JPH08324013A - Thick film type thermal head - Google Patents

Thick film type thermal head

Info

Publication number
JPH08324013A
JPH08324013A JP19021996A JP19021996A JPH08324013A JP H08324013 A JPH08324013 A JP H08324013A JP 19021996 A JP19021996 A JP 19021996A JP 19021996 A JP19021996 A JP 19021996A JP H08324013 A JPH08324013 A JP H08324013A
Authority
JP
Japan
Prior art keywords
common electrode
silver film
thermal head
film
heating resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19021996A
Other languages
Japanese (ja)
Other versions
JP2815338B2 (en
Inventor
Hiroaki Hayashi
浩昭 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP19021996A priority Critical patent/JP2815338B2/en
Publication of JPH08324013A publication Critical patent/JPH08324013A/en
Application granted granted Critical
Publication of JP2815338B2 publication Critical patent/JP2815338B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

PURPOSE: To provide a low-cost thick film type thermal head of improving the printing quality level by reducing the thickness of a reinforcing silver film. CONSTITUTION: A common electrode 4 provided on a board is integrally coupled by a strip-like coupling part 4c, so disposed that the end 4a of the common electrode and the ends 6a of individual electrodes are alternately engaged, strip-like heating resistors 7 are formed on the ends 4a, 6a, silver films 5 are formed along the board edges 2a, 2b, further a plurality of branches 4b are branched from the part 4c in the direction perpendicular to the lengthwise direction of the resistor 7, and the films 5 are superposed on the branches 4b.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】この発明は、共通電極を銀膜
で補強した厚膜型サーマルヘッドに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick film type thermal head in which a common electrode is reinforced with a silver film.

【0002】[0002]

【従来の技術】従来の厚膜型サーマルヘッドの構成を図
5に基づいて以下に説明する。基板12はアルミナセラ
ミック等の材質よりなり、その表面には、蓄熱層として
のガラスグレーズ層13が形成されている。〔図5の
(a)参照〕。ガラスグレーズ層13上には、金膜より
なる共通電極14及び個別電極16が形成されており、
これらの先端部14a,16aは櫛歯状に交互に噛み合
う配置とされる〔図5の(b)参照〕。この金膜は金ペ
ーストを印刷・焼成してなるもので、金(Au)だけで
はなく、ガラス成分等も含まれている。これら共通電極
先端部14a,…、個別電極先端部16a,…上には、
帯状の発熱抵抗体17が形成されている。
2. Description of the Related Art The structure of a conventional thick film type thermal head will be described below with reference to FIG. The substrate 12 is made of a material such as alumina ceramic, and a glass glaze layer 13 as a heat storage layer is formed on the surface thereof. [See (a) of FIG. 5]. A common electrode 14 and an individual electrode 16 made of a gold film are formed on the glass glaze layer 13,
These tip portions 14a, 16a are arranged so as to mesh with each other in a comb-like shape (see FIG. 5B). This gold film is formed by printing and firing a gold paste, and contains not only gold (Au) but also glass components and the like. On the common electrode tip portions 14a, ..., Individual electrode tip portions 16a ,.
A band-shaped heating resistor 17 is formed.

【0003】図5に示すように、発熱抵抗体17が基板
12のエッジに沿って形成される場合、即ちエッジ型の
場合には、共通電極14の幅が大きくとれないため、そ
の抵抗値が増大し、電圧降下が大きくなってしまう。そ
こで、共通電極14上には、補強用の銀膜15を形成し
てある。この銀膜15も銀ペーストを印刷・焼成してな
るもので、銀(Ag)、ガラス成分等より構成される。
As shown in FIG. 5, when the heating resistor 17 is formed along the edge of the substrate 12, that is, in the case of an edge type, since the width of the common electrode 14 cannot be wide, its resistance value is And the voltage drop becomes large. Therefore, a reinforcing silver film 15 is formed on the common electrode 14. The silver film 15 is also formed by printing and firing a silver paste, and is composed of silver (Ag), a glass component and the like.

【0004】共通電極14、銀膜15、個別電極16及
び発熱抵抗体17は、耐摩耗層18で被覆されると共
に、感熱記録紙との摩耗から保護される。
The common electrode 14, the silver film 15, the individual electrodes 16 and the heating resistor 17 are covered with a wear resistant layer 18 and are protected from wear with the thermal recording paper.

