JPH0832287A - Parts carrier - Google Patents

Abstract

PURPOSE:To obtain a parts carrier for carrying a part, having irregular suction face, accurately while sucking surely. CONSTITUTION:A pressed part 27 is carried with the suction face 27a being sucked by a pad 23 provided, on the inside, with a vacuum suction path communicated with a vacuum source. When the part is pressed, the pad 23 is deformed according to the irregularities on the suction face 27a of the part 27. Consequently, the gap is filled and air leak to the vacuum suction path is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component transporting device for transporting a component in a sucked state, and more particularly to a component transporting device for transporting a component having an uneven suction surface.

[0002]

2. Description of the Related Art As a device for handling electronic parts, there is, for example, a parts supply device. This parts supply device sucks parts provided on a tray with suction nozzles and places them on a parts conveyor device. It is configured to supply the mounting device. Then, the above-mentioned component transfer device sucks the component pressed by the suction nozzle from the lower surface side thereof with a pad provided inside a vacuum suction passage communicating with the vacuum generation source, and transports while maintaining this suction state. I am supposed to do it.

By the way, conventionally, as shown in FIG.
Like a P (Quad Flat Package) or the like, a package 50 having a rectangular shape is provided with a large number of leads 51 on a side portion thereof.
Although C has been mainly used, it is possible to reduce the size and thickness of the package, and because it is easy to handle and allows the mounting device to have general versatility, it can be mounted on the bottom surface of a rectangular package. B having solder balls arranged in a grid pattern
An IC called GA (Ball Grid Array) has been adopted in accordance with the increase in the number of pins of parts.

[0004]

By the way, as shown in FIG. 7, in the conventional QFP or the like, in a parts conveying device for parts having a flat lower surface of the package 50, if a flat rubber pad 53 is used as a pad, a vacuum is generated. Suction passage 5
The vacuum pressure of 3a ensures reliable adsorption.
However, when such a rubber pad 53 is applied to a component transfer device for BGA, as shown in FIG.
A gap is formed between the rubber pad 53 and the solder ball on the lower surface 55a of the BGA 55. Then, an air leak occurs in the vacuum suction passage 53a inside from this gap,
Since a sufficient vacuum pressure, that is, a suction force cannot be obtained, there is a problem in that accurate conveyance cannot be performed.

Therefore, it is an object of the present invention to provide a component transporting device capable of reliably sucking and accurately transporting a component whose suction surface is not flat but has an uneven shape.

[0006]

In order to achieve the above object, in the component carrying apparatus according to claim 1 of the present invention, a vacuum suction passage communicating the suction surface of the pressed component with the vacuum source is provided inside. The pad is sucked and conveyed by a provided pad, and the pad is an elastic body that deforms in accordance with the uneven shape of the suction surface of the component and fills the gap when the component is pressed.

In addition to the apparatus according to claim 1, the component transfer apparatus according to claim 2 of the present invention is characterized in that the pad is made of a porous material.

Further, in the component carrying device according to claim 3 of the present invention, in addition to the device according to claim 1 or 2, the pad has an outer cylinder part and an inner cylinder part inside thereof. The outer cylinder portion and the inner cylinder portion are characterized in that either one of them can be projected and retracted with respect to the other.

[0009]

According to the component carrying device of the first aspect, when the component is pressed, the pad is deformed according to the irregular shape of the suction surface of the component to fill the gap. Therefore, no air leak occurs in the vacuum suction passage.

According to the component transfer device of the second aspect, since the pad is made of a porous material, it can be easily deformed, and the hole is crushed at the time of deformation so that air leaks to the vacuum suction passage through the pad itself. To prevent.

According to the third aspect of the present invention, in the case of picking up a component having a large suction surface, the outer cylinder portion is relatively projected with respect to the inner cylinder portion, and the component having a small suction surface is suctioned. In this case, the inner tubular portion is made to project relatively to the outer tubular portion. This eliminates the need to replace the pad even when handling a component having a different suction surface.

[0012]

【Example】

(1) Configuration of Embodiments A component carrying device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5. FIG. 1 shows a component supply device to which the component transfer device of the present invention is applied. This component supply device supplies a component having solder balls on its lower surface, such as a BGA, to a mounting device. In FIG. 1, reference numeral 1 is a hook that engages with a tray (not shown) on which components are placed in an aligned state, and reference numeral 2 is a rodless air cylinder that moves the hook 1 together with the tray in an engaged state with the tray. , Reference numeral 3 denotes a pick-and-place head (hereinafter, abbreviated as “P & P head”) that sucks components from the moved tray from the upper surface side by vacuum pressure. The trays are arranged side by side in the vertical direction on the component supply device, and are replaced when empty.

