JPH08323578A - Machining device - Google Patents

Abstract

PURPOSE: To provide a machining device that is able to properly keep a clearance between a suction nozzle and a machining surface and to suck in chips or swarf to be produced at the time of machining simultaneously with the operation. CONSTITUTION: This machining device is composed of a proximity sensor 18 for controlling a clearance between a machining surface 6 and a suction nozzle installed nearby a tool 3 surrounded by a scattering preventing cover 4, a suction nozzle driving part 7, and a positioning controller 40.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for removing and collecting processing chips simultaneously with a processing operation.

[0002]

2. Description of the Related Art A device for sucking machining waste is described in, for example, Japanese Patent Application Laid-Open No. 57-20234 and Japanese Patent Application Laid-Open No. 5-245454. The processing device is described in the mechanical engineering handbook.

[0003]

A conventional apparatus and method for removing machining chips on a machined surface is disclosed in Japanese Patent Laid-Open Nos. 57-20234 and 5-245454.
After processing, the suction nozzle is lowered to the place where the processing waste is accumulated to suck the processing waste, and the processing waste is collected through a filter. Alternatively, after the processing, the work scraps are manually removed by a brush or the like. In addition, in the conventional processing equipment introduced in the mechanical engineering handbook, etc., a means for removing the processing waste from the processing location by flowing out the processing waste by cutting oil, eliminating the processing waste by air blow, etc. No device was provided to collect the processing waste.

However, when it is not allowed to leave the processing waste generated during the processing as a residue around the processing equipment, such as the shape processing such as cutting and cutting of highly toxic substances such as radioactive waste materials, In the above-mentioned conventional example, there is a problem that it is difficult to collect the processing chips scattered in a wide range around the processing point.

It is an object of the present invention to provide a processing apparatus capable of simultaneously performing processing and suctioning of processing waste without scattering the processing waste over a wide range.

[0006]

In order to achieve the object of the present invention, the present invention is directed to a processing apparatus which includes a suction nozzle for sucking machining chips generated by machining and a suction nozzle disposed near the tool, A suction mechanism including a suction pump for generating a negative pressure and at least one accumulating portion for accumulating the suctioned machining waste is provided, and the suction nozzle has a degree of freedom in which the suction nozzle can be positioned relative to the tool. There is provided a positioning means for bringing the tip of the suction nozzle into contact with the surface or for positioning the tip position of the suction nozzle along the processing surface while keeping a predetermined gap.

Further, according to the present invention, the tool driving section is provided with a scattering prevention cover which surrounds the tool and has a structure in which a predetermined gap is maintained between the tool and the machined surface or which is in contact with the machined surface through a flexible body. To configure.

[0008]

[Function] With the movement of the tool moving along the machining surface to be machined, the gap between the tip of the suction nozzle installed near the tool and the machining surface is properly maintained, and the contact between the suction nozzle and the machining surface is maintained. The movement of the tool is not hindered, and the space between the tip of the suction nozzle and the processing surface is limited to secure the suction capacity for processing chips.

Further, the scattering prevention cover limits the scattering range of the processing waste from the tool, and guides the processing waste to the tip of the suction nozzle.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a side view showing the overall construction of this embodiment.

In the present embodiment, a tool 3 for machining an object 5 to be machined, a moving mechanism 1 for controlling the relative position of the tool 3 with respect to the object 5 to be machined, and a tool drive for driving the tool 3 installed in the moving mechanism 1. A scattering prevention cover 4 provided with a skirt 22 made of a flexible material such as rubber, which is attached to the tool driving portion 2 so as to surround the portion 2 and the tool 3 and closes a gap between the processing surface 6 and the portion 2. And, it is installed near the tool 3, and the processing waste 1
A suction nozzle 10 for sucking 1; a linear motion bearing 8 for slidably supporting the suction nozzle 10 in the vertical direction with respect to the tool driving unit 2;
A proximity sensor 1 attached to the tip of the suction nozzle 10 and outputting a value proportional to the gap between the suction nozzle 10 and the processing surface 6.
8, a suction nozzle drive unit 7 attached to the tool drive unit 2 for vertically driving the suction nozzle 10, and a suction nozzle 1
0 and an air tube 13 for connecting to a suction pump 14 for generating a negative suction pressure, and an air tube 15 provided on the exhaust side of the suction pump 14 for connecting processing waste 11
Is stored in the suction nozzle drive unit 7 based on the gap between the processing waste storage unit 12 in which the filter 121 is attached and the tip of the suction nozzle 10 detected by the proximity sensor 18 and the processing surface 6 of the workpiece 5. A positioning control device 40 that issues an operation command to position the suction nozzle 10 with respect to the machining surface 6, an upper limit sensor 41 that detects the upper limit position of the suction nozzle 10, and the positioning of the moving mechanism 1 and also performs positioning control. The device 40 comprises a main controller 42 for giving a target value for controlling the gap between the suction nozzle 10 and the processing surface 6.