【0005】[0005]

【発明が解決しようとする課題】上記銀膜は、銀ペース
トを印刷し、これを高温で焼成して形成されるが、その
際に金膜中の金により合金化層が生じてしまい、比抵抗
が増大してしまう。図4の(a)に示すように、グレー
ズ層13上に銀膜Sのみで共通電極を構成した場合で
は、8インチサイズのサーマルヘッドで共通電極の抵抗
値は約0.7Ωとなる。ところが、図4の(b)に示す
ように、金膜G上に銀膜Sを重ねて共通電極とした場合
には、8インチサイズのサーマルヘッドで1.8Ωにま
で抵抗値が増大し、銀膜Sのみの場合と比べて2倍以上
になってしまう。
The silver film is formed by printing a silver paste and firing it at a high temperature. At that time, the gold in the gold film causes an alloying layer to be formed. The resistance increases. As shown in FIG. 4A, when the common electrode is composed of only the silver film S on the glaze layer 13, the resistance value of the common electrode is about 0.7Ω in an 8-inch thermal head. However, as shown in FIG. 4B, when the silver film S is overlaid on the gold film G to form a common electrode, the resistance value increases to 1.8Ω with an 8-inch size thermal head, This is more than double the case of using only the silver film S.

【0006】そこで、従来は銀膜を二層以上重ねて抵抗
値を下げることが行われており、図5では、二層の銀膜
15a,15bを積層し(例えば両者の膜厚は共に10
μm)、共通電極14を補強している。ところが、銀膜
を積層して形成し、その膜厚を大きくすると、それだけ
銀(ペースト)が多量に必要となり、コストが上昇して
しまう問題点があった。又、銀膜15と発熱抵抗体17
との高低差が大きくなり、発熱抵抗体17へのプラテン
(図示せず)の当たりが弱くなり、印字濃度が下がっ
て、印字品位が損なわれる。このため、印字濃度を上げ
るには、印加するエネルギを増加しなければならない問
題点があった。
Therefore, conventionally, it has been practiced to reduce the resistance value by stacking two or more silver films, and in FIG. 5, two layers of silver films 15a and 15b are laminated (for example, both film thicknesses are 10
μm), and the common electrode 14 is reinforced. However, if silver films are formed by stacking and the film thickness is increased, a large amount of silver (paste) is required, which causes a problem of cost increase. Also, the silver film 15 and the heating resistor 17
The platen (not shown) hits the heating resistor 17 weakly, the printing density is lowered, and the printing quality is impaired. Therefore, there is a problem that the applied energy must be increased in order to increase the print density.

【0007】この発明は、上記に鑑みなされたもので、
補強用銀膜の膜厚を小さくし、コストの低減及び印字品
位の向上を図れる厚膜型サーマルヘッドの提供を目的と
している。
The present invention has been made in view of the above,
It is an object of the present invention to provide a thick film type thermal head capable of reducing the thickness of the reinforcing silver film to reduce the cost and improve the printing quality.

【0008】[0008]

【課題を解決するための手段】前記目的を達成するため
に、本発明の請求項1の厚膜型サーマルヘッドは、基板
上に帯状の発熱抵抗体を設け、この発熱抵抗体と前記基
板エッジとの間に帯状の金による共通電極を設け、この
共通電極の一部分に銀による膜(銀膜)を重ねてなるサ
ーマルヘッドにおいて、前記共通電極と銀膜とが、共通
電極から前記発熱抵抗体の長手方向に直交する方向に分
岐する複数の分岐部で重なるように構成したことを特徴
とする。
In order to achieve the above object, the thick film type thermal head according to claim 1 of the present invention is provided with a strip-shaped heating resistor on a substrate, and the heating resistor and the substrate edge. In a thermal head in which a strip-shaped gold common electrode is provided between the common electrode and a silver film (silver film) on a part of the common electrode, the common electrode and the silver film are formed from the common electrode to the heating resistor. It is characterized in that a plurality of branching portions that branch in a direction orthogonal to the longitudinal direction of are overlapped.

