JPH08320351A - Method for inspecting conduction of printed wiring board - Google Patents

Abstract

PURPOSE: To inspect the conduction of a printed wiring board by using a common conduction inspection device even if the contact part of the printed wiring board is located on a basic lattice or a non-basic lattice. CONSTITUTION: A connection wire 12 of an inspection device is branched, two systems of contact pins 8 are set, one system of contact pins 8 are arranged on the basic lattice of a fixing plate 13 to inspect the conduction of a printed wiring board with a contact part on the basic lattice, and at the same time the contact pin 8 of the other system is arranged on the non-basic lattice of an upper plate 10 of a jig 4. Then, by using for the conduction inspection of the circuit conductor part of a printed wiring board with the contact part on the non-basic lattice, the conduction inspection of the printed wiring board is performed by using a common inspection device regardless of the pattern of the circuit conductor, for example, on the basic lattice or the non-basic lattice.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuity inspection method for printed wiring boards.

[0002]

2. Description of the Related Art Generally, there are several kinds of methods for manufacturing printed wiring boards. For example, an unnecessary portion of a copper foil is removed to form a circuit conductor, and a hole is formed by using a drill or the like, followed by electroless copper plating. Method to form through holes, or the place where the conductor circuit on the surface is formed with a negative pattern using a permanent resist, and after drilling holes where necessary using a drill, etc., the circuit conductor and through holes are formed. There is known a method of forming a metal by electroless copper plating.

As shown in FIG. 3, the printed wiring board manufactured by the above-mentioned manufacturing method has through holes 2 and footprints 3 serving as contact portions formed in a predetermined pattern on the printed wiring board 1. , Due to the accuracy of the jigs and tools used in manufacturing and the printing error when forming the circuit conductor by printing,
As shown in FIG. 4, defects such as disconnection 4 and short circuit 5 may occur in the circuit conductor.

Disconnection 4 of these circuit conductors and short circuit 5 between circuits
Must be eliminated because it cannot operate normally as a circuit, and the fact is that a normal continuity test is performed to detect disconnection 4 and short circuit 5.

This method for inspecting the continuity of a printed wiring board is a circuit inspection performed by utilizing inspection data prepared in advance or inspection information obtained from an inspected substrate, and is 2.54 mm.
When the through holes 2 on the grid (hereinafter referred to as the basic grid) are used as the contact portions, as shown in FIG. 5, the contact pins 8 arranged on the basic grid on the fixed plate 13 of the printed wiring board 1 are arranged. In order to contact the through hole 2, a mask 7 (see FIG. 6) provided with a hole 6 for passing the contact pin 8 to be used is inserted between the contact pin 8 and the printed wiring board 1 to be inspected, and the printed wiring board is inserted. After aligning the contact positions of 1 with each other, although not shown, press pressure is applied from above or below using a pressing mechanism to contact the contact pin 8 with the through hole 2 by using an inspection machine, The continuity test was performed on the printed wiring board 1 that it had.

[0006] In addition, the contact portion on the basic lattice and non-2.54 m
When the contact portion on the m-lattice (hereinafter referred to as the non-basic lattice) is included, the contact pins 8 are arranged on the non-basic lattice on the upper plate 10, and the upper plate 10 and the lower plate 11 are arranged as shown in FIG. The jig 14 consisting of and was used to conduct the continuity test of the printed wiring board 1 having the contact portion on the non-basic grid.

[0007]

As described above, in the conventional method for inspecting the continuity of the printed wiring board, the printed wiring board having the contact portions on the basic grid and the printed wiring board having the contact portions on the non-basic grid are provided. Has conducted a continuity test with an inspection machine that uses a dedicated jig, requires two types of inspection machines, and has been pointed out to have the drawback of lowering inspection efficiency.

The present invention has been made in view of the above circumstances, and a printed wiring board can be formed by a common inspection machine regardless of whether the position of the contact portion of the printed wiring board is on the basic grid or on the non-basic grid. It is an object of the present invention to provide a method for inspecting the continuity of a printed wiring board, which makes it possible to inspect the continuity of the contact portion of the printed wiring board.

[0009]

In order to achieve the above-mentioned object, the method for inspecting continuity of a printed wiring board according to the present invention branches a connecting line of a detecting device and sets two systems of contact pins on each connecting line. Then, the contact pins of one system are arranged on the basic grid, and the continuity inspection of the printed wiring board having the contact portion on the basic grid is conducted by this contact pin, while the contact pins of the other system are arranged on the non-basic grid. And this contact pin
It is characterized in that a continuity test of a printed wiring board having a contact portion on a non-basic grid is performed.

