JPH0833241A - Microwave transmitter/receiver - Google Patents

Abstract

PURPOSE:To obtain a microwave transmitter/receiver in which variation is suppressed in the performance while reducing the weight and thickness by employing a multilayer laminate, where an antenna layer, a ground conductor layer, and a high frequency are laminated in this order, as a basic constitution. CONSTITUTION:The microwave transmitter/receiver, i.e., a multilayer laminate 1, comprises an antenna part layer 4 including an antenna element 2 formed of a microstrip line of a conductor and a dielectric antenna board 3 made of Teflon glass fiber, an aluminum plate 5 of ground conductor layer, and a high frequency module part layer 8 including a dielectric circuit board 6 of Teflon glass fiber and a high frequency module circuit 7 containing a phase shifter, an amplifier, etc. laminated in this order. An electromagnetic coupling slot 5a is made on the aluminum plate 5 and a pattern on the high frequency module circuit 7 is coupled electromagnetically with the antenna element 2. This structure suppresses vibration in the performance thus stabilizing the operation while reducing the weight and the thickness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to microwave transmission for transmitting electric power to a moving object such as outer space, an airship or an airplane, or an isolated object by microwave, and for receiving the electric power sent by microwave. The present invention relates to a power receiving device.

[0002]

2. Description of the Related Art Microwave power transmission and reception technology
Energy can be sent to places such as outer space where power lines cannot be drawn, flying moving objects such as airships and airplanes, and isolated objects.

Currently, various researches and developments are being carried out to establish a technique for transmitting and receiving electric power by microwaves. For example, as shown in FIG. There is a technique in which electric power is transmitted and electric power is received by a microwave power receiving device provided on the bottom surface of an airplane to rectify and rectify it to send power energy necessary for flight to the airplane for flight.

As a microwave power transmission device for transmitting electric power to such a flying object such as an airplane, a device as shown in FIG. 3 is known.

The microwave power transmission device shown in FIG. 3 is an antenna substrate 102 which is a dielectric having an antenna element 101 which is a conductor for transmitting microwaves adhered on the upper surface, and a conductor which is used as a voltage reference. Ground conductor 10
The antenna unit 100 is composed of 3 and a high frequency wave including a ground conductor 104 which is a conductor and a circuit necessary for amplifying electric power supplied from the outside and generating a high frequency signal radiated from the antenna element 101. Module 10
The high frequency module unit 109 is composed of 5.

The electric connection between the antenna section 100 and the high frequency module section 109 is made by connecting a connector 106 provided below the ground conductor 103 and a connector 108 provided above the ground conductor 103 with a connecting cable. 107
The antenna substrate 102 and the ground conductor 103 are bonded to each other and the ground conductor 104 and the high frequency module 105 are bonded and fixed to each other by tightening means such as a screw.

In this microwave power transmission device, the electric power supplied from the outside to the high frequency module 105 is converted into a high frequency signal by a phase shifter, a high output amplifier, etc. in the high frequency module 105, and this high frequency signal is directly transmitted. , Connector 108, connecting cable 107 and connector 10
6 is transmitted to the antenna element 101, is radiated from the antenna element 101 toward the target object as the power receiving object, and is received by the microwave power receiving device provided in the power receiving object, whereby power can be transmitted. Become.

[0008]

However, the direct power feeding type micro-device which directly supplies the antenna element 101 with the electric power converted into the high frequency signal through the conventional connector 106, the connecting cable 107 and the connector 108 as described above. In the wave power transmission device, the connection cable 107
Bend the connector 106, 108 to the ground conductor 103, 10
4 may change the phase of the high-frequency signal radiated from the antenna element 101 depending on the conditions of attachment to the antenna 4, the transmission loss of the high-frequency signal may cause a reduction in output, and may cause electromagnetic interference. However, there is a problem in that the power transmission efficiency may deteriorate and the beam steering characteristics may deteriorate.