【0009】このサーマルヘッドでは、構造的に共通電
極(金膜)と銀膜との重なり面積を効率的に減少させる
ことが可能となる。つまり、共通電極の分岐部と銀膜と
の重なり部分を必要最低限とすることが容易であり、そ
れにより、合金層の発生を抑え、銀膜の比抵抗が上昇す
るのを防止する。又、請求項2の厚膜型サーマルヘッド
は、基板と、共通電極及び当該共通電極と重ならない発
熱抵抗体との間には、グレーズ層を介在させると共に、
共通電極の複数の分岐部と銀膜とは部分的に重なり、隣
合う分岐部と銀膜との間にグレーズ層が露出する空白部
を形成し、共通電極と発熱抵抗体を含む基板の上にガラ
スよりなる耐摩耗層を設けてなることを特徴とする。
In this thermal head, structurally, it is possible to efficiently reduce the overlapping area of the common electrode (gold film) and the silver film. That is, it is easy to minimize the overlapping portion between the branch portion of the common electrode and the silver film, thereby suppressing the generation of the alloy layer and preventing the specific resistance of the silver film from increasing. In the thick-film thermal head according to claim 2, a glaze layer is interposed between the substrate, the common electrode and the heating resistor that does not overlap the common electrode, and
On the substrate including the common electrode and the heating resistor, a plurality of branches of the common electrode partially overlap with the silver film to form a blank portion where the glaze layer is exposed between the adjacent branches and the silver film. It is characterized in that a wear-resistant layer made of glass is provided on.

【0010】このサーマルヘッドでは、隣合う分岐部と
銀膜との間に、グレーズ層が露出する空白部が形成され
るので、共通電極の下層のグレーズ層と上層のガラスよ
りなる耐摩耗層とが直接接触するようになり、共通電極
を挟む上下の層を相互に強固に接着することが可能とな
り、分岐部等の細いパターンを有する共通電極の剥離問
題を防止できる。
In this thermal head, since a blank portion where the glaze layer is exposed is formed between the adjacent branch portion and the silver film, a glaze layer below the common electrode and a wear resistant layer made of glass above the common electrode are formed. Are in direct contact with each other, the upper and lower layers sandwiching the common electrode can be firmly adhered to each other, and the peeling problem of the common electrode having a thin pattern such as a branch portion can be prevented.

【0011】[0011]

【発明の実施の形態】以下、本発明を実施の形態に基づ
いて説明する。図1は、実施形態に係る厚膜型サーマル
ヘッドの耐摩耗層を省略して示す要部平面図、図3の
(a),(b)は、それぞれ図1のIIa−IIa線、
IIb−IIb線における要部断面図である。
BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below based on embodiments. FIG. 1 is a plan view of a main part of the thick film thermal head according to the embodiment, in which an abrasion resistant layer is omitted, and FIGS. 3A and 3B are lines IIa-IIa in FIG. 1, respectively.
It is a principal part sectional drawing in the IIb-IIb line.

【0012】基板2は、アルミナセラミック等の材質よ
りなる。この基板2上には、蓄熱層として機能するガラ
スグレーズ層3が形成されている〔図3の(a),
(b)参照〕。このガラスグレーズ層3は、基板2の表
面に非晶質ガラスペーストを印刷し、これを焼成してな
るものである。このガラスグレーズ層3上には、共通電
極4,…4、個別電極6,…,6が形成される。まず、
ガラスグレーズ層3上に金ペーストを印刷し、これを焼
成して金膜とする。更に、この金膜をホトリソグラフィ
を適用してパターン付けし、共通電極4,…4、個別電
極6,…,6とする。
The substrate 2 is made of a material such as alumina ceramic. A glass glaze layer 3 functioning as a heat storage layer is formed on the substrate 2 ((a) of FIG. 3,
(B)]. The glass glaze layer 3 is formed by printing an amorphous glass paste on the surface of the substrate 2 and firing the paste. On the glass glaze layer 3, the common electrodes 4, ... 4, The individual electrodes 6 ,. First,
Gold paste is printed on the glass glaze layer 3 and baked to form a gold film. Further, this gold film is patterned by applying photolithography to form common electrodes 4, ... 4, Individual electrodes 6 ,.