The positioning controller 40 includes a main controller 42.
From the proximity sensor 18 and the adder 401 that calculates the deviation between the target value output from the proximity sensor 18 and the upper limit sensor 41 detects that the suction nozzle 10 reaches the upper limit position, and the deviation is in the upward direction of the suction nozzle 10. An upper limit control unit 402 that outputs the deviation as 0 in the case of the polarity instructing to drive and an output of the adder 401 as the deviation in other cases, and an upper limit control unit 40.
2 and the amplification device 403 that amplifies the output of No. 2 and drives the suction nozzle drive unit 7.

Next, the operation of this embodiment will be described.

In the above structure, the main control unit 42 transmits to the positioning control unit 40 a target value equal to or higher than the output upper limit value of the proximity sensor 18 before the machining operation is started. By this operation, the suction nozzle 10 rises, and when the upper limit sensor 41 detects that the suction nozzle 10 has reached the upper limit position, the output of the upper limit controller 402 becomes 0 and the driving of the suction nozzle driver 7 is stopped. The suction nozzle 10 is held at the stop position.

Next, the main controller 42 positions the tool 3 close to the workpiece 5 and at the same time transmits the target value for setting a predetermined gap to the positioning controller 40.

By this operation, the suction nozzle drive unit 7 lowers the suction nozzle 10, and when the gap between the tip of the suction nozzle 10 and the processing surface 6 matches the target value, the suction nozzle 10
Stops.

Next, when the machining accompanied by the movement by the moving mechanism 1 and the tool driving section 2 is started by the control of the main controller 42, the gap between the tip of the suction nozzle 10 and the machining surface 6 becomes smaller than the target value. If they are displaced, the suction nozzle drive unit 7 is controlled to be moved up and down by the positioning control device 40 so that the gap approaches the target value.

When the machining operation is further terminated, the proximity sensor 1 is sent from the main controller 42 to the positioning controller 40.
A target value equal to or higher than the output upper limit value of 8 is transmitted. By this operation, the suction nozzle 10 rises, and when the upper limit sensor 41 detects that the suction nozzle 10 has reached the upper limit position, the output of the upper limit controller 402 becomes 0 and the driving of the suction nozzle driver 7 is stopped. The suction nozzle 10 is held at the stop position.

In this machining process, the tip of the suction nozzle 10 is positioned near the tool 3 while always maintaining a constant gap with respect to the machining surface 6, and is generated as the machining of the object 5 to be machined by the tool 3 occurs. Processing scraps scattered around 11
Scattering is stopped by the scattering prevention cover 4 surrounding the tool 3, guided to the tip of the suction nozzle 10, and after being sucked by the suction nozzle 10, accumulated in the processing waste accumulating portion 12.

According to this embodiment, since the value of the gap between the tip of the suction nozzle 10 and the machining surface 6 is fed back to the positioning control device 40 at any time, even if the machining surface 6 is a curved surface, the suction nozzle 10 can be moved to the machining surface 6. It can be aligned and positioned. Further, since the scattering prevention cover 4 is attached so as to surround the tool 3, even if the processing waste 11 is generated during processing, it does not scatter over a wide area and functions to guide the processing waste 11 toward the suction nozzle 10. The processing waste 11 is reliably sucked and collected.

Next, the structure and operation of another embodiment of the present invention will be described with reference to the drawings.

FIG. 2 is a side view of another embodiment of the present invention, and FIG. 3 is a flow chart showing the operation of the positioning control device 44.