Further, the microwave power transmission device is required to be lighter and thinner than before in order to be used for a flying object such as an artificial satellite, an airplane or an airship in outer space. In the device, the antenna unit 100 and the high-frequency module unit 109 are independent of each other, and the connector 106, the connecting cable 107, and the connector 108 are used for their electrical connection, so that it is difficult to reduce the weight and the thickness. Since the antenna substrate 102 and the ground conductor 103 are bonded and the ground conductor 104 and the high frequency module 105 are bonded and fixed by a fastening means such as a screw,
It is difficult to reduce the weight and stabilize the performance, and it has been a problem to solve these problems.

On the other hand, by changing the high-frequency module section of the microwave power transmission device to a rectifier circuit section composed of a rectifier circuit necessary for rectifying the power of the high-frequency signal received by the antenna element 101 and converting it into a DC output, Although it can be used as a wave power receiving device, the above-mentioned problems also exist in such a microwave power receiving device, and it has been a problem to solve these problems.

[0011]

SUMMARY OF THE INVENTION The present invention has been conceived in view of the above-mentioned conventional problems, and an object of the present invention is to provide a microwave power transmission / reception device which has a small variation in performance and is thin and lightweight.

[0012]

A microwave power transmission device according to the present invention is a microwave power transmission device for transmitting power to a target object as a power receiving object by a microwave, which is an antenna element and a dielectric. The antenna part layer composed of the antenna substrate, the ground conductor layer which is a conductor and serves as a voltage reference and in which the electromagnetic coupling slot is formed, the circuit substrate which is a dielectric, and amplifies electric power supplied from the outside. It is characterized in that a high-frequency module section layer composed of a circuit necessary for generating a high-frequency signal radiated from the antenna element is basically constituted by a multi-layer laminated plate laminated in this order.

In the embodiment of the microwave power transmission device according to the present invention, the antenna substrate, which is a dielectric, and the ground conductor layer, which is a conductor, are bonded (for example, heat-bonded) by a dielectric adhesive sheet (for example, a pressure-bonding sheet). In the embodiment, the ground conductor layer which is a conductor and the circuit board which is a dielectric may be thermocompression-bonded by a dielectric adhesive sheet. ,
Similarly, in the embodiment, the ground conductor layer which is a conductor and serves as a voltage reference and on which the electromagnetic coupling slot is formed may be a plate made of aluminum (including alloy).

A microwave power receiving device according to the present invention is a microwave power receiving device which receives electric power sent by microwaves, and an antenna part layer comprising an antenna element which is a conductor and an antenna substrate which is a dielectric. , A rectifier composed of a ground conductor layer which is a conductor and serves as a voltage reference and in which an electromagnetic coupling slot is formed, and a rectifier circuit necessary for rectifying a high frequency signal received by a circuit board and an antenna element which are dielectric bodies. It is characterized in that it is basically configured by a multi-layer laminated plate in which the circuit part layers are laminated in this order.

In the embodiment of the microwave power receiving device according to the present invention, the antenna substrate, which is a dielectric, and the ground conductor layer, which is a conductor, are bonded using a dielectric adhesive sheet (for example, a pressure bonding sheet). , Thermocompression bonding), and in the same embodiment, the ground conductor layer that is a conductor and the circuit board that is a dielectric are thermocompression bonded using a dielectric adhesive sheet. Similarly, in the embodiment, the ground conductor layer, which is a conductor and serves as a voltage reference and in which the electromagnetic coupling slot is formed, may be a plate made of aluminum (including alloy).

