JPH08323913A - Composite panel - Google Patents

Composite panel

Info

Publication number
JPH08323913A
JPH08323913A JP15702795A JP15702795A JPH08323913A JP H08323913 A JPH08323913 A JP H08323913A JP 15702795 A JP15702795 A JP 15702795A JP 15702795 A JP15702795 A JP 15702795A JP H08323913 A JPH08323913 A JP H08323913A
Authority
JP
Japan
Prior art keywords
adhesive
plywood
water
composite panel
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15702795A
Other languages
Japanese (ja)
Inventor
Koji Higuchi
晃司 樋口
Mitsuo Nishimura
光雄 西村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eidai Co Ltd
Original Assignee
Eidai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eidai Co Ltd filed Critical Eidai Co Ltd
Priority to JP15702795A priority Critical patent/JPH08323913A/en
Publication of JPH08323913A publication Critical patent/JPH08323913A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the warpage of a composite panel when plywood and wooden fiberboard are bonded under heating and pressure. CONSTITUTION: A composite panel is obtained by applying a urea resin adhesive to which 10% of PEG (polyethylene glycol) with a mol.wt. of 400 is added is applied to the single surface of plywood and MDF (medium duty fiberboard) is laminated to be bonded thereto under heating and pressure by a hot press to obtain a composite panel.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、建築用材料や家具用材
料等に用いられる複合材料に係るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite material used as a building material, a furniture material or the like.

【0002】[0002]

【従来技術の欠点】従来からパ−ティクルボ−ドやMD
F(中質繊維板)、配向性ストランドボ−ド等の木質板
と合板との2層構造の複合板は知られていたが、熱圧接
着時に合板と木質板との吸放湿の違いや乾燥収縮の違い
により、上記複合板に反りが発生する欠点があった。こ
れは合板より木質板の方が湿気や水の影響で伸びたり縮
んだり若しくは膨んだりする傾向が大きいためであっ
た。
Disadvantages of the Prior Art Conventionally, a particle board or MD
F (medium fiber board), oriented strand board, and other composite boards having a two-layer structure made of wood and plywood have been known, but the difference in moisture absorption and release between plywood and wood during thermocompression bonding. There is a defect that the composite plate warps due to the difference in drying shrinkage. This is because the wood board has a greater tendency to expand, contract, or swell due to the influence of moisture or water than the plywood.

【0003】また、合板と木質板(チップボ−ドやMD
F等)を冷圧で接着しても、使用する接着剤が酢ビエマ
ルジョンや水性ビニルウレタン系接着剤等の水性接着剤
であるため、上記接着剤中の水分の影響で木質板の膨潤
作用でやはり完全に反りをなくすことは困難であった。
しかも、接着剤の硬化時間が20〜30分と長かった。
Also, plywood and wood boards (chipboards and MDs
(F, etc.) even if they are bonded under cold pressure, the adhesive used is a water-based adhesive such as vinyl acetate emulsion or water-based vinyl urethane adhesive, so the swelling action of the wood board is affected by the water content in the adhesive. However, it was difficult to completely eliminate the warp.
Moreover, the curing time of the adhesive was as long as 20 to 30 minutes.

【0004】[0004]

【上記欠点を解消するための手段】本発明は上記欠点を
解消するために以下の如き手段を用いた。すなわち、本
発明は合板と木質板とを熱圧接着して積層するにあた
り、熱圧時の反りを防止する目的でなされたもので、合
板と木質板の間に接着剤を介し熱圧接着して得られる複
合板であり、上記接着剤として水親和性があり木質材に
浸透性のある物質が添加されたものを用いているところ
に特徴がある。
The present invention uses the following means in order to solve the above-mentioned drawbacks. That is, the present invention was made for the purpose of preventing warpage during hot pressing when laminating a plywood and a wood board by thermocompression bonding, and obtained by thermocompression bonding via an adhesive between the plywood and the wood board. It is a composite plate that is used, and is characterized in that it is made of a wood material to which a permeable substance is added as the adhesive agent.

【0005】上記木質板とは、パ−ティクルボ−ドやハ
−ドボ−ド、MDF等の木質繊維板を示す。また、上記
熱圧接着するための接着剤としては、アミノ系樹脂、ア
クリル系樹脂あるいはポリウレタン系樹脂その他熱圧可
能な水溶性接着剤が挙げられる。また、水親和性のある
物質で木質板に浸透性のある物質として、PEG(ポリ
エチレングリコ−ル)や変性PEG、例えばポリエチレ
ングリコ−ルモノメタクリレ−トなど高分子化合物、若
しくはグリセロ−ル等低分子化合物がある。
The above-mentioned wood board means a wood fiber board such as a particle board, a hardboard, or MDF. Examples of the adhesive for the above-mentioned heat-pressure adhesion include water-soluble adhesives that can be heat-pressed such as amino resins, acrylic resins, polyurethane resins and the like. Further, as a substance having a water affinity and penetrating into the wood board, PEG (polyethylene glycol) or modified PEG, for example, a high molecular compound such as polyethylene glycol monomethacrylate, or glycerol is low. There are molecular compounds.