Here, the P & P head 3 is vertically movable by a Z-axis air cylinder 4 vertically arranged, and horizontally by an X-axis moving mechanism 5 and a Y-axis moving mechanism 6 which are horizontally arranged orthogonal to each other. It is movable, and when it descends, it picks up and releases parts, and when it is in a raised state, it is horizontally moved to move the part in a picked state to a predetermined position. The reference numeral 10 in FIG. 1 denotes the component transfer device of this embodiment for horizontally transferring the components transferred by the P & P head 3 to the mounting device (not shown).

The component transfer device 10 has a rodless air cylinder 11 arranged horizontally, and by this rodless air cylinder 11, a receiving position for receiving a component from the P & P head 3 and a suction position by a suction head of a mounting device (not shown). And a traverser 12 which is moved to and from a supply position for supplying components.

As shown in FIGS. 2 (a) and 2 (b), the traverser 12 includes a movable base 13 which is moved by the rodless air cylinder 11, and a mounting base fixed above the movable base 13. 14 and. The moving base 13 includes two vacuum generators (vacuum generation sources) 16 and the suction nozzles 1 individually connected to the vacuum generators 16.
7 and are attached. As shown in FIG. 3, the suction nozzle 17 has a substantially stepped cylindrical shape and also has a moving base portion 13.
A support portion 18 fixed to the support portion 18, a substantially stepped cylindrical nozzle head portion 19 mounted on the support portion 18 slidably up and down by a predetermined size, and a spring 20 for biasing the nozzle head portion 19 upward. It has and.

The hollow portion at the center of the nozzle head portion 19 communicates with the vacuum generator 16. A flange portion 21 is formed at a predetermined intermediate position thereof, and the cylindrical pad 2 is provided on the outer peripheral portion above the flange portion 21.
3 is fitted and fixed. The pad 23 has a protruding portion 23a that is protruded further upward from the upper end surface of the nozzle head portion 19, and the upper end surface is a flat surface extending in the horizontal direction. Then, the protruding portion 23 of the pad 23
Vacuum suction passage 2 whose inside is communicated with the vacuum generator 16
It is 3b.

Here, in the suction nozzle 17, the nozzle head portion in which the pad 23 is attached to the through hole 24 formed in the mounting table portion 14 in a state where the support portion 18 is fixed at a predetermined position of the moving table portion 13. 19 is inserted with a gap. Moreover, when the nozzle head portion 19 is located at the upper position by the urging force of the spring 20, the pad 2
3 is in a state of projecting above the mounting table portion 14 by a predetermined amount. The suction nozzle 17 on the right side in FIG.
The suction nozzle 17 on the left side is used when the component received from the tray is conveyed to the mounting apparatus, and is used when returning the component having an error on the mounting apparatus side to the P & P head 3 side.

In this embodiment, the pad 23 is made of a porous material that is easily deformable, such as sponge.
Then, the lower surface 2 of the component 27 attracted by the P & P head 3
When 7a is pressed against the pad 23, as shown in FIG. 4, the projecting portion 23a is deformed according to the uneven shape of the solder balls 28 arranged and formed in a grid pattern on the lower surface 27a, and enters the gaps between the solder balls 28. . Therefore, the protrusion 23a
Air leaks at the end surface of and the lower surface of the component 27 are prevented. Moreover, by compressing the protrusion 23a, many holes of the protrusion 23a are crushed to close the air flow path of the protrusion 23a itself.

(2) Operation of the Embodiment Next, the operation of the component supplying apparatus having the above-mentioned configuration will be described with reference to the flowchart of FIG. First, the P & P head 3 moves down to adsorb the BGA 26 from the tray (step SP1), and then moves up and moves onto the traverser 12 at the receiving position (step SP2). Then P &
The P head 3 descends and presses the lower surface 27a of the component 27 against the pad 23 of the suction nozzle 17 of the traverser 12 (step SP3). At that time, the spring 20 is compressed by the pressing force of the P & P head 3, the nozzle head portion 19 is lowered, and the pad 23 is compressed downward, so that the component 27 is elastically received by the pad 23.

Further, when the pad 23 is compressed, the projecting portion 23a is deformed according to the uneven shape of the solder ball 28 on the lower surface 27a of the component 27, and the solder ball 2
Fill the gap between 8. Moreover, in this state, the pad 2
Reference numeral 3 blocks the air passage of the protrusion 23a itself by collapsing the hole of the protrusion 23a itself, so that the air leak passage to the inside of the protrusion 23a, that is, the vacuum suction passage 23b is blocked. Therefore, the vacuum pressure is satisfactorily applied to the lower surface 27a of the component 27, and the component 27 is reliably attracted to the pad 23 of the suction nozzle 17 (step SP4). Then, in this state, the traverser 12 is moved to the mounting device side (not shown) by the driving force of the rodless air cylinder 11 (step SP5).