[0016]

The microwave power transmission device according to the present invention has the above-mentioned structure, and the antenna section layer including the antenna element which is a conductor and the antenna substrate which is a dielectric, and the conductor which serves as a voltage reference. And a high frequency wave composed of a ground conductor layer in which a slot for electromagnetic coupling is formed, a circuit board which is a dielectric, and a circuit necessary for amplifying electric power supplied from the outside to generate a high frequency signal radiated from an antenna element. Since the module part layer and the module part layer are basically composed of a multilayer laminated plate laminated in this order, the grounding conductor in which the electromagnetic coupling slot is formed for electrical connection between the antenna part and the high frequency module part. By using electromagnetic coupling through the layers, connection cables and connectors are not required, and the antenna layer, ground conductor layer, and high frequency By stacking the Joule part layers, the multilayer laminated plate antenna part and the high-frequency module part become a front and back integrated structure to be thin and lightweight, and the phase of the high-frequency signal radiated from the antenna element fluctuates. In addition, the transmission loss of high frequency signals, the output of the high frequency signal, the electromagnetic interference, and the like, and the reduction of the power transmission efficiency of electric power and the fluctuation of the beam steering characteristic are eliminated.

Further, the antenna substrate as a dielectric and the ground conductor layer as a conductor are adhered (for example, thermocompression bonded) by a dielectric adhesive sheet (for example, thermocompression bonding) and the ground as a conductor. By using a configuration in which the conductor layer and the circuit board that is a dielectric are adhered (for example, thermocompression bonded) by a dielectric adhesive sheet (for example, a pressure bonding sheet), the assembly process is simplified and arrayed or Mass production is facilitated, and because tightening means such as screws is not required for joining the substrates, the weight is further reduced, and the peel strength of the multilayer laminated plate is further increased.
Further, since a uniform layer is formed by the dielectric adhesive sheet during electromagnetic coupling between the antenna section and the high frequency module section, the dielectric constant in the multilayer laminated plate is less likely to vary, resulting in stable high frequency Electric power, which is a signal, is transmitted.

Further, the ground conductor layer, which is a conductor and serves as a voltage reference and in which the electromagnetic coupling slots are formed, is a plate made of aluminum, so that the strength of the multi-layer laminated plate can be secured and the multi-layer laminated plate can be secured. This reduces the influence of heat generated on the plate on the substrate and semiconductor components.

A microwave power receiving device according to the present invention is a rectifier circuit comprising a rectifying circuit necessary for rectifying the power of a high frequency signal received by an antenna element in a high frequency module section of the microwave power transmitting device and converting it into a direct current output. By changing to a part, it becomes a microwave power receiving device, and the same operation as that of the microwave power transmitting device according to the present invention described above is achieved.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional structural view of a multi-layer laminated board showing an embodiment of a microwave power transmission device according to the present invention.

In FIG. 1, a multi-layer laminated board 1 which is a microwave power transmission device comprises an antenna element 2 usually called a patch antenna formed by a microstrip line which is a conductor and a Teflon glass fiber antenna substrate which is a dielectric. And an aluminum plate 5 which is a ground conductor layer (ground) serving as a voltage reference.
And a circuit board 6 made of Teflon glass fiber, which is a dielectric, and a high frequency module circuit 7 including a phase shifter, an amplifier and the like necessary for converting an electric power supplied from the outside into a high output high frequency signal. The high frequency module section layer 8 is laminated in this order.

Then, the antenna substrate 3 and the aluminum plate 5, and the aluminum plate 5 and the circuit substrate 6 are thermocompression-bonded to each other using a dielectric adhesive sheet (compression sheet in this embodiment) 9. There is. Further, the aluminum plate 5 is provided with an electromagnetic coupling slot 5 for transmitting a high frequency signal generated in the high frequency module section to the antenna element 2.
a is formed, and the pattern on the high-frequency module circuit 7 and the antenna element 2 are electromagnetically coupled by the electromagnetic coupling method.

In the high frequency module circuit 7, a voltage reference (ground) is always necessary when converting the power supplied from the outside into a high output high frequency signal, but the aluminum plate 5 serves as the ground here. . In this case, the aluminum plate 5 and the high frequency module circuit 7 are connected to each other by forming holes in the circuit board 6 and the dielectric adhesive sheet 9 as shown in FIG.
Insert one side and directly bond one end to the aluminum plate 5 and fix the other end to the pattern of the high frequency module circuit 7 by the soldering portion 11, or form through-hole plating on the circuit board 6 and It is possible to provide a ground pattern on the module circuit 7 and connect it to the ground pattern, and surface mount the semiconductor 10 for power amplification on the ground pattern of the circuit board 6.

