JPH08321809A - Spatial light bus signal transmission device - Google Patents

Abstract

PURPOSE: To transmit spatial light bus signals among packages, to speed up signal transmission, to devise a countermeasure against radiation noise and to reduce mounting space. CONSTITUTION: A mother board 1, the plural packages 2a, 2b and 2c which are stored in the mother board 1 in parallel, light-emitting elements 3a, 3b and 3c arranged on one surface in plural packages 2a-2c and light-receiving elements 4a, 4b and 4c arranged on the other surfaces are provided. A spatial light signal transmission device transmits the light signals among the plural packages which are adjacently stored. The light-emitting elements 3a-3c and the light-receiving elements 4a-4c are arranged on the same axis extending to a direction vertical to the respective surfaces of the plural packages 2a-2c. The same light signal is transmitted between at least two arbitrary packages in the plural packages 2a-2c.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a signal transmission device, and more particularly to a spatial optical signal transmission device between packages housed in a mother board.

[0002]

2. Description of the Related Art Conventionally, for signal transmission between packages of a signal transmission device in which a plurality of packages are accommodated on a mother board, a method of transmitting electric signals via the mother board has been used.

Further, the invention of a signal transmission method between plug-in units described in Japanese Patent Laid-Open No. 4-119697 relates to a spatial optical signal transmission system, and relates to a reduction of a signal propagation delay time between plug-in units and a plug-in unit. For the purpose of improving the mounting efficiency by eliminating the cable connector on the sub-edge side, the high-speed signal transmission, the radiation noise countermeasure, and the mounting space are reduced.

FIG. 6 is a diagram showing a configuration of a spatial optical signal transmission device to which the conventional example described in the above publication is applied.

FIG. 6 shows a mother board 1 and a plurality of packages 2 accommodated on the mother board 1 in parallel with each other.
a, 2b, 2c, the package 2a includes a light emitting / receiving element 14a, and the package 2b
Includes a light emitting / receiving element 14b and 14c, and the package 2c includes a light emitting / receiving element 14d.

In FIG. 6, by the light emitting / receiving element 14b arranged on one surface of the package 2b,
Spatial optical signal transmission is performed with the light emitting / receiving element 14a arranged on the surface of the package 2a facing the package 2b. The optical signal transmitted from the light emitting / receiving element 14a is received by the light emitting / receiving element 14b, and the light emitting / receiving element 1
The optical signal transmitted from 4b is received by the light emitting / receiving element 14a.

Similarly, by the light emitting / receiving element 14c arranged on the other surface of the package 2b, the light emitting / receiving element 14d arranged on the surface of the package 2c facing the package 2b and the spatial light signal. Make a transmission.
The optical signal transmitted from the light emitting / receiving element 14c is received by the light emitting / receiving element 14d, and the light emitting / receiving element 14d is received.
The optical signal transmitted from is received by the light emitting / receiving element 14c.

At this time, the light emitting / receiving elements 14a and 1
4b is arranged on the same axis extending in the direction perpendicular to the surfaces of the packages 2a and 2b, and the light emitting / receiving elements 14c and 14d extend in the direction perpendicular to the surfaces of the packages 2b and 2c. Are located on the same axis.

However, the light emitting / receiving elements 14a and 14
The axis where b is arranged and the light emitting / receiving elements 14c and 1
It is different from the axis on which 4d is located.

[0010]

In this conventional spatial light signal transmission device, the light emitting / receiving elements arranged on the opposite surfaces of the adjacent packages are on the same axis, but all the light emitting / receiving elements are arranged. Are not on the same axis. For this reason, in a spatial optical bus signal transmission in which the same optical signal is distributed to all packages, if one package is removed, two packages on both sides of the removed package will be used.
There is a problem that it becomes impossible to transmit an optical signal between the packages. As a result, when the packages are evaluated or the packages are added or removed, the optical bus signals cannot be transmitted between the packages unless the packages adjacent to each other are mounted.

In view of the above points, the present invention realizes spatial optical bus signal transmission between packages, and speeds up signal transmission,
It is an object of the present invention to provide a spatial optical bus signal transmission device capable of implementing measures against radiated noise and reduction of mounting space.