In the present embodiment, a contact switch 23 for detecting the gap between the tip of the suction nozzle 10 and the processing surface 6 is attached to the tip of the suction nozzle 10, and the tip of the suction nozzle 10 detected by the contact switch 23 An operation command is issued to the suction nozzle drive unit 7 based on the gap between the machining surface 6 and
A positioning control device 44 for positioning the suction nozzle 10 with respect to the processing surface 6 and positioning of the moving mechanism 1,
Further, a main controller 45 is provided for giving a control command for instructing the positioning controller 44 to start and end the gap control between the suction nozzle 10 and the processing surface 6.

The positioning control device 44 includes the suction nozzle 10
Is composed of a main control unit 441 configured to control the vertical movement of the suction nozzle driving unit 7 and a speed control unit 442 driving the suction nozzle driving unit 7.

With this configuration, when a control command for starting the work is generated from the main control unit 45, the main control unit 441 starts lowering the suction nozzle, and when the contact switch 23 detects the contact, only the timer set value τ is set. The suction nozzle 10 is raised, a predetermined gap is set between the suction nozzle 10 and the processing surface, and the suction nozzle 10 is positioned.

When the machining work is further finished, a control command for finishing the work is generated from the main control unit 45, and the main control unit 441 raises the suction nozzle 10 until the upper limit sensor 41 detects that the upper limit of the suction nozzle 10 has been reached. Let

According to the present embodiment, the gap between the suction nozzle 10 and the machining surface 6 is set before the start of the cutting work, and the driving of the suction nozzle drive section 7 is kept stopped during the machining work. Compared with the configuration in which the gap is controlled by the servo system as in the embodiment, the suction nozzle 10 and the machining surface 6 due to the disorder of the servo system
The abnormal contact of can be avoided.

In this embodiment, the distance between the processing surface 6 and the tip of the suction nozzle 10 is measured by the contact switch 23. However, a proximity sensor for discriminating and outputting the presence / absence of a gap at a predetermined threshold value is output. It is obvious that the same effect can be obtained by using.

Next, a modification of the embodiment shown in FIG. 2 will be described with reference to the drawings.

FIG. 4 is a flowchart showing a modified example of the processing executed by the positioning control device 44 shown in FIG.

When a control command for starting the work is generated from the main controller 45, the main controller 441 starts lowering the suction nozzle 10, and when the contact switch 23 detects contact between the suction nozzle 10 and the machining surface 6. The suction nozzle 10 is raised, and when the contact switch 23 detects the detachment of the suction nozzle 10 from the processing surface 6, the suction nozzle 10 is lowered. By repeating the above operations during processing, the suction nozzle 10
The contact position of the suction nozzle 10 is sequentially updated, and the suction nozzle 10 is determined by the ascending and descending limit cycle of the suction nozzle 10.
The gap between the machined surface 6 and the machined surface 6 is maintained discretely.

Further, when a control command for finishing the work is issued from the main control unit 45, the process is interrupted and the suction nozzle 1 is detected until the upper limit of the suction nozzle 10 is detected by the upper limit sensor.
Increase 0.

According to this modification, the contact position of the suction nozzle 10 is updated by repeating the lowering and raising of the suction nozzle 10. That is, even if the machined surface 6 is a curved surface, the suction nozzle 10 can be positioned along the machined surface 6. Furthermore, the control system can be simplified.

Next, another embodiment of the present invention will be described with reference to the drawings.

FIG. 5 is a side view showing another embodiment of the positioning means for the suction nozzle 10 of the present invention.

In this embodiment, the guide roller 19 is attached to the tip of the suction nozzle 10, and the upper end of the suction nozzle 10 is supported by the support spring 21 fixed to the tool driving section 2.

In this configuration, the suction nozzle 1 is moved by the moving mechanism 1.
When 0 is pressed against the processing surface 6, the gap between the tip of the suction nozzle 10 and the processing surface 6 is maintained at a predetermined gap by the guide roller 19 and positioned.

According to the present embodiment, since the suction nozzle 10 can be pressed against the machining surface 6 to position it along the machining surface 6 without using a special control system, the apparatus structure can be simplified.

Next, the structure of a modification of the embodiment shown in FIG. 5 will be described with reference to the drawings.