In the microwave power transmission device of FIG. 1, the antenna part layer 4, the aluminum plate 5 and the high frequency module part layer 8 are laminated to form a multilayer laminated plate 1 in which the antenna and the high frequency module circuit are integrated into the front and back surfaces. Moreover, the pattern on the high frequency module circuit 7 and the antenna element 2 are electromagnetically coupled by the electromagnetic coupling slot 5a formed in the plate 5 made of aluminum, so that the antenna element 2 is electrically connected as compared with the conventional case. Since a microwave cable, a connector, etc. are not required, the microwave power transmitting device can be made significantly thinner and lighter, and there are problems such as transmission loss of high frequency signals radiated from the antenna element 2, phase fluctuation, and electromagnetic interference. Since it can be improved and the structure is simplified, arraying and mass production are easy.

Further, since a cable, a connector and the like for electrically connecting are unnecessary, the microwave power transmitting device can be manufactured at low cost.

Further, by thermocompression-bonding the antenna substrate 3 and the aluminum plate 5 using the dielectric adhesive sheet 9, the assembly process is simplified, arraying and mass production are facilitated, and Relative positional accuracy can be easily obtained when joining the substrates, and further, the peeling strength of the multilayer laminated plate 1 can be increased, and the dielectric adhesive sheet can be used when electromagnetically coupling the antenna part and the high frequency module part. By forming a uniform layer by 9, it becomes difficult for the dielectric constant in the multilayer laminate 1 to vary, and as a result,
It becomes possible to stably transmit electric power which is a high frequency signal.

Further, since the aluminum plate 5 having the electromagnetic coupling slot 5a is used to electromagnetically couple the pattern on the high frequency module circuit 7 and the antenna element 2, the multilayer laminated plate 1 is used. The aluminum has a small specific gravity and contributes to weight reduction, and since it has a relatively high thermal conductivity, it has a high effect of releasing the heat generated when electromagnetically coupled. As a result, promotion of deterioration due to heat in the microwave power transmission device can be suppressed.

The high frequency module circuit 7 is replaced with a rectifying circuit for converting a high frequency signal received by the antenna element 2 into a DC output, and the power amplifying semiconductor 10 is replaced with a rectifying semiconductor, whereby It can be a power receiving device.

[0030]

As described above, according to the microwave power transmitting device of the present invention, the antenna section layer including the antenna element which is a conductor and the antenna substrate which is a dielectric, and the conductor A ground conductor layer serving as a voltage reference and having an electromagnetic coupling slot formed therein, a circuit board as a dielectric, and a circuit necessary for amplifying electric power supplied from the outside to generate a high frequency signal radiated from an antenna element. Since the high-frequency module part layer consisting of is basically composed of a multi-layer laminated plate laminated in this order, an electromagnetic coupling slot is formed for electrical connection between the antenna part and the high-frequency module part. By performing the electromagnetic coupling through the ground conductor layer, connection cables and connectors are unnecessary, and the antenna layer,
By stacking the ground conductor layer and the high-frequency module part layer, the antenna part and the high-frequency module part of the multi-layer laminated plate can be made into a front and back integrated structure, and can be made thinner and lighter. It is possible to prevent a reduction in power transmission efficiency due to fluctuations in the signal phase, high-frequency signal transmission loss, reduced output, electromagnetic interference, etc. Excellent effect can be obtained.

Further, the structure in which the antenna substrate as a dielectric and the ground conductor layer as a conductor are adhered using a dielectric adhesive sheet, and the ground conductor layer as a conductor and the circuit substrate as a dielectric are provided. By using a dielectric adhesive sheet for bonding, the assembly process can be simplified, arraying and mass production are easy, and it is possible to reduce the weight by eliminating the need for tightening means such as screws to join the boards. Next to
Furthermore, it is possible to increase the peel strength of the multilayer laminated plate, and it is possible to form a uniform layer by the dielectric adhesive sheet during electromagnetic coupling between the antenna part and the high frequency module part. It is possible to reduce the variation of the dielectric constant inside, and as a result, it is possible to stably transmit or receive electric power which is a high frequency signal.