[0012]

In order to achieve the above-mentioned object, a spatial optical bus signal transmission device of the present invention comprises a mother board, a plurality of packages housed in the mother board in parallel with each other, and the plurality of packages. Of the plurality of packages, which are arranged adjacent to each other, respectively, and a light receiving element arranged on the other surface of each of the plurality of packages. A spatial optical signal transmission device for transmitting an optical signal between a plurality of packages housed adjacently by using the light emitting element and the light receiving element arranged on a surface of the light emitting element, All of the light-receiving elements are arranged on the same axis extending in a direction perpendicular to each surface of the plurality of packages, and at least two arbitrary ones of the plurality of packages are arranged. To transmit the same optical signal between the package.

The above-mentioned spatial optical bus signal transmission device of the present invention comprises:
When all of the light emitting element and the light receiving element are a set of one-way optical signal transmitting means, two sets of one-way optical signal transmitting means for transmitting optical signals in different directions are provided on the plurality of packages. , And optical signals in different directions can be transmitted between at least two arbitrary packages of the plurality of packages.

Further, in the above-described space optical bus signal transmission device of the present invention, each of the plurality of packages includes a hole portion and a light emitting and receiving circuit arranged on one surface of each of the plurality of packages. The light emitting and receiving circuit includes the light emitting element and the light receiving element, and all of the holes are arranged on the same axis extending in a direction perpendicular to each surface of the plurality of packages, All of the light emitting and receiving circuits are on the same axis in which the light emitting direction of the light emitting element and the light receiving direction of the light receiving element extend through the hole in a direction perpendicular to each surface of the plurality of packages. And each of the light emitting element and the light receiving element are formed in a direction in which the light emitting direction of the light emitting element and the light receiving direction of the light receiving element are the same, and at least two arbitrary ones of the plurality of packages are disposed. Same optical signal transmission between packages It can be carried out.

[0015]

The spatial optical bus signal transmission device of the present invention has the following actions.

All of the light emitting element and the light receiving element are arranged on the same axis extending in a direction perpendicular to the planes of the plurality of packages, and between at least two arbitrary packages of the plurality of packages. Since the same optical signal is transmitted in the package, the space optical bus signal between packages can be changed even if any package is inserted / removed or the mounting order is changed during package evaluation or package addition / removal. It becomes possible to realize the transmission, to realize the high-speed signal transmission, the radiation noise countermeasure, and the reduction of the mounting space.

When all of the light emitting element and the light receiving element are set as one set of one-way optical signal transmission means, two sets of one-way optical signal transmission means for transmitting optical signals in different directions are provided. The optical signals are transmitted in different directions from each other among at least two arbitrary packages out of the plurality of packages, and therefore, at the time of evaluation of the packages or addition or removal of the packages, an arbitrary signal is transmitted. Even if the packages are inserted / removed or the package mounting order is changed, it is possible to realize spatial optical bus signal transmission between packages, speed up signal transmission, prevent radiated noise, and reduce mounting space. Become.

Further, each of the plurality of packages includes a hole and a light emitting / receiving circuit arranged on one surface of each of the plurality of packages, and the light emitting / receiving circuit includes a light emitting element and a light receiving element. , All of the holes are arranged on the same axis extending in the direction perpendicular to each surface of the plurality of packages, and all of the light emitting and receiving circuits have the light emitting direction of the light emitting element and the light receiving direction of the light receiving element. Are arranged on the same axis extending through the hole in a direction perpendicular to the surfaces of the plurality of packages, and the light emitting element and the light receiving element each have a light emitting direction of the light emitting element and a light receiving direction of the light receiving element. Are formed in the same direction, and the same optical signal is transmitted between at least two arbitrary packages of the plurality of packages, so that spatial optical bus signal transmission between the packages is realized, and Speed up, radiation Sound measures, and it is possible to realize a reduction in the mounting space.

[0019]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing the configuration of a spatial optical bus signal transmission device according to the first embodiment of the present invention.