【0006】[0006]

【作用】本発明によれば、水親和性がありPBやMDF
などの木質板に浸透性のある水溶性化合物、例えばPE
Gが熱圧可能な水溶性接着剤に添加されているので、熱
圧時PEGと木質板中の水分とが結びついて水分の蒸散
が抑制される。その結果熱圧による含水率変化が少なく
なり水分の変化による反りの発生の少ない複合板とな
る。
According to the present invention, there is a water affinity and there is PB and MDF.
Water-soluble compounds that are permeable to wood boards such as PE
Since G is added to the water-soluble adhesive capable of being hot pressed, the PEG and the water in the wood board are bound to each other when hot pressed to prevent the evaporation of water. As a result, the change in water content due to heat and pressure is reduced, resulting in a composite plate with less warpage due to change in water content.

【0007】[0007]

【実施例】本発明を実施例でもってさらに詳しく述べ
る。尿素樹脂接着剤に分子量400のPEGを10%添
加した接着剤を9mm厚合板に20g/尺2 塗布し、そ
の上に3mm厚のMDFを貼り合わせる。その後、11
0℃、8kg/cm2 、3分間の熱圧条件で熱圧接着し
所望の複合板をえた。上記接着剤中のPEGがMDFの
中の水分と結びつき、熱圧時の水分蒸発を防止する。し
たがって熱圧による含水率変化が少なくなり、複合板の
反りが極めて少なくなる。
EXAMPLES The present invention will be described in more detail with reference to examples. An adhesive obtained by adding 10% of PEG having a molecular weight of 400 to a urea resin adhesive is applied to a 9 mm-thick plywood at 20 g / scale 2 , and a 3 mm-thick MDF is attached thereon. Then 11
The desired composite plate was obtained by thermocompression bonding under the conditions of 0 ° C., 8 kg / cm 2 , and 3 minutes. The PEG in the adhesive bonds with the water in the MDF to prevent water evaporation during hot pressing. Therefore, the change in water content due to heat and pressure is reduced, and the warpage of the composite plate is extremely reduced.

【0008】上記PEGの分子量は200〜1000が
適している。分子量200以下では反り防止効果が小さ
く、分子量1000以上ではPEGの木質板への浸透性
が悪くなる。また、PEGの添加率は5〜50%が好ま
しい。5%以下では複合板の反り防止効果は小さく、5
0%以上では合板と木質板との十分な接着力がえられな
い。また、接着剤塗布は乾燥収縮の大きい木質板に塗布
した方がPEGの木質板への浸透が早く、熱圧による含
水率変化を少なくするという点で効果的である。
The molecular weight of PEG is preferably 200 to 1000. When the molecular weight is 200 or less, the effect of preventing warpage is small, and when the molecular weight is 1000 or more, the penetration of PEG into the wood board is poor. The addition rate of PEG is preferably 5 to 50%. If it is less than 5%, the effect of preventing the warpage of the composite plate is small.
When it is 0% or more, sufficient adhesion between the plywood and the wood board cannot be obtained. Further, the application of an adhesive is more effective when applied to a wood board having a large drying shrinkage, because the penetration of the PEG into the wood board is quicker and the change in water content due to heat pressure is reduced.

【0009】[0009]

【発明の効果】実施例でも明らかなように本発明に係る
複合板については、水親和性があり木質板に浸透性のあ
る水溶性化合物が接着剤に添加されたものが合板と木質
板との間に介在され、熱圧接着されて構成されているの
で、熱圧時の乾燥収縮による水分変化のために反りが発
生することがなく、また経時変化で水分が蒸発し難しく
水分変化による反りの発生が少なくなる。
EFFECTS OF THE INVENTION As is clear from the examples, regarding the composite board according to the present invention, a plywood and a wood board are prepared by adding a water-soluble compound having a water affinity and a permeability to the wood board to the adhesive. Since it is interposed between and bonded by heat and pressure, warping does not occur due to moisture change due to drying shrinkage during hot pressure, and it is difficult to evaporate moisture over time and warpage due to moisture change Is less likely to occur.

【0010】合板と木質板とが熱圧接着されているの
で、安定した接着力の有する複合板となり、冷圧で接着
貼り合わせするより接着硬化時間が短縮され生産性が向
上する。
Since the plywood and the wood board are bonded by heat and pressure, a composite board having a stable adhesive force is obtained, and the adhesive curing time is shortened and productivity is improved as compared with bonding and bonding by cold pressure.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 合板と木質板の間に接着剤を介し、熱圧
接着して得られる複合板において、上記接着剤に、水親
和性があり木質板に浸透性のある水溶性化合物が添加さ
れていることを特徴とする複合板。
1. A composite board obtained by thermocompression bonding with an adhesive between a plywood and a wood board, wherein a water-soluble compound having a water affinity and a permeability to the wood board is added to the adhesive. Composite board characterized by being
JP15702795A 1995-05-31 1995-05-31 Composite panel Pending JPH08323913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15702795A JPH08323913A (en) 1995-05-31 1995-05-31 Composite panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15702795A JPH08323913A (en) 1995-05-31 1995-05-31 Composite panel

Publications (1)

Publication Number Publication Date
JPH08323913A true JPH08323913A (en) 1996-12-10

Family

ID=15640591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15702795A Pending JPH08323913A (en) 1995-05-31 1995-05-31 Composite panel

Country Status (1)

Country Link
JP (1) JPH08323913A (en)

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Effective date: 20020702