【0013】共通電極4,…4は、細かい線状のパター
ンであり、基板2のエッジ2aに沿って延伸する帯状の
連結部4cに一体に連結され、先端部4a,…,4aに
交互に噛み合うように個別電極6,…,6の先端部6
a,…,6aが配置されている。又、共通電極連結部4
cからは、発熱抵抗体7の長手方向に直交する方向に基
板エッジ2aに向かって延びる複数の分岐部(後端部4
b,…,4b)が分岐している。
The common electrodes 4, ... 4 have a fine linear pattern, are integrally connected to a strip-shaped connecting portion 4c extending along the edge 2a of the substrate 2, and are alternately connected to the tip portions 4a ,. The tips 6 of the individual electrodes 6, ..., 6 so as to mesh with each other
, a, 6a are arranged. Also, the common electrode connecting portion 4
From c, a plurality of branch portions (rear end portion 4) extending toward the substrate edge 2a in the direction orthogonal to the longitudinal direction of the heating resistor 7 are formed.
b, ..., 4b) are branched.

【0014】前記ガラスグレーズ層3上には、補強用の
銀膜5が形成される。この銀膜5は、基板エッジ2a、
サイドエッジ2b,2bに沿って延伸する帯状のもの
で、ガラスグレーズ層3上に印刷した銀ペーストを焼成
してなる単層のものである。この銀膜5は、共通電極分
岐部4b,…,4b上に重なり、1つ1つの重なり領域
は、例えばx=0.1mm、y=0.05mmとされて
いる。この銀膜5と分岐部4bとが重なることで、銀膜
5と隣合う共通電極の分岐部4b,4bとで囲まれた四
角形部分は、銀膜や共通電極が存在せずにガラスグレー
ズ層3が露出する空白部9となる。又、銀膜5の引き出
し部5b,5bは、前記共通電極連結部4cの端部4
d,4d上にそれぞれ重なっている。
A reinforcing silver film 5 is formed on the glass glaze layer 3. This silver film 5 is formed on the substrate edge 2a,
It is a strip-shaped member extending along the side edges 2b, 2b, and is a single layer formed by firing a silver paste printed on the glass glaze layer 3. The silver film 5 is overlapped on the common electrode branch portions 4b, ..., 4b, and each overlap area is set to x = 0.1 mm and y = 0.05 mm, for example. By overlapping the silver film 5 and the branching portion 4b, the rectangular portion surrounded by the silver film 5 and the branching portions 4b and 4b of the adjacent common electrode does not have the silver film or the common electrode, and thus the glass glaze layer is not present. 3 becomes the exposed blank portion 9. Further, the lead-out portions 5b, 5b of the silver film 5 are the end portions 4 of the common electrode connecting portion 4c.
d and 4d, respectively.

【0015】共通電極先端部4a及び個別電極先端部6
a上には、帯状の発熱抵抗体7が形成される。この発熱
抵抗体7は、ガラスグレーズ層3上に、酸化ルテニウム
等の抵抗成分を含む抵抗体ペーストをスクリーン印刷
し、これを焼成してなるもので、相隣る共通電極先端部
4a,4aで挟まれる抵抗体部分が1つのドットに対応
している。発熱抵抗体7の幅は約200μm程度で、そ
の中心と基板エッジ2aとの距離dは2.2mmの仕様
が現在多く用いられている。この場合には、銀膜5、連
結部4cの幅は、それぞれ1mm、0.5mm程度とる
ことができる。
Common electrode tip 4a and individual electrode tip 6
A strip-shaped heating resistor 7 is formed on a. The heating resistor 7 is formed by screen-printing a resistor paste containing a resistance component such as ruthenium oxide on the glass glaze layer 3 and firing the paste. In the adjacent common electrode tips 4a, 4a, The sandwiched resistor portion corresponds to one dot. The heating resistor 7 has a width of about 200 μm, and a distance d between the center of the heating resistor 7 and the substrate edge 2a is 2.2 mm. In this case, the widths of the silver film 5 and the connecting portion 4c can be about 1 mm and 0.5 mm, respectively.