FIG. 1 shows a mother board 1 and three packages 2 accommodated on the mother board 1 in parallel with each other.
a, 2b, 2c, and each of the packages 2a, 2b, 2c has a light emitting element 3a, 3c.
b, 3c and light receiving elements 4a, 4b, 4c, respectively.

In FIG. 1, the light emitting element 3a arranged on one surface of the package 2a performs spatial light signal transmission with the light receiving element 4b arranged on the surface of the package 2b facing the package 2a. . Light emitting element 3a
The optical signal transmitted from is received by the light receiving element 4b.

Further, the light emitting element 3b arranged on the other surface of the package 2b performs spatial light signal transmission with the light receiving element 4c arranged on the surface of the package 2c facing the package 2b. The light signal transmitted from the light emitting element 3b is received by the light receiving element 4c.

Further, the light receiving element 4a arranged on the other surface of the package 2a transmits from a light emitting element (not shown) arranged on the surface facing the package 2a of another adjacent package (not shown). Received optical signal. The light emitting element 3c arranged on the other surface of the package 2c transmits an optical signal to a light receiving element (not shown) arranged on the surface facing the package 2c of another adjacent package (not shown).

At this time, the light emitting elements 3a to 3c and the light receiving elements 4a to 4c are on the same axis (hereinafter referred to as the first axis) extending in the direction perpendicular to the surfaces of the packages 2a to 2c. It is located in.

In this way, the transmission of the bus signal between the packages is performed by the spatial optical signal transmission.

FIG. 2 is a view showing the light emitting element and the light receiving element in the configuration of FIG. 1, and shows a state in which the light emitting element 3 and the light receiving element 4 are mounted on both surfaces of the package substrate 2.

FIG. 2 shows a structure having a package substrate 2, a light emitting element 3 and a light receiving element 4 mounted on both surfaces of the package substrate 2, and an in-package circuit 8 mounted on the package substrate 2. There is. The light emitting element 3 includes an electro-optical converter 5 and a condenser lens 7a, and the light receiving element 4 includes an opto-electric converter 6 and a condenser lens 7b.

The light emitting element 3 and the light receiving element 4 are arranged on the same axis (hereinafter referred to as the second axis) in which the condenser lenses 7a and 7b extend in the direction perpendicular to the surface of the package substrate 2. It is arranged to be located.

In the first embodiment, a light emitting diode or a semiconductor laser is used as the electro-optical conversion device 5, and a phototransistor or a photodiode is used as the photo-electric conversion device 6.

In FIG. 2, the opto-electrical converter 6 receives an input optical signal 9 transmitted from a package substrate (not shown) adjacent to the surface on which the opto-electrical converter 6 is arranged by a condenser lens 7b. It collects light and converts it into an electrical signal. This electric signal is supplied to the electro-optical conversion device 5 and the in-package circuit 8 as shown by arrows 10 and 11.

The electro-optical converting device 5 converts the electric signals (arrows 10 and 11) supplied from the opto-electric converting device 6 and the circuit 8 in the package into the output optical signal 12, and through the condenser lens 7a. And transmit it in the direction perpendicular to the package substrate 2,
It is transmitted to a package substrate (not shown) adjacent to the surface on which the electro-optical conversion device 5 is arranged.

By doing so, even if the package 2b is removed in the configuration of FIG. 1, since the light emitting element 3a and the light receiving element 4c are arranged on the first axis, there is a gap between the packages 2a and 2c. Therefore, spatial optical signal transmission can be performed.

Also, even if the positions of the packages 2a to 2c are changed to be accommodated in the mother board 1, the packages 2a to 2c are similarly changed.
It is possible to perform spatial optical signal transmission between ~ 2c.

In the first embodiment, a light emitting diode or a semiconductor laser is used as the electro-optical conversion device 5, and a phototransistor or a photodiode is used as the photo-electric conversion device 6, but the invention is not limited to these. As long as it has a similar function, it may be realized by another element or the like.

FIG. 3 is a diagram showing the configuration of a spatial optical bus signal transmission device according to the second embodiment of the present invention, showing the case where bidirectional optical signal transmission is performed.