FIG. 6 is a side view showing the configuration of a modified example of the present invention.

In this modification, a fixing portion 26 for fixing the suction nozzle 25 to the tool driving portion 2, a tip portion 28 to which the guide roller 19 is attached, and a bellows having an elastic structure for connecting the fixing portion 26 and the tip portion 28 together. It is composed of a part 27.

According to this modification, it is obvious that the same effect as that of the embodiment shown in FIG. 5 can be obtained.

Next, another embodiment of the present invention will be described with reference to the drawings.

FIG. 7 is a side view showing an embodiment of the shatterproof cover 50 of the present invention.

In this embodiment, the shatterproof cover 50 is provided so as to surround the tool 3 and has a skirt 30 made of a flexible material such as rubber for closing a gap between the tool 3 and the processing surface.
Is slidably supported on the tool driving unit 2 via a linear motion bearing 17, a proximity sensor 31 for measuring a gap between the scattering prevention cover 50 and the machining surface 6 is provided, and the scattering prevention cover 50 is perpendicular to the tool driving unit 2. Drive in the direction. Anti-scatter cover drive unit 51
And a positioning control device 60 for positioning the shatterproof cover 50 with respect to the processing surface 6.

The positioning control device 60 includes a main control device 42.
The adder 601 that calculates the deviation between the target value output from the proximity sensor 31 and the detection value from the proximity sensor 31, and the upper limit sensor 61 detect the arrival of the upper limit position of the shatterproof cover 50, and the deviation is the rising direction of the shatterproof cover 50. The output of the adder 601 is output as the deviation in the other cases, and the output of the upper limit control section 602 is amplified and the scattering prevention cover drive section is amplified. And an amplifying device 603 for driving 51.

In this configuration, the main control unit 42 transmits the target value equal to or higher than the output upper limit value of the proximity sensor 31 to the positioning control unit 60 before the machining work is started. This operation raises the shatterproof cover 50, and when the upper limit sensor 61 detects that the shatterproof cover 50 has reached the upper limit position, the output of the upper limit control unit 602 becomes 0 and the drive of the shatterproof cover drive unit 51. Is stopped and the shatterproof cover 50 is held at the stop position.

Next, the main controller 42 positions the tool 3 close to the workpiece 5 and at the same time transmits a target value for setting a predetermined gap to the positioning controller 60. By this operation, the anti-scattering cover drive unit 51 lowers the anti-scattering cover 50, and the anti-scattering cover 50 stops when the gap between the tip of the anti-scattering cover 50 and the processing surface 6 matches the target value.

Next, when the machining accompanied by the movement by the moving mechanism 1 and the tool driving section 2 is started by the control of the main controller 42, the gap between the tip of the scattering prevention cover 50 and the machining surface 6 becomes the target value. When they are misaligned with each other, the positioning control device 60 controls the scattering prevention cover drive unit 51 to move up and down so that the clearance approaches the target value.

When the machining operation is further terminated, the proximity sensor 3 is sent from the main controller 42 to the positioning controller 60.
A target value equal to or greater than the output upper limit value of 1 is transmitted. By this operation, the shatterproof cover 50 rises, and when the upper limit sensor 61 detects that the shatterproof cover 50 reaches the upper limit position, the output of the upper limit controller 602 becomes 0 and the drive of the shatterproof cover drive unit 51. Is stopped and the scattering prevention cover 5
0 is held in the stop position.

According to the present embodiment, even if the tool 3 is deeply machined in the object to be machined 5, a step formed during machining is not caught, and machining is advanced without scattering the machining waste 11 generated during machining in a wide range. be able to. Further, even if the processing surface 6 is a curved surface having large irregularities, the suction nozzle 10 and the scattering prevention cover 50 can independently set the gaps to the processing surface 6 independently, so that the recovery rate of the processing waste 11 can be increased. .

[0053]

According to the present invention, the gap between the suction nozzle and the processing surface can be properly positioned, and the scattering prevention cover can guide the processing waste toward the suction nozzle without scattering in a wide range. At the same time as the work, the processing waste accumulated on the processing surface can be surely sucked and collected. So, for example,
When processing highly toxic materials such as radioactive substances, it is possible to perform safe work without scattering processing chips around the processing location.