[0010]

As is apparent from the above construction, in the inspection device used in the method of the present invention, the connection line from the detection device is branched and one side is connected to the contact pin arranged on the fixed plate on the basic lattice. At the same time, by connecting the other side to the contact pins arranged on the jig on the non-basic lattice, the fixing plate and the jig on which the two systems of contact pins on the basic lattice and the non-basic lattice are arranged respectively. Since the structure is provided, the continuity test of the printed wiring board having the contact portion on the basic grid is performed using the contact pins arranged on the basic grid, and the printed wiring board having the contact portion on the non-basic grid is performed. The continuity test can be performed using contact pins arranged on a non-basic grid.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of a printed wiring board continuity inspection method according to the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is an explanatory view showing a connection structure of contact pins used in the method of the present invention, and FIG. 2 is a sectional view showing an example of the method of the present invention.

First, as shown in FIG. 1, the connection lines 12 of the detection device 15 are branched, and each connection line 12 is
It is connected to the contact pins 8 of two systems.

That is, as shown in FIG.
Among them, one system is arranged on the fixed plate 13 on the basic lattice, and the contact pins 8 on the other side are arranged on the upper plate 10 in the required number on the non-basic lattice and connected to the connector 9. .

The upper plate 10 and the lower plate 11 in which the contact pins 8 are arranged on the non-basic lattice are fixed by using columns (not shown) to form a jig 14.

As described above, in the continuity inspection apparatus used in the method of the present invention, the connection line 12 of the detection apparatus 15 is branched and connected to the contact pins 8 of the two systems, and the contact pin 8 of the one system is fixed to the fixing plate 13. And the contact pins 8 on the other side are arranged on the non-basic lattice on the upper plate 10 constituting the jig 14.

Next, in order to carry out the continuity inspection method using the continuity inspection device having the above-mentioned configuration, for example, the continuity inspection of the circuit in the printed wiring board 1 having the contact portion on the basic grid is required by the necessary contact pins. After placing the mask 7 having the holes 6 through which the holes 8 pass through on the fixing plate 13 at a proper position, the printed wiring board 1 is placed on the mask 7 and the contacting positions are aligned. It suffices to apply pressure and bring the contact portion of the printed wiring board 1 into contact with the contact pin 8 to conduct a continuity test.

In addition, the continuity inspection of the circuit of the printed wiring board 1 having the contact portion on the non-basic grid is performed by the upper plate 10 of the jig 14.
After placing the printed wiring board 1 on the top and aligning the contact positions, pressure is applied from above or below by a press mechanism (not shown) to bring the contact portions (through hole 2 and footprint 3) of the printed wiring board 1 into contact with each other. The circuit continuity test may be performed.

Further, the continuity inspection performed using the contact pins 8 arranged on the basic lattice and the continuity inspection performed using the contact pins 8 arranged on the non-basic lattice share a detection circuit (not shown) of the detection device 15. Use without doing.

[0020]

As described above, in the method of inspecting the continuity of a printed wiring board according to the present invention, the connection lines from the detection device are branched and the contact pins connected to the respective connection lines are fixed plates of one system. While arranging on the basic lattice,
For contact pins of other systems, use an inspection device that is arranged on a non-basic grid.For printed wiring boards that have contact parts on the basic grid, use contact pins that are arranged on the basic grid on the fixed plate. For printed wiring boards with contact parts on the non-basic grid, use a jig with contact pins arranged on the non-basic grid to position the contact parts on the basic grid or on the non-basic grid. In either case, the common inspection device can be used to conduct the continuity inspection of the printed wiring board, and the inspection efficiency in the continuity inspection of the printed wiring board can be significantly improved.

[Brief description of drawings]

FIG. 1 is an explanatory view showing the relationship between a contact pin used in the method of the present invention and an inspection device.

FIG. 2 is a cross-sectional view showing an example of a printed wiring board continuity inspection method according to the present invention.

FIG. 3 is a plan view showing a printed wiring board.

FIG. 4 is a perspective view illustrating a defective portion of a circuit conductor of a printed wiring board.

FIG. 5 is a cross-sectional view showing a conventional conduction inspection method using a contact pin on a basic lattice.

FIG. 6 is a plan view showing a mask used in the continuity inspection method.

FIG. 7 is a cross-sectional view showing a conventional conduction inspection method using contact pins on a non-basic grid.

[Explanation of symbols]

 1 Printed Wiring Board 7 Mask 8 Contact Pin 9 Connector 10 Upper Plate 11 Lower Plate 12 Connection Line 13 Fixing Plate 14 Jig 15 Detection Device

Claims (1)

[Claims] 1. A connection line of a detection device is branched, two contact pins are set for each connection line, one contact pin is arranged on a basic lattice, and the contact pins make contact on the basic lattice. While conducting a continuity test of a printed wiring board having parts, contact pins of other systems are arranged on a non-basic grid, and the continuity test of a printed wiring board having a contact part on the non-basic grid is performed by these contact pins. And a method for inspecting continuity of a printed wiring board.