In FIG. 3, in addition to the structure of FIG. 1, each of the packages 2a, 2b, 2c has a light emitting element 3a *, 3b.
*, 3c * and light receiving elements 4a *, 4b *, 4c * are provided. Light emitting elements 3a * to 3c
* And the light receiving elements 4a * to 4c * are package 2a to
They are arranged on the same axis (hereinafter, referred to as a third axis) extending in the direction perpendicular to the plane of 2c, and the third axis is different from the first axis.

In FIG. 3, the first axis and the third axis are the light emitting elements 3a to 3c and the light receiving elements 4a to 4c, the light emitting elements 4a * to 4c *, and the light receiving elements 3a * to 3c *, respectively. Although they are arranged so as to come into contact with each other, they may be arranged so as not to come into contact with each other.

In FIG. 3, in addition to the spatial optical signal transmission described in FIG. 1, the package 2 is provided by the light emitting element 3c * arranged on one surface of the package 2c.
Spatial optical signal transmission is performed with the light receiving element 4b * disposed on the surface of b facing the package 2c. Light emitting element 3c *
The optical signal transmitted from is received by the light receiving element 4b *.

The light emitting element 3b * arranged on the other surface of the package 2b performs spatial optical signal transmission with the light receiving element 4a * arranged on the surface of the package 2a facing the package 2b. The optical signal transmitted from the light emitting element 3b * is received by the light receiving element 4a *.

Further, the light receiving element 4c * arranged on the other surface of the package 2c is separated from the light emitting element (not shown) arranged on the surface facing the package 2c of another adjacent package (not shown). Receive the transmitted optical signal. The light emitting element 3a * arranged on the other surface of the package 2a transmits an optical signal to a light receiving element (not shown) arranged on the surface of the other adjacent package (not shown) facing the package 2a. . In this way, the bidirectional transmission of the bus signal between the packages is performed by the spatial optical signal transmission.

By doing so, similarly to the first embodiment, even if the package 2b is removed in the configuration of FIG. 3, the light emitting element 3a and the light receiving element 4c are arranged on the first axis, Light receiving element 4a * and light emitting element 3c *
Are arranged on the third axis, it is possible to perform spatial optical signal transmission between the packages 2a and 2c.

Further, even if the positions of the packages 2a to 2c are changed and accommodated in the mother board 1, the packages 2a to 2c are also similarly changed.
It is possible to perform spatial optical signal transmission between ~ 2c.

FIG. 4 is a diagram showing the configuration of the spatial optical bus signal transmission device according to the third embodiment of the present invention, and shows the case where the light emitting and receiving circuit 13 is used for single-sided mounting.

FIG. 4 shows a mother board 1 and three packages 2 accommodated on the mother board 1 in parallel with each other.
a, 2b, 2c, and each of the packages 2a, 2b, 2c has a light emitting / receiving circuit 13
It is configured to include a, 13b, and 13c. Also,
Each of the light emitting and receiving circuits 13a of the packages 2a to 2c
Holes of arbitrary size and shape are drilled at the positions where ~ 13c are arranged. Light emitting and receiving circuits 13a to 1
As described in detail with reference to FIG. 5, 3c is configured to include a light emitting element 3 and a light receiving element 4.

In FIG. 4, by the light emitting / receiving circuit 13a arranged on one surface of the package 2a, the light emitting / receiving circuit 13b arranged on the surface opposite to the surface facing the package 2a on the package 2b. And spatial light signal transmission. The optical signal transmitted from the light emitting / receiving circuit 13a is received by the light emitting / receiving circuit 13b.

The light emitting / receiving circuit 13b performs spatial optical signal transmission with the light emitting / receiving circuit 13c arranged on the surface of the package 2c opposite to the surface facing the package 2b. The optical signal transmitted from the light emitting / receiving circuit 13b is received by the light emitting / receiving circuit 13c.

Further, the light emitting and receiving circuit 1 of the package 2a
3a receives an optical signal transmitted from a light emitting and receiving circuit (not shown) arranged on the surface of the other adjacent package (not shown) facing the package 2a. Package 2
The light emitting and receiving circuit 13c of c transmits an optical signal to the light emitting and receiving circuit (not shown) arranged on the surface opposite to the surface of the other adjacent package (not shown) facing the package 2c.