Further, since the ground conductor layer, which is a conductor and serves as a voltage reference and in which the electromagnetic coupling slot is formed, is made of an aluminum plate, the strength of the multilayer laminated plate can be ensured and the weight is light. In addition to contributing to the realization of aluminum, the high thermal conductivity of aluminum can reduce the influence of heat generated in the multilayer laminated plate on the substrate and semiconductor components, and suppress the acceleration of deterioration of the microwave power transmitting and receiving device due to heat. It becomes possible to do.

Further, also in the microwave power receiving device according to the present invention in which the high frequency module circuit of the microwave power transmitting device according to the present invention and the power amplifying semiconductor are replaced with the rectifying circuit and the rectifying semiconductor, the same effects as above can be obtained. can get.

[Brief description of drawings]

FIG. 1 is a cross-sectional explanatory view showing an embodiment of a microwave power transmission device according to the present invention.

FIG. 2 is an explanatory diagram showing a state of power transmission / reception by a microwave power transmission / reception device in an airplane.

FIG. 3 is an explanatory cross-sectional view showing a conventional microwave power transmission device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer laminated board (microwave transmission (power receiving) device) 2 Power receiving element 3 Antenna substrate 4 Antenna part layer 5 Ground conductor layer (Ground) 6 Circuit board 7 High frequency module circuit 8 High frequency module part layer 9 Dielectric adhesive sheet 10 Power amplification semiconductor 11 Soldering part

Claims (8)

[Claims] 1. A microwave power transmitting device for transmitting power to a target object as a power receiving object by microwaves, comprising: an antenna part layer comprising an antenna element which is a conductor and an antenna substrate which is a dielectric; and a conductor. Required to generate a high-frequency signal radiated from the antenna element by amplifying the electric power supplied from the ground conductor layer that is the voltage reference and the electromagnetic coupling slot is formed, the circuit board that is a dielectric, and the outside. A microwave power transmission device, characterized in that a high-frequency module section layer composed of a high-frequency module circuit is basically constituted by a multilayer laminated plate laminated in this order. 2. The microwave power transmission device according to claim 1, wherein the antenna substrate, which is a dielectric, and the ground conductor layer, which is a conductor, are bonded by a dielectric adhesive sheet. 3. The microwave power transmission device according to claim 1, wherein the ground conductor layer that is a conductor and the circuit board that is a dielectric are bonded by a dielectric adhesive sheet. 4. The microwave according to claim 1, wherein the ground conductor layer, which is a conductor and serves as a voltage reference and in which a slot for electromagnetic coupling is formed, is a plate made of aluminum. Power transmission equipment. 5. In a microwave power receiving device for receiving electric power sent by microwaves, an antenna section layer comprising an antenna element which is a conductor and an antenna substrate which is a dielectric, and a voltage reference which is a conductor. In this order, the ground conductor layer in which the slot for electromagnetic coupling is formed and the rectifier circuit section layer including the rectifier circuit necessary for rectifying the high frequency signal received by the circuit substrate and the antenna element which are dielectrics are arranged in this order. A microwave power receiving device, which is basically configured by a laminated multilayer plate. 6. The microwave power receiving device according to claim 5, wherein the antenna substrate, which is a dielectric, and the ground conductor layer, which is a conductor, are adhered by a dielectric adhesive sheet. 7. The microwave power receiving device according to claim 5, wherein the ground conductor layer which is a conductor and the circuit board which is a dielectric are adhered by a dielectric adhesive sheet. 8. The microwave according to claim 5, wherein the ground conductor layer which is a conductor and serves as a voltage reference and in which a slot for electromagnetic coupling is formed is a plate made of aluminum. Power receiving device.