[Brief description of drawings]

FIG. 1 is a side view showing the overall configuration of an embodiment of the present invention.

FIG. 2 is a side view showing the overall configuration of a second embodiment of the present invention.

FIG. 3 is a flowchart of a positioning control system according to a second embodiment of the present invention.

FIG. 4 is a flowchart of a positioning control system according to a third embodiment of the present invention.

FIG. 5 is a side view of the positioning means according to the third embodiment of the present invention.

FIG. 6 is a side view of a modification of the positioning means of the fourth embodiment of the present invention.

FIG. 7 is a side view showing a configuration of a scattering prevention cover according to a fifth embodiment of the present invention.

[Explanation of symbols]

1 ... Moving mechanism, 2 ... Tool drive part, 3 ... Tool, 4, 50 ...
Scattering preventive cover, 5 ... Object, 6 ... Machining surface, 7 ... Suction nozzle drive section, 8, 17 ... Linear bearing, 10, 25 ... Suction nozzle, 11 ... Machining waste, 12 ... Machining waste accumulating section, 13 ，
15 ... Air tube, 14 ... Suction pump, 18 ... Proximity sensor, 22, 30 ... Skirt, 40, 44 ... Positioning control device, 41 ... Upper limit sensor, 42 ... Main control device, 121
... filter, 401 ... adder, 402 ... upper limit control unit, 4
03 ... Amplification device.

Claims (8)

[Claims] 1. A tool for machining a processing object, a moving mechanism for positioning the tool with respect to the processing object, and a tool driving unit for driving the tool and connected to the moving mechanism, the tool being driven along a processing surface of the processing object. In a processing device for moving a tool to machine a machining surface, a suction nozzle for sucking machining chips generated by machining and arranged near the tool, a suction pump for generating a negative pressure for suction, and A suction mechanism including at least one accumulating portion for accumulating the suctioned machining waste is provided, and the suction nozzle has a degree of freedom with which the suction nozzle can be positioned relative to the tool. A processing apparatus comprising a positioning means for contacting or positioning a tip of the suction nozzle along a processing surface while keeping a predetermined gap. 2. The tool driving section is provided with an anti-scattering cover which surrounds the tool and has a predetermined gap between the tool and the machined surface or which is in contact with the machined surface through a flexible body. The processing device according to claim 1. 3. The processing apparatus according to claim 2, wherein a cover made of a flexible body is provided along an opening end portion of the shatterproof cover facing the processed surface. 4. An anti-scattering cover having a degree of freedom with which the tool can be positioned relative to the tool, and the opening end portion of the anti-scattering cover facing the processing surface is brought into contact with the processing surface. 3. The processing apparatus according to claim 2, further comprising positioning means for positioning the opening end portion of the shatterproof cover along the processing surface while keeping a predetermined gap. 5. A suction nozzle drive unit for holding the suction nozzle with at least one degree of freedom with respect to the tool drive unit and positioning the suction nozzle installed in the tool drive unit, the processing surface and the suction nozzle. The positioning means comprises a detection means for detecting a relative position with respect to the tip and a control device for maintaining and controlling a gap between the processing surface and the suction nozzle tip to a predetermined value based on information of the detection means. The processing device according to Item 1. 6. An elastic body that holds the suction nozzle with at least one degree of freedom with respect to the tool driving unit and pushes the suction nozzle against the working surface with respect to the tool driving unit, and an elastic body provided at the tip of the suction nozzle. 2. The positioning means comprises a guide portion composed of a rotating body or a low-friction sliding body that maintains a gap between the processed surface and the tip of the suction nozzle at a predetermined value by directly contacting the processed surface. The processing device described in. 7. The suction nozzle is composed of a telescopic portion made of an elastic body that connects between a fixed portion and a nozzle tip portion, the fixed portion is fixed to the tool driving portion, and the nozzle tip portion is directly attached to the processing surface. The processing according to claim 1, wherein the positioning means is configured by including a guide portion formed of a rotating body or a low friction sliding body that maintains a gap between the processing surface and the tip of the suction nozzle at a predetermined value by contacting each other. apparatus. 8. The processing apparatus according to claim 1, wherein a cover made of a flexible body is provided along the suction opening at the tip of the suction nozzle.