At this time, the light emitting / receiving circuits 13a to 13c and the holes formed in the packages 2a to 2c are arranged on the first axis. Therefore, light can be transmitted without mounting the light emitting and receiving circuits 13a to 13c on both surfaces of the packages 2a to 2c. In this way, the transmission of the bus signal between the packages is performed by the spatial optical signal transmission.

FIG. 5 is a view showing the light emitting / receiving circuit in the configuration of FIG. 4, and shows a state in which the light emitting / receiving circuit 13 is mounted on one surface of the package substrate 2.

FIG. 5 shows a structure including a package substrate 2, a light emitting / receiving circuit 13 mounted on one surface of the package substrate 2, and an in-package circuit 8 mounted on the package substrate 2 to emit light. The light receiving circuit 13 includes a light emitting element 3 and a light receiving element 14.
The light emitting element 3 includes an electro-optical conversion device 5 and a condenser lens 7.
a, and the light receiving element 4 is configured to include the photoelectric conversion device 6 and the condenser lens 7b.

The light emitting element 3 and the light receiving element 4 are arranged so that the condenser lenses 7a and 7b are located on the second axis. The holes formed in each of the packages 2a to 2c are also arranged so as to be located on the second axis.

In the third embodiment, a light emitting diode or a semiconductor laser is used as the electro-optical conversion device 5, and a phototransistor or a photodiode is used as the photo-electric conversion device 6.

In FIG. 5, the opto-electrical conversion device 6 includes a package substrate 2 (not shown) adjacent to the surface opposite to the surface on which the opto-electrical conversion device 6 is arranged.
Input optical signal transmitted through a hole in the hole 9
Is condensed by the condenser lens 7b and converted into an electric signal. This electric signal is supplied to the electro-optical conversion device 5 and the in-package circuit 8 as shown by arrows 10 and 11.

The electro-optical converting device 5 converts the electric signals (arrows 10 and 11) supplied from the opto-electric converting device 6 and the circuit 8 in the package into the output optical signal 12, and passes through the condenser lens 7a. And transmit it in the direction perpendicular to the package substrate 2,
It is transmitted to a package substrate (not shown) adjacent to the surface on which the electro-optical conversion device 5 is arranged.

By doing so, similarly to the first embodiment, the light emitting and receiving circuit 13a and the light emitting and receiving circuit 13c are arranged on the first axis even if the package 2b is removed in the configuration of FIG. Therefore, spatial optical signal transmission can be performed between the package 2a and the package 2c.

Even if the positions of the packages 2a to 2c are changed and the packages 2a to 2c are accommodated in the mother board 1, the packages 2a to 2c are similarly moved.
It is possible to perform spatial optical signal transmission between ~ 2c.

Further, since the light emitting / receiving circuits 13a to 3c can be mounted on one side, the mounting space can be reduced.

In the third embodiment, a light emitting diode or a semiconductor laser is used as the electro-optical conversion device 5, and a phototransistor or a photodiode is used as the photo-electric conversion device 6, but the invention is not limited to these. As long as it has a similar function, it may be realized by another element or the like.

[0060]

As described above, the present invention has the following effects.

All of the light emitting element and the light receiving element are arranged on the same axis extending in a direction perpendicular to each surface of the plurality of packages, and between at least two arbitrary packages of the plurality of packages. By transmitting the same optical signal in the package, the space between the packages can be changed even if any package is inserted / removed or the package mounting order is changed during package evaluation or package addition / removal. It is possible to realize signal transmission, speed up signal transmission, prevent radiated noise, and reduce mounting space.

When all of the light emitting element and the light receiving element are set as one set of one-way optical signal transmission means, two sets of one-way optical signal transmission means for transmitting optical signals in different directions are provided. By transmitting optical signals in different directions between at least two arbitrary packages of the plurality of packages,
Even if you insert or remove any package or change the mounting order of the packages when evaluating or adding or removing packages, you can achieve spatial optical bus signal transmission between packages and speed up signal transmission. This has an effect that it is possible to implement measures against radiated noise and reduction of mounting space.

