク用スタンパの電鋳装
置の第2実施例を説明するための図である。
FIG. 2 is a diagram for explaining a second embodiment of an electroforming apparatus for an optical disk stamper according to the present invention.

【図3】 本発明による光ディスク用スタンパの電鋳装
置の第3実施例を説明するための図である。
FIG. 3 is a view for explaining a third embodiment of the electroforming apparatus for an optical disk stamper according to the present invention.

【符号の説明】[Explanation of symbols]

1…電鋳本槽、2…陰極、3…陽極、4…ノズル、5…
バッフル板、6…原盤、7…電鋳液、10…ノズル、1
1,12…開閉板、8…電鋳液流管、20,21,2
2,23…ノズル。
1 ... Electroformed main tank, 2 ... Cathode, 3 ... Anode, 4 ... Nozzle, 5 ...
Baffle plate, 6 ... Master, 7 ... Electroforming liquid, 10 ... Nozzle, 1
1, 12 ... Open / close plate, 8 ... Electroforming liquid flow tube, 20, 21,
2, 23 ... Nozzles.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ガラス基板上のフォトレジスト層に設け
られたトラック溝の微細凹凸形状上面に導電性Ni被膜
を形成し、該導電性Ni被膜上にNi電鋳を行う電鋳装
置において、前記導電性Ni被膜に対し、略直角方向に
電鋳液を吐出する複数の噴射口を有する筒状のノズルを
前記ガラス基板の半径方向に配置し、前記噴射口は、前
記基板の中心部から周端部に向け順次開口面積を大きく
したことを特徴とする光ディスク用スタンパの電鋳装
置。
1. An electroforming apparatus for forming a conductive Ni coating on the upper surface of a fine uneven shape of a track groove provided in a photoresist layer on a glass substrate and performing Ni electroforming on the conductive Ni coating, Cylindrical nozzles having a plurality of injection ports for ejecting the electroforming liquid in a direction substantially perpendicular to the conductive Ni coating are arranged in the radial direction of the glass substrate, and the injection ports are surrounded by the central portion of the substrate. An electroforming device for an optical disk stamper, characterized in that the opening area is gradually increased toward the end.
【請求項2】 前記複数の噴射口を設けたノズルは、前
記噴射口の開口面積を変更可能な開閉機構を有すること
を特徴とする請求項1に記載の光ディスク用スタンパの
電鋳装置。
2. The electroforming apparatus for an optical disk stamper according to claim 1, wherein the nozzle provided with the plurality of ejection ports has an opening / closing mechanism capable of changing the opening area of the ejection ports.
【請求項3】 前記複数の噴射口を設けたノズルを2本
以上組合わせたことを特徴とする請求項1又は2に記載
の光ディスク用スタンパの電鋳装置。
3. The electroforming apparatus for an optical disk stamper according to claim 1, wherein two or more nozzles provided with the plurality of ejection ports are combined.
JP14016895A 1995-06-07 1995-06-07 Electroforming device of stamper for optical disk Pending JPH08335335A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14016895A JPH08335335A (en) 1995-06-07 1995-06-07 Electroforming device of stamper for optical disk

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14016895A JPH08335335A (en) 1995-06-07 1995-06-07 Electroforming device of stamper for optical disk

Publications (1)

Publication Number Publication Date
JPH08335335A true JPH08335335A (en) 1996-12-17

Family

ID=15262471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14016895A Pending JPH08335335A (en) 1995-06-07 1995-06-07 Electroforming device of stamper for optical disk

Country Status (1)

Country Link
JP (1) JPH08335335A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019206729A (en) * 2018-05-28 2019-12-05 三菱電機株式会社 Apparatus and method for manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019206729A (en) * 2018-05-28 2019-12-05 三菱電機株式会社 Apparatus and method for manufacturing semiconductor device

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