According to the component transporting apparatus having the above-described structure, when the component is pressed, the projecting portion 23a of the pad 23 is deformed according to the uneven shape of the lead 28 on the lower surface 27a of the package 27 of the BGA 26 and the gap between the leads 28 is filled. From
The occurrence of air leak to the vacuum suction passage 23b is prevented. Therefore, the BGA 26 can be surely adsorbed by the pad 23, and the conveyance can be performed accurately in this adsorbed state.

Particularly, in the above embodiment, since the pad 23 is made of sponge, the pad 23 is compressed by being pressed against the BGA 26 to crush the internal hole. Thereby, the flow path of the air leak to the inside of the protruding portion 23a, that is, the vacuum suction passage 23b is blocked. In this way, since the occurrence of air leak to the vacuum suction passage 23b is prevented, the component 27 can be more surely adsorbed to the pad 23.

(3) Modifications The present invention is not limited to the above embodiments, but various modifications are possible. For example, in the above embodiment,
The pad 23 has a cylindrical shape, that is, the one having one vacuum suction passage 23b has been described as an example, but if the vacuum suction passage is formed inside, for example, a plurality of vacuum suction passages should be formed. It is also possible to make the pad 23 into a prismatic shape. Further, the outer peripheral surface of the pad 23 can be coated with a resin for preventing air leak. In addition, although the pad is made of a porous material such as sponge in the above embodiment, any material may be used as long as it can be easily deformed.

Further, as shown in FIG. 6, the pad has a double structure having a cylindrical outer cylindrical portion 29 and an inner cylindrical portion 30 concentrically arranged inside the outer cylindrical portion 29 with a gap. The inner cylindrical portion 30 and the outer cylindrical portion 29 can be configured to be switchable by an actuator or the like between a position where one of them projects upward with respect to the other and a position where they retract downward.

For example, the inner cylindrical portion 30 is switched between a protruding position and a retracting position with respect to the outer cylindrical portion 29 by an actuator, and when the inner cylindrical portion 30 projects, only the inside of the inner cylindrical portion 30 communicates with the vacuum generator 16. On the other hand, when the inner cylindrical portion 30 is pulled in, the flow path is switched by a solenoid valve or the like so that the gap between the outer cylindrical portion 29 and the inner cylindrical portion 30 is in communication with the vacuum generator 16.

With this structure, when a component having a large suction surface is sucked, the inner cylindrical portion 30 is retracted so that the outer cylindrical portion 29 performs suction, and a component having a small suction surface is sucked. In this case, if the inner cylindrical portion 30 is projected and suction is performed by the inner cylindrical portion 30, it is not necessary to replace the pad even when handling a component having a different suction surface. Therefore, it is possible to shorten the setup change time for dealing with components having different suction surface sizes. Of course, these are not limited to the cylindrical shape, and may be a rectangular tube shape.

[0027]

As described in detail above, according to the present invention,
When the component is pressed, the pad deforms according to the uneven shape of the suction surface of the component and fills the gap. Therefore, by performing suction in this state, it is possible to securely suck the component without causing air leak in the vacuum suction passage, and thus it is possible to accurately transport the component.

[Brief description of drawings]

FIG. 1 is a front view showing the overall configuration of a component supply device to which a component transfer device according to an embodiment of the present invention is applied.

2A and 2B show a parts conveying device according to an embodiment of the present invention, wherein FIG. 2A is a plan view and FIG. 2B is a front view.

FIG. 3 is a vertical cross-sectional view showing a main part of a suction nozzle of a component carrying device according to an embodiment of the present invention.

FIG. 4 is a front view showing a state when a BGA (component) is picked up by a pad of the component transfer device according to the embodiment of the present invention.

FIG. 5 is a flowchart illustrating a flow of component supply of a component supply device to which a component transfer device according to an embodiment of the present invention is applied.

FIG. 6 is a perspective view showing a pad of a component carrying device according to another embodiment of the present invention.

FIG. 7 is a front view showing a state in which QFP is adsorbed by a pad of a conventional component transfer device.

FIG. 8 is a front view showing a state in which a BGA is sucked by a pad of a conventional component transfer device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Parts conveying device, 16 ... Vacuum generator (vacuum generation source), 23 ... Pad, 23b ... Vacuum suction passage, 27 ... Parts, 27a ... Lower surface (suction surface), 29 ... Outer cylinder part (outer cylinder part), 30 ... Inner cylindrical part (inner cylindrical part).

Claims (3)

[Claims] 1. A component transfer device for transferring a suction surface of a pressed component to a pad provided inside a vacuum suction passage communicating with a vacuum generation source, wherein the pad is used when pressing the component. The component transfer device, which is an elastic body that deforms according to the uneven shape of the suction surface of the above and fills the gap. 2. The component transfer device according to claim 1, wherein the pad is made of a porous material. 3. The pad has an outer tubular portion and an inner tubular portion inside thereof, and one of the outer tubular portion and the inner tubular portion can be projected / retracted with respect to the other. The component transfer device according to claim 1 or 2, wherein