Further, each of the plurality of packages includes a hole portion and a light emitting and receiving circuit arranged on one surface of each of the plurality of packages, and the light emitting and receiving circuit includes a light emitting element and a light receiving element. , All of the holes are arranged on the same axis extending in the direction perpendicular to each surface of the plurality of packages, and all of the light emitting and receiving circuits have the light emitting direction of the light emitting element and the light receiving direction of the light receiving element. Are arranged on the same axis extending through the hole in a direction perpendicular to the surfaces of the plurality of packages, and the light emitting element and the light receiving element each have a light emitting direction of the light emitting element and a light receiving direction of the light receiving element. Are formed in the same direction, and the same optical signal is transmitted between at least two arbitrary packages of the plurality of packages, so that spatial optical bus signal transmission between the packages is realized and the signal transmission is performed. Fast Has the effect that it is possible to achieve reductions in radiation noise countermeasure, and mounting space.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a spatial optical bus signal transmission device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a light emitting element and a light receiving element in the configuration of FIG.

FIG. 3 is a diagram showing a configuration of a spatial optical bus signal transmission device according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a configuration of a spatial optical bus signal transmission device according to a third embodiment of the present invention.

5 is a diagram showing a light emitting and receiving circuit in the configuration of FIG.

FIG. 6 is a diagram showing a configuration of a spatial optical signal transmission device to which a conventional example described in Japanese Patent Laid-Open No. 4-119697 is applied.

[Explanation of symbols]

1 Motherboard 2 Package Substrate 2a, 2b, 2c Package 3, 3a, 3b, 3c, 3a *, 3b *, 3c * Light-Emitting Element 4, 4a, 4b, 4c, 4a *, 4b *, 4c * Light-Receiving Element 5 Electric- Optical conversion device 6 Optical-electrical conversion device 7a, 7b Condenser lens 8 Package internal circuit 9 Input optical signal 12 Output optical signal 13, 13a, 13b, 13c Light emitting / receiving circuit 14a, 14b, 14c, 14d Light emitting / light receiving element

Claims (3)

[Claims] 1. A mother board, a plurality of packages housed in parallel to each other on the mother board, a light-emitting element arranged on one surface of each of the plurality of packages, and the other of the plurality of packages. And a light receiving element disposed on the surface of the plurality of packages, and the light receiving element and the light receiving element that are disposed on the surfaces of the plurality of packages housed adjacent to each other facing each other In a spatial optical signal transmission device for transmitting an optical signal between a plurality of packages, all of the light emitting element and the light receiving element extend in a direction perpendicular to each surface of the plurality of packages. Spatial optical bus signal transmission characterized by being arranged on the same axis and transmitting the same optical signal between at least two arbitrary packages of the plurality of packages. Location. 2. When all of the light emitting element and the light receiving element are a set of one-way optical signal transmitting means, two sets of the one-way optical signal transmitting means for transmitting optical signals in different directions are provided. The spatial optical bus signal transmission device according to claim 1, wherein the spatial optical bus signal transmission device is arranged on the plurality of packages and transmits optical signals in mutually different directions between at least two arbitrary packages of the plurality of packages. 3. Each of the plurality of packages comprises a hole and a light emitting and receiving circuit arranged on one surface of each of the plurality of packages, the light emitting and receiving circuit comprising the light emitting element and the light emitting element. A light receiving element, all of the holes are arranged on the same axis extending in a direction perpendicular to each surface of the plurality of packages, and all of the light emitting and receiving circuits are provided in the light emitting element. The light emitting direction and the light receiving direction of the light receiving element are arranged on the same axis extending through the hole in a direction perpendicular to each surface of the plurality of packages. Each is formed so that the light emitting direction of the light emitting element and the light receiving direction of the light receiving element are the same, and the same optical signal is transmitted between at least two arbitrary packages of the plurality of packages. The spatial light according to claim 1 or 2. The scan signal transmission device.