【0016】基板2上には、更に耐摩耗層8が形成さ
れ、共通電極4,…,4、銀膜5、個別電極6,…,
6、発熱抵抗体7が被覆されて、これらが絶縁されると
共に、感熱記録紙等との摩耗より保護される。この耐摩
耗層8も、非晶質ガラスペーストを印刷し、これを焼成
してなるものである。この実施形態の厚膜型サーマルヘ
ッドでは、共通電極連結部4cから分岐する分岐部4b
と銀膜5が重なる構造であるから、金膜よりなる共通電
極4,…,4と銀膜5との重なり領域を極力小さくする
ことができ、金膜と銀膜との相互作用により生じる合金
層も少なくなり、銀膜5の比抵抗の増加を防止できる。
このため、銀膜5の膜厚を従来の1/2程度にまで小さ
くすることができ、銀(ペースト)の使用量を従来より
も約50%低減することができる。又、銀膜5と発熱抵
抗体7との高低差が小さくなり、発熱抵抗体7へのプラ
テンの当たりが改善される。
A wear resistant layer 8 is further formed on the substrate 2, and the common electrodes 4, ..., 4, the silver film 5, the individual electrodes 6 ,.
6. The heating resistor 7 is coated to insulate them, and at the same time, they are protected from abrasion with thermal recording paper and the like. The abrasion resistant layer 8 is also formed by printing an amorphous glass paste and firing it. In the thick film type thermal head of this embodiment, the branch portion 4b branched from the common electrode connecting portion 4c.
Since the silver film 5 and the silver film 5 overlap each other, the overlapping region between the common electrodes 4, ..., 4 made of a gold film and the silver film 5 can be made as small as possible, and the alloy produced by the interaction between the gold film and the silver film. The number of layers is reduced, and an increase in the specific resistance of the silver film 5 can be prevented.
Therefore, the thickness of the silver film 5 can be reduced to about 1/2 of the conventional thickness, and the amount of silver (paste) used can be reduced by about 50% as compared with the conventional one. Further, the height difference between the silver film 5 and the heating resistor 7 becomes small, and the contact of the platen with the heating resistor 7 is improved.

【0017】更に、共通電極が複数の分岐部4bを有
し、この分岐部4bに帯状の銀膜5が重なる構造である
ため、前記したように、銀膜5と隣合う共通電極の分岐
部4b,4bとで囲まれた四角形部分は、ガラスグレー
ズ層3が露出する空白部9となる。このため、空白部9
上に形成されるガラスよりなる耐摩耗層8と空白部9に
露出するガラスグレーズ層3とが、直接接触することに
なり、銀膜5、共通電極4及び発熱抵抗体7等を含む基
板2上に耐摩耗層8をより強い接着力で設けることがで
きる。
Further, since the common electrode has a plurality of branch portions 4b and the strip-shaped silver film 5 overlaps the branch portions 4b, as described above, the branch portion of the common electrode adjacent to the silver film 5 is formed. A quadrangle portion surrounded by 4b and 4b becomes a blank portion 9 where the glass glaze layer 3 is exposed. Therefore, the blank part 9
The abrasion resistant layer 8 made of glass and the glass glaze layer 3 exposed in the blank portion 9 are in direct contact with each other, and the substrate 2 including the silver film 5, the common electrode 4, the heating resistor 7, etc. The abrasion resistant layer 8 can be provided on the top with a stronger adhesive force.

【0018】つまり、一般に、ガラス成分の含有率が低
い共通電極は、ガラスを主成分とする下層のガラスグレ
ーズ層3と上層の耐摩耗層8との接着性が悪いが、ガラ
スグレーズ層3が露出する空白部9を分岐部4bと交互
に複数設けることで、相互に強固に接着し合うガラスグ
レーズ層3と耐摩耗層8との接着部分が多くなり、ガラ
スグレーズ層3や耐摩耗層8との接着性の低い共通電極
が両層3,8から剥離する問題を防止することができ
る。
That is, in general, a common electrode having a low glass component content has poor adhesion between the lower glass glaze layer 3 and the upper abrasion resistant layer 8 which are mainly composed of glass, but the glass glaze layer 3 By providing a plurality of exposed blank portions 9 alternately with the branch portions 4b, the number of adhesive portions between the glass glaze layer 3 and the abrasion resistant layer 8 that strongly adhere to each other increases, and the glass glaze layer 3 and the abrasion resistant layer 8 are increased. It is possible to prevent the problem that the common electrode having a low adhesiveness with is separated from both layers 3 and 8.

【0019】ところで、この実施形態の厚膜型サーマル
ヘッドでは、共通電極4,…,4が細かい線状のパター
ンとなるため、その一部が欠損する危険性が高くなる。
図2は、共通電極分岐部4bの1つが欠損した場合(4
bx)を示しているが、この場合には、当該共通電極4
が連結部4cにより隣接する共通電極4と導通している
ため、印字には支障が生じない。このように連結部4c
は、共通電極分岐部4bに欠損が生じても、印字が行え
るよう保証する役割を果たしている。
By the way, in the thick film type thermal head of this embodiment, since the common electrodes 4, ..., 4 have a fine linear pattern, there is a high risk that some of them will be lost.
FIG. 2 shows a case where one of the common electrode branches 4b is missing (4
bx) is shown, but in this case, the common electrode 4
Is connected to the adjacent common electrode 4 by the connecting portion 4c, so that printing is not hindered. Thus, the connecting portion 4c
Plays a role of ensuring that printing can be performed even if a defect occurs in the common electrode branch portion 4b.

【0020】[0020]

【発明の効果】この発明の請求項1の厚膜型サーマルヘ
ッドによれば、以上説明したように構成されるため、下
記の効果(1)〜(3)を有する。 (1)共通電極から分岐する複数の分岐部に銀膜が重な
る構造であるため、両者(金膜と銀膜)との重なり面積
を効率的に減少させることが可能となる。 (2)銀膜の膜厚を小さくし、銀(ペースト)の使用量
を減らしてコストの低減を図ると共に、印字濃度を上げ
て印字品位の向上及び駆動時の省エネルギ化を図ること
ができる。 (3)共通電極の分岐部が発熱抵抗体の長手方向に直交
する方向、即ち感熱記録紙やプラテンが当たる方向に延
びているので、感熱記録紙やプラテンのサーマルヘッド
への当たりを良好にできる。
According to the thick film type thermal head of claim 1 of the present invention, since it is configured as described above, it has the following effects (1) to (3). (1) Since the silver film overlaps a plurality of branch portions branched from the common electrode, it is possible to efficiently reduce the overlapping area with both (gold film and silver film). (2) It is possible to reduce the thickness of the silver film and reduce the amount of silver (paste) used to reduce the cost, and increase the print density to improve the print quality and save energy during driving. . (3) Since the branch portion of the common electrode extends in the direction orthogonal to the longitudinal direction of the heating resistor, that is, in the direction in which the thermal recording paper or the platen abuts, the thermal recording paper or the platen can be satisfactorily contacted with the thermal head. .

【0021】又、請求項2の厚膜型サーマルヘッドによ
れば、下記の効果(4)を有する。 (4)隣合う分岐部と銀膜との間に、グレーズ層が露出
する空白部が形成されるので、共通電極の下層のグレー
ズ層と上層のガラスよりなる耐摩耗層とが直接接触する
ようになり、共通電極を挟む上下の層を相互に強固に接
着することが可能となり、分岐部等の細いパターンを有
する共通電極の剥離問題を防止できる。
According to the thick film type thermal head of the second aspect, the following effect (4) is obtained. (4) Since a blank portion where the glaze layer is exposed is formed between the adjacent branch portion and the silver film, the glaze layer below the common electrode and the abrasion resistant layer made of glass above the common electrode should be in direct contact with each other. Therefore, the upper and lower layers sandwiching the common electrode can be firmly adhered to each other, and the problem of peeling of the common electrode having a thin pattern such as a branch portion can be prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】この発明の一実施形態に係る厚膜型サーマルヘ
ッドの耐摩耗層を省略して示す要部平面図である。
FIG. 1 is a plan view of an essential part showing a wear resistant layer of a thick film type thermal head according to an embodiment of the present invention.

【図2】同厚膜型サーマルヘッドの共通電極に欠損が生
じた場合を説明する要部平面図である。
FIG. 2 is a plan view of relevant parts for explaining a case where a defect occurs in a common electrode of the thick film type thermal head.

【図3】同厚膜型サーマルヘッドの図1のIIa−II
a線における要部断面図(a)、及びIIb−IIb線
における要部断面図(b)である。
3 is a thick film type thermal head of FIG. 1 IIa-II.
It is the principal part sectional view in the a line, and the principal part sectional view in the IIb-IIb line.

【図4】銀膜単層での抵抗値の挙動を説明する断面図で
ある。
FIG. 4 is a cross-sectional view for explaining the behavior of the resistance value in a silver film single layer.

【図5】従来の厚膜型サーマルヘッドの要部断面図
(a)、及び同従来の厚膜型サーマルヘッドの耐摩耗層
を省略して示す要部平面図(b)である。
FIG. 5 is a cross-sectional view (a) of a main part of a conventional thick film thermal head, and a plan view (b) of a main part of the conventional thick film thermal head with an abrasion resistant layer omitted.

【符号の説明】[Explanation of symbols]

2 基板 3 ガラスグレーズ層 4,…,4 共通電極 4c 共通電極連結部 4a,…,4a 共通電極先端部 4b,…,4b 共通電極分岐部 5 銀膜 6,…,6 個別電極 6a,…,6a 個別電極先端部 7 発熱抵抗体 9 空白部 2 substrate 3 glass glaze layer 4, ..., 4 common electrode 4c common electrode connection part 4a, ..., 4a common electrode tip part 4b, ..., 4b common electrode branch part 5 silver film 6, ..., 6 individual electrode 6a ,. 6a Tip of individual electrode 7 Heating resistor 9 Blank part

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】基板上に帯状の発熱抵抗体を設け、この発
熱抵抗体と前記基板エッジとの間に帯状の金による共通
電極を設け、この共通電極の一部分に銀による膜(銀
膜)を重ねてなるサーマルヘッドにおいて、 前記共通電極と銀膜とは、共通電極から前記発熱抵抗体
の長手方向に直交する方向に分岐する複数の分岐部で重
なるように構成したことを特徴とする厚膜型サーマルヘ
ッド。
1. A strip-shaped heating resistor is provided on a substrate, a strip-shaped common electrode made of gold is provided between the heating resistor and the substrate edge, and a silver film (silver film) is formed on a part of the common electrode. In the thermal head, the common electrode and the silver film are configured so that the common electrode and the silver film are overlapped by a plurality of branch portions that branch from the common electrode in a direction orthogonal to the longitudinal direction of the heating resistor. Membrane type thermal head.
【請求項2】前記基板と、共通電極及び当該共通電極と
重ならない発熱抵抗体との間には、グレーズ層を介在さ
せると共に、前記共通電極の複数の分岐部と銀膜とは部
分的に重なり、隣合う分岐部と銀膜との間に前記グレー
ズ層が露出する空白部を形成し、前記共通電極と発熱抵
抗体を含む基板の上にガラスよりなる耐摩耗層を設けて
なることを特徴とする請求項1記載の厚膜型サーマルヘ
ッド。
2. A glaze layer is interposed between the substrate, a common electrode, and a heating resistor that does not overlap the common electrode, and a plurality of branch portions of the common electrode and a silver film are partially formed. A blank part where the glaze layer is exposed is formed between the overlapping and adjacent branch parts and the silver film, and a wear resistant layer made of glass is provided on the substrate including the common electrode and the heating resistor. The thick film thermal head according to claim 1, which is characterized in that:
JP19021996A 1996-07-19 1996-07-19 Thick film type thermal head Expired - Lifetime JP2815338B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19021996A JP2815338B2 (en) 1996-07-19 1996-07-19 Thick film type thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19021996A JP2815338B2 (en) 1996-07-19 1996-07-19 Thick film type thermal head

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2109089A Division JP2578242B2 (en) 1990-04-25 1990-04-25 Thick film type thermal head

Publications (2)

Publication Number Publication Date
JPH08324013A true JPH08324013A (en) 1996-12-10
JP2815338B2 JP2815338B2 (en) 1998-10-27

Family

ID=16254464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19021996A Expired - Lifetime JP2815338B2 (en) 1996-07-19 1996-07-19 Thick film type thermal head

Country Status (1)

Country Link
JP (1) JP2815338B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002002005A (en) * 2000-06-19 2002-01-08 Rohm Co Ltd Thick film type thermal printing head
JP2012111049A (en) * 2010-11-19 2012-06-14 Rohm Co Ltd Thermal print head and method of manufacturing the same
CN102555515A (en) * 2010-11-19 2012-07-11 罗姆股份有限公司 Thermal print head and method of manufacturing the same
JP2022044731A (en) * 2016-10-11 2022-03-17 ローム株式会社 Thermal print head and thermal print head manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002002005A (en) * 2000-06-19 2002-01-08 Rohm Co Ltd Thick film type thermal printing head
JP2012111049A (en) * 2010-11-19 2012-06-14 Rohm Co Ltd Thermal print head and method of manufacturing the same
CN102555515A (en) * 2010-11-19 2012-07-11 罗姆股份有限公司 Thermal print head and method of manufacturing the same
JP2022044731A (en) * 2016-10-11 2022-03-17 ローム株式会社 Thermal print head and thermal print head manufacturing method

Also Published As

Publication number Publication date
JP2815338B2 (en) 1998-10-27

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